Rainbow Electronics AT28C0101 User Manual

Features
Fast Read Access Time - 120 ns
Automatic Page Write Operation
Internal Address and Data Latches for 128-Bytes Internal Control Timer
Page Write Cycle Time - 10 ms Maximum 1 to 128-Byte Page Write Operation
Low Power Dissipation
80 mA Active Current 300 µA CMOS Standby Current
Hardware and Software Data Protection
DAT A Polling for End of Write Detection
High Reliability CMOS Technology
Endurance: 104 or 105 Cycles Data Retention: 10 Years
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-Wide Pinout
Description
The AT28C010 i s a high -perf ormanc e E lectr ica lly E rasab le a nd P rog rammab le R ea d Only Memory. Its one meg abit of memory is orga nized as 131,072 wor ds by 8 bits. Manufactured with A tmel ’s a dvanc ed no nv ola til e CMO S technology, the device offe rs access times to 120 ns with power dissipation of just 440 mW. When the device is deselected, the CMOS standby current is less than 300 µA.
(continued)
AT28C010 Mil
1-Megabit (128K x 8) Paged Parallel EEPROMs
AT28C010 Military
Pin Configuration
Pin Name Function
A0 - A16 Addresses CE Chip Enable OE Outp ut Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect
CERDIP, FLATPACK
Top View
NC A16 A15 A12
I/O0 I/O1 I/O2
GND
1 2 3 4 5
A7
6
A6
7
A5
8
A4
9
A3
10
A2
11
A1
12
A0
13 14 15 16
32
VCC
31
WE
30
NC
29
A14
28
A13
27
A8
26
A9
25
A11
24
OE
23
A10
22
CE
21
I/O7
20
I/O6
19
I/O5
18
I/O4
17
I/O3
A12
44 LCC
Top View
A15
A16NCNCNCNC
65432
7 8
A7
9
A6
10
A5
11
NC
12
NC
13
NC
14
A4
15
A3
16
A2
17
A1
1819202122232425262728
A0
I/O0
I/O1
I/O2
VCCWENCNCA14
1
4443424140
NC
I/O3
VSS
I/O4
I/O5
I/O6
39 38 37 36 35 34 33 32 31 30 29
I/O7
A13 A8 A9 A11 NC NC NC NC OE A10 CE
I/O0
5
A7
6
A6
7
A5
8
A4
9
A3
10
A2
11
A1
12
A0
13
32 LCC
Top View
A12
A15
A16NCVCCWENC
432
1
323130
14151617181920
I/O1
I/O2
I/O3
I/O4
I/O5
GND
PGA
Top View
29 28 27 26 25 24 23 22 21
I/O6
A14 A13 A8 A9 A11 OE A10 CE I/O7
Rev. 0010C–10/98
1
The AT28C010 is accessed like a Static RAM for the read or write cycle without the need for external components. The device contai ns a 128- byte pa ge r egist er to a llow writ­ing of up to 128-bytes simultane ous ly . Durin g a write c ycle , the address and 1 to 128-bytes of data are internally latched, freeing the address and data bus for other opera­tions. Following the initiation of a write cycle, the device will automatically write the latched data using an internal con­trol timer. The end of a write cycle can be detected by
Block Diagram
POLLING of I/O7. Once the end of a write cy cle has
DATA been detected a new access for a read or write can begin.
Atmel's 28C010 has additional features to ensure high quality and manufacturability. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protec­tion mechanism is available to guard against inadvertent writes. The device also includes an extra 128-bytes of EEPROM for device identification or tracking.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
All Input Voltages (including NC Pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground.............................-0.6V to V
Voltage on OE
with Respect to Ground...................................-0.6V to +13.5V
and A9
+ 0.6V
CC
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the device. This i s a stress rating o nl y and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions f or e xtended p eriods ma y aff ect de vice reliability.
2
AT28C010 Mil
Device Operation
READ:
When CE at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state when either CE line control gives designers flexibility in preventing bus con­tention in their system.
BYTE WRITE:
or WE low (respec tive ly ) and OE high initiates a write cycle. The address is latched on the fallin g edge of CE whichever occurs last. The data is latched by the first rising edge of CE will automatically time itself to completion. Once a pro­gramming operation has been in itiate d and for the du ratio n of t tion.
PAGE WRITE:
allows 1 to 128-bytes o f data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; the first byte written can then be followe d by 1 t o 127 add i­tional bytes. Each successive byte must be written within 150 µs (t exceeded the AT28C010 will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the s tate of the A7 - A16 inputs. For each WE tion, A7 - A16 must be the same.
The A0 to A6 inputs are used to specify which bytes wi thin the page are to be written. The bytes may be lo ade d in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnec­essary cycling of other bytes within the page does not occur.
DATA
indicate the end of a write cycle. During a byte or page write cycle an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA cycle.
TOGGLE BIT:
provides another m etho d for determining th e end of a wr it e cycle. During the write operation, successive attempts to read data from th e device will resul t in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop togglin g and v alid dat a will be read. Re ading th e toggle bit may begin at any time during the write cycle.
DATA PROTECTION:
vertent writes may oc cur during transitio ns of the hos t sys-
The AT28C010 is accessed like a Static RAM.
and OE are low and WE is high, the data stored
or OE is high. This dual-
A low pulse on the W E
or CE input with CE
or WE,
or WE. Once a byte write has been started it
, a read operation will effectively be a polling opera-
WC
The page write operatio n of the AT28C01 0
) of the previous byte. If the t
BLC
BLC
limit is
high to low transition during the page write opera-
POLLING:
The AT28C010 features DATA
Polling to
Polling may begin at an ytim e d uring the wr ite
In addition to DATA
Polling the AT28C010
If precautions are not taken, inad-
AT28C010 Mil
tem power supply. Atmel has incorp orated both har dware and software features that will protect the memory against inadvertent writes.
HARDWARE PROTECTION:
against inadvertent writes to the AT28C010 in the following ways: (a) V
sense - if VCC is below 3.8V (typical) the write
CC
function is inhibited; (b) V reached 3.8V the device will automatically time out 5 ms (typical) before allowing a write: (c) write inhibit - holding any one of OE
low, CE high or WE high inhibits write cycles; (d) noise filter - pulses of less than 15 ns (typical) on the WE
or CE inputs will not initiate a write cycle.
SOFTWARE DATA PROTECTION:
data protection feat ure has been impleme nted on the AT28C010. When enabl ed, the software da ta protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28C010 is shipped from Atmel with SDP disabled.
SDP is enabled by the host system issuing a series of three write commands; th ree specifi c bytes of dat a are writ ten to three specific addre sses ( refer to S oftware Da ta Pro tectio n Algorithm). After writing the 3-byte command sequence and after t
the entire AT28C010 will be protected against
WC
inadvertent write operations. It should be noted, that once protected the hos t may still perfor m a byte or page writ e to the AT28C010. This is done by preceding the data to be written by the same 3-byte command sequence used to enable SDP.
Once set, SDP will remain activ e unless the disable c om­mand sequence is i ssued. Power transitions d o no t di sabl e SDP and SDP will protect the AT28C010 during power-up and power-down conditions . A ll comman d s eque nc es must conform to the page write timing specifications. The data in the enable and disable command sequences is not written to the device and the memory addresses used in the sequence may be written with data in eit her a by te or page write operation.
After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be writt en to the de vice; h owever , for the duration of t
, read operations will effectively be poll-
WC
ing operations.
DEVICE IDENTIFICATI ON:
EEPROM memory are available to the user for device iden­tification. By raising A9 to 12V ± 0.5V and using address locations 1FF80H to 1FFFFH the bytes may be written to or read from in the same manner as the regular memory array.
OPTIONAL CHIP ERASE MODE:
be erased using a 6-byte software code. Please see Soft­ware Chip Erase application note for details.
Hardware features protect
power-on delay - once VCC has
CC
A software controlled
An extra 128-bytes of
The entire device can
3
DC and AC Operating Range
AT28C010-12 AT28C010-15 AT28C010-20 AT28C010-25
Operating Temperature (Case)
Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%
V
CC
Mil. -55°C - 125°C -55°C - 125°C -55°C - 125°C -55°C - 125°C
Operating Modes
Mode CE OE WE I/O
Read V
(2)
Write Standby/Write Inhibit V
IL
V
IL
IH
Write Inhibit X X V Write Inhibit X V Output Disable X V
V V
X
IL
IH
(1)
IL
IH
V
IH
V
IL
X High Z
IH
X X High Z
D
OUT
D
IN
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms
DC Characteristics
Symbol Parameter Condition Min Max Units
I
LI
I
LO
I
SB1
I
SB2
I
CC
V
IL
V
IH
V
OL
V
OH1
V
OH2
Input Load Current VIN = 0V to VCC + 1V 10 µA Output Leakage Current V
= 0V to V
I/O
CC
10 µA VCC Standby Current CMOS CE = VCC - 0.3V to VCC + 1V 300 µA VCC Standby Current TTL CE = 2.0V to VCC + 1V 3 mA VCC Active Current f = 5 MHz; I
= 0 mA 80 mA
OUT
Input Low Voltage 0.8 V Input High Voltage 2.0 V Output Low Voltage IOL = 2.1 mA 0.45 V Output High Voltage IOH = -400 µA2.4V Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4,2 V
4
AT28C010 Mil
AC Read Characteristics
Symbol Parameter
t
ACC
(1)
t
CE
(2)
tOE
(3, 4)
t
DF
t
OH
AC Read Waveforms
Address to Output Delay 120 150 200 250 ns CE to Output Delay 120 150 200 250 ns OE to Output Delay 050055055055ns CE or OE to Output Float 050055055055ns Output Hold from OE, CE or
Address, whichever occurred first
(1)(2)(3)(4)
AT28C010 Mil
AT28C010-12 AT28C010-15 AT28C010-20 AT28C010-25
UnitsMin Max Min Max Min Max Min Max
0000ns
Notes: 1. CE may be delayed up to t
2. OE may be delayed up to tCE - tOE after the falling edge of CE with out im pa ct on tCE or by t without impact in t
ACC
.
- tCE after the address transition without impact on t
ACC
ACC
.
- tOE after an address change
ACC
3. tDF is specified from OE or CE wichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Output Test Load
Measurement Level
Pin Capacitance
f = 1 MHz, T = 25°C
Symbol Ty p Max Units Conditions
C
IN
C
OUT
Note: 1. This parameter is 100% characterized and is not 100% tested.
(1)
410pFV 812pFV
IN
OUT
= 0V
= 0V
5
AC Write Characteristics
Symbol Parameter Min Max Units
t
WC
t
AS
t
AH
t
DS
t
DH
t
WP
t
BLC
t
WPH
Write Cycle Time 10 ms Address Set-up Time 0 ns Address Hold Time 50 ns Data Set-up Time 50 ns Data Hold Time 0 ns Write Pulse Width 100 ns Byte Load Cycle Time 150 µs Write Pulse Width High 50 ns
AC Write Waveforms
WE Controlled
CE Controlled
6
AT28C010 Mil
AT28C010 Mil
Page Mode Characteristics
Symbol Parameter Min Max Units
t
AS
t
AH
t
CS
t
CH
t
WP
t
DS
tDH, t
, t
OES
OEH
Address, OE Set-up Time 0 ns Address Hold Time 50 ns Chip Select Set-up Time 0 ns Chip Select Hold Time 0 ns Write Pulse Width (WE or CE) 100 ns Data Set-up Time 50 ns Data, OE Hold Time 0 ns
Page Mode Write Waveforms
Notes: 1. A7 through A16 must specify the page address during each high to low transition of WE (or CE).
2. OE must be high only when WE and CE are both low.
(1)(2)
Chip Erase Waveforms
tS = 5 msec (min.) tW = tH = 10 msec (min.) VH = 12.0V ± 0.5V
7
Software Data Protection Enable Algorithm
LOAD DATA AA
TO
ADDRESS 5555
(1)
Software Data Protection Disable Algorithm
LOAD DATA AA
TO
ADDRESS 5555
(1)
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS
LOAD LAST BYTE
TO
LAST ADDRESS
WRITES ENABLED
(4)
ENTER DATA PROTECT STATE
(2)
Notes: 1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Write Protect state will be activated at end of write even if no other data is loaded.
3. Write Protect state will be dea cti vated at end of write period even if no other data if loaded.
4. 1 to 128 bytes of data are loaded.
Software Protected Program Cycle Waveform
(1)(2)(3)
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 20
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS
LOAD LAST BYTE
TO
LAST ADDRESS
EXIT DATA PROTECT STATE
(4)
(3)
Notes: 1. A0 - A14 must conform to the addressing sequence for the first 3 bytes as shown above.
2. After the command se que nce ha s bee n i ss ued an d a pa ge write operation follows, th e p age ad dres s inputs (A7 - A16) must be the same for each high to low transition of WE
(or CE).
3. OE must be high only when WE and CE are both low.
8
AT28C010 Mil
AT28C010 Mil
Data Polling Characterstics
Symbol Parameter Min Typ Max Units
t
DH
t
OEH
t
OE
t
WR
Notes: 1. These parameters are characterized and not 100% tested.
Data Hold Time 10 ns OE Hold Time 10 ns OE to Output Delay Write Recovery Time 0 ns
2. See AC Read Characteristics.
(2)
(1)
Data Polling Waveforms
ns
Toggle Bit Characteristics
Symbol Parameter Min Typ Max Units
t
DH
t
OEH
t
OE
t
OEHP
t
WR
Notes: 1. These parameters are characterized and not 100% tested.
Data Hold Time 10 ns OE Hold Time 10 ns OE to Output Delay OE High Pulse 150 ns Write Recovery Time 0 ns
2. See AC Read Characteristics.
(2)
Toggle Bit Waveforms
(1)
(1)(2)(3)
ns
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any addres location may be used but the address should not vary.
9
AT28C010 Ordering Information
I
(mA)
t
ACC
(ns)
120 80 0.3 AT28C010(E)-12DM/883
150 80 0.3 AT28C010(E)-15DM/883
200 80 0.3 AT28C010(E)-20DM/883
250 80 0.3 AT28C010(E)-25DM/883
Note: 1. See Valid Part Number table below.
CC
Ordering Code Package Operation RangeActive Standby
AT28C010(E)-12EM/883 AT28C010-12FM/883 AT28C010(E)-12LM/883 AT28C010(E)-12UM/883
AT28C010(E)-15EM/883 AT28C010-15FM/883 AT28C010(E)-15LM/883 AT28C010(E)-15UM/883
AT28C010(E)-20EM/883 AT28C010-20FM/883 AT28C010(E)-20LM/883 AT28C010(E)-20UM/883
AT28C010(E)-25EM/883 AT28C010-25FM/883 AT28C010(E)-25LM/883 AT28C010(E)-25UM/883
(1)
32D6 32L 32F 44L 30U
32D6 32L 32F 44L 30U
32D6 32L 32F 44L 30U
32D6 32L 32F 44L 30U
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Package Type
32D6 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
32F 32-Lead, Non-Windowed, Ceramic Bottom -Brazed Flat Package (Flat pack) 32L 32-Pad, Non-Windowe d, Ceramic Leadless Chip Carrier (LCC) 44L 44-Pad, Non-Windowe d, Ceramic Leadless Chip Carrier (LCC) 30U 30-Pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
10
AT28C010 Mil
AT28C010 Mil
5962-38267 Ordering Info rmation
I
(mA)
t
ACC
(ns)
120 80 0.3 5962-38267 07 MXX
150 80 0.3 5962-38267 05 MXX
200 80 0.3 5962-38267 03 MXX
250 80 0.3 5962-38267 01 MXX
Note: 1. See Valid Part Number table below.
CC
Ordering Code Package Operation RangeActive Standby
5962-38267 07 MZX 5962-38267 07 MYX 5962-38267 07 MTX
5962-38267 05 MUX 5962-38267 05 MZX 5962-38267 05 MYX 5962-38267 05 MTX
5962-38267 03 MUX 5962-38267 03 MZX 5962-38267 03 MYX 5962-38267 03 MTX
5962-38267 01 MUX 5962-38267 01 MZX 5962-38267 01 MYX 5962-38267 01 MTX
(1)
32D6 32F 44L 30U
32D6 32L 32F 44L 30U
32D6 32L 32F 44L 30U
32D6 32L 32F 44L 30U
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Package Type
32D6 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
32F 32-Lead, Non-Windowed, Ceramic Bottom -Brazed Flat Package (Flat pack) 32L 32-Pad, Non-Windowe d, Ceramic Leadless Chip Carrier (LCC) 44L 44-Pad, Non-Windowe d, Ceramic Leadless Chip Carrier (LCC) 30U 30-Pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
11
Valid Part Numbers
The following table lists standard Atmel products that can be ordered.
Device Numbers Speed Package and Temperature Combinations AT28C010 AT28C010E AT28C010 AT28C010E AT28C010 AT28C010E AT28C010 AT28C010E AT28C010
12 DM/883, EM/883, FM/883, LM/883, UM/883 12 DM/883, EM/883, LM/883, UM/883 15 DM/883, EM/883, FM/883, LM/883, UM/883 15 DM/883, EM/883, LM/883, UM/883 20 DM/883, EM/883, FM/883, LM/883, UM/883 20 DM/883, EM/883, LM/883, UM/883 25 DM/883, EM/883, FM/883, LM/883, UM/883 25 DM/883, EM/883, LM/883, UM/883
–W
Die Products
Reference Section: Parallel EEPROM Die Products
12
AT28C010 Mil
Packaging Information
PIN #1 ID
.370(9.40) .270(6.86)
.019(.482) .015(.381)
.050(1.27) BSC
.045(1.14) MAX
.120(3.05) .098(2.49)
.045(1.14) .026(.660)
.072(1.82) .030(0.76)
.408(10.4) .355(9.02)
.006(.152) .004(.101)
.488(12.4) .472(12.0)
.829(21.1)
.811(20.6)
AT28C010 Mil
32D6
, 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual inline Package (Cerdip) Dimensions in Inches and (Millimeters)
MIL-STD-1835 D-16 CONFIG A
1.68(42.7)
.225(5.72)
SEATING
PLANE
.200(5.08) .125(3.18)
MAX
.110(2.79) .090(2.29)
.015(.381)
.008(.203)
1.64(41.7)
1.500(38.10) REF
.065(1.65) .045(1.14)
.620(15.7) .590(15.0)
PIN
1
0
REF
15
.700(17.8) MAX
.610(15.5) .570(14.5)
.098(2.49)
.005(.127)
.060(1.52)
.015(.381) .023(.584) .014(.356)
MAX
MIN
32F
, 32-Lead, Non-Windowed, Ceramic Bottom Brazed Flat Package (Flatpack) Dimensions in Inches and (Millimeters)
MIL-STD-1835 F-18 CONFIG B JEDEC OUTLINE MO-115
32L
, 32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-12
*Controlling dimension: millimeters *Controlling dimension: millimeters
44L
, 44-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-5
13
Packaging Information
30U
, 30-Pin, Ceramic Pin Grid Array (PGA)
Dimensions in Inches and (Millimeters)
14
AT28C010 Mil
AT28C010 Mil
15
Atmel Headquarters Atmel Operations
Corporate Headquarters
2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441- 0311 FAX (408) 487-2600
Europe
Atmel U.K., Ltd. Coliseum Business Centre Riverside Way Camberley, Surrey GU15 3YL England TEL (44) 1276-686677 FAX (44) 1276-686697
Asia
Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon, Hong Kong TEL (852) 27219778 FAX (852) 27221369
Japan
Atmel Japan K.K. Tonetsu Shinkawa Bldg., 9F 1-24-8 Shinka wa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581
Atmel Colorado Springs
1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759
Atmel Rousset
Zone Indu strie lle 13106 Rousset Cedex, France TEL (33) 4 42 53 60 00 FAX (33) 4 42 53 60 01
Fax-on-Demand
North America: 1-(800) 292-8635
International: 1-(408) 441-0732
e-mail
literature@atmel.com
Web Site
http://www.atmel.com
BBS
1-(408) 436-4309
© Atmel Corporation 1998.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war­ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop­erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems.
®
Marks bearing Ter ms and product names in this document may be trademarks of others.
and/or ™ are registered trademarks and trademarks of Atmel Corporation.
Printed on recycled paper.
0010C–10/98/xM
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