Rainbow Electronics ADC10064 User Manual

December 1994
ADC10061/ADC10062/ADC10064 10-Bit 600 ns A/D Converter with Input Multiplexer and Sample/Hold
ADC10061/ADC10062/ADC10064 10-Bit 600 ns A/D Converter
with Input Multiplexer and Sample/Hold
General Description
Using an innovative, patented multistep* conversion tech­nique, the 10-bit ADC10061, ADC10062, and ADC10064 CMOS analog-to-digital converters offer sub-microsecond conversion times yet dissipate a maximum of only 235 mW. The ADC10061, ADC10062, and ADC10064 perform a 10-bit conversion in two lower-resolution ‘‘flashes’’, thus yielding a fast A/D without the cost, power dissipation, and other problems associated with true flash approaches. The ADC10061 is pin-compatible with the ADC1061 but much faster, thus providing a convenient upgrade path for the ADC1061.
The analog input voltage to the ADC10061, ADC10062, and ADC10064 is sampled and held by an internal sampling cir­cuit. Input signals at frequencies from dc to over 200 kHz can therefore be digitized accurately without the need for an external sample-and-hold circuit.
The ADC10062 and ADC10064 include a ‘‘speed-up’’ pin. Connecting an external resistor between this pin and ground reduces the typical conversion time to as little as 350 ns with only a small increase in linearity error.
For ease of interface to microprocessors, the ADC10061, ADC10062, and ADC10064 have been designed to appear as a memory location or I/O port without the need for exter­nal interface logic.
Ordering Information
ADC10061
s
Industrial (b40§CsT
ADC10061BIN, ADC10061CIN N20A Molded DIP ADC10061BIWM, ADC10061CIWM M20B Small Outline
a
85§C) Package
A
Features
Y
Built-in sample-and-hold
Y
Singlea5V supply
Y
1, 2, or 4-input multiplexer options
Y
No external clock required
Y
Speed adjust pin for faster conversions (ADC10062 and ADC10064). See ADC10662/4 for high speed guaran­teed performance.
Key Specifications
Y
Conversion time to 10 bits 600 ns typical,
900 ns max over temperature
Y
Sampling Rate 800 kHz
Y
Low power dissipation 235 mW (max)
Y
Total unadjusted error
Y
No missing codes over temperature
g
1.0 LSB (max)
Applications
Y
Digital signal processor front ends
Y
Instrumentation
Y
Disk drives
Y
Mobile telecommunications
ADC10064
s
Industrial (b40§CsT
ADC10064BIN, ADC10064CIN N28B Molded DIP ADC10064BIWM, ADC10064CIWM M28B Small Outline
a
85§C) Package
A
s
Military (b55§CsT
a
125§C) Package
A
ADC10061CMJ/883 J20A Cerdip
Military (b55§CsT
ADC10064CMJ/883 J28A Cerdip
s
a
125§C) Package
A
ADC10062
s
Industrial (b40§CsT
a
85§C) Package
A
ADC10062BIN, ADC10062CIN N24A Molded DIP ADC10062BIWM, ADC10062CIWM M24B Small Outline
s
Military (b55§CsT
a
125§C) Package
A
ADC10062CMJ/883 J24A Cerdip
*U.S. Patent Number 4918449
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
TL/H/11020
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply Voltage (V
Voltage at Any Input or Output
Input Current at Any Pin (Note 3) 5 mA
Package Input Current (Note 3) 20 mA
Power Dissipation (Note 4) 875 mW
ESD Susceptability (Note 5) 2000V
Soldering Information (Note 6)
N Package (10 Sec) 260 J Package (10 Sec) 300 SO Package:
Vapor Phase (60 Sec) 215 Infrared (15 Sec) 220
Storage Temperature Range
Junction Temperature 150§C
a
e
AV
CC
e
DVCC)
b
0.3V toa6V
b
0.3V to V
b
65§Ctoa150§C
a
a
0.3V
Operating Ratings (Notes 1, 2)
s
s
T
Temperature Range T
ADC10061BIN, ADC10061BIWM,
MIN
ADC10061CIN, ADC10061CIWM, ADC10062BIN, ADC10062BIWM, ADC10062CIN, ADC10062CIWM, ADC10064BIN, ADC10064BIWM, ADC10064CIN, ADC10064CIWM ADC10061CMJ/883, ADC10062CMJ/883, ADC10064CMJ/883
b
40§CsT
b
55§CsT
Supply Voltage Range 4.5V to 5.5V
C
§
C
§
C
§
C
§
T
A
MAX
s
a
85§C
A
s
a
125§C
A
Converter Characteristics
The following specifications apply for V unless otherwise specified. Boldface limits apply for T
a
ea
5V, V
REF(a)
A
e
ea
T
J
e
5V, V
T
Min
Symbol Parameter Conditions
Resolution 10 Bits
Integral Linearity Error BIN, BIWM Suffixes
CIN, CIWM, CMJ Suffixes
e
R
18 kX
SA
Offset Error
Full-Scale Error
Total Unadjusted Error BIN, BIWM Suffixes
CIN, CIWM, CMJ Suffixes All Suffixes, R
e
SA
Missing Codes 0 (max)
a
Power Supply Sensitivity V
THD Total Harmonic Distortion f
SNR Signal-to-Noise Ratio f
Effective Number of Bits f
R
REF
R
REF
V
REF(a)VREF(a)
V
REF(b)VREF(b)
V
REF(a)VREF(a)
V
REF(b)VREF(b)
V
IN
V
IN
Reference Resistance 650 400 X (min)
Reference Resistance 650 900 X (max)
Input Voltage V
Input Voltage GNDb0.05 V (min)
Input Voltage V
Input Voltage V
Input Voltage V
Input Voltage GNDb0.05 V (min)
OFF Channel Input Leakage Current CSeVa,V ON Channel Input Leakage Current CS
e
5Vg5%, V
a
e
V
5Vg10%, V
e
10 kHz, 4.85 V
IN
e
f
160 kHz, 4.85 V
IN
e
10 kHz, 4.85 V
IN
e
f
160 kHz, 4.85 V
IN
e
10 kHz, 4.85 V
IN
e
f
160 kHz, 4.85 V
IN
e
Va,V
REF
e
V
IN
e
V
IN
REF(b)
to T
18 kX
REF
P-P
P-P
P-P
P-P
P-P
P-P
a
a
e
; all other limits T
Max
e
4.5V
e
4.5V
GND, and Speed Adjust pin unconnected
e
ea
T
A
25§C.
J
Typical Limit Units
(Note 7) (Notes 8, 10) (Limit)
g
0.6/g1.1 LSB (max)
g
g
0.5 LSB
g
0.5 LSB
g
(/16 LSB
1.0/g1.5 LSB (max)
g
1 LSB (max)
g
1 LSB (max)
g
1.0/g1.5 LSB (max)
g
1.5/g2.0 LSB (max)
g
*/8 LSB (max)
0.06 %
0.08 %
61 dB 60 dB
9.6 Bits
9.4 Bits
a
a
0.05 V (max)
REF(b)
REF(a)
a
a
0.05 V (max)
V (min)
V (max)
0.01 3 mA (max)
g
1
b
3 mA (max)
2
DC Electrical Characteristics
The following specifications apply for V otherwise specified. Boldface limits apply for T
a
ea
5V, V
A
REF(a)
e
T
e
5V V
e
T
MIN
to T
J
Symbol Parameter Conditions
a
V
IN(1)
V
IN(0)
I
IN(1)
I
IN(0)
V
OUT(1)
V
OUT(0)
I
OUT
DI
CC
AI
CC
Logical ‘‘1’’ Input Voltage V
Logical ‘‘0’’ Input Voltage V
Logical ‘‘1’’ Input Current V
Logical ‘‘0’’ Input Current V
Logical ‘‘1’’ Output Voltage V
Logical ‘‘0’’ Output Voltage V
TRI-STATEÉOutput Current V
DVCCSupply Current CSeS/HeRDe0, R
AVCCSupply Current CSeS/HeRDe0, R
e
5.5V 2.0 V (min)
a
e
4.5V 0.8 V (max)
e
5V 0.005 3.0 mA (max)
IN(1)
0V
IN(0)
a
V
V
a
a
OUT
OUT
e e
e
4.5V, I
4.5V, I
4.5V, I
e e
eb
OUT
eb
OUT
e
1.6 mA 0.4 V (max)
OUT
5V 0.1 50 mA (max) 0V
CSeS/HeRDe0, R
e
S/HeRDe0, R
CS
e
REF(b)
GND, and Speed Adjust pin unconnected unless
; all other limits T
MAX
e
ea
T
A
25§C.
J
Typical Limit Units
(Note 7) (Notes 8, 10) (Limits)
b
0.005
b
3.0 mA (max)
360 mA 2.4 V (min) 10 mA 4.25 V (min)
b
0.1
e %
SA
e
18 kX 1.0 mA (max)
SA
e %
SA
e
18 kX 30 mA (max)
SA
1.0 2 mA (max)
30 45 mA (max)
b
50 mA (max)
AC Electrical Characteristics
The following specifications apply for V unconnected unless otherwise specified. Boldface limits apply for T
a
25§C.
a
ea
5V, t
e
e
t
f
20 ns, V
r
Symbol Parameter Conditions
t
CONV
t
CRD
Mode 1 Conversion Time BIN, BIWM, CIN, from Rising Edge of S to Falling Edge of INT
/H CIWM Suffixes 600 750/900 ns (max)
CMJ Suffixes 600 1000 ns (max)
e
R
18k 375 ns
SA
Mode 2 Conversion Time BIN, BIWM, CIN,
CIWM Suffixes 850 1400 ns (max) CMJ Suffixes 850 1500 ns (max)
e
SA
e
L
e
L
; (Note 9) 250 ns (max)
e
1k, C
L
t
ACC1
t
ACC2
t
SH
t1H,t
Mode 2, R
Access Time (Delay from Falling Mode 1; C Edge of RD
to Output Valid)
Access Time (Delay from Falling Mode 2; C Edge of RD to Output Valid)
Minimum Sample Time
0H
TRI-STATE Control (Delay R from Rising Edge of RD
(Figure 1)
e
L
to High-Z State)
t
INTH
t
P
Delay from Rising Edge of RD C to Rising Edge of INT
Delay from End of Conversion to Next Conversion
e
100 pF
L
REF(a)
e
A
e
5V, V
e
T
T
J
MIN
REF(b)
to T
e
GND, and Speed Adjust pin
; all other limits T
MAX
A
Typical Limit Units
(Note 7) (Notes 8, 10) (Limits)
18k 530 ns
100 pF
100 pF
30 60 ns (max)
900 t
a
50 ns (max)
CRD
10 pF
30 60 ns (max)
25 50 ns (max)
50 ns (max)
e
e
T
J
3
AC Electrical Characteristics (Continued)
The following specifications apply for V unconnected unless otherwise specified. Boldface limits apply for T
a
25§C.
Symbol Parameter Conditions
t
MS
t
MH
C
VIN
C
OUT
C
IN
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteris­tics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditons.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: When the input voltage (V
to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T allowable power dissipation at any temperature is P cases, the maximum derated power dissipation will be reached only during fault conditions. For these devices, T from the tables below:
Suffix iJA(§C/W)
CMJ 54
BIN, CIN 70
BIWM, CIWM 85
Note 5: Human body model, 100 pF discharged through a 1.5 kX resistor.
Note 6: See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
Note 7: Typicals are at
Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 9: Accuracy may degrade if t
Note 10: A military RETS electrical test specification is available on request. At time of printing, the ADC10061CMJ/883, ADC10062CMJ/883, and
ADC10064CMJ/883 RETS specification complies fully with the boldface limits in this column.
Multiplexer Control Setup Time 10 75 ns (max)
Multiplexer Hold Time 10 40 ns (max)
Analog Input Capacitance 35 pF (max)
Logic Output Capacitance 5 pF (max)
Logic Input Capacitance 5 pF (max)
) at any pin exceeds the power supply rails (V
IN
ADC10061
a
25§C and represent must likely parametric norm.
is shorter than the value specified. See curves of Accuracy vs tSH.
SH
a
ea
e
D
e
5V, t
r
b
(T
TA)/iJAor the number given in the Absolute Maximum Ratings, whichever is lower. In most
JMAX
Suffix iJA(§C/W)
CMJ 48
BIN, CIN 60
BIWM, CIWM 82
e
t
20 ns, V
f
k
IN
ADC10062
REF(a)
A
GND or V
e
5V, V
e
e
T
T
J
MIN
REF(b)
to T
e
GND, and Speed Adjust pin
; all other limits T
MAX
Typical Limit Units
(Note 7) (Note 8) (Limits)
l
Va) the absolute value of current at that pin should be limited
IN
, iJAand the ambient temperature, TA. The maximum
JMAX
for a board-mounted device can be found
JMAX
ADC10064
Suffix iJA(§C/W)
CMJ 44
BIN, CIN 53
BIWM, CIWM 78
e
T
A
J
e
4
Typical Performance Characteristics
Zero (Offset) Error vs Reference Voltage
Digital Supply Current vs Temperature
Conversion Time vs Speed-Up Resistor (ADC10062 and ADC10064 Only)
Linearity Error vs Reference Voltage
Conversion Time vs Temperature
Conversion Time vs Speed-Up Resistor (ADC10062 and ADC10064 Only)
Analog Supply Current vs Temperature
Conversion Time vs Temperature
Spectral Response with 100 kHz Sine Wave Input
Spectral Response with 100 kHz Sine Wave Input
5
TL/H/11020– 2
Typical Performance Characteristics (Continued)
Signal-to-Noise vs Signal Frequency
Linearity Change vs Speed-Up Resistor (ADC10062 and ADC10064 Only)
a
THD Ratio
Linearity Change vs Speed-Up Resistor (ADC10062 and ADC10064 Only)
Linearity Error Change vs Sample Time
TL/H/11020– 4
6
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