ADC1061 10-Bit High-Speed mP-Compatible
A/D Converter with Track/Hold Function
ADC1061 10-Bit High-Speed mP-Compatible A/D Converter with Track/Hold Function
December 1994
General Description
Using a modified half-flash conversion technique, the 10-bit
ADC1061 CMOS analog-to-digital converter offers very fast
conversion times yet dissipates a maximum of only 235 mW.
The ADC1061 performs a 10-bit conversion in two lowerresolution ‘‘flashes’’, thus yielding a fast A/D without the
cost, power dissipation, and other problems associated with
true flash approaches.
The analog input voltage to the ADC1061 is tracked and
held by an internal sampling circuit. Input signals at frequencies from DC to greater than 160 kHz can therefore be digitized accurately without the need for an external sampleand-hold circuit.
For ease of interface to microprocessors, the ADC1061 has
Features
Y
1.8 ms maximum conversion time to 10 bits
Y
Low power dissipation: 235 mW (maximum)
Y
Built-in track-and-hold
Y
No external clock required
Y
Singlea5V supply
Y
No missing codes over temperature
Applications
Y
Waveform digitizers
Y
Disk drives
Y
Digital signal processor front ends
Y
Mobile telecommunications
been designed to appear as a memory location or I/O port
without the need for external interface logic.
Simplified Block and Connection Diagrams
Dual-In-Line Package
TL/H/10559– 2
Top View
TL/H/10559– 1
Order Number
Ordering Information
Industrial (b40§CsT
ADC1061CIJJ20A
s
85§C)Package
A
ADC1061CIJ, ADC1061CIN,
ADC1061CIWM or ADC1061CMJ
See NS Package J20A,
M20B or N20A
ADC1061CINN20A
ADC1061CIWMM20B
Military (b55§CsT
s
125§C)Package
A
ADC1061CMJJ20A
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor CorporationRRD-B30M75/Printed in U. S. A.
TL/H/10559
Absolute Maximum Ratings (Notes1&2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
Voltage at any Input or Output
Input Current at Any Pin (Note 3)5 mA
Package Input Current (Note 3)20 mA
Power Dissipation (Note 4)875 mW
ESD Susceptibility (Note 5)1500V
a
e
AV
CC
e
DVCC)
b
0.3V to V
b
0.3V toa6V
a
a
0.3V
Soldering Information (Note 6)
N Package (10 seconds)260
J Package (10 seconds)300
SO Package (Note 6):
The following specifications apply for V
specified. Boldface limits apply for T
a
ea
e
T
A
e
MIN
e
t
to T
f
MAX
20 ns, V
REF(a)
; all other limits T
r
5V, t
e
T
J
SymbolParameterConditions
t
CONV
t
CRD
t
ACC1
t
ACC2
t
SH
t1H,t
t
INTH
t
ID
t
P
Conversion Time from Rising EdgeMode 1
of S
/H to Falling Edge of INT
Conversion Time for MODE 2Mode 2
(RD Mode)
Access Time (Delay from FallingMode 1; C
Edge of RD
to Output Valid)
Access Time (Delay from FallingMode 2; C
Edge of RD
to Output Valid)
Minimum Sample Time
TRI-STATE Control (Delay from RisingR
0H
Edge of RD to High-Z State)
Delay from Rising Edge of RD
to Rising Edge of INT
Delay from INT to Output ValidC
Delay from End of Conversion
to Next Conversion
e
L
e
L
(Figure 1)
; (Note 9)250ns (Max)
e
L
e
L
e
1k, C
L
100 pF2050ns (Max)
SRSlew Rate for Correct
Track-and-Hold Operation
100 pF
100 pF
10 pF
e
5V, and V
A
e
e
T
J
REF(b)
25§C.
e
GND unless otherwise
TypicalLimitUnits
(Note 7)(Note 8)(Limits)
1.21.8ms (Max)
1.82.4ms (Max)
2050ns (Max)
a
t
50ns (Max)
CRD
2050ns (Max)
1050ns (Max)
1020ns (Max)
2.5V/ms
3
AC Electrical Characteristics (Continued)
The following specifications apply for V
specified. Boldface limits apply for T
SymbolParameterConditions
C
VIN
C
OUT
C
IN
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: When the input voltage (V
to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input of 5 mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation at any temperature is P
device, T
JMAX
C/W for the small outline (WM) package.
and 65
§
Note 5: Human body model, 100 pF discharged through a 1.5 kX resistor.
Note 6: See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
Note 7: Typicals are at 25
Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 9: Accuracy may degrade if tSH is shorter than the value specified.
Analog Input Capacitance35pF
Logic Output Capacitance5pF
Logic Input Capacitance5pF
) at any pin exceeds the power supply rails (V
IN
e
150§C, and the typical thermal resistance (iJA) when board mounted is 47§C/W for the plastic (N) package, 85§C/W for the ceramic (J) package,
C and represent most likely parametric norm.
§
a
ea
e
T
A
e
5V, t
e
J
e
t
to T
f
MAX
20 ns, V
; all other limits T
r
T
MIN
REF(a)
e
5V, and V
e
A
e
REF(b)
e
T
25§C.
J
GND unless otherwise
TypicalLimitUnits
(Note 7)(Note 8)
k
IN
e
b
(T
D
TA)/iJAor the number given in the Absolute Maximum Ratings, whichever is lower. For this
JMAX
Vbor V
l
Va) the absolute value of current at that pin should be limited
IN
, iJAand the ambient temperature, TA. The maximum
JMAX
TRI-STATE Test Circuits and Waveforms
TL/H/10559– 3
TL/H/10559– 5
TL/H/10559– 4
TL/H/10559– 6
4
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