The ADC12D040 is a dual, low power monolithic CMOS
analog-to-digital converter capable of converting analog input signals into 12-bit digital words at 40 Megasamples per
second (MSPS), minimum. This converter uses a differential,
pipeline architecture with digital error correction and an onchip sample-and-hold circuit to minimize die size and power
consumption while providing excellent dynamic performance. Operating on a single 5V power supply, the
ADC12D040 achieves 10.9 effective bits at 10 MHz input
and consumes just 600 mW at 40 MSPS, including the
reference current. The Power Down feature reduces power
consumption to 75 mW.
The differential inputs provide a full scale differential input
swing equal to 2V
input. Full use of the differential input is recommended for
optimum performance. The digital outputs for the two ADCs
are available on separate 12-bit buses with an output data
format choice of offset binary or 2’s complement.
For ease of interface, the digital output driver power pins of
the ADC12D040 can be connected to a separate supply
voltage in the range of 2.4V to the digital supply voltage,
making the outputs compatible with low voltage systems.
The ADC12D040’s speed, resolution and single supply operation make it well suited for a variety of applications.
This device is available in the 64-lead TQFP package and
will operate over the industrial temperature range of −40˚C to
+85˚C.
with the possibility of a single-ended
REF
Features
n Binary/2’s complement output format
n Single supply operation
n Internal sample-and-hold
n Outputs 2.4V to 5V compatible
n TTL/CMOS compatible inputs/outputs
n Power down mode
n On-chip reference buffer
n Internal/External Reference
Key Specifications
n Resolution12 Bits
n Conversion Rate40 MSPS (min)
n SNR (f
n ENOB (f
n SFDR (f
n Crosstalk80 dB (typ)
n Data Latency6 Clock Cycles
n Supply Voltage+5V
n Power Consumption, Operating600 mW (typ)
= 10 MHz)68 dB (typ)
IN
= 10 MHz)10.9 bits (typ)
IN
= 10 MHz)80 dB (typ)
IN
±
5%
Applications
n Ultrasound and Imaging
n Instrumentation
n Communications Receivers
n Sonar/Radar
n xDSL
n Cable Modems
n DSP Front Ends
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Non-Inverting analog signal Inputs. With a 2.0V reference the
full-scale input signal level is 2.0 V
pair, centered on a common V
Inverting analog signal Input. With a 2.0V reference the
full-scale input signal level is 2.0 V
pair, centered on a common V
connected to a common V
a differential input signal is required for best performance.
Reference input. This pin should be bypassed to AGND with
a 0.1 µF monolithic capacitor when external reference is
used. V
is 2.0V nominal and should be between 1.0V to
REF
2.4V.
V
select pin. With a logic low at this pin the internal 2.0V
REF
reference is selected. With a logic high on this pin an external
reference voltage must be applied to V
on each pin of the input
P-P
.
CM
on each pin of the input
P-P
. These (-) input pins may be
CM
for single-ended operation, but
CM
input pin 7.
REF
13
5
14
4
12
6
DIGITAL I/O
60CLK
22
41
59PD
21OF
V
RP
V
RP
V
RM
V
RM
V
RN
V
RN
OEA
OEB
A
B
A
B
These pins are high impedance reference bypass pins only.
Connect a 0.1 µF capacitor from each of these pins to AGND.
DO NOT LOAD these pins.
A
B
Digital clock input. The range of frequencies for this input is
100 kHz to 55 MHz (typical) with guaranteed performance at
40 MHz. The input is sampled on the rising edge of this input.
OEA and OEB are the output enable pins that, when low,
enables their respective TRI-STATE®data output pins. When
either of these pins is high, the corresponding outputs are in a
high impedance state.
PD is the Power Down input pin. When high, this input puts
the converter into the power down mode. When this pin is
low, the converter is in the active mode.
Output Format pin. A logic low on this pin causes output data
to be in offset binary format. A logic high on this pin causes
the output data to be in 2’s complement format.
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Pin Descriptions and Equivalent Circuits (Continued)
Pin No.SymbolEquivalent CircuitDescription
ADC12D040
24–29
34–39
DA0–DA11
Digital data output pins that make up the 12-bit conversion
results of their respective converters. DA0 and DB0 are the
LSBs, while DA11 and DB11 are the MSBs of the output
word. Output levels are TTL/CMOS compatible.
42–47
52–57
DB0–DB11
ANALOG POWER
Positive analog supply pins. These pins should be connected
9, 18, 19,
62, 63
V
A
to a quiet +5V source and bypassed to AGND with 0.1 µF
monolithic capacitors located within 1 cm of these power pins,
and with a 10 µF capacitor.
3, 8, 10,
17, 20, 61,
AGNDThe ground return for the analog supply.
64
DIGITAL POWER
Positive digital supply pin. This pin should be connected to
33, 48V
D
the same quiet +5V source as is V
DGND with a 0.1 µF monolithic capacitor located within 1 cm
of the power pin and with a 10 µF capacitor.
32, 49DGNDThe ground return for the digital supply.
Positive digital supply pins for the ADC12D040’s output
drivers. These pins should be connected to a voltage source
of +2.4V to +5V and bypassed to DR GND with a 0.1 µF
30, 51V
DR
monolithic capacitor. If the supply for these pins are different
from the supply used for V
and VD, they should also be
A
bypassed with a 10 µF tantalum capacitor. V
exceed the voltage on V
. All bypass capacitors should be
D
located within 1 cm of the supply pin.
The ground return for the digital supply for the ADC12D040’s
23, 31, 40,
50, 58
DR GND
output drivers. These pins should be connected to the system
digital ground, but not be connected in close proximity to the
ADC12D040’s DGND or AGND pins. See Section 5 (Layout
and Grounding) for more details.
and be bypassed to
A
should never
DR
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Absolute Maximum Ratings (Notes 1,
2)
If Military/Aerospace specified devices are required,
ADC12D040
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
A,VD,VDR
V
DR
|V
|≤ 100 mV
A–VD
Voltage on Any Input or Output Pin−0.3V to (V
6.5V
VD+ 0.3V
or V
A
D
Operating Ratings (Notes 1, 2)
Operating Temperature−40˚C ≤ T
Supply Voltage (V
Output Driver Supply (V
V
Input1.0V to 2.4V
REF
CLK, PD, OE
Analog Input Pins−0V to (V
|AGND–DGND|≤100mV
)+4.75V to +5.25V
A,VD
)+2.35V to V
DR
−0.5V to (VD+ 0.5V)
+0.3V)
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Package Dissipation at T
= 25˚CSee (Note 4)
A
±
25 mA
±
50 mA
ESD Susceptibility
Human Body Model (Note 5)2500V
Machine Model (Note 5)250V
Soldering Temperature,
Infrared, 10 sec. (Note 6)235˚C
Storage Temperature−65˚C to +150˚C
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VAVD+5V, VDR+3.0V, PD
= 0V, INT/EXT = V
TJ=T
MIN
to T
MAX
D,VREF
: all other limits TJ= 25˚C (Notes 7, 8, 9)
= +2.0V, OEA, OEB = 0V, f
SymbolParameterConditions
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes12Bits (min)
INLIntegral Non Linearity (Note 11)
DNLDifferential Non Linearity
GEGain Error
TC GEGain Error Tempco
V
TC
V
OFF
OFF
Offset Error (VIN+=VIN−)−0.1
Offset Error Tempco
Positive Error0.51+2.8/−1.9%FS
Negative Error0.68+4/−2.7%FS
External Reference15ppm/
Internal Reference100ppm/
External Reference3ppm/
Internal Reference3ppm/
Under Range Output Code00
Over Range Output Code40954095
DYNAMIC CONVERTER CHARACTERISTICS
FPBWFull Power Bandwidth0 dBFS Input, Output at −3 dB100MHz