Rainbow Electronics AT27C256R User Manual

Features
Fast Read Access Time - 45 ns
Low-Power CMOS Operation
µµµµ
– 100
– 20 mA max. Active at 5 MHz
JEDEC Standard Packages
– 28-Lead 600-mil PDIP – 32-Lead PLCC – 28-Lead TSOP and SOIC
±
5V
10% Supply
High Reliability CMOS Technology
– 2,000V ESD Protection – 200 mA Latchup Immunity
Rapid™ Programming Algorithm - 100
CMOS and TTL Compatible Inputs and Outputs
Integrated Product Identification Code
Commercial, Industrial and Automotive Temperature Ranges
µµµµ
s/byte (typical)
Description
The AT27C256R is a low- pow er , high- pe rf orman ce 262,144-bit one-time pro gramm a­ble read only memory (OTP EPROM) organized 32K by 8 bits. It requires only one 5V power supply in norm al read mo de operat ion. Any byt e can be acc essed in less than 45 ns, eliminating the n eed for speed reducing WAIT s tates on high-pe rformance microprocessor systems.
Atmel’s scaled CMOS technolo gy provide s low-acti ve power c onsumptio n, and fast programming. Power consumption is typically only 8 mA in Active Mode and less than 10 µA in Standby.
(continued)
Pin Configurations
Pin Name Function
A0 to A14 Addresses O0 - O7 Outputs CE OE NC No Connect
PLCC Top View
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
NC
13
O0
Note: PLCC Package Pins 1 and
17 are DON’T CONNECT.
Chip Enable Output En able
A7
A12
VPPNCVCC
A14
432
1
323130
14151617181920
O1
O2
O3O4O5
NC
GND
A13
29 28 27 26 25 24 23 22 21
A8 A9 A11 NC OE A10 CE O7 O6
A11
A13
A14 VCC VPP
A12
PDIP, SOIC Top View
VPP
A12
A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2
GND
TSOP Top View
OE
22 23
A9
24
A8
25 26 27 28
1 2 3
A7
4
A6
5
A5
6
A4
7
A3
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Type 1
28
VCC
27
A14
26
A13
25
A8
24
A9
23
A11
22
OE
21
A10
20
CE
19
O7
18
O6
17
O5
16
O4
15
O3
21
A10
20
CE
19
O7
18
O6
17
O5
16
O4
15
O3
14
GND
13
O2
12
O1
11
O0
10
A0
9
A1
8
A2
256K (32K x 8) OTP EPROM
AT27C256R
256K EPROM
Rev. 0014H–07/98
1
The AT27C256 R is ava ilable in a c hoice of indu stry st an­dard JEDEC-approved one time programmable (OTP) plastic DIP, PLCC, SOIC, and TSOP packages. All devices feature two-line control (CE ibility to prevent bus contention.
With 32K byte storage capability, the AT27C256R allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media.
Atmel’s 27C256R has addit ional features to ensure high quality and efficient producti on use. The Rapi d™ Progra m­ming Algori thm reduc es the time require d to prog ram the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronica lly identifi es the devic e and manufacturer. This feature is used by industry standard programming equi pmen t to se lect the prop er progr ammi ng algorithms and voltages.
, OE) to give designers the flex-
System Considerations
Switching between active and standby conditions via the Chip Enable pin may produ ce tra ns ien t vo ltag e ex cu rs i ons . Unless accommodated by the system design, these tran­sients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be uti­lized for each device. This capacitor should be connected between the V close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the V terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array.
and Ground terminals of the device, as
CC
and Ground
CC
2
AT27C256R
Block Diagram
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature.....................................-65°C to +150°C
Voltage on Any Pin with
Respect to Ground .........................................-2.0V to +7.0V
Voltage on A9 with
Respect to Ground ......................................-2.0V to +14.0V
VPP Supply Voltage with
Respect to Ground .......................................-2.0V to +14.0V
AT27C256R
*NOTICE: Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the device. This is a stress rating only and func­tional operation of the device at these or any other
(1)
(1)
Note: 1 . Minimum voltage is -0.6V dc which ma y unde rshoot
(1)
conditions beyond those indicated in the opera­tional sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
to -2.0V for pulses of les s than 20 ns .Maximum out­put pin voltage is V
+ 0.75V dc which may over-
CC
shoot to +7.0 volts for pulses of less than 20 ns.
Operating Modes
Mode\Pin CE OE Ai V
Read V Output Disable V Standby V Rapid Program PGM Verify Optional PGM Verify PGM Inhibit
Product Identification
(2)
(2)
(2)
(2)
(4)
Notes: 1. X can be VIL or VIH.
2. Refer to Programming Characteristics. = 12.0 ± 0.5V.
3. V
H
4. T wo identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggle d low
) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.
(V
IL
IL
IL
IH
V
IL
(1)
X
V
IL
V
IH
V
IL
V
IL
V
IH
(1)
X
V
IH
V
IL
V
IL
V
IH
V
IL
Ai V
(1)
X
(1)
X Ai V Ai V Ai V
(1)
X
A9 = V
(3)
H
A0 = VIH or VIL A1 - A14 = V
IL
V
PP
CC
V
CC
V
CC
PP
PP
CC
V
PP
CC
Outputs
D
OUT
High Z High Z D
IN
D
OUT
D
OUT
High Z
Identification Code
3
DC and AC Operating Conditions for Read Operation
AT27C256R
-45 -55 -70 -90 -12 -15
Com. 0°C - 70°C0°C - 70°C0°C - 70°C0°C - 70°C0°C - 70°C0°C - 70°C Operating Temp. (Case)
Ind. -40°C - 85°C-40°C - 85°C-40°C - 85°C-40°C - 85°C-40°C - 85°C-40°C - 85°C
Auto. -40°C - 125°C-40°C - 125°C-40°C - 125°C-40°C - 125°C V
Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%
CC
DC and Operating Characteristics for Read Operation
Symbol Parameter Condition Min Max Units
I
LI
Input Load Current VIN = 0V to V
CC
Com., Ind. ±1 µA Auto. ±5 µA
I
I
I
I V V V V
LO
PP1
SB
CC
IL
IH
OL
OH
(2)
Output Leakage Current V
(1)
V
Read/Standby Current VPP = V
PP
(1)
V
Standby Current
CC
VCC Active Current f = 5 MHz, I
= 0V to V
OUT
(CMOS), CE = VCC ± 0.3V 100 µA
I
SB1
I
(TTL), CE = 2.0 to V
SB2
CC
OUT
CC
CC
= 0 mA, E = V
Auto. ±10 µA
10 µA
+ 0.5V 1 mA
IL
20 mA Input Low Voltage -0.6 0.8 V Input High Voltage 2.0 VCC + 0.5 V Output Low Voltage IOL = 2.1 mA 0.4 V Output High Voltage IOH = -400 µA2.4V
Notes: 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP..
Com., Ind. ±5 µA
may be connected directly to VCC, except d uring p r og r amming. The suppl y c urre nt w o ul d th en be the sum of ICC and IPP..
2. V
PP
AC Characteristics for Read Operat ion
AT27C256R
-45 -55 -70 -90 -12 -15
Symbol Parameter Condition Min Max Min Max Min Max Min Max Min Max Min Max
(3)
t t t
t
ACC
CE
OE
DF
(2)
(2)(3)
(4)(5)
Address to Output Delay CE = OE = V CE to Output Delay OE = V OE to Output Delay CE = V
IL
IL
OE or CE High to Output Float, whichever occurred first
IL
45 55 70 90 120 150 ns 45 55 70 90 120 150 ns 20 25 30 30 35 40 ns
20 20 25 25 30 35 ns
Units
t
OH
Output Hold from Address, CE or OE, whichever occurred first
777000ns
Note: 2, 3, 4, 5. - see AC Waveforms for Read Operation.
4
AT27C256R
AT27C256R
AC Waveforms for Read Operation
Notes: 1. Timing measurement reference level is 1.5V for -45 and -55 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V.
Timing measurement reference levels for all other speed grades are V
= 0.45V and VIH = 2.4V.
V
IL
2. OE
3. OE may be delayed up to t
4. This parameter is only sampled and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
- tOE after the address is valid without impact on t
ACC
(1)
= 0.8V and VOH = 2.0V. Input AC drive levels are
OL
.
ACC
Input Test Waveforms and
Output Test Load
Measurement Levels
For -45 and -55 devices only:
tR, tF < 5 ns (10% to 90%)
For -70, -90, -12, and -15 devices:
tR, tF < 20 ns (10% to 90%)
Note: CL = 100 pF including jig
capacitanc e, except for the -45 and -55 devices, where C
=30 pF.
L
Pin Capacitance
(f = 1MHz, T = 25°C)
C
IN
C
OUT
Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
(1)
Typ Max Units Conditions
46pFV 812pFV
IN
OUT
= 0V
= 0V
5
Programming Waveforms
(1)
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and t
are characteristics of the device but must be accommodated by the programmer.
DFP
3. When programming the AT27C256R a 0.1 µF capacitor is required across V transients.
DC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Symbol Parameter Test Conditions
I
LI
V
IL
V
IH
V
OL
V
OH
I
CC2
I
PP2
V
ID
Input Load Current V Input Low Level -0.6 0.8 V Input High Level 2.0 VCC + 1 V Output Low Volt IOL = 2.1 mA 0.4 V Output High Volt I VCC Supply Current (Program and Verify) 25 mA VPP Current CE = V A9 Product Identification Voltage 11.5 12.5 V
= VIL,V
IN
OH
IH
= -400 µA2.4 V
IL
and ground to suppress spurious voltage
PP
Limits
UnitsMin Max
10
±
µ
25 mA
A
6
AT27C256R
AC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Symbol Parameter T est Conditions
AT27C256R
Limits
(1)
UnitsMin Max
t t t t t
t
t t t t
t
AS
OES
DS
AH
DH
DFP
VPS
VCS
PW
OE
PRT
Address Setup Time OE Setup Time 2 Data Setup Time 2 Address Hold Time 0 Data Hold Time 2 OE High to
Output Float Delay
(2)
VPP Setup Time 2 VCC Setup Time 2 CE Program Pulse Width Data Valid from OE
(3)
(2)
Input Rise and Fall Times
(10% to 90%) 20ns
Input Pulse Levels
0.45V to 2.4V
Input Timing Reference Level
0.8V to 2.0V
Output Timing Reference Level
0.8V to 2.0V
VPP Pulse Rise Time During Programming
2
0 130 ns
95 105
50 ns
Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP..
2. This parameter i s only sam pled a nd is not 1 00 % teste d. Out put Flo at is d efined as the point where dat a is no longe r driv e n—
see timing diagram.
3. Program Pulse width tolerance is 100
µsec
±
5%.
Atmel’s 27C256R Integrated Product Identification Code
Pins
Codes
µ µ µ µ µ
µ µ µ
150 ns
s s s s s
s s s
Hex
DataA0 O7 O6 O5 O4 O3 O2 O1 O0
Manufacturer 0000111101E Device Type 1100011008C
7
Rapid Programming Algorithm
A 100 µs CE pulse width is used to program. The address is set to the first location. V raised to 13.0V. Each address is first programmed with one 100 µs CE tion/reprogramming loop is execu ted for ea ch address . In the event a byte fails to pass verification, up to 10 succes­sive 100 µs pulses are applied with a verification after each
pulse with out verificati on. Then a ve rifica-
is raised to 6.5V and VPP is
CC
pulse. If the byte fails to verify after 10 pulses have been applied, the part is c on sider e d f ail ed . A fter the b yte ver if ies properly, the next address is selected until all have been checked. V bytes are read again and compared with the original data to determine if the device passes or fails.
is then lowered to 5.0V and VCC to 5.0V. All
PP
8
AT27C256R
Ordering Information
I
t
ACC
(ns)
45 20 0.1 AT27C256R-4 5J C
55 20 0.1 AT27C256R-55JC
70 20 0.1 AT27C256R-70JC
(mA)
CC
Ordering Code Packa ge Operation RangeActive Standby
AT27C2 56R -4 5PC AT27C2 56R -4 5R C AT27C2 56R -4 5TC
20 0.1 AT27C256R-45JI
AT27C256R-45PI AT27C256R-45RI AT27C256R-45TI
AT27C256R-55PC AT27C256R-55RC AT27C256R-55TC
20 0.1 AT27C256R-55JI
AT27C256R-55PI AT27C256R-55RI AT27C256R-55TI
AT27C256R-70PC AT27C256R-70RC AT27C256R-70TC
20 0.1 AT27C256R-70JI
AT27C256R-70PI AT27C256R-70RI AT27C256R-70TI
20 0.1 AT27C256R-70JA
AT27C256R-70PA AT27C256R-70RA
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R
AT27C256R
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Automotive
(-40°C to 125°C)
Package Type
32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) 28P6 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28R 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) 28T 28-Lead, Thin Small Outline Package (TSOP)
(continued)
9
Ordering Information (Continued)
I
t
ACC
(ns)
90 20 0.1 AT27C256R-90JC
120 20 0.1 AT27C256R-12JC
150 20 0.1 AT27C256R-15JC
(mA)
CC
Ordering Code Packa ge Operation RangeActive Standby
AT27C256R-90PC AT27C256R-90RC AT27C256R-90TC
20 0.1 AT27C256R-90JI
AT27C256R-90PI AT27C256R-90RI AT27C256R-90TI
20 0.1 AT27C256R-90JA
AT27C256R-90PA AT27C256R-90RA
AT27C256R-12PC AT27C256R-12RC AT27C256R-12TC
20 0.1 AT27C256R-12JI
AT27C256R-12PI AT27C256R-12RI AT27C256R-12TI
20 0.1 AT27C256R-12JA
AT27C256R-12PA AT27C256R-12RA
AT27C256R-15PC AT27C256R-15RC AT27C256R-15TC
20 0.1 AT27C256R-15JI
AT27C256R-15PI AT27C256R-15RI AT27C256R-15TI
20 0.1 AT27C256R-15JA
AT27C256R-15PA AT27C256R-15RA
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R
32J 28P6 28R 28T
32J 28P6 28R 28T
32J 28P6 28R
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Automotive
(-40°C to 125°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Automotive
(-40°C to 125°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Automotive
(-40°C to 125°C)
Package Type
32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) 28P6 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28R 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) 28T 28-Lead, Thin Small Outline Package (TSOP)
10
AT27C256R
Packaging Information
AT27C256R
32J
, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
.045(1.14) X 45°
.032(.813) .026(.660)
.050(1.27) TYP
PIN NO.1 IDENTIFY
.553(14.0) .547(13.9)
.300(7.62) REF
.430(10.9) .390(9.90)
AT CONTACT POINTS
.453(11.5) .447(11.4)
.495(12.6) .485(12.3)
.025(.635) X 30° - 45°
.595(15.1) .585(14.9)
.022(.559) X 45° MAX (3X)
.012(.305) .008(.203)
.530(13.5) .490(12.4)
.021(.533) .013(.330)
.030(.762) .015(3.81) .095(2.41)
.060(1.52) .140(3.56) .120(3.05)
28P6
, 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-011 AB
1.47(37.3)
.220(5.59)
SEATING
PLANE
.161(4.09) .125(3.18)
MAX
.110(2.79) .090(2.29)
.012(.305)
.008(.203)
1.44(36.6)
1.300(33.02) REF
.065(1.65) .041(1.04)
.630(16.0) .590(15.0)
.690(17.5) .610(15.5)
PIN
0
REF
15
1
.566(14.4) .530(13.5)
.090(2.29)
.005(.127)
.065(1.65)
.015(.381) .022(.559) .014(.356)
MAX
MIN
28R
, 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) Dimensions in Inches and (Millimeters)
28T
, 28-Lead, Plastic Thin Small Outline Package (TSOP) Dimensions in Millimeters and (Inches)*
INDEX MARK
AREA
0.55 (0.022) BSC
0
REF
5
7.15 (0.281) REF
8.10 (0.319)
7.90 (0.311)
0.20 (0.008)
0.10 (0.004)
0.70 (0.028)
0.30 (0.012)
11.9 (0.469)
11.7 (0.461)
0.27 (0.011)
0.18 (0.007)
13.7 (0.539)
13.1 (0.516)
1.25 (0.049)
1.05 (0.041)
0.20 (0.008)
0.15 (0.006)
*Controlling dimension: millimeters
11
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e-mail
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Web Site
http://www.atmel.com
BBS
1-(408) 436-4309
© Atmel Corporation 1998.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war­ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop­erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems.
®
Marks bearing Terms and product names in this document may be trademarks of others.
and/or ™ are registered trademarks and trademarks of Atmel Corporation.
Printed on recycled paper.
0014H–07/98/xM
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