ADC0820 8-Bit High Speed mP Compatible
A/D Converter with Track/Hold Function
ADC0820 8-Bit High Speed mP Compatible A/D Converter with Track/Hold Function
February 1995
General Description
By using a half-flash conversion technique, the 8-bit
ADC0820 CMOS A/D offers a 1.5 ms conversion time and
dissipates only 75 mW of power. The half-flash technique
consists of 32 comparators, a most significant 4-bit ADC
and a least significant 4-bit ADC.
The input to the ADC0820 is tracked and held by the input
sampling circuitry eliminating the need for an external sample-and-hold for signals moving at less than 100 mV/ms.
For ease of interface to microprocessors, the ADC0820 has
been designed to appear as a memory location or I/O port
without the need for external interfacing logic.
Key Specifications
Y
Resolution8 Bits
Y
Conversion Time2.5 ms Max (RD Mode)
1.5 ms Max (WR-RD Mode)
Y
Input signals with slew rate of 100 mV/ms converted
without external sample-and-hold to 8 bits
Y
Low Power75 mW Max
Y
Total Unadjusted Error
g
(/2 LSB andg1 LSB
Connection and Functional Diagrams
Dual-In-Line, Small Outline and
SSOP Packages
Features
Y
Built-in track-and-hold function
Y
No missing codes
Y
No external clocking
Y
Single supplyÐ5 V
Y
Easy interface to all microprocessors, or operates
stand-alone
Y
Latched TRI-STATEÉoutput
Y
Logic inputs and outputs meet both MOS and T2L voltage level specifications
Y
Operates ratiometrically or with any reference value
equal to or less than V
Y
0V to 5V analog input voltage range with single 5V
supply
Y
No zero or full-scale adjust required
Y
Overflow output available for cascading
Y
0.3×standard width 20-pin DIP
Y
20-pin molded chip carrier package
Y
20-pin small outline package
Y
20-pin shrink small outline package (SSOP)
DC
CC
Top View
TL/H/5501– 1
Molded Chip Carrier
Package
FIGURE 1
TL/H/5501– 2
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. A.
TL/H/5501– 33
TL/H/5501
See Ordering Information
Absolute Maximum Ratings (Notes1&2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
Logic Control Inputs
Voltage at Other Inputs and Output
Storage Temperature Range
Package Dissipation at T
)10V
CC
e
A
b
0.2V to V
b
CC
0.2V to V
CC
b
65§Ctoa150§C
25§C875 mW
a
0.2V
a
0.2V
Input Current at Any Pin (Note 5)1 mA
Package Input Current (Note 5)4 mA
ESD Susceptability (Note 9)1200V
Converter Characteristics The following specifications apply for RD mode (pin 7
and V
Resolution888Bits
Total UnadjustedADC0820BCN, BCWM
ErrorADC0820CCJ
(Note 3)ADC0820CCN, CCWM, CIWM,
Minimum Reference2.31.002.31.2kX
Resistance
Maximum Reference2.362.35.36kX
Resistance
Maximum V
Input Voltage
Minimum V
Input Voltage
Minimum V
Input Voltage
Maximum V
Input Voltage
Maximum VINInputV
Voltage
Minimum VINInputGNDb0.1GNDb0.1 GNDb0.1V
Voltage
Maximum AnalogCSeV
Input LeakageV
CurrentV
Power SupplyV
Sensitivity
(b)eGND unless otherwise specified. Boldface limits apply from T
REF
ParameterConditions
Typ
(Note 6)
ADC0820CCMSA
(a)V
REF
(b)GNDGNDGNDV
REF
(a)V
REF
(b)V
REF
CC
e
V
IN
CC
e
GND
IN
CC
e
5Vg5%
g
(/16
Lead Temp. (Soldering, 10 sec.)
Dual-In-Line Package (plastic)260
Dual-In-Line Package (ceramic)300
Surface Mount Package
AC Electrical Characteristics The following specifications apply for V
V
(b)e0V and T
REF
t
, Conversion Time for RD ModePin 7e0,
CRD
t
, Access Time (Delay fromPin 7e0,
ACC0
Falling Edge of RD
t
, Conversion Time forPin 7eVCC;t
CWR-RD
WR-RD Modet
tWR, Write TimeMinPin 7eVCC;
e
25§C unless otherwise specified.
A
ParameterConditions
(Figure 2)
(Figure 2)
to Output Valid)
600 ns;
WR
(Figures 3a
RD
e
e
(Figures 3a
(Note 6)
t
CRD
600 ns,1.52ms
and
3b)
and
3b)
Max(Note 4) See Graph50ms
tRD, Read TimeMinPin 7eVCC;
(Figures 3a
and
3b)
(Note 4) See Graph
e
1k and C
RD
RD
k
tI;
(Figure 3a)
l
tI;
(Figure 3b)
e
15 pF30ns
L
t
, Access Time (Delay fromPin 7eVCC,t
ACC1
Falling Edge of RD to Output Valid)C
C
t
, Access Time (Delay fromPin 7eVCC,t
ACC2
Falling Edge of RD to Output Valid)C
C
t
, Access Time (Delay from RisingR
ACC3
Edge of RDY to Output Valid)
e
15 pF190280ns
L
e
100 pF210320ns
L
e
15 pF70120ns
L
e
100 pF90150ns
L
PULLUP
3
e
e
e
5V, t
t
Typ
CC
20 ns, V
r
f
TestedDesign
LimitLimitUnits
REF
(a)e5V,
(Note 7)(Note 8)
1.62.5ms
a
20t
CRD
a
50ns
600ns
600ns
e
e
AC Electrical Characteristics (Continued) The following specifications apply for V
V
(a)e5V, V
REF
tI, Internal Comparison TimePin 7eVCC;
t1H,t0H, TRI-STATE ControlR
(Delay from Rising Edge of RD
(b)e0V and T
REF
ParameterConditions
e
25§C unless otherwise specified.
A
e
C
50 pF
L
e
1k, C
L
to
L
Typ
(Note 6)
(Figures 3b
e
10 pF100200ns
and
4)
8001300ns
TestedDesign
LimitLimitUnits
(Note 7)(Note 8)
CC
5V, t
e
t
20 ns,
r
f
Hi-Z State)
t
, Delay from Rising Edge ofPin 7eVCC,C
INTL
WR
to Falling Edge of INTt
t
, Delay from Rising Edge of
INTH
RD
to Rising Edge of INTC
t
, Delay from Rising Edge of
INTHWR
WR
to Rising Edge of INT
t
, Delay from CS to RDY
RDY
tID, Delay from INT to Output Valid
l
tI;
RD
k
t
tI;
RD
(Figures 2, 3a
e
50 pF
L
(Figure 4)
(Figure 2)
(Figure 4)
tRI, Delay from RD to INTPin 7eVCC,t
(Figure 3a)
tP, Delay from End of Conversion
(Figures 2, 3a, 3b
e
50 pF
L
(Figure 3b)
(Figure 3a)
and
3b)
e
,C
50 pF175270ns
L
e
,C
50 pF, Pin 7e050100ns
L
a
t
200t
RD
125225ns
2050ns
k
RD
t
I
and
4)
200290ns
t
I
a
290ns
RD
500ns
ns
to Next Conversion(Note 4) See Graph
Slew Rate, Tracking0.1V/ms
C
, Analog Input Capacitance45pF
VIN
C
, Logic Output Capacitance5pF
OUT
CIN, Logic Input Capacitance5pF
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its specified operating conditions.
Note 2: All voltages are measured with respect to the GND pin, unless otherwise specified.
Note 3: Total unadjusted error includes offset, full-scale, and linearity errors.
Note 4: Accuracy may degrade if t
Note 5: When the input voltage (V
to 1 mA or less. The 4 mA package input current limits the number of pins that can exceed the power supply boundaries witha1mAcurrent limit to four.
Note 6: Typicals are at 25
Note 7: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Design limits are guaranteed but not 100% tested. These limits are not used to calculate outgoing quality levels.
Note 9: Human body model, 100 pF discharaged through a 1.5 kX resistor.
§
or tRDis shorter than the minimum value specified. See Accuracy vs tWRand Accuracy vs tRDgraphs.
WR
) at any pin exceeds the power supply rails (V
IN
C and represent most likely parametric norm.
k
IN
Vbor V
l
Va) the absolute value of current at that pin should be limited
IN
TRI-STATE Test Circuits and Waveforms
t
1H
TL/H/5501– 3
t
0H
TL/H/5501– 5
4
TL/H/5501– 4
e
t
20 nsTL/H/5501 – 6
r
Timing Diagrams
Note: On power-up the state of INT can be high or low.
FIGURE 3a. WR-RD Mode (Pin 7 is High and t
FIGURE 2. RD Mode (Pin 7 is Low)
RD
TL/H/5501– 7
TL/H/5501– 8
k
tI)
FIGURE 3b. WR-RD Mode (Pin 7 is High and t
RD
l
TL/H/5501– 10
FIGURE 4. WR-RD Mode (Pin 7 is High)
Stand-Alone Operation
TL/H/5501– 9
tI)
5
Typical Performance Characteristics
Logic Input Threshold
Voltage vs Supply Voltage
Conversion Time (RD Mode)
vs Temperature
Power Supply Current vs
Temperature (not including
reference ladder)
*1 LSB
e
Accuracy vs t
Accuracy vs V
e
[
V
V
REF
REF
V
REF
256
WR
REF
(a)bV
REF
(b)
Accuracy vs t
RD
tI, Internal Time Delay vs
]
Temperature
Accuracy vs t
p
Output Current vs
Temperature
TL/H/5501– 11
6
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