– Single Cycle Reprogram (Erase and Program)
– Internal Address and Data Latches for 64 Bytes
• Internal Program Control and Timer
• Hardware and Software Data Protection
• Fast Program Cycle Times
– Page(64Byte)ProgramTime–10ms
– Chip Erase Time– 10 ms
• DATA Polling for End of Program Detection
• Low-power Dissipation
– 50mAActiveCurrent
–300 µA CMOS Standby Current
• Typical Endurance > 10,000 Cycles
• Single 5V ± 10% Supply
• CMOS and TTL Compatible Inputs and Outputs
• Commercial and Industrial Temperature Ranges
Description
The AT29C256 is a five-volt-only in-system Flash programmable and erasable read
only memory (PEROM). Its 256K of memory is organized as 32,768 words by 8 bits.
Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers
access times to 70 ns with power dissipation of just 275 mW. When the device is
deselected, the CMOS standby current is less than 300 µA. The device endurance is
such that any sector can typically be written to in excess of 10,000 times.
256K (32K x 8)
5-volt Only
Flash Memory
AT29C256
Pin Configurations
Pin NameFunction
A0 - A14Addresses
CE
OE
WE
I/O0 - I/O7Data Inputs/Outputs
NCNo Connect
DCDon’t Connect
PLCC and LCC Top View
Note:PLCC package pins 1 and 17 are
DON’T CONNECT.
Chip Enable
Output Enable
Write Enable
A7
432
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
NC
13
I/O0
14151617181920
I/O1
A12WEDC
I/O2
GND
1
DC
VCC
A14
323130
I/O3
I/O4
A13
29
28
27
26
25
24
23
22
21
I/O5
A8
A9
A11
NC
OE
A10
CE
I/O7
I/O6
DIP Top View
WE
A12
I/O0
I/O1
I/O2
GND
TSOP Top View
22
OE
23
A11
24
A9
25
A8
26
A13
27
A14
28
VCC
1
WE
2
A12
3
A7
4
A6
5
A5
6
A4
7
A3
A7
A6
A5
A4
A3
A2
A1
A0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Type 1
28
VCC
27
A14
26
A13
25
A8
24
A9
23
A11
22
OE
21
A10
20
CE
19
I/O7
18
I/O6
17
I/O5
16
I/O4
15
I/O3
21
A10
20
CE
19
I/O7
18
I/O6
17
I/O5
16
I/O4
15
I/O3
14
GND
13
I/O2
12
I/O1
11
I/O0
10
A0
9
A1
8
A2
Rev. 0046O–FLASH–06/02
1
Block Diagram
To allow for simple in-system reprogrammability, the AT29C256 does not require high
input voltages for programming. Five-volt-only commands determine the operation of
the device. Reading data out of the device is similar to reading from a static RAM.
Reprogramming the AT29C256 is performed on a page basis; 64 bytes of data are
loaded into the device and then simultaneously programmed. The contents of the entire
device may be erased by using a six-byte software code (although erasure before programming is not needed).
During a reprogram cycle, the address locations and 64 bytes of data are internally
latched, freeing the address and data bus for other operations. Following the initiation of
a program cycle, the device will automatically erase the page and then program the
latched data using an internal control timer. The end of a program cycle can be detected
by DATA
access for a read, program or chip erase can begin.
polling of I/O7. Once the end of a program cycle has been detected a new
Device Operation
READ: The AT29C256 is accessed like a static RAM. When CE and OE are low and
WE
is high, the data stored at the memory location determined by the address pins
is asserted on the outputs. The outputs are put in the high impedance state whenever
CE
or OE is high. This dual-line control gives designers flexibility in preventing bus
contention.
BYTE LOAD: A byte load is performed by applying a low pulse on the WE
with CE
edge of CE
CE
software codes for data protection and chip erasure.
or WE low (respectively) and OE high. The address is latched on the falling
or WE, whichever occurs last. The data is latched by the first rising edge of
or WE. Byte loads are used to enter the 64 bytes of a page to be programmed or the
page is to be changed, data for the entire page must be loaded into the device. Any byte
that is not loaded during the programming of its page will be indeterminate. Once the
bytes of a page are loaded into the device, they are simultaneously programmed during
the internal programming period. After the first data byte has been loaded into the
device, successive bytes are entered in the same manner. Each new byte to be programmed must have its high-to-low transition on WE
high transition of WE
(or CE) of the preceding byte. If a high-to-low transition is not
detected within 150 µs of the last low-to-high transition, the load period will end and the
internal programming period will start. A6 to A14 specify the page address. The page
address must be valid during each high-to-low transition of WE
the byte address within the page. The bytes may be loaded in any order; sequential
loading is not required. Once a programming operation has been initiated, and for the
duration of t
, a read operation will effectively be a polling operation.
WC
SOFTWARE DATA PROTECTION: A software controlled data protection feature is
available on the AT29C256. Once the software protection is enabled a software algorithm must be issued to the device before a program may be performed. The software
protection feature may be enabled or disabled by the user; when shipped from Atmel,
the software data protection feature is disabled. To enable the software data protection,
a series of three program commands to specific addresses with specific data must be
performed. After the software data protection is enabled the same three program commands must begin each program cycle in order for the programs to occur. All software
program commands must obey the page program timing specifications. Once set, the
software data protection feature remains active unless its disable command is issued.
Power transitions will not reset the software data protection feature, however the software feature will guard against inadvertent program cycles during power transitions.
(or CE) within 150 µs of the low-to-
(or CE). A0 to A5 specify
Once set, software data protection will remain active unless the disable command
sequence is issued.
After setting SDP, any attempt to write to the device without the three-byte command
sequence will start the internal write timers. No data will be written to the device; however, for the duration of t
, a read operation will effectively be a polling operation.
WC
After the software data protection’s three-byte command code is given, a byte load is
performed by applying a low pulse on the WE
tively) and OE
high. The address is latched on the falling edge of CE or WE, whichever
occurs last. The data is latched by the first rising edge of CE
or CE input with CE or WE low (respec-
or WE. The 64 bytes of
data must be loaded into each sector by the same procedure as outlined in the program
section under device operation.
HARDWARE DATA PROTECTION: Hardware features protect against inadvertent
programs to the AT29C256 in the following ways: (a) V
(typical), the program function is inhibited; (b) V
reached the V
sense level, the device will automatically time out 5 ms (typical) before
CC
CC
programming; (c) Program inhibit – holding any one of OE
sense – if VCCis below 3.8V
CC
power on delay – once VCChas
low, CE high or WE high
inhibits program cycles; and (d) Noise filter – pulses of less than 15 ns (typical) on the
WE
or CE inputs will not initiate a program cycle.
0046O–FLASH–06/02
3
PRODUCT IDENTIFICATION: The product identification mode identifies the device
and manufacturer and may be accessed by a hardware operation. For details, see
Operating Modes or Product Identification.
DATA POLLING:The AT29C256 features DATA
gram cycle. During a program cycle an attempted read of the last byte loaded will result
in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA
begin at any time during the program cycle.
TOGGLE BIT: In addition to DATA
determining the end of a program or erase cycle. During a program or erase operation,
successive attempts to read data from the device will result in I/O6 toggling between
one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid
data will be read. Examining the toggle bit may begin at any time during a program
cycle.
OPTIONAL CHIP ERASE MODE: The entire device can be erased by using a six-byte
software code. Please see Software Chip Erase application note for details.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°Cto+125°C
Storage Temperature ..................................... -65°Cto+150°C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+0.6V
polling to indicate the end of a pro-
polling may
polling the AT29C256 provides another method for
*NOTICE:Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
4
AT29C256
0046O–FLASH–06/02
DC and AC Operating Range
AT29C256
AT29C256-70AT29C256-90AT29C256-12AT29C256-15
Operating
Temperature (Case)
V
Power Supply5V ± 5%5V± 10%5V± 10%5V± 10%
CC
Note:
Not recommended for New Designs.
Com.0°C-70°C0°C-70°C0°C-70°C
Ind.-40°C-85°C-40°C-85°C-40°C-85°C
Operating Modes
ModeCEOEWEAiI/O
ReadV
Program
(2)
5V Chip EraseV
Standby/Write InhibitV
IL
V
IL
IL
IH
Write InhibitXXV
Write InhibitXV
Output DisableXV
High Voltage Chip EraseV
IL
Product Identification
V
Hardware
Software
(5)
IL
Notes: 1. X can be VILor VIH.
2. Refer to AC Programming Waveforms.
3. V
= 12.0V ± 0.5V.
H
4. Manufacturer Code: 1F, Device Code: DC.
5. See details under Software Product Identification Entry/Exit.
V
IL
V
IH
V
IH
(1)
X
IL
IH
(3)
V
H
V
IL
V
IH
V
IL
V
IL
AiD
AiD
Ai
OUT
IN
XXHighZ
IH
X
XHighZ
V
IL
V
IH
A1-A14 = VIL,A9=VH,A0=VILManufacturer Code
XHighZ
A1-A14 = VIL,A9=VH,A0=VIHDevice Code
A0 = V
A0 = V
IL
IH
Manufacturer Code
Device Code
0°C-70°C
-40°C-85°C
(4)
(4)
(4)
(4)
DC Characteristics
SymbolParameterConditionMinMaxUnits
I
LI
I
LO
I
SB1
I
SB2
I
CC
V
IL
V
IH
V
OL
V
OH1
V
OH2
0046O–FLASH–06/02
Input Load CurrentVIN=0VtoV
Output Leakage CurrentV
=0VtoV
I/O
CC
CC
VCCStandby Current CMOSCE =VCC-0.3VtoV
VCCStandby Current TTLCE =2.0VtoV
VCCActive Currentf = 5 MHz; I
CC
= 0 mA50mA
OUT
CC
10µA
10µA
300µA
3mA
Input Low Voltage0.8V
Input High Voltage2.0V
Output Low VoltageIOL=2.1mA0.45V
Output High VoltageIOH=-400µA2.4V
Output High Voltage CMOSIOH=-100µA;VCC=4.5V4.2V
5
AC Read Characteristics
SymbolParameter
t
ACC
t
CE
t
OE
t
DF
t
OH
Note:
(1)
(2)
(3)(4)
Address to Output Delay7090120150ns
CE to Output Delay7090120150ns
OE to Output Delay040040050070ns
CE or OE to Output Float025025030040ns
Output Hold from OE,CEor Address,
whichever occurred first
Not recommended for New Designs.
AC Read Waveforms
(1)(2)(3)(4)
AT29C256-70AT29C256-90AT29C256-12
AT29C256-15
MinMax
0000ns
UnitsMinMaxMinMaxMinMax
Notes: 1. CE may be delayed up to t
2. OE
may be delayed up to tCE-tOEafter the falling edge of CE without impact on tCEor by t
without impact on t
3. t
is specified from OE or CE whichever occurs first (CL = 5 pF).
DF
ACC
.
4. This parameter is characterized and is not 100% tested.
6
AT29C256
ACC-tCE
after the address transition without impact on t
ACC
.
ACC-tOE
after an address change
0046O–FLASH–06/02
Loading...
+ 12 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.