Radicom Research BPM2001 UserMan

Radicom Research, Inc.

Preliminary Designers Guide

for

the

BPM2001

BPM2001-EK

RoHS Bluetooth HCI Modules

BPM2001 SMD Module BPM2001-HM Dip Module

November 22th, 2012

1

Table of Contents

Introduction 3

Features 4

Applications 5

Specifications 6

Electronic Character 7

Model and Orderi ng Inf orm ati on 7

Layout Design Considerations 8

BPM2001 SMD Module Mechanical Diagram & Pin Assignments 9

BPM2001 SMD Module In terface Signal Definiti ons 10

BPM2001-HM Mechanical Diagram & Pin Assignments 12

BPM2001-EK Switches & Connector Funct ional Descri ptions 16

Operating the BPM2001-EK Evaluation Kit 17

BPM2001-MB Carrier Board RS232 DE-9 Pin Definitions 17

FCC & IC Label and Model Identification 18

Important Regulatory Compliance and User Information 19

Industry Canada statement: 21

CE Declaration o f Confor m it y 24

Limited Warranty 25

Contacting R a d ic o m 27

Information furnished by Radicom is believed to be accurate and reliable. However Radicom assumes
no responsibility for its use, or any infringement of patents or other rights of third parties that may
result from its use. Radicom reserves the right to change circuitry at any time without notice. This
document is subject to change without notice.

2

Introduction

Radicom BPM2001 is a single chip based radio and baseband for Bluetooth v4.0 systems
and Bluetooth low energy. Wit h h ost software, BPM2001 provides a s y stem fully qualified
to the Bluetooth v4.0 specification for data and voice applications.

3

Features

• Fully qualified Bluetooth Bluetooth® v4.0 sys tem

• Full-speed Bluetooth operation with full piconet and scatternet support

• Class 2 Bluetooth power level supported

• High-sensitivity Bluetooth receiver

• Wideband speech

• SBC encoding

• Low-power selectable 1.2 to 3.6V I/O

• Full-speed USB 2. 0 i n te rface

• High-speed UART port (up to 4Mb ps)

• 2 x PCM/I2S digital audio interfaces

• Support for IEEE 802®.11 coexistence

• Dual-mode Bl uet oot h low ener g y radio

• 3 Bluetooth low energy connections at the same time as basic rate A2DP

• Approx. 27.9mm x 16.5mm FR4 PCB.

• On-board antenna

• -40°C to +85°C temperature operating

• RoHS compliant

4

Applications

• Industrial

• Medical

• For AP Switch, Router, PC, NB, PND, PDA, Mobile devices, USB dongle

5

Dimensions

Specifications

27.94mm x 16.51mm x 2.20mm (BPM2001)

83.73mm x 66.11mm (BPM2001HM)

Device Type

Interface

Data Link Protocol

Frequency

Transmit Power

Receiver Sensitivity

Bluetooth Class

Range

Security

Power Consumption

Embedded Bluetooth OEM modules

Serial UART / PCM / I2S / USB

Bluetooth 4.0

2.402 – 2.480 GHz

6 dBm (typical)

-92.5dBm (typical)

Class 2

Up to 10 meters

128-bit encryption (optional)

IDE: 3~6mA / Play: 22~38mA

Power Supply Voltage

Normal Voltage

Operating Temperature
Environmental

1.8V~ 3.6V

3.3V

-40ºC to +85ºC

RoHS compliant

6

Electronic Character

Minimum Typical Maximum Unit
Operation voltage 1.8 3.3 3.6 V
Output Power 6

dBm

Sensitivity -84

dBm

active mode, VBAT=3.3V 24

mA

Model and Ordering Information

Model Number

BPM2001

BPM2001-HM

Description

Surface mount, cla s s 2 , Bluetooth H C I module with on-board
antenna

BPM2001HM-a: DIP, through hole module with on-board antenna.

BPM2001HM-c: DIP, through hole module wit h U.FL anten na
connector for external antenna

BPM2001-MB

BPM2001-EK

BPM2001-MB Evaluation PCB

Model: BPM2001-MB

Evaluation Kit. Each kit consists of the follo win g c omponents:

1. BPM2001HM (-a or -c) on a testing board

2. USB cables (A to B)

3. Null modem cables (DB9F to DB9F)

* BPM2001HM-c ships with 1 external antenna and cable.

7

Layout Design Suggestions

•

General Layout Rules- All Printed Circuit Boards must comply with UL94V0

standard for flamm ability. Always use RoHS compliant Parts and materials.

•

Suggestions for Layout:

1. Do not place Power circuit, X’tal, Inductor, etc near RF area.

2. The bigger Antenna clearance area, the better. Th e Antenna itself n eeds to stay a way
from any circuit or co mponent at least 2mm. Antenna clearance area means Top and
Bottom bot h req uired t o be clear e d.

3. Do not use metal materials on design whe re near Antenna area. For example, battery
snaps, USB connector, iron case, etc.

4. Except ground, do not place any circuit below Bluetooth IC. The area below Bluetooth
IC is required to be ground and be connected by through hole.

5. When meeting a turning point, try to make the circuit as smooth as you can.

6. Put all TP (Test-Point) in one area, in order to make easier for a fixture design.

7. Within the acceptance, please make circuit diameter as big as you can.

8. If a position hole is needed, please make them in diagonal location. This design could
make easier for fixture allocation and save cost in fixture designing.

These guidelines a re for design referenc e; rea l perform ance st ill depends on actual
design.

8

BPM2001 SMD Module Mechanical Diagram & Pin Assignments

Top side view:

 Board size = 27.940 mm x 16.510 mm
 Pitch of short and long side = 1.905 mm
 Pad width = 1.524 mm x 1.000 mm

Module Height

 Maximun height = 2.2 mm

 Board thickness = 0.80 mm

9