– 7mA Active Read Current Typical
– 25µA Standby Current Typical
– 15µA Deep Power-down Typical
• Hardware and Software Data Protection Features
– Individual Sector
• Sector Lockdown for Secure Code and Data Storage
– Individual Sector
• Security: 128-byte Security Register
– 64-byte User Programmable Space
– Unique 64-byte Device Identifier
• JEDEC Standard Manufacturer and Device ID Read
• 100,000 Program/Erase Cycles Per Page Minimum
• Data Retention – 20 Years
• Industrial Temperature Range
• Green (Pb/Halide-free/RoHS Compliant) Packaging Options
2-megabit
2.7V Minimum
DataFlash
AT45DB021D
Description
The AT45DB021D is a 2.7V, serial-interface Flash memory ideally suited for a wide
variety of digital voice-, image-, program code- and data-storage applications. The
AT45DB021D supports RapidS™serial interface for applications requiring very high
speed operations. RapidS serial interface is SPI compatible for frequencies up to
66MHz. Its 2-,162-,688-bits of memory are organized as 1,024-pages of 256-bytes or
264-bytes each. In addition to the main memory, the AT45DB021D also contains one
SRAM buffer of 256-/264-bytes. EEPROM emulation (bit or byte alterability) is easily
handled with a self-contained three step read-modify-write operation. Unlike conventional Flash memories that are accessed randomly with multiple address lines and a
parallel interface, the DataFlash®uses a RapidS serial interface to sequentially
access its data. The simple sequential access dramatically reduces active pin count,
facilitates hardware layout, increases system reliability, minimizes switching noise,
and reduces package size.
3638K–DFLASH–11/2012
The device is optimized for use in many commercial and industrial applications where high-density, low-pin count,
low-voltage and low-power are essential.
To allow for simple in-system reprogrammability, the AT45DB021D does not require high input voltages for
programming. The device operates from a single power supply, 2.7V to 3.6V, for both the program and read
operations. The AT45DB021D is enabled through the chip select pin (
consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK).
All programming and erase cycles are self-timed.
1.Pin Configurations and Pinouts
Table 1-1.Pin Configurations
SymbolName and Function
Chip Select: Asserting the CS pin selects the device. When the CS pin is deasserted, the device will be
deselected and normally be placed in the standby mode (not Deep Power-Down mode), and the output
pin (SO) will be in a high-impedance state. When the device is deselected, data will not be accepted on
CS
SCK
SI
SO
WP
RESET
V
CC
GNDGround: The ground reference for the power supply. GND should be connected to the system ground.–
the input pin (SI).
A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition is
required to end an operation. When ending an internally self-timed operation such as a program or erase
cycle, the device will not enter the standby mode until the completion of the operation.
Serial Clock: This pin is used to provide a clock to the device and is used to control the flow of data to
and from the device. Command, address, and input data present on the SI pin is always latched on the
rising edge of SCK, while output data on the SO pin is always clocked out on the falling edge of SCK.
Serial Input: The SI pin is used to shift data into the device. The SI pin is used for all data input including
command and address sequences. Data on the SI pin is always latched on the rising edge of SCK.
Serial Output: The SO pin is used to shift data out from the device. Data on the SO pin is always clocked
out on the falling edge of SCK.
Write Protect: When the WP pin is asserted, all sectors specified for protection by the Sector Protection
Register will be protected against program and erase operations regardless of whether the Enable Sector
Protection command has been issued or not. The WP pin functions independently of the software
controlled protection method. After the WP pin goes low, the content of the Sector Protection Register
cannot be modified.
If a program or erase command is issued to the device while the WP pin is asserted, the device will
simply ignore the command and perform no operation. The device will return to the idle state once the CS
pin has been deasserted. The Enable Sector Protection command and Sector Lockdown command,
however, will be recognized by the device when the WP pin is asserted.
The WP pin is internally pulled-high and may be left floating if hardware controlled protection will not be
used. However, it is recommended that the WP pin also be externally connected to VCCwhenever
possible.
Reset: A low state on the reset pin (RESET) will terminate the operation in progress and reset the
internal state machine to an idle state. The device will remain in the reset condition as long as a low level
is present on the RESET pin. Normal operation can resume once the RESET pin is brought back to a
high level.
The device incorporates an internal power-on reset circuit, so there are no restrictions on the RESET pin
during power-on sequences. If this pin and feature are not utilized it is recommended that the RESET pin
be driven high externally.
Device Power Supply: The VCCpin is used to supply the source voltage to the device.
Operations at invalid VCCvoltages may produce spurious results and should not be attempted.
CS) and accessed via a three-wire interface
Asserte
d StateType
LowInput
–Input
–Input
–Output
LowInput
LowInput
–Power
Groun
d
2
AT45DB021D
3638K–DFLASH–11/2012
AT45DB021D
Figure 1-1.SOIC Top ViewFigure 1-2.UDFN Top View
1
SI
SCK
RESET
CS
1
2
3
4
SO
8
GND
7
VCC
6
WP
5
SCK
RESET
CS
SI
2
3
4
(1)
8
SO
7
GND
6
VCC
5
WP
Notes: 1. The metal pad on the bottom of the UDFN package is floating. This pad can be a “No Connect” or connected to
GND
Figure 1-3.Block Diagram
WP
FLASH MEMORY ARRAY
PAGE (256-/264-BYTES)
BUFFER (256-/264-BYTES)
SCK
CS
RESET
VCC
GND
I/O INTERFACE
SO SI
3638K–DFLASH–11/2012
3
2.Memory Array
To provide optimal flexibility, the memory array of the AT45DB021D is divided into three levels of granularity
comprising of sectors, blocks, and pages. The “Memory Architecture Diagram” illustrates the breakdown of each
level and details the number of pages per sector and block. All program operations to the DataFlash occur on a
page-by-page basis. The erase operations can be performed at the chip, sector, block or page level.
The device operation is controlled by instructions from the host processor. The list of instructions and their
associated opcodes are contained in Tables 13-1 through 13-7. A valid instruction starts with the falling edge of CS
followed by the appropriate 8-bit opcode and the desired buffer or main memory address location. While the CS pin
is low, toggling the SCK pin controls the loading of the opcode and the desired buffer or main memory address
location through the SI (serial input) pin. All instructions, addresses, and data are transferred with the most
significant bit (MSB) first.
SECTOR 0b
SECTOR 1
Block = 1,024/1,056-bytes
BLOCK 14
BLOCK 15
BLOCK 16
BLOCK 17
BLOCK 30
BLOCK 31
BLOCK 32
BLOCK 33
BLOCK 126
BLOCK 127
BLOCK 0
BLOCK 1
PAGE 6
PAGE 7
PAGE 8
PAGE 9
PAGE 14
PAGE 15
PAGE 16
PAGE 17
PAGE 18
PAGE 1,022
PAGE 1,023
Page = 256/264-bytes
Buffer addressing for the DataFlash standard page size (264-bytes) is referenced in the datasheet using the
terminology BFA8 - BFA0 to denote the nine address bits required to designate a byte address within a buffer.
Main memory addressing is referenced using the terminology PA9 - PA0 and BA8 - BA0, where PA9 - PA0
denotes the 10-address bits required to designate a page address and BA8 - BA0 denotes the nine address bits
required to designate a byte address within the page.
For the “Power of 2” binary page size (256-bytes), the Buffer addressing is referenced in the datasheet using the
conventional terminology BFA7 - BFA0 to denote the eight address bits required to designate a byte address within
a buffer. Main memory addressing is referenced using the terminology A17 - A0, where A17 - A8 denotes the 10address bits required to designate a page address and A7 - A0 denotes the eight address bits required to
designate a byte address within a page.
4
AT45DB021D
3638K–DFLASH–11/2012
4.Read Commands
By specifying the appropriate opcode, data can be read from the main memory or from the SRAM data buffer. The
DataFlash supports RapidS protocols for Mode 0 and Mode 3. Please refer to the “Detailed Bit-level Read Timing”
diagrams in this datasheet for details on the clock cycle sequences for each mode.
4.1Continuous Array Read (Legacy Command – E8H): Up to 66MHz
By supplying an initial starting address for the main memory array, the Continuous Array Read command can be
utilized to sequentially read a continuous stream of data from the device by simply providing a clock signal; no
additional addressing information or control signals need to be provided. The DataFlash incorporates an internal
address counter that will automatically increment on every clock cycle, allowing one continuous read operation
without the need of additional address sequences. To perform a continuous read from the DataFlash standard
page size (264-bytes), an opcode of E8H must be clocked into the device followed by three address bytes (which
comprise the 24-bit page and byte address sequence) and four don’t care bytes. The first 10-bits (PA9 - PA0) of
the 19-bit address sequence specify which page of the main memory array to read, and the last 9-bits (BA8 - BA0)
of the 19-bit address sequence specify the starting byte address within the page. To perform a continuous read
from the binary page size (256-bytes), the opcode (E8H) must be clocked into the device followed by three address
bytes and four don’t care bytes. The first 10-bits (A17 - A8) of the 18-bits sequence specify which page of the main
memory array to read, and the last 8-bits (A7 - A0) of the 18-bits address sequence specify the starting byte
address within the page. The don’t care bytes that follow the address bytes are needed to initialize the read
operation. Following the don’t care bytes, additional clock pulses on the SCK pin will result in data being output on
the SO (serial output) pin.
AT45DB021D
The
CS pin must remain low during the loading of the opcode, the address bytes, the don’t care bytes, and the
reading of data. When the end of a page in main memory is reached during a Continuous Array Read, the device
will continue reading at the beginning of the next page with no delays incurred during the page boundary crossover
(the crossover from the end of one page to the beginning of the next page). When the last bit in the main memory
array has been read, the device will continue reading back at the beginning of the first page of memory. As with
crossing over page boundaries, no delays will be incurred when wrapping around from the end of the array to the
beginning of the array.
A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
maximum SCK frequency allowable for the Continuous Array Read is defined by the f
Continuous Array Read bypasses the data buffer and leaves the contents of the buffer unchanged.
4.2Continuous Array Read (High Frequency Mode – 0BH): Up to 66MHz
This command can be used with the serial interface to read the main memory array sequentially in high speed
mode for any clock frequency up to the maximum specified by f
page size set to 264-bytes, the CS must first be asserted then an opcode 0BH must be clocked into the device
followed by three address bytes and a dummy byte. The first 10-bits (PA9 - PA0) of the 19-bit address sequence
specify which page of the main memory array to read, and the last nine bits (BA8 - BA0) of the 19-bit address
sequence specify the starting byte address within the page. To perform a continuous read with the page size set to
256-bytes, the opcode, 0BH, must be clocked into the device followed by three address bytes (A17 - A0) and a
dummy byte. Following the dummy byte, additional clock pulses on the SCK pin will result in data being output on
the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When
the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading
at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from
the end of one page to the beginning of the next page). When the last bit in the main memory array has been read,
the device will continue reading back at the beginning of the first page of memory. As with crossing over page
. To perform a continuous read array with the
CAR1
specification. The
CAR1
3638K–DFLASH–11/2012
5
boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the
array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
maximum SCK frequency allowable for the Continuous Array Read is defined by the f
Continuous Array Read bypasses the data buffer and leaves the contents of the buffer unchanged.
4.3Continuous Array Read (Low Frequency Mode: 03H): Up to 33MHz
This command can be used with the serial interface to read the main memory array sequentially without a dummy
byte up to maximum frequencies specified by f
264-bytes, the CS must first be asserted then an opcode, 03H, must be clocked into the device followed by three
address bytes (which comprise the 24-bit page and byte address sequence). The first 10-bits (PA9 - PA0) of the
19-bit address sequence specify which page of the main memory array to read, and the last nine bits (BA8 - BA0)
of the 19-bit address sequence specify the starting byte address within the page. To perform a continuous read
with the page size set to 256-bytes, the opcode, 03H, must be clocked into the device followed by three address
bytes (A17 - A0). Following the address bytes, additional clock pulses on the SCK pin will result in data being
output on the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, and the reading of data. When
the end of a page in the main memory is reached during a Continuous Array Read, the device will continue reading
at the beginning of the next page with no delays incurred during the page boundary crossover (the crossover from
the end of one page to the beginning of the next page). When the last bit in the main memory array has been read,
the device will continue reading back at the beginning of the first page of memory. As with crossing over page
boundaries, no delays will be incurred when wrapping around from the end of the array to the beginning of the
array. A low-to-high transition on the CS pin will terminate the read operation and tri-state the output pin (SO). The
Continuous Array Read bypasses the data buffer and leaves the contents of the buffer unchanged.
. To perform a continuous read array with the page size set to
CAR2
specification. The
CAR1
4.4Main Memory Page Read
A main memory page read allows the user to read data directly from any one of the 2,048-pages in the main
memory, bypassing the data buffer and leaving the contents of the buffer unchanged. To start a page read from the
DataFlash standard page size (264-bytes), an opcode of D2H must be clocked into the device followed by three
address bytes (which comprise the 24-bit page and byte address sequence) and four don’t care bytes. The first 10bits (PA9 - PA0) of the 19-bit address sequence specify the page in main memory to be read, and the last 9-bits
(BA8 - BA0) of the 19-bit address sequence specify the starting byte address within that page. To start a page read
from the binary page size (256-bytes), the opcode D2H must be clocked into the device followed by three address
bytes and four don’t care bytes. The first 10-bits (A17 - A8) of the 18-bit sequence specify which page of the main
memory array to read, and the last 8-bits (A7 - A0) of the 18-bit address sequence specify the starting byte address
within the page. The don’t care bytes that follow the address bytes are sent to initialize the read operation.
Following the don’t care bytes, additional pulses on SCK result in data being output on the SO (serial output) pin.
The CS pin must remain low during the loading of the opcode, the address bytes, the don’t care bytes, and the
reading of data. When the end of a page in main memory is reached, the device will continue reading back at the
beginning of the same page. A low-to-high transition on the CS pin will terminate the read operation and tri-state
the output pin (SO). The maximum SCK frequency allowable for the Main Memory Page Read is defined by the
f
specification. The Main Memory Page Read bypasses the data buffer and leaves the contents of the buffer
SCK
unchanged.
4.5Buffer Read
The SRAM data buffer can be accessed independently from the main memory array, and utilizing the Buffer Read
Command allows data to be sequentially read directly from the buffer. Two opcodes, D4H or D1H, can be used for
the Buffer Read Command. The use of each opcode depends on the maximum SCK frequency that will be used to
6
AT45DB021D
3638K–DFLASH–11/2012
read data from the buffer. The D4H opcode can be used at any SCK frequency up to the maximum specified by
. The D1H opcode can be used for lower frequency read operations up to the maximum specified by f
f
CAR1
To perform a buffer read from the DataFlash standard buffer (264-bytes), the opcode must be clocked into the
device followed by three address bytes comprised of 15 don’t care bits and 9 buffer address bits (BFA8 - BFA0).
To perform a buffer read from the binary buffer (256-bytes), the opcode must be clocked into the device followed
by three address bytes comprised of 16 don’t care bits and eight buffer address bits (BFA7 - BFA0). Following the
address bytes, one don’t care byte must be clocked in to initialize the read operation. The
during the loading of the opcode, the address bytes, the don’t care bytes, and the reading of data. When the end of
a buffer is reached, the device will continue reading back at the beginning of the buffer. A low-to-high transition on
the CS pin will terminate the read operation and tri-state the output pin (SO).
5.Program and Erase Commands
5.1Buffer Write
Data can be clocked in from the input pin (SI) into the buffer. To load data into the DataFlash standard buffer (264bytes), a 1-byte opcode, 84H, must be clocked into the device followed by three address bytes comprised of 15
don’t care bits and nine buffer address bits (BFA8 - BFA0). The nine buffer address bits specify the first byte in the
buffer to be written. To load data into the binary buffers (256-bytes each), a 1-byte opcode, 84H, must be clocked
into the device followed by three address bytes comprised of 16 don’t care bits and eight buffer address bits (BFA7
- BFA0). The eight buffer address bits specify the first byte in the buffer to be written. After the last address byte
has been clocked into the device, data can then be clocked in on subsequent clock cycles. If the end of the data
buffer is reached, the device will wrap around back to the beginning of the buffer. Data will continue to be loaded
into the buffer until a low-to-high transition is detected on the CS pin.
AT45DB021D
.
CAR2
CS pin must remain low
5.2Buffer to Main Memory Page Program with Built-in Erase
Data written into the buffer can be programmed into the main memory. A 1-byte opcode, 83H, must be clocked into
the device. For the DataFlash standard page size (264-bytes), the opcode must be followed by three address bytes
consist of five don’t care bits, 10 page address bits (PA9 - PA0) that specify the page in the main memory to be
written and nine don’t care bits. To perform a buffer to main memory page program with built-in erase for the binary
page size (256-bytes), the opcode 83H must be clocked into the device followed by three address bytes consisting
of six don’t care bits, 10 page address bits (A17 - A8) that specify the page in the main memory to be written and
eight don’t care bits. When a low-to-high transition occurs on the CS pin, the part will first erase the selected page
in main memory (the erased state is a logic 1) and then program the data stored in the buffer into the specified
page in main memory. Both the erase and the programming of the page are internally self-timed and should take
place in a maximum time of tEP. During this time, the status register will indicate that the part is busy.
5.3Buffer to Main Memory Page Program without Built-in Erase
A previously-erased page within main memory can be programmed with the contents of the buffer. A 1-byte
opcode, 88H, must be clocked into the device. For the DataFlash standard page size (264-bytes), the opcode must
be followed by three address bytes consist of five don’t care bits, 10 page address bits (PA9 - PA0) that specify the
page in the main memory to be written and nine don’t care bits. To perform a buffer to main memory page program
without built-in erase for the binary page size (256-bytes), the opcode 88H must be clocked into the device
followed by three address bytes consisting of six don’t care bits, 10 page address bits (A17 - A8) that specify the
page in the main memory to be written and eight don’t care bits. When a low-to-high transition occurs on the CS
pin, the part will program the data stored in the buffer into the specified page in the main memory. It is necessary
that the page in main memory that is being programmed has been previously erased using one of the erase
commands (Page Erase or Block Erase). The programming of the page is internally self-timed and should take
place in a maximum time of tP. During this time, the status register will indicate that the part is busy.
3638K–DFLASH–11/2012
7
5.4Page Erase
The Page Erase command can be used to individually erase any page in the main memory array allowing the
Buffer to Main Memory Page Program to be utilized at a later time. To perform a page erase in the DataFlash
standard page size (264-bytes), an opcode of 81H must be loaded into the device, followed by three address bytes
comprised of five don’t care bits, 10 page address bits (PA9 - PA0) that specify the page in the main memory to be
erased and nine don’t care bits. To perform a page erase in the binary page size (256-bytes), the opcode 81H must
be loaded into the device, followed by three address bytes consist of six don’t care bits, 10 page address bits (A17
- A8) that specify the page in the main memory to be erased and eight don’t care bits. When a low-to-high transition
occurs on the
internally self-timed and should take place in a maximum time of tPE. During this time, the status register will
indicate that the part is busy.
5.5Block Erase
A block of eight pages can be erased at one time. This command is useful when large amounts of data has to be
written into the device. This will avoid using multiple Page Erase Commands. To perform a block erase for the
DataFlash standard page size (264-bytes), an opcode of 50H must be loaded into the device, followed by three
address bytes comprised of five don’t care bits, seven page address bits (PA9 -PA3) and 12 don’t care bits. The
seven page address bits are used to specify which block of eight pages is to be erased. To perform a block erase
for the binary page size (256-bytes), the opcode 50H must be loaded into the device, followed by three address
bytes consisting of six don’t care bits, seven page address bits (A17 - A11) and 11 don’t care bits. The 9-page
address bits are used to specify which block of eight pages is to be erased. When a low-to-high transition occurs
on the CS pin, the part will erase the selected block of eight pages. The erase operation is internally self-timed and
should take place in a maximum time of tBE. During this time, the status register will indicate that the part is busy.
CS pin, the part will erase the selected page (the erased state is a logical 1). The erase operation is
Table 5-1.Block Erase Addressing
PA9/
A17
0000000XXX0
0000001XXX1
0000010XXX2
0000011XXX3
•
•
•
1111100XXX124
1111101XXX125
1111110XXX126
1111111XXX127
PA8/
A16
5.6Sector Erase
The Sector Erase command can be used to individually erase any sector in the main memory. There are four
sectors and only one sector can be erased at one time. To perform sector 0a or sector 0b erase for the DataFlash
standard page size (264-bytes), an opcode of 7CH must be loaded into the device, followed by three address bytes
comprised of five don’t care bits, seven page address bits (PA9 - PA3) and 12 don’t care bits. To perform a sector
1-7 erase, the opcode 7CH must be loaded into the device, followed by three address bytes comprised of five don’t
care bits, three page address bits (PA9 - PA7) and 16 don’t care bits. To perform sector 0a or sector 0b erase for
PA7/
A15
•
•
•
•
•
•
PA6/
A14
•
•
•
PA5/
A13
•
•
•
PA4/
A12
•
•
•
PA3/
A11
•
•
•
PA2/
A10
•
•
•
PA1/
A9
•
•
•
PA0/
A8Block
•
•
•
•
•
•
8
AT45DB021D
3638K–DFLASH–11/2012
AT45DB021D
the binary page size (25-bytes), an opcode of 7CH must be loaded into the device, followed by three address bytes
comprised of six don’t care bits and seven page address bits (A17 - A11) and 11 don’t care bits. To perform a
sector 1-seven erase, the opcode 7CH must be loaded into the device, followed by three address bytes comprised
of six don’t care bit and three page address bits (A17 - A15) and 16 don’t care bits. The page address bits are used
to specify any valid address location within the sector which is to be erased. When a low-to-high transition occurs
on the CS pin, the part will erase the selected sector. The erase operation is internally self-timed and should take
place in a maximum time of tSE. During this time, the status register will indicate that the part is busy.
Table 5-2.Sector Erase Addressing
PA9/
A17
0000000XXX0a
0000001XXX0b
•
•
•
01 1 XXXXXXX5
10 0 XXXXXXX6
11 1 XXXXXXX7
5.7Chip Erase
The entire main memory can be erased at one time by using the Chip Erase command.
To execute the Chip Erase command, a 4-byte command sequence C7H, 94H, 80H and 9AH must be clocked into
the device. Since the entire memory array is to be erased, no address bytes need to be clocked into the device,
and any data clocked in after the opcode will be ignored. After the last bit of the opcode sequence has been
clocked in, the CS pin can be deasserted to start the erase process. The erase operation is internally self-timed
and should take place in a time of tCE. During this time, the Status Register will indicate that the device is busy.
The Chip Erase command will not affect sectors that are protected or locked down; the contents of those sectors
will remain unchanged. Only those sectors that are not protected or locked down will be erased.
PA8/
A16
•
•
•
PA7/
A15
•
•
•
PA6/
A14
•
•
•
PA5/
A13
•
•
•
PA4/
A12
•
•
•
PA3/
A11
•
•
•
PA2/
A10
•
•
•
PA1/
A9
•
•
•
PA0/
A8Sector
•
•
•
•
•
•
The WP pin can be asserted while the device is erasing, but protection will not be activated until the internal erase
cycle completes.
Table 5-3.Chip Erase Command
CommandByte 1Byte 2Byte 3Byte 4
Chip EraseC7H94H80H9AH
Figure 5-1.Chip Erase
CS
SI
3638K–DFLASH–11/2012
Opcode
Byte 1
Each transition
represents 8 bits
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
9
5.8Main Memory Page Program Through Buffer
This operation is a combination of the Buffer Write and Buffer to Main Memory Page Program with Built-in Erase
operations. Data is first clocked into the buffer from the input pin (SI) and then programmed into a specified page in
the main memory. To perform a main memory page program through buffer for the DataFlash standard page size
(264-bytes), a 1-byte opcode, 82H, must first be clocked into the device, followed by three address bytes. The
address bytes are comprised of five don’t care bits, 10 page address bits, (PA9 - PA0) that select the page in the
main memory where data is to be written, and nine buffer address bits (BFA8 - BFA0) that select the first byte in
the buffer to be written. To perform a main memory page program through buffer for the binary page size (256bytes), the opcode 82H must be clocked into the device followed by three address bytes consisting of six don’t care
bits, 10 page address bits (A17 - A8) that specify the page in the main memory to be written, and eight buffer
address bits (BFA7 - BFA0) that selects the first byte in the buffer to be written. After all address bytes are clocked
in, the part will take data from the input pins and store it in the specified data buffer. If the end of the buffer is
reached, the device will wrap around back to the beginning of the buffer. When there is a low-to-high transition on
the CS pin, the part will first erase the selected page in main memory to all ones and then program the data stored
in the buffer into that memory page. Both the erase and the programming of the page are internally self-timed and
should take place in a maximum time of t
. During this time, the status register will indicate that the part is busy.
EP
6.Sector Protection
Two protection methods, hardware and software controlled, are provided for protection against inadvertent or
erroneous program and erase cycles. The software controlled method relies on the use of software commands to
enable and disable sector protection while the hardware controlled method employs the use of the Write Protect
(WP) pin. The selection of which sectors that are to be protected or unprotected against program and erase
operations is specified in the nonvolatile Sector Protection Register. The status of whether or not sector protection
has been enabled or disabled by either the software or the hardware controlled methods can be determined by
checking the Status Register.
6.1Software Sector Protection
6.1.1Enable Sector Protection Command
Sectors specified for protection in the Sector Protection Register can be protected from program and erase
operations by issuing the Enable Sector Protection command. To enable the sector protection using the software
controlled method, the CS pin must first be asserted as it would be with any other command. Once the CS pin has
been asserted, the appropriate 4-byte command sequence must be clocked in via the input pin (SI). After the last
bit of the command sequence has been clocked in, the CS pin must be deasserted after which the sector
protection will be enabled.
Table 6-1.Enable Sector Protection Command
CommandByte 1Byte 2Byte 3Byte 4
Enable Sector Protection3DH2AH7FHA9H
Figure 6-1.Enable Sector Protection
CS
SI
Opcode
Byte 1
Each transition
represents 8 bits
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
10
AT45DB021D
3638K–DFLASH–11/2012
6.1.2Disable Sector Protection Command
To disable the sector protection using the software controlled method, the
be with any other command. Once the
Sector Protection command must be clocked in via the input pin (SI). After the last bit of the command sequence
has been clocked in, the
CS pin must be deasserted after which the sector protection will be disabled. The WP pin
must be in the deasserted state; otherwise, the Disable Sector Protection command will be ignored.
Table 6-2.Disenable Sector Protection Command
CommandByte 1Byte 2Byte 3Byte 4
Disable Sector Protection3DH2AH7FH9AH
Figure 6-2.Disable Sector Protection
CS
AT45DB021D
CS pin must first be asserted as it would
CS pin has been asserted, the appropriate 4-byte sequence for the Disable
SI
Opcode
Byte 1
Each transition
represents 8 bits
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
6.1.3Various Aspects About Software Controlled Protection
Software controlled protection is useful in applications in which the
processor. In such instances, the WP pin may be left floating (the WP pin is internally pulled high) and sector
protection can be controlled using the Enable Sector Protection and Disable Sector Protection commands.
If the device is power cycled, then the software controlled protection will be disabled. Once the device is powered
up, the Enable Sector Protection command should be reissued if sector protection is desired and if the WP pin is
not used.
7.Hardware Controlled Protection
Sectors specified for protection in the Sector Protection Register and the Sector Protection Register itself can be
protected from program and erase operations by asserting the WP pin and keeping the pin in its asserted state.
The Sector Protection Register and any sector specified for protection cannot be erased or reprogrammed as long
as the WP pin is asserted. In order to modify the Sector Protection Register, the WP pin must be deasserted. If the
WP pin is permanently connected to GND, then the content of the Sector Protection Register cannot be changed.
If the WP pin is deasserted, or permanently connected to VCC, then the content of the Sector Protection Register
can be modified.
WP pin is not or cannot be controlled by a host
The WP pin will override the software controlled protection method but only for protecting the sectors. For example,
if the sectors were not previously protected by the Enable Sector Protection command, then simply asserting the
WP pin would enable the sector protection within the maximum specified t
deasserted; however, the sector protection would no longer be enabled (after the maximum specified t
long as the Enable Sector Protection command was not issued while the WP pin was asserted. If the Enable
Sector Protection command was issued before or while the WP pin was asserted, then simply deasserting the WP
pin would not disable the sector protection. In this case, the Disable Sector Protection command would need to be
issued while the WP pin is deasserted to disable the sector protection. The Disable Sector Protection command is
also ignored whenever the WP pin is asserted.
A noise filter is incorporated to help protect against spurious noise that may inadvertently assert or deassert the
WP pin.
3638K–DFLASH–11/2012
time. When the WPpinis
WPE
WPD
time) as
11
The table below details the sector protection status for various scenarios of the WP pin, the Enable Sector
Protection command, and the Disable Sector Protection command.
Figure 7-1.
WP Pin and Protection Status
12
WP
Table 7-1.
Time
Period
1High
2LowXXEnabledRead Only
3High
WP Pin and Protection Status
Enable Sector Protection
WP Pin
Command Not Issued Previously
Issue Command
Command Issued During Period 1
Issue Command
7.1Sector Protection Register
The nonvolatile Sector Protection Register specifies which sectors are to be protected or unprotected with either
the software or hardware controlled protection methods. The Sector Protection Register contains 8-bytes of data,
of which byte locations zero through seven contain values that specify whether sectors zero through seven will be
protected or unprotected. The Sector Protection Register is user modifiable and must first be erased before it can
be reprogrammed. Table 7-3 illustrates the format of the Sector Protection Register
Command
–
or 2
–
Disable Sector
Protection Command
X
Issue Command
–
Not Issued Yet
Issue Command
–
3
Sector
Protection Status
Disabled
Disabled
Enabled
Enabled
Disabled
Enabled
Sector
Protection
Register
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Table 7-2.Sector Protection Register.
Sector Number0 (0a, 0b)1 to 7
Protected
See Table 7-3
Unprotected00H
FFH
Table 7-3.Sector 0 (0a, 0b)
0a0b
(Page 0-7)(Page 8-127)
Bit7,6Bit5,4Bit1,0
Sectors 0a, 0b Unprotected0000xxxx0xH
Protect Sector 0a1100xxxxCxH
Protect Sector 0b (Page 8-127)0011xxxx3xH
Protect Sectors 0a (Page 0-7), 0b (Page 8-127)
Note:1. The default value for bytes 0 through 7 when shipped from Adesto is 00H
x = don’t care
(1)
1111xxxxFxH
Bit3,2
Value
Data
12
AT45DB021D
3638K–DFLASH–11/2012
7.1.1Erase Sector Protection Register Command
In order to modify and change the values of the Sector Protection Register, it must first be erased using the Erase
Sector Protection Register command.
AT45DB021D
To erase the Sector Protection Register, the
CS pin must first be asserted as it would be with any other command.
Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device via
the SI pin. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and CFH. After the last
bit of the opcode sequence has been clocked in, the CS pin must be deasserted to initiate the internally self-timed
erase cycle. The erasing of the Sector Protection Register should take place in a time of t
, during which time the
PE
Status Register will indicate that the device is busy. If the device is powered-down before the completion of the
erase cycle, then the contents of the Sector Protection Register cannot be guaranteed.
The Sector Protection Register can be erased with the sector protection enabled or disabled. Since the erased
state (FFH) of each byte in the Sector Protection Register is used to indicate that a sector is specified for
protection, leaving the sector protection enabled during the erasing of the register allows the protection scheme to
be more effective in the prevention of accidental programming or erasing of the device. If for some reason an
erroneous program or erase command is sent to the device immediately after erasing the Sector Protection
Register and before the register can be reprogrammed, then the erroneous program or erase command will not be
processed because all sectors would be protected.
Once the Sector Protection Register has been erased, it can be reprogrammed using the Program Sector
Protection Register command.
To program the Sector Protection Register, the CS pin must first be asserted and the appropriate 4-byte opcode
sequence must be clocked into the device via the SI pin. The 4-byte opcode sequence must start with 3DH and be
followed by 2AH, 7FH, and FCH. After the last bit of the opcode sequence has been clocked into the device, the
data for the contents of the Sector Protection Register must be clocked in. As described in Section 7.1, the Sector
Protection Register contains 4-bytes of data, so 4-bytes must be clocked into the device. The first byte of data
corresponds to sector zero, the second byte corresponds to sector one, the third byte corresponds to sector two,
and the last byte of data corresponding to sector three.
After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed
program cycle. The programming of the Sector Protection Register should take place in a time of tP, during which
time the Status Register will indicate that the device is busy. If the device is powered-down during the program
cycle, then the contents of the Sector Protection Register cannot be guaranteed.
IfthepropernumberofdatabytesisnotclockedinbeforetheCS pin is deasserted, then the protection status of
the sectors corresponding to the bytes not clocked in can not be guaranteed. For example, if only the first two bytes
are clocked in instead of the complete 8-bytes, then the protection status of the last six sectors cannot be
Opcode
Byte 4
3638K–DFLASH–11/2012
13
guaranteed. Furthermore, if more than 8-bytes of data is clocked into the device, then the data will wrap back
around to the beginning of the register. For instance, if 9-bytes of data are clocked in, then the ninth byte will be
stored at byte location zero of the Sector Protection Register.
If a value other than 00H or FFH is clocked into a byte location of the Sector Protection Register, then the
protection status of the sector corresponding to that byte location cannot be guaranteed. For example, if a value of
17H is clocked into byte location two of the Sector Protection Register, then the protection status of sector two
cannot be guaranteed.
The Sector Protection Register can be reprogrammed while the sector protection enabled or disabled. Being able
to reprogram the Sector Protection Register with the sector protection enabled allows the user to temporarily
disable the sector protection to an individual sector rather than disabling sector protection completely.
The Program Sector Protection Register command utilizes the internal SRAM buffer for processing. Therefore, the
contents of the buffer will be altered from its previous state when this command is issued.
To read the Sector Protection Register, the CS pin must first be asserted. Once the CS pin has been asserted, an
opcode of 32H and three dummy bytes must be clocked in via the SI pin. After the last bit of the opcode and
dummy bytes have been clocked in, any additional clock pulses on the SCK pins will result in data for the content
of the Sector Protection Register being output on the SO pin. The first byte corresponds to sector 0 (0a, 0b), the
second byte corresponds to sector one, the third byte corresponds to sector two, and the last byte (byte four)
corresponds to sector three. Once the last byte of the Sector Protection Register has been clocked out, any
additional clock pulses will result in undefined data being output on the SO pin. The CS must be deasserted to
terminate the Read Sector Protection Register operation and put the output into a high-impedance state.
Table 7-6.Read Sector Protection Register Command
CommandByte 1Byte 2Byte 3Byte 4
Read Sector Protection Register32HxxHxxHxxH
Note:xx = Dummy Byte
Figure 7-4.Read Sector Protection Register
CS
Opcode
Byte 4
Data Byte
n
Data Byte
n + 1
Data Byte
n + 3
14
SI
OpcodeXXX
SO
Each transition
represents 8 bits
AT45DB021D
Data BytenData Byte
n + 1
Data Byte
n + 3
3638K–DFLASH–11/2012
7.1.4Various Aspects About the Sector Protection Register
The Sector Protection Register is subject to a limit of 10,000 erase/program cycles. Users are encouraged to
carefully evaluate the number of times the Sector Protection Register will be modified during the course of the
applications’ life cycle. If the application requires that the Sector Protection Register be modified more than the
specified limit of 10,000 cycles because the application needs to temporarily unprotect individual sectors (sector
protection remains enabled while the Sector Protection Register is reprogrammed), then the application will need
to limit this practice. Instead, a combination of temporarily unprotecting individual sectors along with disabling
sector protection completely will need to be implemented by the application to ensure that the limit of 10,000 cycles
is not exceeded.
8.Security Features
8.1Sector Lockdown
The device incorporates a Sector Lockdown mechanism that allows each individual sector to be permanently
locked so that it becomes read only. This is useful for applications that require the ability to permanently protect a
number of sectors against malicious attempts at altering program code or security information. Once a sector is
locked down, it can never be erased or programmed, and it can never be unlocked.
To issue the Sector Lockdown command, the CS pin must first be asserted as it would be for any other command.
Once the CS pin has been asserted, the appropriate 4-byte opcode sequence must be clocked into the device in
the correct order. The 4-byte opcode sequence must start with 3DH and be followed by 2AH, 7FH, and 30H. After
the last byte of the command sequence has been clocked in, then three address bytes specifying any address
within the sector to be locked down must be clocked into the device. After the last address bit has been clocked in,
the CS pin must then be deasserted to initiate the internally self-timed lockdown sequence.
AT45DB021D
The lockdown sequence should take place in a maximum time of tP, during which time the Status Register will
indicate that the device is busy. If the device is powered-down before the completion of the lockdown sequence,
then the lockdown status of the sector cannot be guaranteed. In this case, it is recommended that the user read the
Sector Lockdown Register to determine the status of the appropriate sector lockdown bits or bytes and reissue the
Sector Lockdown command if necessary.
Table 8-1.Sector Lockdown
CommandByte 1Byte 2Byte 3Byte 4
Sector Lockdown3DH2AH7FH30H
Figure 8-1.Sector Lockdown
CS
SI
Opcode
Byte 1
Each transition
represents 8 bits
Opcode
Byte 2
Opcode
Byte 3
Opcode
Byte 4
Address
Bytes
Address
Bytes
Address
Bytes
3638K–DFLASH–11/2012
15
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