The ADC12DL066 is a dual, low power monolithic CMOS
analog-to-digital converter capable of converting analog input signals into 12-bit digital words at 66 Megasamples per
second (MSPS), minimum. This converter uses a differential,
pipeline architecture with digital error correction and an onchip sample-and-hold circuit to minimize die size and power
consumption while providing excellent dynamic performance
and a 450 MHz Full Power Bandwidth. Operating on a single
3.3V power supply, the ADC12DL066 achieves 10.7 effective bits and consumes just 686 mW at 66 MSPS, including
the reference current. The Power Down feature reduces
power consumption to 75 mW.
The differential inputs provide a full scale differential input
swing equal to 2 times V
ended input. Full use of the differential input is recommended for optimum performance. The digital outputs from
the two ADCs are available on separate 12-bit buses with an
output data format choice of offset binary or two’s complement.
To ease interfacing to lower voltage systems, the digital
output driver power pins of the ADC12DL066 can be connected to a separate supply voltage in the range of 2.4V to
the digital supply voltage.
This device is available in the 64-lead TQFP package and
will operate over the industrial temperature range of −40˚C to
+85˚C. An evaluation board is available to ease the evaluation process.
with the possibility of a single-
REF
Features
n Single +3.3V supply operation
n Internal sample-and-hold
n Outputs 2.4V to 3.3V compatible
n Pin compatible with ADC12D040
n Power down mode
n On-chip reference
Key Specifications
n Resolution12 Bits
n DNL
n SNR (f
n SFDR (f
n Data Latency6 Clock Cycles
n Power Consumption
— Operating686 mW (typ)
— Power Down Mode75 mW (typ)
= 10 MHz)66 dB (typ)
IN
= 10 MHz)81 dB (typ)
IN
±
0.5 LSB (typ)
Applications
n Ultrasound and Imaging
n Instrumentation
n Communications Receivers
n Sonar/Radar
n xDSL
n Cable Modems
n DSP Front Ends
Connection Diagram
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TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Differential analog input pins. With a 1.0V reference voltage
the differential full-scale input signal level is 2.0 V
each input pin voltage centered on a common mode voltage,
. The negative input pins may be connected to VCMfor
V
CM
single-ended operation, but a differential input signal is
required for best performance.
Reference input. This pin should be bypassed to AGND with
a 0.1 µF capacitor when an external reference is used. V
is 1.0V nominal and should be between 0.8V to 1.5V.
Reference source select pin. With a logic low at this pin the
internal 1.0V reference is selected and the V
not be driven. With a logic high on this pin an external
reference voltage should be applied to V
REF
input pin 7.
REF
with
P-P
pin need
ADC12DL066
REF
13
5
14
4
12
6
DIGITAL I/O
60CLK
22
41
59PD
21OF
V
RP
V
RP
VRMA
V
RM
V
RN
V
RN
OEA
OEB
A
B
These pins are high impedance reference bypass pins.
B
Bypass per Section 1.2. DO NOT LOAD these pins.
A
B
Digital clock input. The range of frequencies for this input is
as specified in the electrical tables with guaranteed
performance at 66 MHz. The input is sampled on the rising
edge of this input.
OEA and OEB are the output enable pins that, when low,
holds their respective data output pins in the active state.
When either of these pins is high, the corresponding outputs
are in a high impedance state.
PD is the Power Down input pin. When high, this input puts
the converter into the power down mode. When this pin is
low, the converter is in the active mode.
Output Format pin. A logic low on this pin causes output
data to be in offset binary format. A logic high on this pin
causes the output data to be in 2’s complement format.
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Pin Descriptions and Equivalent Circuits (Continued)
Pin No.SymbolEquivalent CircuitDescription
ADC12DL066
24–29
34–39
42–47
52–57
ANALOG POWER
9, 18, 19,
62, 63
3, 8, 10, 17,
20, 61, 64
DIGITAL POWER
33, 48V
32, 49DGNDThe ground return for the digital supply.
30, 51V
23, 31, 40,
50, 58
DA0–DA11
Digital data output pins that make up the 12-bit conversion
results of their respective converters. DA0 and DB0 are the
LSBs, while DA11 and DB11 are the MSBs of the output
word. Output levels are TTL/CMOS compatible.
DB0–DB11
Positive analog supply pins. These pins should be connected
V
A
to a quiet +3.3V source and bypassed to AGND with 0.1 µF
capacitors located within 1 cm of these power pins, and with
a 10 µF capacitor.
AGNDThe ground return for the analog supply.
Positive digital supply pin. This pin should be connected to
D
the same quiet +3.3V source as is V
DGND with a 0.1 µF capacitor located within 1 cm of the
power pin and with a 10 µF capacitor.
Positive digital supply pin for the ADC12DL066’s output
drivers. This pin should be connected to a voltage source of
+2.4V to V
DR
capacitor. If the supply for this pin is different from the
supply used for V
a 10 µF capacitor. V
. All bypass capacitors should be located within 1 cm of
V
D
and be bypassed to DR GND with a 0.1 µF
D
and VD, it should also be bypassed with
A
DR
the supply pin.
The ground return for the digital supply for the
ADC12DL066’s output drivers. These pins should be
DR GND
connected to the system digital ground, but not be
connected in close proximity to the ADC12DL066’s DGND or
AGND pins. See Section 5 (Layout and Grounding) for more
details.
and be bypassed to
A
should never exceed the voltage on
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ADC12DL066
Absolute Maximum Ratings (Notes 1,
2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
or V
A
+0.3V)
±
25 mA
±
50 mA
4.2V
V
A,VD,VDR
|V
|≤ 100 mV
A–VD
Voltage on Any Input or Output Pin−0.3V to (V
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Package Dissipation at T
= 25˚CSee (Note 4)
A
D
Operating Ratings (Notes 1, 2)
Operating Temperature−40˚C ≤ T
Supply Voltage (V
Output Driver Supply (V
V
Input0.8V to 1.5V
REF
CLK, PD, OE
)+3.0V to +3.6V
A,VD
)+2.4V to V
DR
−0.05V to (VD+ 0.05V)
Analog Input Pins0V to (V
V
CM
|AGND–DGND|≤100mV
≤ +85˚C
A
A
0.5V to 1.5V
ESD Susceptibility
Human Body Model (Note 5)2500V
Machine Model (Note 5)250V
Soldering Temperature,
Infrared, 10 sec. (Note 6)235˚C
Storage Temperature−65˚C to +150˚C
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA=VD= +3.3V, VDR=
+2.5V, PD = 0V, INT/EXT REF pin = +3.3V, V