• Individual Sector Protection with Global Protect/Unprotect Feature
– One 16-Kbyte Top Sector
– Two 8-Kbyte Sectors
– One 32-Kbyte Sector
– Seven 64-Kbyte Sectors
• Hardware Controlled Locking of Protected Sectors via WP pin
• Flexible Programming Options
– Byte/Page Program (1 to 256 Bytes)
– Sequential Program Mode Capability
• Fast Program and Erase Times
– 1.2 ms Typical Page Program (256 Bytes) Time
– 50 ms Typical 4-Kbyte Block Erase Time
– 250 ms Typical 32-Kbyte Block Erase Time
– 400 ms Typical 64-Kbyte Block Erase Time
• Automatic Checking and Reporting of Erase/Program Failures
• JEDEC Standard Manufacturer and Device ID Read Methodology
• Low Power Dissipation
– 5 mA Active Read Current (Typical)
– 15 µA Deep Power-down Current (Typical)
• Endurance: 100,000 Program/Erase Cycles
• Data Retention: 20 Years
• Complies with Full Industrial Temperature Range
• Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
The AT25DF041A is a serial interface Flash memory device designed for use in a
wide variety of high-volume consumer-based applications in which program code is
shadowed from Flash memory into embedded or external RAM for execution. The
flexible erase architecture of the AT25DF041A, with its erase granularity as small as
4 Kbytes, makes it ideal for data storage as well, eliminating the need for additional
data storage EEPROM devices.
3668E–DFLASH–11/2012
The physical sectoring and the erase block sizes of the AT25DF041A have been optimized to
meet the needs of today’s code and data storage applications. By optimizing the size of the
physical sectors and erase blocks, the memory space can be used much more efficiently.
Because certain code modules and data storage segments must reside by themselves in their
own protected sectors, the wasted and unused memory space that occurs with large sectored
and large block erase Flash memory devices can be greatly reduced. This increased memory
space efficiency allows additional code routines and data storage segments to be added while
still maintaining the same overall device density.
The AT25DF041A also offers a sophisticated method for protecting individual sectors against
erroneous or malicious program and erase operations. By providing the ability to individually protect and unprotect sectors, a system can unprotect a specific sector to modify its contents while
keeping the remaining sectors of the memory array securely protected. This is useful in applications where program code is patched or updated on a subroutine or module basis, or in
applications where data storage segments need to be modified without running the risk of errant
modifications to the program code segments. In addition to individual sector protection capabilities, the AT25DF041A incorporates Global Protect and Global Unprotect features that allow the
entire memory array to be either protected or unprotected all at once. This reduces overhead
during the manufacturing process since sectors do not have to be unprotected one-by-one prior
to initial programming.
Specifically designed for use in 2.5-volt or 3-volt systems, the AT25DF041A supports read, program, and erase operations with a supply voltage range of 2.3V to 3.6V or 2.7V to 3.6V. No
separate voltage is required for programming and erasing.
2
AT25DF041A
3668E–DFLASH–11/2012
2.Pin Descriptions and Pinouts
Table 2-1.Pin Descriptions
SymbolName and Function
CS
SCK
SI
SO
WP
HOLD
V
CC
GND
CHIP SELECT: Asserting the
device will be deselected and normally be placed in standby mode (not Deep Power-down mode),
and the SO pin will be in a high-impedance state. When the device is deselected, data will not be
accepted on the SI pin.
A high-to-low transition on the
is required to end an operation. When ending an internally self-timed operation such as a program
or erase cycle, the device will not enter the standby mode until the completion of the operation.
SERIAL CLOCK: This pin is used to provide a clock to the device and is used to control the flow of
data to and from the device. Command, address, and input data present on the SI pin is always
latched on the rising edge of SCK, while output data on the SO pin is always clocked out on the
falling edge of SCK.
SERIAL INPUT: The SI pin is used to shift data into the device. The SI pin is used for all data input
including command and address sequences. Data on the SI pin is always latched on the rising
edge of SCK.
SERIAL OUTPUT: The SO pin is used to shift data out from the device. Data on the SO pin is
always clocked out on the falling edge of SCK.
WRITE PROTECT: The
section “Protection Commands and Features” on page 15 for more details on protection features
and the
The
WP pin.
WP pin is internally pulled-high and may be left floating if hardware-controlled protection will
not be used. However, it is recommended that the
whenever possible.
HOLD: The
HOLD pin is used to temporarily pause serial communication without deselecting or
resetting the device. While the
SI pin will be ignored, and the SO pin will be in a high-impedance state.
The
CS pin must be asserted, and the SCK pin must be in the low state in order for a Hold
condition to start. A Hold condition pauses serial communication only and does not have an effect
on internally self-timed operations such as a program or erase cycle. Please refer to section “Hold”
on page 30 for additional details on the Hold operation.
The
HOLD pin is internally pulled-high and may be left floating if the Hold function will not be used.
However, it is recommended that the
possible.
DEVICE POWER SUPPLY: The VCCpin is used to supply the source voltage to the device.
Operations at invalid V
GROUND: The ground reference for the power supply. GND should be connected to the
system ground.
CS pin selects the device. When the CS pin is deasserted, the
CS pin is required to start an operation, and a low-to-high transition
WP pin controls the hardware locking feature of the device. Please refer to
HOLD pin is asserted, transitions on the SCK pin and data on the
HOLD pin also be externally connected to VCCwhenever
voltages may produce spurious results and should not be attempted.
CC
WP pin also be externally connected to V
AT25DF041A
Asserted
StateType
LowInput
Input
Input
Output
LowInput
CC
LowInput
Power
Power
3668E–DFLASH–11/2012
Figure 2-1.8-SOIC Top ViewFigure 2-2.8-UDFN Top View
CS
SO
WP
GND
1
1
2
3
4
VCC
8
HOLD
7
SCK
6
SI
5
CS
SO
WP
GND
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
3
3.Block Diagram
CS
SCK
SI
SO
WP
INTERFACE
CONTROL
4.Memory Array
CONTROL AND
PROTECTION LOGIC
AND
LOGIC
ADDRESS LATCH
To provide the greatest flexibility, the memory array of the AT25DF041A can be erased in four
levels of granularity including a full chip erase. In addition, the array has been divided into physical sectors of various sizes, of which each sector can be individually protected from program
and erase operations. The sizes of the physical sectors are optimized for both code and data
storage applications, allowing both code and data segments to reside in their own isolated
regions. Figure 4-1 on page 5 illustrates the breakdown of each erase level as well as the breakdown of each physical sector.
Y-DECODER
X-DECODER
I/O BUFFERS
AND LATCHES
SRAM
DATA BUFFER
Y-GATING
FLASH
MEMORY
ARRAY
4
AT25DF041A
3668E–DFLASH–11/2012
Figure 4-1.Memory Architecture Diagram
64KB
(Sector 0)
32KB
32KB
• • •
64KB
32KB
32KB
• • •
• • •
• • •
64KB
32KB
32KB
• • •
64KB
(Sector 6)
64KB
16KB
(Sector 10)
8KB
(Sector 9)
8KB
(Sector 8)
32KB
(Sector 7)
r
Block Erase DetailPage Program Detail
AT25DF041A
Internal Sectoring fo
Sector ProtectionBlock EraseBlock EraseBlock ErasePage Program
The AT25DF041A is controlled by a set of instructions that are sent from a host controller, commonly referred to as the SPI Master. The SPI Master communicates with the AT25DF041A via
the SPI bus which is comprised of four signal lines: Chip Select (
Input (SI), and Serial Output (SO).
The SPI protocol defines a total of four modes of operation (mode 0, 1, 2, or 3) with each mode
differing in respect to the SCK polarity and phase and how the polarity and phase control the
flow of data on the SPI bus. The AT25DF041A supports the two most common modes, SPI
modes 0 and 3. The only difference between SPI modes 0 and 3 is the polarity of the SCK signal
when in the inactive state (when the SPI Master is in standby mode and not transferring any
data). With SPI modes 0 and 3, data is always latched in on the rising edge of SCK and always
output on the falling edge of SCK.
Figure 5-1.SPI Mode 0 and 3
CS
SCK
CS), Serial Clock (SCK), Serial
SI
SO
MSBLSB
6.Commands and Addressing
A valid instruction or operation must always be started by first asserting the CS pin. After the CS
pin has been asserted, the SPI Master must then clock out a valid 8-bit opcode on the SPI bus.
Following the opcode, instruction dependent information such as address and data bytes would
then be clocked out by the SPI Master. All opcode, address, and data bytes are transferred with
the most significant bit (MSB) first. An operation is ended by deasserting the CS pin.
Opcodes not supported by the AT25DF041A will be ignored by the device and no operation will
be started. The device will continue to ignore any data presented on the SI pin until the start of
the next operation (CS pin being deasserted and then reasserted). In addition, if the CSpinis
deasserted before complete opcode and address information is sent to the device, then no operation will be performed and the device will simply return to the idle state and wait for the next
operation.
Addressing of the device requires a total of three bytes of information to be sent, representing
address bits A23 - A0. Since the upper address limit of the AT25DF041A memory array is
07FFFFh, address bits A23 - A19 are always ignored by the device.
MSB
LSB
6
AT25DF041A
3668E–DFLASH–11/2012
AT25DF041A
Table 6-1.Command Listing
CommandOpcodeAddress BytesDummy BytesData Bytes
Read Commands
Read Array0Bh0000 1011311+
Read Array (Low Frequency)03h0000 0011301+
Program and Erase Commands
Block Erase (4 Kbytes)20h0010 0000300
Block Erase (32 Kbytes)52h0101 0010300
Block Erase (64 Kbytes)D8h1101 1000300
Chip Erase
Byte/Page Program (1 to 256 Bytes)02h0000 0010301+
Sequential Program Mode
Protection Commands
60h0110 0000000
C7h1100 0111000
ADh1010 11013, 0
AFh1010 11113, 0
(1)
(1)
01
01
Write Enable06h0000 0110000
Write Disable04h0000 0100000
Protect Sector36h0011 0110300
Unprotect Sector39h0011 1001300
Global Protect/UnprotectUse Write Status Register command
Read Sector Protection Registers3Ch0011 1100301+
Status Register Commands
Read Status Register05h0000 0101001+
Write Status Register01h0000 0001001
Miscellaneous Commands
Read Manufacturer and Device ID9Fh1001 1111001 to 4
Deep Power-downB9h1011 1001000
Resume from Deep Power-downABh1010 1011000
Note:1. Three address bytes are only required for the first operation to designate the address to start programming at. Afterwards,
the internal address counter automatically increments, so subsequent Sequential Program Mode operations only require
clocking in of the opcode and the data byte until the Sequential Program Mode has been exited.
3668E–DFLASH–11/2012
7
7.Read Commands
7.1Read Array
The Read Array command can be used to sequentially read a continuous stream of data from
the device by simply providing the SCK signal once the initial starting address has been specified. The device incorporates an internal address counter that automatically increments on every
clock cycle.
Two opcodes, 0Bh and 03h, can be used for the Read Array command. The use of each opcode
depends on the maximum SCK frequency that will be used to read data from the device. The
0Bh opcode can be used at any SCK frequency up to the maximum specified by f
opcode can be used for lower frequency read operations up to the maximum specified by f
To perform the Read Array operation, the CS pin must first be asserted and the appropriate
opcode (0Bh or 03h) must be clocked into the device. After the opcode has been clocked in, the
three address bytes must be clocked in to specify the starting address location of the first byte to
read within the memory array. If the 0Bh opcode is used, then one don't care byte must also be
clocked in after the three address bytes.
After the three address bytes (and the one don't care byte if using opcode 0Bh) have been
clocked in, additional clock cycles will result in serial data being output on the SO pin. The data
is always output with the MSB of a byte first. When the last byte (07FFFFh) of the memory array
has been read, the device will continue reading back at the beginning of the array (000000h).
No delays will be incurred when wrapping around from the end of the array to the beginning
of the array.
.The03h
SCK
RDLF
.
Deasserting the CS pin will terminate the read operation and put the SO pin into a high-impedance state. The CS pin can be deasserted at any time and does not require that a full byte
of data be read.
The Byte/Page Program command allows anywhere from a single byte of data to 256 bytes of
data to be programmed into previously erased memory locations. An erased memory location is
one that has all eight bits set to the logical “1” state (a byte value of FFh). Before a Byte/Page
Program command can be started, the Write Enable command must have been previously
issued to the device (see “Write Enable” on page 15 command description) to set the Write
Enable Latch (WEL) bit of the Status Register to a logical “1” state.
To perform a Byte/Page Program command, an opcode of 02h must be clocked into the device
followed by the three address bytes denoting the first byte location of the memory array to begin
programming at. After the address bytes have been clocked in, data can then be clocked into the
device and will be stored in an internal buffer.
If the starting memory address denoted by A23 - A0 does not fall on an even 256-byte page
boundary (A7 - A0 are not all 0’s), then special circumstances regarding which memory locations
will be programmed will apply. In this situation, any data that is sent to the device that goes
beyond the end of the page will wrap around back to the beginning of the same page. For example, if the starting address denoted by A23 - A0 is 0000FEh, and three bytes of data are sent to
the device, then the first two bytes of data will be programmed at addresses 0000FEh and
0000FFh while the last byte of data will be programmed at address 000000h. The remaining
bytes in the page (addresses 000001h through 0000FDh) will be unaffected and will not change.
In addition, if more than 256 bytes of data are sent to the device, then only the last 256 bytes
sent will be latched into the internal buffer.
AT25DF041A
When the
gram it into the appropriate memory array locations based on the starting address specified by
A23 - A0 and the number of data bytes sent to the device. If less than 256 bytes of data were
sent to the device, then the remaining bytes within the page will not be altered. The programming of the data bytes is internally self-timed and should take place in a time of tPP.
The three address bytes and at least one complete byte of data must be clocked into the device
before the CS pin is deasserted, and the CS pin must be deasserted on even byte boundaries
(multiples of eight bits); otherwise, the device will abort the operation and no data will be programmed into the memory array. In addition, if the address specified by A23 - A0 points to a
memory location within a sector that is in the protected state (see section “Protect Sector” on
page 16), then the Byte/Page Program command will not be executed, and the device will return
to the idle state once the CS pin has been deasserted. The WEL bit in the Status Register will be
reset back to the logical “0” state if the program cycle aborts due to an incomplete address being
sent, an incomplete byte of data being sent, or because the memory location to be programmed
is protected.
While the device is programming, the Status Register can be read and will indicate that the
device is busy. For faster throughput, it is recommended that the Status Register be polled
rather than waiting the tBPor tPPtime to determine if the data bytes have finished programming.
At some point before the program cycle completes, the WEL bit in the Status Register will be
reset back to the logical “0” state.
The device also incorporates an intelligent programming algorithm that can detect when a byte
location fails to program properly. If a programming error arises, it will be indicated by the EPE
bit in the Status Register.
CS pin is deasserted, the device will take the data stored in the internal buffer and pro-
3668E–DFLASH–11/2012
9
The Byte/Page Program mode is the default programming mode after the device powers-up or
resumes from a device reset.
Figure 8-1.Byte Program
CS
SCK
SI
SO
Figure 8-2.Page Program
CS
SCK
SI
SO
00000010
MSBMSB
HIGH-IMPEDANCE
2310
OPCODE
00000010
MSBMSB
HIGH-IMPEDANCE
2310
OPCODE
6754983937 383336353431 3229 30
ADDRESS BITS A23-A0DATA IN BYTE 1
AAAAAA
6754101198123937 383336353431 3229 30
ADDRESS BITS A23-A0DATA IN
AAAAAAAA A
DDDDDDDD
MSB
DDDDDDDD
MSB
DATA IN BYTE n
DDDDDDDD
MSB
8.2Sequential Program Mode
The Sequential Program Mode improves throughput over the Byte/Page Program command
when the Byte/Page Program command is used to program single bytes only into consecutive
address locations. For example, some systems may be designed to program only a single byte
of information at a time and cannot utilize a buffered Page Program operation due to design
restrictions. In such a case, the system would normally have to perform multiple Byte Program
operations in order to program data into sequential memory locations. This approach can add
considerable system overhead and SPI bus traffic.
The Sequential Programming Mode helps reduce system overhead and bus traffic by incorporating an internal address counter that keeps track of the byte location to program, thereby
eliminating the need to supply an address sequence to the device for every byte to program.
When using the Sequential Program mode, all address locations to be programmed must be in
the erased state. Before the Sequential Program mode can first be entered, the Write Enable
command must have been previously issued to the device to set the WEL bit of the Status Register to a logical “1” state.
To start the Sequential Program Mode, the CS pin must first be asserted, and either an opcode
of ADh or AFh must be clocked into the device. For the first program cycle, three address bytes
must be clocked in after the opcode to designate the first byte location to program. After the
address bytes have been clocked in, the byte of data to be programmed can be sent to the
10
AT25DF041A
3668E–DFLASH–11/2012
AT25DF041A
device. Deasserting the CS pin will start the internally self-timed program operation, and the byte
of data will be programmed into the memory location specified by A23 - A0.
After the first byte has been successfully programmed, a second byte can be programmed by
simply reasserting the CS pin, clocking in the ADh or AFh opcode, and then clocking in the next
byte of data. When the
the next sequential memory location. The process would be repeated for any additional bytes.
There is no need to reissue the Write Enable command once the Sequential Program Mode has
been entered.
When the last desired byte has been programmed into the memory array, the Sequential
Program Mode operation can be terminated by reasserting the
Write Disable command to the device to reset the WEL bit in the Status Register back to the
logical “0” state.
If more than one byte of data is ever clocked in during each program cycle, then only the last
byte of data sent on the SI pin will be stored in the internal latches. The programming of each
byte is internally self-timed and should take place in a time of tBP. For each program cycle, a
complete byte of data must be clocked into the device before the CS pin is deasserted, and the
CS pin must be deasserted on even byte boundaries (multiples of eight bits); otherwise, the
device will abort the operation, the byte of data will not be programmed into the memory array,
and the WEL bit in the Status Register will be reset back to the logical “0” state.
CS pin is deasserted, the second byte of data will be programmed into
CS pin and sending the
If the address initially specified by A23 - A0 points to a memory location within a sector that is in
the protected state, then the Sequential Program Mode command will not be executed, and the
device will return to the idle state once the CS pin has been deasserted. The WEL bit in the Status Register will also be reset back to the logical “0” state.
There is no address wrapping when using the Sequential Program Mode. Therefore, when the
last byte (07FFFFh) of the memory array has been programmed, the device will automatically
exit the Sequential Program mode and reset the WEL bit in the Status Register back to the logical “0” state. In addition, the Sequential Program mode will not automatically skip over protected
sectors; therefore, once the highest unprotected memory location in a programming sequence
has been programmed, the device will automatically exit the Sequential Program mode and
reset the WEL bit in the Status Register. For example, if Sector 1 was protected and Sector 0
was currently being programmed, once the last byte of Sector 0 was programmed, the Sequential Program mode would automatically end. To continue programming with Sector 2, the
Sequential Program mode would have to be restarted by supplying the ADh or AFh opcode, the
three address bytes, and the first byte of Sector 2 to program.
While the device is programming a byte, the Status Register can be read and will indicate that
the device is busy. For faster throughput, it is recommended that the Status Register be polled at
the end of each program cycle rather than waiting the tBPtime to determine if the byte has finished programming before starting the next Sequential Program mode cycle.
The device also incorporates an intelligent programming algorithm that can detect when a byte
location fails to program properly. If a programming error arises, it will be indicated by the EPE
bit in the Status Register.
3668E–DFLASH–11/2012
11
Figure 8-3.Sequential Program Mode – Status Register Polling
CS
Seqeuntial Program Mode
Command
Opcode
SI
SO
Note: Each transitionshown for SI represents one byte (8 bits)
A23-16 A15-8A7-005hData
First Address to Program
HIGH-IMPEDANCE
Status Register Read
Command
STATUS REGISTER
Seqeuntial Program Mode
Command
Opcode
DATA
Seqeuntial Program Mode
Data05h04h
STATUS REGISTER
DATA
Figure 8-4.Sequential Program Mode – Waiting Maximum Byte Program Time
CS
t
BP
Seqeuntial Program Mode
Command
Opcode
SI
SO
Note: Each transitionshown for SI represents one byte (8 bits)
A23-16 A15-8A7-0Data
First Address to Program
HIGH-IMPEDANCE
Seqeuntial Program Mode
Command
Opcode
Data04h
t
BP
Seqeuntial Program Mode
Command
Command
Opcode
Opcode
Data05h
Data
Write Disable
Command
t
BP
STATUS REGISTER
Write Disable
Command
DATA
8.3Block Erase
A block of 4, 32, or 64 Kbytes can be erased (all bits set to the logical “1” state) in a single operation by using one of three different opcodes for the Block Erase command. An opcode of 20h is
used for a 4-Kbyte erase, an opcode of 52h is used for a 32-Kbyte erase, and an opcode of D8h
is used for a 64-Kbyte erase. Before a Block Erase command can be started, the Write Enable
command must have been previously issued to the device to set the WEL bit of the Status Register to a logical “1” state.
To perform a Block Erase, the CS pin must first be asserted and the appropriate opcode (20h,
52h or D8h) must be clocked into the device. After the opcode has been clocked in, the three
address bytes specifying an address within the 4-, 32-, or 64-Kbyte block to be erased must be
clocked in. Any additional data clocked into the device will be ignored. When the CS pin is deasserted, the device will erase the appropriate block. The erasing of the block is internally selftimed and should take place in a time of t
BLKE
.
Since the Block Erase command erases a region of bytes, the lower order address bits do not
need to be decoded by the device. Therefore, for a 4-Kbyte erase, address bits A11 - A0 will be
ignored by the device and their values can be either a logical “1” or “0”. For a 32-Kbyte erase,
address bits A14 - A0 will be ignored, and for a 64-Kbyte erase, address bits A15 - A0 will be
ignored by the device. Despite the lower order address bits not being decoded by the device, the
complete three address bytes must still be clocked into the device before the CS pin is deasserted, and the CS pin must be deasserted on an even byte boundary (multiples of eight bits);
otherwise, the device will abort the operation and no erase operation will be performed.
12
AT25DF041A
3668E–DFLASH–11/2012
AT25DF041A
If the address specified by A23 - A0 points to a memory location within a sector that is in the protected state, then the Block Erase command will not be executed, and the device will return to
the idle state once the
sizes of 32K and 64 Kbytes, more than one physical sector may be erased (e.g. sectors 18
through 15) at one time. Therefore, in order to erase a larger block that may span more than one
sector, all of the sectors in the span must be in the unprotected state. If one of the physical sectors within the span is in the protected state, then the device will ignore the Block Erase
command and will return to the idle state once the CS pin is deasserted.
The WEL bit in the Status Register will be reset back to the logical “0” state if the erase cycle
aborts due to an incomplete address being sent or because a memory location within the region
to be erased is protected.
While the device is executing a successful erase cycle, the Status Register can be read and will
indicate that the device is busy. For faster throughput, it is recommended that the Status Register be polled rather than waiting the t
some point before the erase cycle completes, the WEL bit in the Status Register will be reset
back to the logical “0” state.
The device also incorporates an intelligent erase algorithm that can detect when a byte location
fails to erase properly. If an erase error occurs, it will be indicated by the EPE bit in the Status
Register.
CS pin has been deasserted. In addition, with the larger Block Erase
time to determine if the device has finished erasing. At
BLKE
Figure 8-5.Block Erase
CS
SCK
SI
SO
CCCCCCCC
MSBMSB
HIGH-IMPEDANCE
2310
OPCODE
6754101198123129 3027 2826
ADDRESS BITS A23-A0
AAAAAAAA AA A A
3668E–DFLASH–11/2012
13
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