Rainbow Electronics AT28HC256 User Manual

Features

5
6
7
8
9
10
11
12
13

29
28
27
26
25
24
23
22
21

A6
A5
A4
A3
A2
A1
A0

NC

I/O0

A8
A9
A11
NC
OE
A10
CE
I/O7
I/O6

432

1

323130

14151617181920

I/O1

I/O2

GND

DC

I/O3

I/O4

I/O5

A7

A12

A14DCVCCWEA13

• Fast Read Access Time – 70 ns

• Automatic Page Write Operation

– Internal Address and Data Latches for 64 Bytes
– Internal Control Timer

• Fast Write Cycle Times

– Page Write Cycle Time: 3 ms or 10 ms Maximum
– 1 to 64-byte Page Write Operation

• Low Power Dissipation

– 80 mA Active Current
– 3 mA Standby Current

• Hardware and Software Data Protection

• DATA Polling for End of Write Detection

• High Reliability CMOS Technology

– Endurance: 104 or 105 Cycles
– Data Retention: 10 Years

• Single 5V ± 10% Supply

• CMOS and TTL Compatible Inputs and Outputs

• JEDEC Approved Byte-wide Pinout

• Full Military, Commercial, and Industrial Temperature Ranges

256 (32K x 8)
High-speed
Parallel
EEPROM

Description

The AT28HC256 is a high-performance electrically erasable and programmable read
only memory. Its 256K of memory is organized as 32,768 words by 8 bits. Manufac­tured with Atmel’s advanced nonvolatile CMOS technology, the AT28HC256 offers

(continued)

Pin Configurations

Pin Name Function

A0 - A14 Addresses

CE

OE

WE

I/O0 - I/O7 Data Inputs/Outputs

NC No Connect

DC Don’t Connect

Note: PLCC package pins 1 and
17 are DON’T CONNECT.

Chip Enable

Output Enable

Write Enable

LCC, PLCC

Top View

1

OE

2

A11

3

A9

4

A8

5

A13

6

WE

7

VCC

8

A14

9

A12

10

A7

11

A6

12

A5

13

A4

14

A3

CERDIP, PDIP, FLATPACK

Top V iew

A14
A12

I/O0
I/O1
I/O2

GND

1
2
3

A7

4

A6

5

A5

6

A4

7

A3

8

A2

9

A1

10

A0

11
12
13
14

28

VCC

27

WE

26

A13

25

A8

24

A9

23

A11

22

OE

21

A10

20

CE

19

I/O7

18

I/O6

17

I/O5

16

I/O4

15

I/O3

TSOP

Top V iew

PGA

To p V i e w

28

A10

27

CE

26

I/O7

25

I/O6

24

I/O5

23

I/O4

22

I/O3

21

GND

20

I/O2

19

I/O1

18

I/O0

17

A0

16

A1

15

A2

AT28HC256

Rev. 0007I–12/99

1

access times to 70 ns with power dissipation of just
440 mW. When the AT28HC256 is deselected, the standby
current is less than 5 mA.

The AT28HC256 is accessed like a Static RAM for the read
or write cycle without the need for external components.
The device contains a 64-byte page register to allow writing
of up to 64 bytes simultaneously. During a write cycle, the
address and 1 to 64 bytes of data are internally latched,
freeing the addresses and data bus for other operations.
Following the initiation of a write cycle, the device will auto­matically write the latched data using an internal control

Block Diagram

timer. The end of a write cycle can be detected by DATA
Polling of I/O7. Once the end of a write cycle has been
detected a new access for a read or write can begin.

Atmel’s 28HC256 has additional features to ensure high
quality and manufacturability. The device utilizes internal
error correction for extended endurance and improved data
retention characteristics. An optional software data protec­tion mechanism is available to guard against inadvertent
writes. The device also includes an extra 64 bytes of
EEPROM for device identification or tracking.

Absolute Maximum Ratings*

Temperature under Bias ................................ -55°C to +125°C

Storage Temperature ..................................... -65°C to +150°C

All Input Voltages
(including NC Pins)

with Respect to Ground...................................-0.6V to +6.25V

All Output Voltages

with Respect to Ground.............................-0.6V to V

Voltage on OE

with Respect to Ground...................................-0.6V to +13.5V

and A9

+ 0.6V

CC

*NOTICE: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam­age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability

2

AT28HC256

AT28HC256

Device Operation

READ: The AT28HC256 is accessed like a Static RAM.

When CE
at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high
impedance state when either CE
line control gives designers flexibility in preventing bus con­tention in their system.

BYTE WRITE: A low pulse on the WE
or WE low (respectively) and OE high initiates a write cycle.
The address is latched on the falling edge of CE
whichever occurs last. The data is latched by the first rising
edge of CE
will automatically time itself to completion. Once a pro­gramming operation has been initiated and for the duration
of t
operation.

PAGE WRITE: The page write operation of the
AT28HC256 allows 1 to 64 bytes of data to be written into
the device during a single internal programming period. A
page write operation is initiated in the same manner as a
byte write; the first byte written can then be followed by 1 to
63 additional bytes. Each successive byte must be written
within 150
exceeded the AT28C256 will cease accepting data and
commence the internal programming operation. All bytes
during a page write operation must reside on the same
page as defined by the state of the A6 - A14 inputs. That is,
for each WE
operation, A6 - A14 must be the same.

The A0 to A5 inputs are used to specify which bytes within
the page are to be written. The bytes may be loaded in any
order and may be altered within the same load period. Only
bytes which are specified for writing will be written; unnec­essary cycling of other bytes within the page does not
occur.

DATA

to indicate the end of a write cycle. During a byte or page
write cycle an attempted read of the last byte written will
result in the complement of the written data to be presented
on I/O
data is valid on all outputs, and the next write cycle may
begin. DATA
cycle.

TOGGLE BIT: In addition to DATA
provides another method for determining the end of a write
cycle. During the write operation, successive attempts to
read data from the device will result in I/O
between one and zero. Once the write has completed, I/O
will stop toggling and valid data will be read. Testing the
toggle bit may begin at any time during the write cycle.

DATA PROTECTION: If precautions are not taken, inad­vertent writes to any 5-volt-only nonvolatile memory may

and OE are low and WE is high, the data stored

or OE is high. This dual-

or CE input with CE

or WE,

or WE. Once a byte write has been started it

, a read operation will effectively be a polling

WC

µs (t

) of the previous byte. If the t

BLC

BLC

limit is

high to low transition during the page write

POLLING: The AT28HC256 features DATA Polling

. Once the write cycle has been completed, true

7

Polling may begin at anytime during the write

Polling the AT28HC256

toggling

6

occur during transition of the host system power supply.
Atmel has incorporated both hardware and software fea­tures that will protect the memory against inadvertent
writes.

HARDWARE PROTECTION: Hardware features protect
against inadvertent writes to the AT28HC256 in the follow­ing ways: (a) V
write function is inhibited; (b) V

has reached 3.8V the device will automatically time out

V

CC

sense – if VCC is below 3.8V (typical) the

CC

power-on delay – once

CC

5 ms typical) before allowing a write; (c) write inhibit – hold­ing any one of OE

low, CE high or WE high inhibits write
cycles; and (d) noise filter – pulses of less than 15 ns (typi­cal) on the WE

or CE inputs will not initiate a write cycle.

SOFTWARE DATA PROTECTION: A software controlled
data protection feature has been implemented on the
AT28HC256. When enabled, the software data protection
(SDP), will prevent inadvertent writes. The SDP feature
may be enabled or disabled by the user; the AT28HC256 is
shipped from Atmel with SDP disabled.

SDP is enabled by the host system issuing a series of three
write commands; three specific bytes of data are written to
three specific addresses (refer to “Software Data Protec­tion” algorithm). After writing the 3-byte command
sequence and after t

the entire AT28HC256 will be pro-

WC

tected against inadvertent write operations. It should be
noted, that once protected the host may still perform a byte
or page write to the AT28HC256. This is done by preceding
the data to be written by the same 3-byte command
sequence.

Once set, SDP will remain active unless the disable com­mand sequence is issued. Power transitions do not disable
SDP and SDP will protect the AT28HC256 during power-up
and power-down conditions. All command sequences must
conform to the page write timing specifications. It should
also be noted that the data in the enable and disable com­mand sequences is not written to the device and the mem­ory addresses used in the sequence may be written with
data in either a byte or page write operation.

After setting SDP, any attempt to write to the device without
the three byte command sequence will start the internal
write timers. No data will be written to the device; however,
for the duration of t

, read operations will effectively be

WC

polling operations.
DEVICE IDENTIFICATION: An extra 64 bytes of EEPROM

memory are available to the user for device identification.
By raising A9 to 12V

± 0.5V and using address locations

7FC0H to 7FFFH the additional bytes may be written to or
read from in the same manner as the regular memory
array.

6

OPTIONAL CHIP ERASE MODE: The entire device can
be erased using a 6-byte software code. Please see “Soft-
ware Chip Erase” application note for details.

3

DC and AC Operating Range

AT28HC256-70 AT28HC256-90 AT28HC256-12

Com. 0°C - 70°C0°C - 70°C0°C - 70°C
Operating
Temperature (Case)

Ind. -40°C - 85°C-40°C - 85°C-40°C - 85°C

Mil. -55°C - 125°C-55°C - 125°C

V

Power Supply 5V ± 10% 5V ± 10% 5V ± 10%

CC

Operating Modes

Mode CE OE WE I/O

Read V

(2)

Write

Standby/Write Inhibit V

IL

V

IL

IH

Write Inhibit X X V

Write Inhibit X V

Output Disable X V

Chip Erase V

IL

V

IL

V

IH

(1)

X

IL

IH

(3)

V

H

V

IH

V

IL

D

OUT

D

IN

XHigh Z

IH

X

XHigh Z

V

IL

High Z

Notes: 1. X can be VIL or VIH.

2. Refer to AC programming waveforms.

= 12.0V ± 0.5V.

3. V

H

DC Characteristics

Symbol Parameter Condition Min Max Units

I

I

I

I

I

V

V

V

V

LI

LO

SB1

SB2

CC

IL

IH

OL

OH

Input Load Current VIN = 0V to VCC + 1V 10 µA

Output Leakage Current V

= 0V to V

I/O

CC

10 µA

AT28HC256-90, -12 3 mA

VCC Standby Current TTL CE = 2.0V to V

VCC Standby Current CMOS CE = VCC - 0.3V to V

V

Active Current f = 5 MHz; I

CC

CC

= 0 mA 80 mA

OUT

AT28HC256-70 60 mA

AT28HC256-90, -12 300 µA

CC

Input Low Voltage 0.8 V

Input High Voltage 2.0 V

Output Low Voltage IOL = 6.0 mA 0.45 V

Output High Voltage I

= -4 mA 2.4 V

OH

4

AT28HC256

AC Read Characteristics

tR, tF < 5 ns

Symbol Parameter

AT28HC256

AT28HC256-70 AT28C256-90 AT28HC256-12

UnitsMinMaxMinMaxMinMax

t

ACC

(1)

t

CE

(2)

t

OE

(3)(4)

t

DF

t

OH

AC Read Waveforms

Address to Output Delay 70 90 120 ns

CE to Output Delay 70 90 120 ns

OE to Output Delay 0 35 0 40 0 50 ns

CE or OE to Output Float 035040050ns

Output Hold from OE, CE or Address,
whichever occurred first

(1)(2)(3)(4)

Notes: 1. CE may be delayed up to t

2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by t
without impact on t

is specified from OE or CE whichever occurs first (CL = 5 pF).

3. t

DF

ACC

.

4. This parameter is characterized and is not 100% tested.

000ns

- tCE after the address transition without impact on t

ACC

ACC

.

- tOE after an address change

ACC

Input Test Waveforms and

Output Test Load

Measurement Level

Pin Capacitance

f = 1 MHz, T = 25°C

Symbol Typ Max Units Conditions

C

IN

C

OUT

Note: 1. This parameter is characterized and is not 100% tested.

(1)

46pFV

812pFV

IN

OUT

= 0V

= 0V

5

AC Write Characteristics

Symbol Parameter Min Max Units

t

AS

t

AH

t

CS

t

CH

t

WP

t

DS

tDH, t

t

DV

, t

OES

OEH

Address, OE Setup Time 0 ns

Address Hold Time 50 ns

Chip Select Setup Time 0 ns

Chip Select Hold Time 0 ns

Write Pulse Width (WE or CE)100ns

Data Setup Time 50 ns

Data, OE Hold Time 0 ns

Time to Data Valid NR

(1)

Note: 1. NR = No Restriction.

AC Write Waveforms

WE Controlled

CE Controlled

6

AT28HC256

AT28HC256

Page Mode Write Characteristics

Symbol Parameter Min Typ Max Units

t

WC

Write Cycle Time (option available)

AT28HC256 5 10 ms

AT28HC256F 2 3 ms

t

AS

t

AH

t

DS

t

DH

t

WP

t

BLC

t

WPH

Address Setup Time 0 ns

Address Hold Time 50 ns

Data Setup Time 50 ns

Data Hold Time 0 ns

Write Pulse Width 100 ns

Byte Load Cycle Time 150 µs

Write Pulse Width High 50 ns

Page Mode Write Waveforms

(1)(2)

Notes: 1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE).

2. OE must be high only when WE and CE are both low.

Chip Erase Waveforms

tS = tH = 5 µsec (min.)
tW = 10 msec (min.)
V

= 12.0V ± 0.5V

H

7

Software Data Protection
Enable Algorithm

(1)

Software Data Protection
Disable Algorithm

(1)

LOAD DATA AA

TO

ADDRESS 5555

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA A0

TO

ADDRESS 5555

LOAD DATA XX

TO

ANY ADDRESS

LOAD LAST BYTE

TO

LAST ADDRESS

WRITES ENABLED

(4)

ENTER DATA
PROTECT STATE

(2)

Notes for software program code:

1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).

2. Write Protect state will be activated at end of
write even if no other data is loaded.

3. Write Protect state will be deactivated at end of
write period even if no other data is loaded.

4. 1 to 64 bytes of data are loaded.

LOAD DATA AA

TO

ADDRESS 5555

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA 80

TO

ADDRESS 5555

LOAD DATA AA

TO

ADDRESS 5555

LOAD DATA 55

TO

ADDRESS 2AAA

LOAD DATA 20

TO

ADDRESS 5555

LOAD DATA XX

TO

ANY ADDRESS

LOAD LAST BYTE

TO

LAST ADDRESS

EXIT DATA
PROTECT STATE

(4)

(3)

Software Protected Write Cycle Waveforms

(1)(2)

Notes: 1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE) after the software

code has been entered.

must be high only when WE and CE are both low.

2. OE

8

AT28HC256

AT28HC256

Data Polling Characteristics

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

WR

Notes: 1. These parameters are characterized and not 100% tested.

Data Hold Time 0 ns

OE Hold Time 0 ns

OE to Output Delay

Write Recovery Time 0 ns

2. See “AC Read Characteristics” on page 5.

(2)

(1)

Data Polling Waveforms

ns

Toggle Bit Characteristics

Symbol Parameter Min Typ Max Units

t

DH

t

OEH

t

OE

t

OEHP

t

WR

Notes: 1. These parameters are characterized and not 100% tested.

Data Hold Time 10 ns

OE Hold Time 10 ns

OE to Output Delay

OE High Pulse 150 ns

Write Recovery Time 0 ns

2. See “AC Read Characteristics” on page 5.

(2)

(1)

Toggle Bit Waveforms

ns

Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.

2. Beginning and ending state of I/O6 will vary.

3. Any address location may be used but the address should not vary.

9

10

AT28HC256

AT28HC256

Ordering Information

I

t

ACC

(ns)

70 80 60 AT28HC256(E,F)-70JC

90 80 0.3 AT28HC256(E,F)-90JC

120 80 0.3 AT28HC256(E,F)-12JC

(mA)

CC

80 0.3 AT28HC256(E,F)-90DM/883

80 0.3 AT28HC256(E,F)-12JI

80 0.3 AT28HC256(E,F)-12DM/883

(1)

Ordering Code Package Operation RangeActive Standby

AT28HC256(E,F)-70PC

0.3 AT28HC256(E,F)-70JI
AT28HC256(E,F)-70PI

AT28HC256(E,F)-90PC

AT28HC256(E,F)-90JI
AT28HC256(E,F)-90PI

AT28HC256(E,F)-90FM/883
AT28HC256(E,F)-90LM/883
AT28HC256(E,F)-90UM/883

AT28HC256(E,F)-12PC
AT28HC256(E,F)-12SC
AT28HC256(E,F)-12TC

AT28HC256(E,F)-12PI
AT28HC256(E,F)-12SI
AT28HC256(E,F)-12TI

AT28HC256(E,F)-12FM/883
AT28HC256(E,F)-12LM/883
AT28HC256(E,F)-12UM/883

32J
28P6

32J
28P6

32J
28P6

32J
28P6

28D6
28F
32L
28U

32J
28P6
28S
28T

32J
28P6
28S
28T

28D6
28F
32L
28U

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Package Type

28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)

28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)

32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)

32L 32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)

28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

28S 28-lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)

28T 28-lead, Plastic Thin Small Outline Package (TSOP)

28U 28-pin, Ceramic Pin Grid Array (PGA)

W Die

Options

Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms

E High Endurance Option: Endurance = 100K Write Cycles

F Fast Write Option: Write Time = 3 ms

11

Ordering Information

I

t

ACC

(ns)

90 80 0.3 5962-88634 03 UX

120 80 0.3 5962-88634 01 UX

Note: 1. See “Valid Part Numbers” table on next page.

(mA)

CC

80 0.3 5962-88634 04 UX

80 0.3 5962-88634 02 UX

(1)

(Continued)

Ordering Code Package Operation RangeActive Standby

5962-88634 03 XX
5962-88634 03 YX
5962-88634 03 ZX

5962-88634 04 XX
5962-88634 04 YX
5962-88634 04 ZX

5962-88634 01 XX
5962-88634 01 YX
5962-88634 01 ZX

5962-88634 02 XX
5962-88634 02 YX
5962-88634 02 ZX

28U
28D6
32L
28F

28U
28D6
32L
28F

28U
28D6
32L
28F

28U
28D6
32L
28F

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Military/883C

Class B, Fully Compliant

(-55°C to 125°C)

Package Type

28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)

28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)

32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)

32L 32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)

28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

28S 28-lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)

28T 28-lead, Plastic Thin Small Outline Package (TSOP)

28U 28-pin, Ceramic Pin Grid Array (PGA)

W Die

Options

Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms

E High Endurance Option: Endurance = 100K Write Cycles

F Fast Write Option: Write Time = 3 ms

12

AT28HC256

AT28HC256

Ordering Information Note

Previous data sheets included the low power suffixes L, LE and LF on the At28HC256 for 120 ns and 90 ns speeds.
The low power parameters are now standard; therefore, the L, LE and LF suffixes are no longer required.

Valid Part Numbers

The following table lists standard Atmel products that can be ordered:

Device Numbers Speed Package and Temperature Combinations

AT28HC256 70 JC, JI, PC, PI

AT28HC256 90 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

AT28HC256E 90 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

AT28HC256F 90 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

AT28HC256 12 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

AT28HC256E 12 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

AT28HC256F 12 JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883

Die Products

Reference Section: Parallel EEPROM Die Products

13

Packaging Information

28D6, 28-lead, 0.600" Wide, Non-windowed,

Ceramic Dual Inline Package (Cerdip)
Dimensions in Inches and (Millimeters)

MIL-STD-1835 D-10 CONFIG A

1.49(37.9)

.225(5.72)

SEATING
PLANE

MAX

.200(5.08)
.125(3.18)

.110(2.79)
.090(2.29)

.015(.381)
.008(.203)

1.44(36.6)

1.300(33.02) REF

.065(1.65)
.045(1.14)

.620(15.7)
.590(15.0)

PIN

1

.610(15.5)
.510(13.0)

.023(.584)
.014(.356)

0

REF

15

.700(17.8) MAX

.098(2.49)

.005(.127)

.060(1.52)
.015(.381)

MAX

MIN

28F, 28-lead, Non-windowed, Ceramic Bottom­brazed Flat Package (Flatpack)
Dimensions in Inches and (Millimeters)

MIL-STD-1835 F-12 CONFIG B

PIN #1 ID

.728(18.5)
.712(18.1)

.416(10.6)
.384(9.75)

.006(.152)

.004(.102)

.077(1.96)
.043(1.09)

.286(7.26)
.274(6.96)

.370(9.40)

.250(6.35)

.019(.483)

.015(.381)

.050(1.27) BSC

.045(1.14) MAX

.119(3.02)

.087(2.21)

.045(1.14)

.026(.660)

32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-016 AE

.045(1.14) X 45˚

.032(.813)
.026(.660)

.050(1.27) TYP

.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)

PIN NO. 1
IDENTIFY

.300(7.62) REF

.430(10.9)
.390(9.90)

.025(.635) X 30˚ - 45˚

.553(14.0)
.547(13.9)

.595(15.1)
.585(14.9)

AT CONTACT
POINTS

.022(.559) X 45˚ MAX (3X)

.012(.305)
.008(.203)

.530(13.5)
.490(12.4)

.021(.533)

.013(.330)

.030(.762)
.015(.381)
.095(2.41)

.060(1.52)
.140(3.56)
.120(3.05)

32L, 32-pad, Non-windowed, Ceramic Leadless Chip
Carrier (LCC)
Dimensions in Inches and (Millimeters)*

MIL-STD-1835 C-12

*Controlling dimension: millimeters

14

AT28HC256

Packaging Information

AT28HC256

28P6, 28-lead, 0.600" Wide, Plastic Dual Inline

Package (PDIP)
Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-011 AB

1.47(37.3)

.220(5.59)

SEATING

PLANE

MAX

.161(4.09)
.125(3.18)

.110(2.79)
.090(2.29)

.012(.305)

.008(.203)

1.44(36.6)

1.300(33.02) REF

.065(1.65)
.041(1.04)

.630(16.0)
.590(15.0)

.690(17.5)
.610(15.5)

PIN

1

.566(14.4)
.530(13.5)

.090(2.29)

.005(.127)

.065(1.65)

.015(.381)
.022(.559)
.014(.356)

0

REF

15

28S, 28-lead, 0.300" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)

MAX

MIN

28T, 28-lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*

INDEX

MARK

AREA

0.55 (0.022)
BSC

0

REF

5

7.15 (0.281)
REF

8.10 (0.319)

7.90 (0.311)

0.20 (0.008)

0.10 (0.004)

0.70 (0.028)

0.30 (0.012)

11.9 (0.469)

11.7 (0.461)

0.27 (0.011)

0.18 (0.007)

13.7 (0.539)

13.1 (0.516)

1.25 (0.049)

1.05 (0.041)

0.20 (0.008)

0.15 (0.006)

*Controlling dimension: millimeters

28U, 28-pin, Ceramic Pin Grid Array (PGA)
Dimensions in Inches and (Millimeters)

15

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Corporate Headquarters

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FAX [phone]

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FAX [phone]

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FAX [phone]

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FAX [phone]

Fax-on-Demand

North America:
1-[phone]

International:
1-[phone]

e-mail

[e-mail]

Web Site

http://www.atmel.com

BBS

1-[phone]

© Atmel Corporation 1999.

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war­ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop­erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are
not authorized for use as critical components in life support devices or systems.

®

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Terms and product names in this document may be trademarks of others.

and/or ™ are registered trademarks and trademarks of Atmel Corporation.

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