Rainbow Electronics ADC12D040 User Manual

ADC12D040 Dual 12-Bit, 40 MSPS, 600 mW A/D Converter with Internal/External Reference
ADC12D040 Dual 12-Bit, 40 MSPS, 600 mW A/D Converter with Internal/External Reference
November 2003

General Description

The ADC12D040 is a dual, low power monolithic CMOS analog-to-digital converter capable of converting analog in­put signals into 12-bit digital words at 40 Megasamples per second (MSPS), minimum. This converter uses a differential, pipeline architecture with digital error correction and an on­chip sample-and-hold circuit to minimize die size and power consumption while providing excellent dynamic perfor­mance. Operating on a single 5V power supply, the ADC12D040 achieves 10.9 effective bits at 10 MHz input and consumes just 600 mW at 40 MSPS, including the reference current. The Power Down feature reduces power consumption to 75 mW.
The differential inputs provide a full scale differential input swing equal to 2V input. Full use of the differential input is recommended for optimum performance. The digital outputs for the two ADCs are available on separate 12-bit buses with an output data format choice of offset binary or 2’s complement.
For ease of interface, the digital output driver power pins of the ADC12D040 can be connected to a separate supply voltage in the range of 2.4V to the digital supply voltage, making the outputs compatible with low voltage systems. The ADC12D040’s speed, resolution and single supply op­eration make it well suited for a variety of applications.
This device is available in the 64-lead TQFP package and will operate over the industrial temperature range of −40˚C to +85˚C.
with the possibility of a single-ended
REF

Features

n Binary/2’s complement output format n Single supply operation n Internal sample-and-hold n Outputs 2.4V to 5V compatible n TTL/CMOS compatible inputs/outputs n Power down mode n On-chip reference buffer n Internal/External Reference

Key Specifications

n Resolution 12 Bits n Conversion Rate 40 MSPS (min) n SNR (f n ENOB (f n SFDR (f n Crosstalk 80 dB (typ) n Data Latency 6 Clock Cycles n Supply Voltage +5V n Power Consumption, Operating 600 mW (typ)
= 10 MHz) 68 dB (typ)
IN
= 10 MHz) 10.9 bits (typ)
IN
= 10 MHz) 80 dB (typ)
IN
±
5%

Applications

n Ultrasound and Imaging n Instrumentation n Communications Receivers n Sonar/Radar n xDSL n Cable Modems n DSP Front Ends
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
© 2003 National Semiconductor Corporation DS200460 www.national.com

Connection Diagram

ADC12D040
20046001

Ordering Information

Industrial (−40˚C TA≤ +85˚C) Package
ADC12D040CIVS 64 Pin TQFP
ADC12D040CIVSX 64 Pin TQFP Tape and Reel
ADC12D040EVAL Evaluation Board
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Block Diagram

ADC12D040
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20046002

Pin Descriptions and Equivalent Circuits

Pin No. Symbol Equivalent Circuit Description
ANALOG I/O
ADC12D040
15
2
16
1
7V
11 INT/EXT REF
V
A+
IN
B+
V
IN
A−
V
IN
B−
V
IN
REF
Non-Inverting analog signal Inputs. With a 2.0V reference the full-scale input signal level is 2.0 V pair, centered on a common V
Inverting analog signal Input. With a 2.0V reference the full-scale input signal level is 2.0 V pair, centered on a common V connected to a common V a differential input signal is required for best performance.
Reference input. This pin should be bypassed to AGND with a 0.1 µF monolithic capacitor when external reference is used. V
is 2.0V nominal and should be between 1.0V to
REF
2.4V.
V
select pin. With a logic low at this pin the internal 2.0V
REF
reference is selected. With a logic high on this pin an external reference voltage must be applied to V
on each pin of the input
P-P
.
CM
on each pin of the input
P-P
. These (-) input pins may be
CM
for single-ended operation, but
CM
input pin 7.
REF
13
5
14
4
12
6
DIGITAL I/O
60 CLK
22 41
59 PD
21 OF
V
RP
V
RP
V
RM
V
RM
V
RN
V
RN
OEA OEB
A B
A B
These pins are high impedance reference bypass pins only. Connect a 0.1 µF capacitor from each of these pins to AGND. DO NOT LOAD these pins.
A B
Digital clock input. The range of frequencies for this input is 100 kHz to 55 MHz (typical) with guaranteed performance at 40 MHz. The input is sampled on the rising edge of this input.
OEA and OEB are the output enable pins that, when low, enables their respective TRI-STATE®data output pins. When either of these pins is high, the corresponding outputs are in a high impedance state.
PD is the Power Down input pin. When high, this input puts the converter into the power down mode. When this pin is low, the converter is in the active mode.
Output Format pin. A logic low on this pin causes output data to be in offset binary format. A logic high on this pin causes the output data to be in 2’s complement format.
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Pin Descriptions and Equivalent Circuits (Continued)
Pin No. Symbol Equivalent Circuit Description
ADC12D040
24–29 34–39
DA0–DA11
Digital data output pins that make up the 12-bit conversion results of their respective converters. DA0 and DB0 are the LSBs, while DA11 and DB11 are the MSBs of the output word. Output levels are TTL/CMOS compatible.
42–47 52–57
DB0–DB11
ANALOG POWER
Positive analog supply pins. These pins should be connected
9, 18, 19,
62, 63
V
A
to a quiet +5V source and bypassed to AGND with 0.1 µF monolithic capacitors located within 1 cm of these power pins, and with a 10 µF capacitor.
3, 8, 10,
17, 20, 61,
AGND The ground return for the analog supply.
64
DIGITAL POWER
Positive digital supply pin. This pin should be connected to
33, 48 V
D
the same quiet +5V source as is V DGND with a 0.1 µF monolithic capacitor located within 1 cm of the power pin and with a 10 µF capacitor.
32, 49 DGND The ground return for the digital supply.
Positive digital supply pins for the ADC12D040’s output drivers. These pins should be connected to a voltage source of +2.4V to +5V and bypassed to DR GND with a 0.1 µF
30, 51 V
DR
monolithic capacitor. If the supply for these pins are different from the supply used for V
and VD, they should also be
A
bypassed with a 10 µF tantalum capacitor. V exceed the voltage on V
. All bypass capacitors should be
D
located within 1 cm of the supply pin.
The ground return for the digital supply for the ADC12D040’s
23, 31, 40,
50, 58
DR GND
output drivers. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC12D040’s DGND or AGND pins. See Section 5 (Layout and Grounding) for more details.
and be bypassed to
A
should never
DR
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Absolute Maximum Ratings (Notes 1,

2)
If Military/Aerospace specified devices are required,
ADC12D040
please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
V
A,VD,VDR
V
DR
|V
| 100 mV
A–VD
Voltage on Any Input or Output Pin −0.3V to (V
6.5V
VD+ 0.3V
or V
A
D
Operating Ratings (Notes 1, 2)
Operating Temperature −40˚C T
Supply Voltage (V
Output Driver Supply (V
V
Input 1.0V to 2.4V
REF
CLK, PD, OE
Analog Input Pins −0V to (V
|AGND–DGND| 100mV
) +4.75V to +5.25V
A,VD
) +2.35V to V
DR
−0.5V to (VD+ 0.5V)
+0.3V)
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Package Dissipation at T
= 25˚C See (Note 4)
A
±
25 mA
±
50 mA
ESD Susceptibility
Human Body Model (Note 5) 2500V
Machine Model (Note 5) 250V
Soldering Temperature,
Infrared, 10 sec. (Note 6) 235˚C
Storage Temperature −65˚C to +150˚C

Converter Electrical Characteristics

Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VAVD+5V, VDR+3.0V, PD = 0V, INT/EXT = V
TJ=T
MIN
to T
MAX
D,VREF
: all other limits TJ= 25˚C (Notes 7, 8, 9)
= +2.0V, OEA, OEB = 0V, f
Symbol Parameter Conditions
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes 12 Bits (min)
INL Integral Non Linearity (Note 11)
DNL Differential Non Linearity
GE Gain Error
TC GE Gain Error Tempco
V
TC V
OFF
OFF
Offset Error (VIN+=VIN−) −0.1
Offset Error Tempco
Positive Error 0.51 +2.8/−1.9 %FS
Negative Error 0.68 +4/−2.7 %FS
External Reference 15 ppm/
Internal Reference 100 ppm/
External Reference 3 ppm/
Internal Reference 3 ppm/
Under Range Output Code 0 0
Over Range Output Code 4095 4095
DYNAMIC CONVERTER CHARACTERISTICS
FPBW Full Power Bandwidth 0 dBFS Input, Output at −3 dB 100 MHz
f
SNR Signal-to-Noise Ratio
SINAD Signal-to-Noise and Distortion
ENOB Effective Number of Bits
THD Total Harmonic Distortion
H2 Second Harmonic
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
= 40 MHz, tr=tf= 3 ns, CL= 20 pF/pin. Boldface limits apply for
CLK
Typical
(Note 10)
±
0.7
±
0.4
Limits
(Note 10)
±
2.0 LSB (max)
±
1.0 LSB (max)
±
1.2 %FS (max)
= 1 MHz, VIN= −0.5 dBFS 69 dB
= 10 MHz, VIN= −0.5 dBFS 68 66.5 dB (min)
= 1 MHz, VIN= −0.5 dBFS 69 dB
= 10 MHz, VIN= −0.5 dBFS 68 65.6 dB (min)
= 1 MHz, VIN= −0.5 dBFS 11.1 Bits
= 10 MHz, VIN= −0.5 dBFS 10.9 10.6 Bits (min)
= 1 MHz, VIN= −0.5 dBFS −80 dB
= 10 MHz, VIN= −0.5 dBFS −78 −69 dB (max)
= 1 MHz, VIN= −0.5 dBFS −84 dB
= 10 MHz, VIN= −0.5 dBFS −80 −73 dB (max)
+85˚C
A
− 0.5V)
A
Units
(Limits)
D
o
C
o
C
o
C
o
C
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Converter Electrical Characteristics (Continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VAVD+5V, VDR+3.0V, PD = 0V, INT/EXT = V
TJ=T
MIN
to T
MAX
D,VREF
: all other limits TJ= 25˚C (Notes 7, 8, 9)
= +2.0V, OEA, OEB = 0V, f
Symbol Parameter Conditions
f
H3 Third Harmonic
SFDR Spurious Free Dynamic Range
IMD Intermodulation Distortion
IN
f
IN
f
IN
f
IN
f
IN
each = −6.0 dBFS
INTER-CHANNEL CHARACTERISTICS
Channel —Channel Offset Match
Channel — Channel Gain Error Match
Crosstalk
10 MHz Tested Channel. 15 MHz Other Channel
REFERENCE AND ANALOG INPUT CHARACTERISTICS
C
IN
V
REF
R
REF
V
IN
VINInput Capacitance (each pin to GND)
Input Reference Voltage (Note 13) 2.00
Reference Input Resistance 100 M(min)
Analog Input Voltage Range
VIN= 2.5 Vdc + 0.7 V
= 40 MHz, tr=tf= 3 ns, CL= 20 pF/pin. Boldface limits apply for
CLK
Typical
(Note 10)
Limits
(Note 10)
Units
(Limits)
= 1 MHz, VIN= −0.5 dBFS −84 dB
= 10 MHz, VIN= −0.5 dBFS −82 −69.5 dB (max)
= 1 MHz, VIN= −0.5 dBFS 84 dB
= 10 MHz, VIN= −0.5 dBFS 80 69.5 dB (min)
= 9.6 MHz and 10.2 MHz,
−80 dBFS
±
0.02 %FS
±
0.05 %FS
−80 dB
(CLK LOW) 8 pF
rms
(CLK HIGH) 7 pF
1.0 V (min)
2.4 V (max)
0 V (min)
4 V (max)
ADC12D040

DC and Logic Electrical Characteristics

Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA=VD= +5V, VDR= +3.0V, PD = 0V, INT/EXT = V
apply for TJ=T
MIN
to T
MAX
D,VREF
: all other limits TJ= 25˚C (Notes 7, 8, 9)
= +2.0V, OEA, OEB = 0V, f
Symbol Parameter Conditions
CLK, PD, OE DIGITAL INPUT CHARACTERISTICS
V
V
I
I
C
IN(1)
IN(0)
IN(1)
IN(0)
IN
Logical “1” Input Voltage VD= 5.25V 2.0 V (min)
Logical “0” Input Voltage VD= 4.75V 1.0 V (max)
Logical “1” Input Current VIN= 5.0V 10 µA
Logical “0” Input Current VIN= 0V −10 µA
Digital Input Capacitance 5 pF
D0–D11 DIGITAL OUTPUT CHARACTERISTICS
V
V
I
OZ
+I
−I
C
OUT(1)
OUT(0)
SC
SC
OUT
Logical “1” Output Voltage I
Logical “0” Output Voltage I
TRI-STATE Output Current
Output Short Circuit Source Current
Output Short Circuit Sink Current V
= −0.5 mA
OUT
= 1.6 mA, VDR=3V 0.4 V (max)
OUT
= 2.5V or 5V 100 nA
V
OUT
V
= 0V −100 nA
OUT
= 0V −20 mA (min)
V
OUT
OUT=VDR
Digital Output Capacitance 5 pF
= 40 MHz, tr=tf= 3 ns, CL= 20 pF/pin. Boldface limits
CLK
Typical
(Note 10)
= 2.5V 2.3 V (min)
V
DR
V
=3V 2.7 V (min)
DR
Limits
(Note 10)
20 mA (min)
Units
(Limits)
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