Rainbow Electronics ADC081000 User Manual

ADC081000 High Performance, Low Power 8-Bit, 1 GSPS A/D Converter
ADC081000 High Performance, Low Power 8-Bit, 1 GSPS A/D Converter
July 2004

General Description

The ADC081000 is a low power, high performance CMOS analog-to-digital converter that digitizes signals to 8 bits resolution at sampling rates up to 1.6 GSPS. Consuming a typical 1.4 Watts at 1 GSPS from a single 1.9 Volt supply, this device is guaranteed to have no missing codes over the full operating temperature range. The unique folding and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-and­hold amplifier and the self-calibration scheme enable a very flat response of all dynamic parameters beyond Nyquist, producing a high 7.5 ENOB with a 500 MHz input signal and a 1 GHz sample rate. Output formatting is offset binary and the LVDS digital outputs are compliant with IEEE 1596.3­1996, with the exception of a reduced common mode volt­age of 0.8V.
The converter has a 1:2 demultiplexer that feeds two LVDS buses, reducing the output data rate on each bus to half the sampling rate. The data on these buses are interleaved in time to provide a 500 MHz output rate per bus and a com­bined output rate of 1 GSPS.
The converter typically consumes less than 10 mW in the Power Down Mode and is available in a 128-lead, thermally enhanced exposed pad LQFP and operates over the indus­trial (-40˚C T
+85˚C) temperature range.
A

Block Diagram

Features

n Internal Sample-and-Hold n Single +1.9V n Adjustable Output Levels n Guaranteed No Missing Codes n Low Power Standby Mode
±
0.1V Operation

Key Specifications

n Resolution 8 Bits n Max Conversion Rate 1 GSPS (min) n ENOB n DNL n Conversion Latency 7 and 8 Clock Cycles n Power Consumption
@
500 MHz Input 7.5 Bits (typ)
±
0.25 LSB (typ)
— Operating 1.45 W (typ) — Power Down Mode 9 mW (typ)

Applications

n Direct RF Down Conversion n Digital Oscilloscopes n Satellite Set-top boxes n Communications Systems n Test Instrumentation
20068153
© 2004 National Semiconductor Corporation DS200681 www.national.com

Ordering Information

ADC081000

Pin Configuration

Extended Commercial Temperature
<
<
T
Range (-40˚C
ADC081000CIYB 128-Pin Exposed Pad LQFP
ADC081000LEVAL Evaluation Board
A
+85˚C)
NS Package
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
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20068101

Pin Descriptions and Equivalent Circuits

Pin Functions
Pin No. Symbol Equivalent Circuit Description
Output Voltage Amplitude set. Tie this pin high for
3 OutV
4 OutEdge
14 DC_Coup
26 PD
30 CAL
35 FSR
127 CalDly
normal differential output amplitude. Ground this pin for a reduced differential output amplitude and reduced power consumption. See Section 1.5.
Output Edge Select. Sets the edge of the DCLK+ (pin
82) at which the output data transitions. The output transitions with the DCLK+ rising edge when this pin is high or on the falling edge when this pin is low. See Section 5.3.
DC Coupling select. When this pin is high, the V
- analog inputs are d.c. coupled and the input
V
IN
common mode voltage should equal the V output voltage. When this pin is low, the analog input pins are internally biased and the input signal should be a.c. coupled to the analog input pins. See Section 3.0.
Power Down Pin. A logic high on this pin puts the ADC into the Power Down mode. A logic low on this pin allows normal operation.
Calibration. A minimum 10 clock cycles low followed by a minimum of 10 clock cycles high on this pin will initiate the self calibration sequence. See Section 1.1.
Full scale Range Select. With a logic low on this pin, the full-scale differential input is 600 mV high on this pin, the full-scale differential input is 800
. See Section 1.3.
mV
P-P
Calibration Delay. This sets the number of clock cycles after power up before calibration begins. See Section
1.1.
(pin 7)
CMO
. With a logic
P-P
+ and
IN
ADC081000
18 19
11 10
CLK+
CLK-
V
IN
V
IN
Clock input pins for the ADC. The differential clock signal must be a.c. coupled to these pins. The input signal is sampled on the falling edge of CLK+.
+
-
Analog Signal Differential Inputs to the ADC.
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Pin Descriptions and Equivalent Circuits (Continued)
Pin Functions
ADC081000
Pin No. Symbol Equivalent Circuit Description
7V
31 V
CMO
BG
126 CalRun
32 R
83 84 85 86 89 90 91 92 93 94 95
96 100 101 102 103
EXT
D7-
D7+
D6-
D6+
D5-
D5+
D4-
D4+
D3-
D3+
D2-
D2+
D1-
D1+
D0-
D0+
Common Mode Output voltage for VIN+ and VIN- when d.c. input coupling is used. See Section 3.0.
Bandgap output voltage. This pin is capable of sourcing or sinking up to 100 µA.
Calibration Running indication. This pin is at a logic high when calibration is running.
External Bias Resistor connection. The required value
±
is 3.3k-Ohms (
0.1%) to ground. See Section 1.1.
LVDS data output bits sampled second in time sequence. These outputs should always be terminated with a differential 100resistance.
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Pin Descriptions and Equivalent Circuits (Continued)
Pin Functions
Pin No. Symbol Equivalent Circuit Description
104 105 106 107 111 112 113 114 115 116 117 118 122 123 124 125
79 80
Dd7­Dd7+ Dd6­Dd6+ Dd5­Dd5+ Dd4­Dd4+ Dd3­Dd3+ Dd2­Dd2+ Dd1­Dd1+ Dd0­Dd0+
OR+
OR-
LVDS data output bits sampled first in time sequence. These outputs should always be terminated with a differential 100resistance.
Out of Range output. A differential high at these pins indicates that the differential input is out of range
±
(outside the range of
300 mV or±400 mV as defined
by the FSR pin). See Section 1.6.
ADC081000
82 81
2, 5, 8, 13, 16, 17, 20, 25, 28,
33, 128
40, 51, 62, 73,
88, 99, 110,
121
1, 6, 9, 12, 15,
21, 24, 27
42, 53, 64, 74,
87, 97, 108,
119
22, 23, 29, 34,
36 - 39, 41, 43 - 50, 52, 54 - 61, 63, 65 - 72, 75 - 78, 98,
109, 120
DCLK+
DCLK-
V
A
V
DR
GND Ground return for V
DR GND Ground return for V
Differential Clock Outputs used to latch the output data. Delayed and non-delayed data outputs are supplied synchronous to this signal.
Analog power supply pins. Bypass these pins to GND.
Output Driver power supply pins. Bypass these pins to DR GND.
A
DR
NC No Connection. Make no connection to these pins.
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Absolute Maximum Ratings

(Notes 1, 2)
If Military/Aerospace specified devices are required,
ADC081000
please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V
Voltage on Any Input Pin −0.15V to
Ground Difference
|GND - DR GND| 0V to 100 mV
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
Power Dissipation at T
ESD Susceptibility (Note 4)
Human Body Model Machine Model
Soldering Temperature, Infrared,
10 seconds (Note 5) 235˚C
Storage Temperature −65˚C to +150˚C
) 2.2V
A,VDR
= 25˚C 2.0 W
A
(V
+0.15V)
A
±
25 mA
±
50 mA
2500V
250V
Operating Ratings (Notes 1, 2)
Ambient Temperature Range −40˚C T
Supply Voltage (V
Driver Supply Voltage (V
) +1.8V to +2.0V
A
) +1.8V to V
DR
Analog Input Common Mode Voltage 1.2V to 1.3V
V
Differential Voltage Range −VFS/2 to +VFS/2
IN
Ground Difference (|GND - DR GND|) 0V
CLK Pins Voltage Range 0V to V
Differential CLK Amplitude 0.6V
P-P

Package Thermal Resistances

θ
J-C
Package
128-Lead Exposed Pad
LQFP
(Top of
Package)
10˚C / W 2.8˚C / W

Converter Electrical Characteristics

The following specifications apply after calibration for VA=VDR= +1.9VDC, OutV = 1.9V, VINFSR (a.c. coupled) = differential 800mV
±
0.1%, Analog Signal Source Impedance = 100. Boldface limits apply for TA=T
= 10 pF, Differential, a.c. coupled Sinewave Clock, f
P-P,CL
unless otherwise stated. (Notes 6, 7)
Symbol Parameter Conditions
STATIC CONVERTER CHARACTERISTICS
INL Integral Non-Linearity
DNL Differential Non-Linearity
Resolution with No Missing Codes 8 Bits
V
OFF
TC V
Offset Error −0.45
Offset Error Tempco −40˚C to +85˚C −3 ppm/˚C
OFF
PFSE Positive Full-Scale Error (Note 9) −2.2
NFSE Negative Full-Scale Error (Note 9) −1.1
TC PFSE Positive Full Scale Error Tempco −40˚C to +85˚C 20 ppm/˚C
TC NFSE Negative Full Scale Error Tempco −40˚C to +85˚C 13 ppm/˚C
Dynamic Converter Characteristics
FPBW Full Power Bandwidth 1.7 GHz
Gain Flatness
ENOB Effective Number of Bits
SINAD
Signal-to-Noise Plus Distortion Ratio
SNR Signal-to-Noise Ratio
d.c. to 500 MHz
d.c. to 1 GHz
= 100 MHz, VIN= FSR − 0.5 dB 7.5 Bits
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB 7.5 7.1 Bits (min)
IN
f
= 498 MHz, VIN= FSR − 0.5 dB 7.5 7.1 Bits (min)
IN
= 100 MHz, VIN= FSR − 0.5 dB 47 dB
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB 47 44.8 dB (min)
IN
f
= 498 MHz, VIN= FSR − 0.5 dB 47 44.8 dB (min)
IN
= 100 MHz, VIN= FSR − 0.5 dB 48 dB
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB 48 45.5 dB (min)
IN
f
= 498 MHz, VIN= FSR − 0.5 dB 48 45.5 dB (min)
IN
= 1 GHz at 0.5V
CLK
with 50% duty cycle, R
P-P
MIN
Typical
(Note 8)
to T
± ±
. All other limits TA= 25˚C,
MAX
Limits
(Note 8)
0.35
0.25
±
0.9 LSB (max)
±
0.7 LSB (max)
−1.5
0.5
±
25 mV (max)
±
25 mV (max)
±
0.5 dBFS
±
1.0 dBFS
+85˚C
A
to 2.0V
θ
J-PAD
(Thermal
Pad)
= 3300
EXT
Units
(Limits)
LSB (min)
LSB (max)
A
A
P-P
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Converter Electrical Characteristics (Continued)
The following specifications apply after calibration for VA=VDR= +1.9VDC, OutV = 1.9V, VINFSR (a.c. coupled) = differential 800mV
±
0.1%, Analog Signal Source Impedance = 100. Boldface limits apply for TA=T
= 10 pF, Differential, a.c. coupled Sinewave Clock, f
P-P,CL
unless otherwise stated. (Notes 6, 7)
Symbol Parameter Conditions
STATIC CONVERTER CHARACTERISTICS
= 100 MHz, VIN= FSR − 0.5 dB -57 dB
f
IN
f
THD Total Harmonic Distortion
2nd Harm Second Harmonic Distortion
3rd Harm Third Harmonic Distortion
SFDR Spurious-Free dynamic Range
IMD Intermodulation Distortion
Out of Range Output Code (In addition to OR Output high)
= 248 MHz, VIN= FSR − 0.5 dB -57 −50 dB (max)
IN
f
= 498 MHz, VIN= FSR − 0.5 dB -57 −50 dB (max)
IN
= 100 MHz, VIN= FSR − 0.5 dB −64 dB
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB −64 dB
IN
f
= 498 MHz, VIN= FSR − 0.5 dB −64 dB
IN
= 100 MHz, VIN= FSR − 0.5 dB −64 dB
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB −64 dB
IN
f
= 498 MHz, VIN= FSR − 0.5 dB −64 dB
IN
= 100 MHz, VIN= FSR − 0.5 dB 58.5 dB
f
IN
f
= 248 MHz, VIN= FSR − 0.5 dB 58.5 50 dB (min)
IN
f
= 498 MHz, VIN= FSR − 0.5 dB 58.5 50 dB (min)
IN
f
= 121 MHz, VIN=FSR−7dB
IN1
= 126 MHz, VIN=FSR−7dB
f
IN2
(V
+)−(VIN−)>+ Full Scale 255
IN
(V
+)−(VIN−)<− Full Scale 0
IN
ANALOG INPUT AND REFERENCE CHARACTERISTICS
V
IN
V
CMI
C
IN
R
IN
Full Scale Analog Differential Input Range
Common Mode Analog Input Voltage
Analog Input Capacitance (Note 10)
Differential Input Resistance 100
FSR pin Low 600
FSR pin High 800
Differential 0.02 pF
Each input to ground 1.6 pF
ANALOG OUTPUT CHARACTERISTICS
V
CMO
TC V
V
BG
TC V
Common Mode Output Voltage I
Common Mode Output Voltage
CMO
Temperature Coefficient
Bandgap Reference Output Voltage
Bandgap Reference Voltage
BG
Temperature Coefficient
=±1 µA 1.21
CMO
= −40˚C to +85˚C 118 ppm/˚C
T
A
=±100 µA 1.26
I
BG
TA= −40˚C to +85˚C,
=±100 µA
I
BG
CLOCK INPUT CHARACTERISTICS
Square Wave Clock 0.6
V
ID
Differential Clock Input Level
Sine Wave Clock 0.6
I
I
C
IN
Input Current VIN=0VorVIN=V
Input Capacitance (Note 10)
Differential 0.02 pF
Each Input to Ground 1.5 pF
= 1 GHz at 0.5V
CLK
A
with 50% duty cycle, R
P-P
MIN
to T
. All other limits TA= 25˚C,
MAX
Typical
(Note 8)
Limits
(Note 8)
EXT
(Limits)
= 3300
Units
-51 dB
550 mV
650 mV
750 mV
850 mV
V
−50
V
CMO
V
CMO
CMO
+50
P-P
P-P
P-P
P-P
mV (min)
mV (max)
94 (min)
106 (max)
0.95
1.45
1.22
1.33
V (min)
V (max)
V (min)
V (max)
-28 ppm/˚C
0.4
2.0
0.4
2.0
±
A
V
P-P
V
P-P
V
P-P
V
P-P
ADC081000
(min)
(max)
(min)
(max)
(min)
(max)
(min)
(max)
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Converter Electrical Characteristics (Continued)
The following specifications apply after calibration for VA=VDR= +1.9VDC, OutV = 1.9V, VINFSR (a.c. coupled) = differential 800mV
ADC081000
±
0.1%, Analog Signal Source Impedance = 100. Boldface limits apply for TA=T
= 10 pF, Differential, a.c. coupled Sinewave Clock, f
P-P,CL
unless otherwise stated. (Notes 6, 7)
Symbol Parameter Conditions
DIGITAL CONTROL PIN CHARACTERISTICS
V
IH
V
IL
I
I
C
IN
Logic High Input Voltage (Note 12) 1.4 V (min)
Logic Low Input Voltage (Note 12) 0.5 V (max)
Input Current VIN=0orVIN=V
Logic Input Capacitance (Note 13) Each input to ground 1.2 pF
DIGITAL OUTPUT CHARACTERISTICS
OutV = V
V
OD
LVDS Differential Output Voltage
OutV = GND, measured
, measured single-ended 300
A
single-ended
V
DIFF
V
V
I
OS
Z
OD
OS
OS
O
Change in LVDS Output Swing Between Logic Levels
Output Offset Voltage 800 mV
Output Offset Voltage Change Between Logic Levels
Output Short Circuit Current
Output+ & Output- connected to
0.8V
Differential Output Impedance 100 Ohms
POWER SUPPLY CHARACTERISTICS
I
A
I
DR
P
D
Analog Supply Current
Output Driver Supply Current
Power Consumption
PSRR1 D.C. Power Supply Rejection Ratio
PD = Low PD = High
PD = Low 108 160 mA (max)
PD = High 0.1 mA
PD = Low 1.43 1.8 W (max)
PD = High 8.7 mW
Change in Offset Error with change in V
from 1.8V to 2.0V
A
AC ELECTRICAL CHARACTERISTICS
= 85˚C 1.1 1.0 GHz (min)
T
A
f
CLK1
f
CLK2
t
CL
t
CH
Maximum Conversion Rate
Minimum Conversion Rate 200 MHz
Input Clock Duty Cycle
Input Clock Low Time (Note 12) 500 200 ps (min)
Input Clock High Time (Note 12) 500 200 ps (min)
T
75˚C 1.3 GHz
A
T
70˚C 1.6 GHz
A
200 MHz Input clock frequency 1 GHz
DCLK Duty Cycle (Note 12) 50
t
t
t
t
LHT
HLT
OSK
AD
Differential Low to High Transition Time
Differential High to Low Transition Time
DCLK to Data Output Skew (Note 11)
Sampling (Aperture) Delay
10% to 90%, C
10% to 90%, C
50% of DCLK transition to 50% of Data transition
Input CLK+ Fall to Acquisition of Data
= 1 GHz at 0.5V
CLK
A
with 50% duty cycle, R
P-P
MIN
Typical
(Note 8)
to T
. All other limits TA= 25˚C,
MAX
Limits
(Note 8)
±
A
200 mV
450 mV
225
±
1mV
±
1mV
140 mV
340 mV
−4 mA
646
792 mA (max)
4.5
73 dB
<
50
20 80
45 55
= 2.5 pF 250 ps
L
= 2.5 pF 250 ps
L
±
0
200 ps (max)
930 ps
EXT
(Limits)
% (min) % (max)
% (min) % (max)
= 3300
Units
(min)
P-P
(max)
P-P
(min)
P-P
(max)
P-P
mA
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Converter Electrical Characteristics (Continued)
The following specifications apply after calibration for VA=VDR= +1.9VDC, OutV = 1.9V, VINFSR (a.c. coupled) = differential 800mV
±
0.1%, Analog Signal Source Impedance = 100. Boldface limits apply for TA=T
= 10 pF, Differential, a.c. coupled Sinewave Clock, f
P-P,CL
unless otherwise stated. (Notes 6, 7)
Symbol Parameter Conditions
AC ELECTRICAL CHARACTERISTICS
t
AJ
t
OD
t
WU
t
CAL
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than V
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. This limit is not placed upon the power, ground and digital output pins.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 kresistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 5: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”.
Note 6: The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
Aperture Jitter 0.4 ps rms
Input Clock to Data Output Delay
Pipeline Delay (Latency) (Note 11)
50% of Input Clock transition to 50% of Data transition
"D" Outputs 7
"Dd" Outputs 8
PD low to Rated Accuracy Conversion (Wake-Up Time)
Calibration Cycle Time 46,000 Clock Cycles
= 1 GHz at 0.5V
CLK
with 50% duty cycle, R
P-P
MIN
(Note 8)
to T
Typical
. All other limits TA= 25˚C,
MAX
Limits
(Note 8)
2.7 ns
500 ns
), the current at that pin should be limited to
A
= 3300
EXT
Units
(Limits)
Clock Cycles
ADC081000
20068104
Note 7: To guarantee accuracy, it is required that VAand VDRbe well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Additionally, achieving rated performance requires that the backside exposed pad be well grounded.
Note 8: Typical figures are at T Level).
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Transfer Characteristic Figure 2. For relationship between Gain Error and Full-Scale Error, see Specification Definitions for Gain Error.
Note 10: The analog and clock input capacitances are die capacitances only.Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to ground are isolated from the die capacitances by lead and bond wire inductances.
Note 11: This parameter is guaranteed by design and is not tested in production.
Note 12: This parameter is guaranteed by design and characterization and is not tested in production.
Note 13: The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die
capacitances by lead and bond wire inductances.
Note 14: The ADC081000 has two interleaved LVDS output buses, which each clock data out at one half the sample rate. The data at each bus is clocked out at one half the sample rate. The second bus (D0 through D7) has a pipeline latency that is one clock cycle less than the latency of the first bus (Dd0 through Dd7).
= 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
J
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