Rainbow Electronics AT27BV512 User Manual

Features

•

Fast Read Access Time - 70 ns

•

Dual Voltage Range Operation

– Unregulated Battery Power Supply Range, 2.7V to 3.6V

or Standard 5V ± 10% Supply Range

•

Pin Compatible with JEDEC Standard AT27C512R

•

Low Power CMOS Operation

– 20 µA max. (less than 1 µA typical) Standby for VCC = 3.6V
– 29 mW max. Active at 5 MHz for VCC = 3.6V

•

JEDEC Standard Surface Mount Packages

– 32-Lead PLCC
– 28-Lead 330-mil SOIC
– 28-Lead TSOP

•

High Reliability CMOS Technology

– 2,000V ESD Protection
– 200 mA Latchup Immunity

•

Rapid™ Programming Algorithm - 100 µs/b y te (typic al)

•

CMOS and TTL Compatible Inputs and Outputs

– JEDEC Standard for LVTTL and LVBO

•

Integrated Product Identification Code

•

Commercial and Industrial Temperature Ranges

512K (64K x 8)
Unregulated

Battery-Voltage

™

High Speed OTP
EPROM

Description

The AT27BV512 is a high performance, low power, low voltage 524,288-bit one-time
programmable re ad only memory (OTP EP ROM) organized as 64 K by 8 bits. It
requires only one suppl y in t he ran ge of 2. 7V to 3. 6V in norma l rea d mode o perat ion,
making it ideal for fast, portable systems using either regulated or unregulated battery
power.

Pin Configurations

Pin Name Function

A0 - A15 Addresses
O0 - O7 Outputs
CE

/VPP

OE

NC No Connect

5

A6

6

A5

7

A4

8

A3

9

A2

10

A1

11

A0

12

NC

13

O0

Note: PLCC package pins 1 and 17 are
DON’T CONNECT.

Chip Enable
Output Enable/

Program Supply

PLCC Top View

A7

A12

A15NCVCC

A14

A13

432

1

323130

29
28
27
26
25
24
23
22

NC

21

O3O4O5

14151617181920

O1

O2

GND

A8
A9
A11
NC
OE/VPP
A10
CE
O7
O6

OE/VPP

A11

A13
A14

VCC

A15
A12

SOIC Top View

A15
A12

GND

1
2
3

A7

4

A6

5

A5

6

A4

7

A3

8

A2

9

A1

10

A0

11

O0

12

O1

13

O2

14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

TSOP Top View

Type 1

22
23
24

A9

25

A8

26
27
28
1
2
3

A7

4

A6

5

A5

6

A4

7

A3

(continued)

VCC
A14
A13
A8
A9
A11
OE/VPP
A10
CE
O7
O6
O5
O4
O3

21
20
19
18
17
16
15
14
13
12
11
10

A10
CE
O7
O6
O5
O4
O3
GND
O2
O1
O0
A0

9

A1

8

A2

AT27BV512

Rev. 0602B–10/98

1

Atmel’s innovative desi gn techniques provide fast sp eeds
that rival 5V parts while keepi ng the lo w power con sump­tion of a 3V supply. At V

= 2.7V, any byte can be

CC

accessed in less than 70 ns. With a typi cal power con­sumption of only 18 mW at 5 MHz and V

= 3V, the

CC

AT27BV512 consumes less than one fifth the power of a
standard 5V EPROM.

Standby mode supply current is typically less than 1 µA at
3V. The AT27BV512 simplifies system design an d
stretches battery lif etime even further by el iminating the
need for power supply regulation.

The AT27BV512 is available in industry standard JEDEC­approved one-time programmable (OTP) plastic PLCC,
SOIC, and TSOP pac kages. All devices featu re two-line
control (CE

, OE) to give designers the flexibility to prevent

bus contention.
The AT27BV512 op eratin g with V

at 3.0V produces TTL

CC

level outputs that are compatible with standard TTL logic
devices operati ng at V

= 5.0V. At VCC = 2.7V, the part is

CC

compatible with JEDEC approved low voltage battery oper­ation (LVBO) interface specifications. T he device is als o
capable of standard 5-volt operation making it ideally suited
for dual sup ply rang e system s or car d produc ts that are
pluggable in both 3-volt and 5-volt hosts.

Atmel’s AT27BV 512 h as a dditio nal f eatures to en sur e hig h
quality and efficient producti on use. The Rapi d™ Progra m-

ming Algorithm reduces the time required to program the
part and guarantees reliable programming. Programming
time is typically only 100 µs/byte. The Integrated Product
Identification Code electronically identifi es the device and
manufacturer. This feature is used by industry standard
programming eq uipme nt to sele ct the prop er program ming
algorithms and voltages. The AT27BV512 programs
exactly the same way as a standard 5V AT27C512R and
uses the same programming equipment.

System Considerations

Switching between active and standby conditions via the
Chip Enable pin may produ ce tra ns ien t vo ltag e ex cu rs i ons .
Unless accommodated by the system design, these tran­sients may exceed data sheet limits, resulting in device
non-conforman ce. At a mini mum, a 0.1 µF high frequency,
low inherent inductance, ceramic capacitor should be uti­lized for each device. This capacitor should be connected
between the V
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7 µF bulk electrolytic capacitor should
be utilized, again connected between the V
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.

and Ground terminals of the device, as

CC

and Ground

CC

Block Diagram

2

AT27BV512

Absolute Maximum Ratings*

Temperature Under Bias.................................. -40°C to +85°C

Storage Temperature..................................... -65°C to +125°C

Voltage on Any Pin with

Respect to Ground .........................................-2.0V to +7.0V

Voltage on A9 with

Respect to Ground ......................................-2.0V to +14.0V

AT27BV512

*NOTICE: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam­age to the de vic e. T his is a stres s r ating o nly an d
functional opera tion of the device at these or an y

(1)

(1)

other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reli abi li ty

VPP Supply Voltage with

Respect to Ground .......................................-2.0V to +14.0V

(1)

Note: 1. Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is

+ 0.75V dc which may be exceeded if certain precautions are observed (consult application notes) and which may

V

CC

overshoot to +7.0V for pulses of less than 20 ns.

Operating Modes

Mode \ Pin CE OE/V

(2)

Read
Output Disable
Standby
Rapid Program
PGM Verify
PGM Inhibit

(2)

(2)

(3)

(3)

(3)

Product Identification

Notes: 1 . X can be V

(3)(5)

IL

or VIH.

V

IL

V

IL

V

IH

V

IL

V

IL

V

IH

V

IL

2. Read, output disable, and standby modes require, 2.7 V ≤ V

3. Refer to Programming C haracteristics. Programming modes require VCC = 6.5V.

4. VH = 12.0 ± 0.5V.

5. Two identifier bytes may be selected. All Ai inputs are held low (V
) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.

(V

IL

PP

V

IL

V

IH

XXV

V

PP

V

IL

V

PP

V

IL

≤ 3.6V, or 4.5V ≤ VCC ≤ 5.5V.

CC

Ai V

Ai V

(1)

X

Ai V
Ai V

XV

A9 = V

(4)

H

A0 = VIH or VIL

A1 - A15 = V

), except A9 which is set to VH and A0 which is toggle d low

IL

IL

CC

(2)

CC

(2)

V

CC

(2)

CC

(3)

CC

(3)

CC

(3)

CC

(3)

V

CC

Outputs

D

OUT

High Z
High Z
D

IN

D

OUT

High Z

Identification Code

3

DC and AC Operating Conditions for Read Operation

AT27BV512

-70 -90 -12 -15

Operating Temperature
(Case)

Com. 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C
Ind. -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C

2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V

Power Supply

V

CC

5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

DC and Operating Characteristics for Read Operation

Symbol Parameter Condition Min Max Units
V

= 2.7V to 3.6V

CC

I

LI

I

LO

(2)

I

PP1

I

SB

I

CC

V

IL

V

IH

V

OL

V

OH

= 4.5V to 5.5V

V

CC

I

LI

I

LO

(2)

I

PP1

I

SB

I

CC

V

IL

V

IH

V

OL

V

OH

Input Load Current VIN = 0V to V
Output Leakage Current V

(1)

V

Read/Standby Current VPP = V

PP

(1)

V

Standby Current

CC

OUT

I

(CMOS), CE = V

SB1

I

(TTL), CE = 2.0 to VCC + 0.5V 100

SB2

VCC Active Current f = 5 MHz, I

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage

VCC = 3.0 to 3.6V -0.6 0.8 V
V

= 2.7 to 3.6V -0.6 0.2 x V

CC

= 3.0 to 3.6V 2.0 VCC + 0.5 V

V

CC

V

= 2.7 to 3.6V 0.7 x V

CC

= 2.0 mA 0.4 V

I

OL

I

= 100 µA0.2V

OL

I

= 20 µA0.1V

OL

= -2.0 mA 2.4 V

I

OH

I

= -100 µAV

OH

I

= -20 µAV

OH

Input Load Current VIN = 0V to V
Output Leakage Current V

(1)

V

Read/Standby Current VPP = V

PP

(1)

V

Standby Current

CC

OUT

(CMOS), CE = VCC ± 0.3V 100

I

SB1

I

(TTL), CE = 2.0 to VCC + 0.5V 1 mA

SB2

VCC Active Current f = 5 MHz, I

= 0V to V

CC

OUT

= 0V to V

CC

OUT

CC

CC

0.3V 20

CC

±

= 0 mA, CE = VIL, VCC = 3.6V 8 mA

CC

- 0.2 V

CC

- 0.1 V

CC

CC

CC

= 0 mA, CE = V

IL

Input Low Voltage -0.6 0.8 V
Input High Voltage 2.0 VCC + 0.5 V
Output Low Voltage IOL = 2.1 mA 0.4 V
Output High Voltage IOH = -400 µA2.4V

Notes: 1. VCC must be applied simultaneously with or before OE/VPP, and removed simultaneously with or after OE/VPP.

may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.

2. V

PP

±

1

±

5

10

CC

VCC + 0.5 V

±

1

±

5

10

20 mA

µ

A

µ

A

µ

A

µ

A

µ

A

V

µ

A

µ

A

µ

A

µ

A

4

AT27BV512

AC Characteristics for Read Operat ion

V

= 2.7V to 3.6V and 4.5V to 5.5V

CC

AT27BV512

AT27BV512

-70 -90 -12 -15

Symbol Parameter Condition

t

ACC

t

CE

t

OE

t

DF

(3)

(2)

(2)(3)

(4)(5)

Address to Output Delay CE = OE/VPP = V
CE to Output Delay OE/VPP = V
OE/VPP to Output Delay CE = V

IL

OE/VPP or CE High to
Output Float, whichever
occurred first

Output Hold from

t

OH

Address, CE

or OE/VPP,

whichever occurred f irst

AC Waveforms for Read Operation

Min Max Min Max Min Max Min Max

IL

IL

70 90 120 150 ns
70 90 120 1 50 ns

Units

50 50 50 60 ns

40 40 40 50 ns

0000ns

(1)

Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.

2. OE/VPP may be delayed up to tCE-tOE after the falling edge of CE without impact on tCE.

/VPP may be delayed up to t

3. OE

after the address is valid without impact on t

ACC-tOE

ACC

.

4. This parameter is only sampled and is not 100% tested.

5. Output float is defined as the point when data is no longer driven.

6. When reading a 27BV256, a 0.1 µF capacitor is required across V

and ground to suppress spurious voltage transients.

CC

5

Input Test Waveform and

Output Test Load

Measurement Level

tR, tF < 20 ns (10% to 90%)

Note: CL = 100 pF
including jig capacitance.

Pin Capacitance

f = 1 MHz, T = 25°C

Symbol Ty p Max Units Conditions

(1)

C

IN

C

OUT

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

46pFV
812pFV

IN

OUT

= 0V

= 0V

6

AT27BV512

AT27BV512

Programming Waveforms

(1)

Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.

2. tOE and t

are characteristics of the device but must be accommodated by the programmer.

DFP

3. When programming the AT27BV512, a 0.1 µF capacitor is required ac ross VPP and ground to suppress spurious voltage

transients.

DC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V

Symbol Parameter T est Condit ions

I

LI

V

IL

V

IH

V

OL

V

OH

I

CC2

I

PP2

V

ID

Input Load Current VIN = VIL, V

IH

Input Low Level -0.6 0.8 V
Input High Level 2.0 V
Output Low Voltage I
Output High Voltage I

= 2.1 mA 0.4 V

OL

= -400 µA2.4 V

OH

VCC Supply Current (Program and Verify) 25 mA
OE/VPP Current CE = V

IL

A9 Product Identification Voltage 11.5 12.5 V

Limits

10

±

+ 0.5 V

CC

25 mA

UnitsMin Max

A

µ

7

AC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

Limits

(1)

UnitsMin Max

t

AS

t

OES

t

OEH

t

DS

t

AH

t

DH

t

DFP

t

VCS

t

PW

t

DV

t

VR

t

PRT

Address Setup Time
OE/VPP Setup Time 2
OE/VPP Hold Time 2
Data Setup Time 2
Address Hold Time 0
Data Hold Time 2
CE High to Output Float Delay

(2)

VCC Setup Time 2
CE Program Pulse Width
Data Valid from CE

(3)

(2)

OE/VPP Recovery Time 2

Input Rise and Fall Times:

(10% to 90) 20 ns

Input Pulse Levels:

0.45V to 2.4V

Input Timing Reference Level:

0.8V to 2.0 V

Output Timing Reference Level:

0.8V to 2.0 V

OE/VPP Pulse Rise Time During
Programming

2

0 130 ns

95 105

50 ns

Notes: 1. VCC must be applied simultaneously or before OE/VPP and removed simultaneously or after OE/VPP.

2. This parameter is only sample d and i s not 1 00% te sted. O utput Float i s defi ned as the po int wh ere dat a is no longe r driv en—

see timing diagram.

3. Program Pulse width tolerance is 100

Atmel’s 27BV512 Integrated Product Identification Code

µsec

±

5%.

(1)

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

1

µ

s

µ

s

Pins

Codes

Hex

DataA0 O7 O6 O5 O4 O3 O2 O1 O0

Manufacturer 0000111101E
Device Type 1000011010D

Note: 1. The AT27BV512 has the same Product Identification Code as the AT27C512R. Both are programming compatible.

8

AT27BV512

Rapid Programming Algorithm

A 100 µs CE pulse width is used to program. The address
is set to the first lo ca tio n. V
is raised to 13.0V. Each address is first pr ogrammed with
one 100 µs CE
tion / reprogrammi ng lo op is ex ecuted fo r ea ch a ddress . In
the event a byte fails to pass verification, up to 10 succes­sive 100 µs pulses are applied with a verification after each

pulse without verification. Then a verifica-

is raised to 6.5V and OE/V

CC

PP

AT27BV512

pulse. If the byte fails to verify after 10 pulses have been
applied, the part is c on sider e d f ail ed . A fter the b yte ver if ies
properly, the next address is selected until all have been
checked. OE
bytes are read again and compared with the original data to
determine if the device passes or fails.

/VPP is then lowered to VIL and VCC to 5.0V. All

9

Ordering Information

I

t

ACC

(ns)

70 8 0.02 AT27BV512-70JC

90 8 0.02 AT27BV512-90JC

120 8 0.02 AT27BV512-12JC

150 8 0.02 AT27BV512-15JC

(mA)

CC

Ordering Code Package Operation RangeActive Standby

AT27BV512-70RC
AT27BV512-70TC

8 0.02 AT27BV512-70JI

AT27BV512-70RI
AT27BV512-70TI

AT27BV512-90RC
AT27BV512-90TC

8 0.02 AT27BV512-90JI

AT27BV512-90RI
AT27BV512-90TI

AT27BV512-12RC
AT27BV512-12TC

8 0.02 AT27BV512-12JI

AT27BV512-12RI
AT27BV512-12TI

AT27BV512-15RC
AT27BV512-15TC

8 0.02 AT27BV512-15JI

AT27BV512-15RI
AT27BV512-15TI

32J
28R
28T

32J
28R
28T

32J
28R
28T

32J
28R
28T

32J
28R
28T

32J
28R
28T

32J
28R
28T

32J
28R
28T

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Commercial

(0°C to 70°C)

Industrial

(-40°C to 85°C)

Package Type

32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
28R 28-Lead, 0.330" Wide, Plastic Gull Wing Small Package (SOIC)
28T 28-Lead, Plastic Thin Small Outline Package (TSOP)

10

AT27BV512

Packaging Information

AT27BV512

32J

, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-016 AE

.045(1.14) X 45˚

.032(.813)
.026(.660)

.050(1.27) TYP

PIN NO.1
IDENTIFY

.553(14.0)
.547(13.9)

.300(7.62) REF

.430(10.9)
.390(9.90)

AT CONTACT
POINTS

.453(11.5)
.447(11.4)

.495(12.6)
.485(12.3)

.025(.635) X 30˚ - 45˚

.595(15.1)
.585(14.9)

.022(.559) X 45˚ MAX (3X)

.012(.305)
.008(.203)

.530(13.5)
.490(12.4)

.021(.533)
.013(.330)

.030(.762)
.015(.381)
.095(2.41)

.060(1.52)
.140(3.56)
.120(3.05)

28R

, 28-Lead, 0.330" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)

28T

, 28-Lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*

INDEX

MARK

AREA

0.55 (0.022)
BSC

0

REF

5

7.15 (0.281)
REF

8.10 (0.319)

7.90 (0.311)

0.20 (0.008)

0.10 (0.004)

0.70 (0.028)

0.30 (0.012)

11.9 (0.469)

11.7 (0.461)

0.27 (0.011)

0.18 (0.007)

13.7 (0.539)

13.1 (0.516)

1.25 (0.049)

1.05 (0.041)

0.20 (0.008)

0.15 (0.006)

*Controlling dimension: millimeters

11

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North America:
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International:
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e-mail

[e-mail]

Web Site

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BBS

1-[phone]

© Atmel Corporation 1998.

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war­ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop­erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are
not authorized for use as critical components in life support devices or systems.

®

Marks bearing
Ter ms and product names in this document may be trademarks of others.

and/or ™ are registered trademarks and trademarks of Atmel Corporation.

Printed on recycled paper.

0602B–10/98/xM