Rainbow Electronics AT29C256 User Manual

Features

Fast Read Access Time – 70 ns
5-volt Only Reprogramming
Page Program Operation
– Single Cycle Reprogram (Erase and Program) – Internal Address and Data Latches for 64 Bytes
Internal Program Control and Timer
Fast Program Cycle Times
– Page(64Byte)ProgramTime–10ms – Chip Erase Time– 10 ms
DATA Polling for End of Program Detection
Low-power Dissipation
– 50mAActiveCurrent –300 µA CMOS Standby Current
Typical Endurance > 10,000 Cycles
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and Industrial Temperature Ranges

Description

The AT29C256 is a five-volt-only in-system Flash programmable and erasable read only memory (PEROM). Its 256K of memory is organized as 32,768 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 70 ns with power dissipation of just 275 mW. When the device is deselected, the CMOS standby current is less than 300 µA. The device endurance is such that any sector can typically be written to in excess of 10,000 times.
256K (32K x 8) 5-volt Only Flash Memory
AT29C256

Pin Configurations

Pin Name Function
A0 - A14 Addresses
CE
OE
WE
I/O0 - I/O7 Data Inputs/Outputs
NC No Connect
DC Don’t Connect
PLCC and LCC Top View
Note: PLCC package pins 1 and 17 are
DON’T CONNECT.
Chip Enable
Output Enable
Write Enable
A7
432
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
NC
13
I/O0
14151617181920
I/O1
A12WEDC
I/O2
GND
1
DC
VCC
A14
323130
I/O3
I/O4
A13
29 28 27 26 25 24 23 22 21
I/O5
A8 A9 A11 NC OE A10 CE I/O7 I/O6
DIP Top View
WE
A12
I/O0 I/O1 I/O2
GND
TSOP Top View
22
OE
23
A11
24
A9
25
A8
26
A13
27
A14
28
VCC
1
WE
2
A12
3
A7
4
A6
5
A5
6
A4
7
A3
A7 A6 A5 A4 A3 A2 A1 A0
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Type 1
28
VCC
27
A14
26
A13
25
A8
24
A9
23
A11
22
OE
21
A10
20
CE
19
I/O7
18
I/O6
17
I/O5
16
I/O4
15
I/O3
21
A10
20
CE
19
I/O7
18
I/O6
17
I/O5
16
I/O4
15
I/O3
14
GND
13
I/O2
12
I/O1
11
I/O0
10
A0
9
A1
8
A2
Rev. 0046O–FLASH–06/02
1

Block Diagram

To allow for simple in-system reprogrammability, the AT29C256 does not require high input voltages for programming. Five-volt-only commands determine the operation of the device. Reading data out of the device is similar to reading from a static RAM. Reprogramming the AT29C256 is performed on a page basis; 64 bytes of data are loaded into the device and then simultaneously programmed. The contents of the entire device may be erased by using a six-byte software code (although erasure before pro­gramming is not needed).
During a reprogram cycle, the address locations and 64 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a program cycle, the device will automatically erase the page and then program the latched data using an internal control timer. The end of a program cycle can be detected by DATA access for a read, program or chip erase can begin.
polling of I/O7. Once the end of a program cycle has been detected a new

Device Operation

READ: The AT29C256 is accessed like a static RAM. When CE and OE are low and
WE
is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE
or OE is high. This dual-line control gives designers flexibility in preventing bus
contention.
BYTE LOAD: A byte load is performed by applying a low pulse on the WE with CE edge of CE CE software codes for data protection and chip erasure.
or WE low (respectively) and OE high. The address is latched on the falling
or WE, whichever occurs last. The data is latched by the first rising edge of
or WE. Byte loads are used to enter the 64 bytes of a page to be programmed or the
or CE input
2
AT29C256
0046O–FLASH–06/02
AT29C256
PROGRAM: Thedeviceisreprogrammedonapagebasis.Ifabyteofdatawithina
page is to be changed, data for the entire page must be loaded into the device. Any byte that is not loaded during the programming of its page will be indeterminate. Once the bytes of a page are loaded into the device, they are simultaneously programmed during the internal programming period. After the first data byte has been loaded into the device, successive bytes are entered in the same manner. Each new byte to be pro­grammed must have its high-to-low transition on WE high transition of WE
(or CE) of the preceding byte. If a high-to-low transition is not detected within 150 µs of the last low-to-high transition, the load period will end and the internal programming period will start. A6 to A14 specify the page address. The page address must be valid during each high-to-low transition of WE the byte address within the page. The bytes may be loaded in any order; sequential loading is not required. Once a programming operation has been initiated, and for the duration of t
, a read operation will effectively be a polling operation.
WC
SOFTWARE DATA PROTECTION: A software controlled data protection feature is available on the AT29C256. Once the software protection is enabled a software algo­rithm must be issued to the device before a program may be performed. The software protection feature may be enabled or disabled by the user; when shipped from Atmel, the software data protection feature is disabled. To enable the software data protection, a series of three program commands to specific addresses with specific data must be performed. After the software data protection is enabled the same three program com­mands must begin each program cycle in order for the programs to occur. All software program commands must obey the page program timing specifications. Once set, the software data protection feature remains active unless its disable command is issued. Power transitions will not reset the software data protection feature, however the soft­ware feature will guard against inadvertent program cycles during power transitions.
(or CE) within 150 µs of the low-to-
(or CE). A0 to A5 specify
Once set, software data protection will remain active unless the disable command sequence is issued.
After setting SDP, any attempt to write to the device without the three-byte command sequence will start the internal write timers. No data will be written to the device; how­ever, for the duration of t
, a read operation will effectively be a polling operation.
WC
After the software data protections three-byte command code is given, a byte load is performed by applying a low pulse on the WE tively) and OE
high. The address is latched on the falling edge of CE or WE, whichever
occurs last. The data is latched by the first rising edge of CE
or CE input with CE or WE low (respec-
or WE. The 64 bytes of data must be loaded into each sector by the same procedure as outlined in the program section under device operation.
HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT29C256 in the following ways: (a) V (typical), the program function is inhibited; (b) V reached the V
sense level, the device will automatically time out 5 ms (typical) before
CC
CC
programming; (c) Program inhibit – holding any one of OE
sense – if VCCis below 3.8V
CC
power on delay – once VCChas
low, CE high or WE high inhibits program cycles; and (d) Noise filter – pulses of less than 15 ns (typical) on the WE
or CE inputs will not initiate a program cycle.
0046O–FLASH–06/02
3
PRODUCT IDENTIFICATION: The product identification mode identifies the device
and manufacturer and may be accessed by a hardware operation. For details, see Operating Modes or Product Identification.
DATA POLLING: The AT29C256 features DATA gram cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been com­pleted, true data is valid on all outputs and the next cycle may begin. DATA begin at any time during the program cycle.
TOGGLE BIT: In addition to DATA determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle.
OPTIONAL CHIP ERASE MODE: The entire device can be erased by using a six-byte software code. Please see Software Chip Erase application note for details.

Absolute Maximum Ratings*

Temperature Under Bias................................ -55°Cto+125°C
Storage Temperature ..................................... -65°Cto+150°C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+0.6V
polling to indicate the end of a pro-
polling may
polling the AT29C256 provides another method for
*NOTICE: Stresses beyond those listed under Absolute
Maximum Ratingsmay cause permanent dam­age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
4
AT29C256
0046O–FLASH–06/02

DC and AC Operating Range

AT29C256
AT29C256-70 AT29C256-90 AT29C256-12 AT29C256-15
Operating Temperature (Case)
V
Power Supply 5V ± 5% 5V± 10% 5V± 10% 5V± 10%
CC
Note:
Not recommended for New Designs.
Com. 0°C-70°C0°C-70°C0°C-70°C
Ind. -40°C-85°C-40°C-85°C-40°C-85°C

Operating Modes

Mode CE OE WE Ai I/O
Read V
Program
(2)
5V Chip Erase V
Standby/Write Inhibit V
IL
V
IL
IL
IH
Write Inhibit X X V
Write Inhibit X V
Output Disable X V
High Voltage Chip Erase V
IL
Product Identification
V
Hardware
Software
(5)
IL
Notes: 1. X can be VILor VIH.
2. Refer to AC Programming Waveforms.
3. V
= 12.0V ± 0.5V.
H
4. Manufacturer Code: 1F, Device Code: DC.
5. See details under Software Product Identification Entry/Exit.
V
IL
V
IH
V
IH
(1)
X
IL
IH
(3)
V
H
V
IL
V
IH
V
IL
V
IL
Ai D
Ai D
Ai
OUT
IN
XXHighZ
IH
X
XHighZ
V
IL
V
IH
A1-A14 = VIL,A9=VH,A0=VILManufacturer Code
XHighZ
A1-A14 = VIL,A9=VH,A0=VIHDevice Code
A0 = V
A0 = V
IL
IH
Manufacturer Code
Device Code
0°C-70°C
-40°C-85°C
(4)
(4)
(4)
(4)

DC Characteristics

Symbol Parameter Condition Min Max Units
I
LI
I
LO
I
SB1
I
SB2
I
CC
V
IL
V
IH
V
OL
V
OH1
V
OH2
0046O–FLASH–06/02
Input Load Current VIN=0VtoV
Output Leakage Current V
=0VtoV
I/O
CC
CC
VCCStandby Current CMOS CE =VCC-0.3VtoV
VCCStandby Current TTL CE =2.0VtoV
VCCActive Current f = 5 MHz; I
CC
= 0 mA 50 mA
OUT
CC
10 µA
10 µA
300 µA
3mA
Input Low Voltage 0.8 V
Input High Voltage 2.0 V
Output Low Voltage IOL=2.1mA 0.45 V
Output High Voltage IOH=-400µA 2.4 V
Output High Voltage CMOS IOH=-100µA;VCC=4.5V 4.2 V
5

AC Read Characteristics

Symbol Parameter
t
ACC
t
CE
t
OE
t
DF
t
OH
Note:
(1)
(2)
(3)(4)
Address to Output Delay 70 90 120 150 ns
CE to Output Delay 70 90 120 150 ns
OE to Output Delay 0 40 0 40 0 50 0 70 ns
CE or OE to Output Float 0 25 0 25 0 30 0 40 ns
Output Hold from OE,CEor Address, whichever occurred first
Not recommended for New Designs.
AC Read Waveforms
(1)(2)(3)(4)
AT29C256-70 AT29C256-90 AT29C256-12
AT29C256-15
Min Max
0000 ns
UnitsMin Max Min Max Min Max
Notes: 1. CE may be delayed up to t
2. OE
may be delayed up to tCE-tOEafter the falling edge of CE without impact on tCEor by t
without impact on t
3. t
is specified from OE or CE whichever occurs first (CL = 5 pF).
DF
ACC
.
4. This parameter is characterized and is not 100% tested.
6
AT29C256
ACC-tCE
after the address transition without impact on t
ACC
.
ACC-tOE
after an address change
0046O–FLASH–06/02
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