QUICK LOGIC QL3060-1PQ208I, QL3060-2PB456C, QL3060-2PB456I, QL3060-2PB456M, QL3060-2PQ208C Datasheet

...
© 2002 QuickLogic Corporation
www.quicklogic.com
1
• • • • • •
Device Highlights
60,000 Usable PLD Gates with 316 I/Os
300 MHz 16-bit Counters,
400 MHz Datapaths
0.35 µm four-layer metal non-volatile
CMOS process for smallest die sizes
Easy to Use / Fast Development Cycles
100% routable with 100% utilization and
complete pin-out stability
Variable-grain logic cells provide high
performance and 100% utilization
Comprehensive design tools include high
quality Verilog/VHDL synthesis
Advanced I/O Capabilities
Interfaces with both 3.3 V and 5.0 V devices
PCI compliant with 3.3 V and 5.0 V buses
for -1/-2/-3/-4 speed grades
Full JTAG boundary scan
I/O Cells with individually controlled
Registered Input Path and Output Enables
Total of 316 I/O Pins
308 bidirectional input/output pins,
PCI-compliant for 5.0 V and 3.3 V buses for
-1/-2/-3/-4 speed grades
Eight high-drive input/distributed
network pins
Eight Low-Skew Distributed Networks
Two array clock/control networks available
to the logic cell flip-flop clock, set and reset inputs — each driven by an input-only pin
Six global clock/control networks available
to the logic cell F1, clock set, and reset inputs and the input and I/O register clock, reset, and enable inputs as well as the output enable control — each driven by an input­only or I/O pin, or any logic cell output or I/O cell feedback
High Performance
Input + logic cell + output total delays
under 6 ns
Data path speeds over 400 MHz
Counter speeds over 300 MHz
Figure 1: 1,584 pASIC 3 Logic Cells
QL3060 pASIC 3 FPGA Data Sheet
60,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
Architecture Overview
The QL3060 is a 60,000 usable PLD gate member of the pASIC 3 family of FPGAs. pASIC 3 FPGAs are fabricated on a 0.35 µm four-layer metal process using QuickLogic
's patented
ViaLink
technology to provide a unique combination of high performance, high density,
low cost, and extreme ease-of-use.
The QL3060 contains 1,584 logic cells. With a maximum of 316 I/Os, the QL3060 is available in 208-PQFP and 456-pin PBGA packages.
Software support for the complete pASIC 3 family, including the QL3060, is available through three basic packages. The turnkey QuickWork s
package provides the most complete FPGA software solution from design entry to logic synthesis, to place and route, to simulation. The QuickTools
TM
for Workstations package provides a solution for designers
who use Cadence
, ExemplarTM, Mentor, Synopsys, Synplicity, ViewlogicTM, AldecTM,
or other third-party tools for design entry, synthesis, or simulation.
© 2002 QuickLogic Corporation
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3
QL3060 pASIC 3 FPGA Data Sheet Rev D
Electrical Specifications
AC Characteristics at VCC = 3.3 V, TA = 25°C (K = 1.00)
To calculate delays, multiply the appropriate K factor from Table 7 by the numbers provided in
Table 1 through Table 5.
Table 1: Logic Cells
Symbol Parameter Propagation Delays (ns) Fanout
a
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and TA = 25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature settings as specified in
Table 7.
1 2 3 4 8
t
PD
Combinatorial Delay
b
b. These limits are derived from a representative selection of the slowest paths through the pASIC
3 logic cell including typical net delays. Worst case delay values for sp ecific paths should be de­termined from timing analysis of your particular design.
1.4 1.7 1.9 2.2 3.2
t
SU
Setup Time
b
1.7 1.7 1.7 1.7 1.7
t
H
Hold Time 0.0 0.0 0.0 0.0 0.0
t
CLK
Clock to Q Delay 0.7 1.0 1.2 1.5 2.5
t
CWHI
Clock High Time 1.2 1.2 1.2 1.2 1.2
t
CWLO
Clock Low Time 1.2 1.2 1.2 1.2 1.2
t
SET
Set Delay 1.0 1.3 1.5 1.8 2.8
t
RESET
Reset Delay 0.8 1.1 1.3 1.6 2.6
t
SW
Set Width 1.9 1.9 1.9 1.9 1.9
t
RW
Reset Width 1.8 1.8 1.8 1.8 1.8
Table 2: Input-Only/Clock Cells
Symbol Parameter Propagation Delays (ns) F a no ut
a
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and TA = 25
°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltag e, and tempera-
ture settings as specified in
Table 7.
1 2 3 4 8 12 24
t
IN
High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4
t
INI
High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5
t
ISU
Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1
t
IH
Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0
t
lCLK
Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6
t
lRST
Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5
t
lESU
Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3
t
lEH
Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
Table 3: Clock Cells
Symbol Parameter Propagation Delays (ns) Loads per Half Column
a
a. The array distributed networks consist of 40 half columns and the global distributed networks con-
sist of 44 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to eight loads per half column. The glo­bal clock has up to 11 loads per half column.
1 2 3 4 8 10 11
t
ACK
Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7
t
GCKP
Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7
t
GCKB
Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3
Table 4: Input-Only I/O Cells
Symbol Parameter Propagation Delays (ns) Fanout
a
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and TA = 25°C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature settings as specified in Table 7.
1 2 3 4 8 10
t
I/O
Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6
t
ISU
Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1
t
IH
Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
t
lOCLK
Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0
t
lORST
Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9
t
lESU
Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3
t
lEH
Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
© 2002 QuickLogic Corporation
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5
QL3060 pASIC 3 FPGA Data Sheet Rev D
Figure 2: Loads used for t
PXZ
Table 5: Output-Only I/O Cells
Symbol Parameter
Propagation Delays (ns) Output Load
Capacitance (pF)
30 50 75 100 150
t
OUTLH
Output Delay Low to High 2.1 2.5 3.1 3.6 4.7
t
OUTHL
Output Delay High to Low 2.2 2.6 3.2 3.7 4.8
t
PZH
Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9
t
PZL
Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2
t
PHZ
Output Delay High to Tri-State
a
a. The loads presented in Figure 2 are used for t
PXZ
:
2.0 - - - -
t
PLZ
Output Delay Low to Tri-State 1.2 - - - -
1ΚΩ
1ΚΩ
t
PHZ
t
PLZ
5 pF
5 pF
6
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
DC Characteristics
The DC specifications are provided in Table 6 through Table 8.
Table 6: Absolute Maximum Ratings
Parameter Value Parameter Value
VCC Voltage -0.5 V to 4.6 V DC Input Current ±20 mA
V
CCIO
Voltage -0.5 V to 7.0 V ESD Pad Protection ±2000 V
Input Voltage -0.5 V to V
CCIO
+0.5 V Storage Temperature -65°C to +150°C
Latch-up Immunity ±200 mA Lead Temperature 300°C
Table 7: Operating Range
Symbol Parameter Military Industrial Commercial Unit
Min Max Min Max Min Max
V
CC
Supply Voltage 3.0 3.6 3.0 3.6 3.0 3.6 V
V
CCIO
I/O Input Tolerance Voltage 3.0 5.5 3.0 5.5 3.0 5.25 V
TA Ambient Temperature -55 - -40 85 0 70 °C
TC Case Temperature - 125 - - - - °C
K Delay Factor
-0 Speed Grade - - 0.43 1.90 0.46 1.85 n/a
-1 Speed Grade 0.42 1.64 0.43 1.54 0.46 1.50 n/a
-2 Speed Grade 0.42 1.37 0.43 1.28 0.46 1.25 n/a
-3 Speed Grade 0.43 0.90 0.46 0.88 n/a
-4 Speed Grade 0.43 0.82 0.46 0.80 n/a
© 2002 QuickLogic Corporation
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QL3060 pASIC 3 FPGA Data Sheet Rev D
Table 8: DC Characteristics
Symbol Parameter Conditions Min Max Units
V
IH
Input HIGH Voltage 0.5 V
CCVCCIO
+0.5 V
V
IL
Input LOW Voltage -0.5 0.3 V
CC
V
V
OH
Output HIGH Voltage
IOH = -12 mA 2.4 V
IOH = -500 µA 0.9 V
CC
V
V
OL
Output LOW Voltage
IOL = 16 mA
a
a. Applies only to -1/-2/-3/-4 commercial grade devices. These speed grades are also PCI-compliant. All
other devices have 8 mA IOL specifications.
0.45 V
IOL = 1.5 mA 0.1 V
CC
V
I
I
I or I/O Input Leakage Current VI = V
CCIO
or GND -10 10 µA
I
OZ
3-State Output Leakage Current VI = V
CCIO
or GND -10 10 µA
C
I
Input Capacitance
b
b. Capacitance is sample tested only. Clock pins are 12 pF maximum.
10 pF
I
OS
Output Short Circuit Current
c
c. Only one output at a time. Duration should not exceed 30 seconds.
VO = GND -15 -180 mA
VO = V
CC
40 210 mA
I
CC
D.C. Supply Current
d
d. For -1/-2/-3/-4 commercial grade devices only. Maximum ICC is 3 mA for -0 commercial grade and all
industrial grade devices. and 5 mA for all military grade devices. For AC conditions, contact QuickLog­ic customer applications group (see
Contact Information).
VI, VIO = V
CCIO
or GND 0.50 (typ) 2 mA
I
CCIO
D.C. Supply Current on V
CCIO
0 100 µA
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
Kv and Kt Graphs
Figure 3: Voltage Fa cto r vs. Supply Voltage
Figure 4: Temperature Factor vs. Operating Temperature
0.9200
0.9400
0.9600
0.9800
1.0000
1.0200
1.0400
1.0600
1.0800
1.1000
3 3.1 3 .2 3 .3 3 .4 3.5 3.6
Voltage Factor vs. Supply Voltage
Supply Voltage (V)
Kv
0.85
0.90
0.95
1.00
1.05
1.10
1.15
-60 -40 -20 0 20 40 60 80
Temper ature Factor vs. Ope ra ting Tempe ra tur e
Junction Tem per ature C
Kt
© 2002 QuickLogic Corporation
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9
QL3060 pASIC 3 FPGA Data Sheet Rev D
Power-up Sequencing
Figure 5: Power-up Requirements
The following requirements must be met when powering up the device (refer to Figure 5):
When ramping up the power supplies keep (V
CCIO
-VCC)
MAX
≤ 500 mV. Deviation from
this recommendation can cause permanent damage to the device.
V
CCIO
must lead V
CC
when ramping the device.
The power supply must take greater than or equal to 400 µs to reach V
CC
. Ramping to
VCC/V
CCIO
earlier than 400 µs can cause the device to behave improperly.
An internal diode is present in-between VCC and V
CCIO
, as shown in Figure 6.
Figure 6: Internal Diode Between VCC and V
CCIO
Voltage
V
CCIO
V
CC
(V
CCIO
-VCC)
MAX
Time
400 us
V
CC
V
CC
V
CCIO
Internal Logic
Cells, RAM
blocks, etc
IO Cells
10
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
JTAG
Figure 7: JTAG Block Diagram
Microprocessors and Application Specific Integrated Circuits (ASICs) pose many design challenges, not the least of which concerns the accessibility of test points. The Joint Test Access Group (JTAG) formed in response to this challenge, resulting in IEEE standard
1149.1, the Standard Test Access Port and Boundary Scan Architecture.
The JTAG boundary scan test methodology allows complete observation and control of the boundary pins of a JTAG-compatible device through JTAG software. A Test Access Port (TAP) controller works in concert with the Instruction Register (IR); these allow users to run three required tests, along with several user-defined tests.
JTAG tests allow users to reduce system debug time, reuse test platforms and tools, and reuse subsystem tests for fuller verification of higher level system elements.
TCK
TMS
TRSTB
RDI
TDO
Instruction Decode
&
Control Logic
TAp Controller State Machine
(16 States)
Instruction Register
Boundary-Scan Register
(Data Register)
Mux
Bypass
Register
Mux
Internal
Register
I/O Registers
User Defined Data Register
© 2002 QuickLogic Corporation
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11
QL3060 pASIC 3 FPGA Data Sheet Rev D
The 1149.1 standard requires the following three tests:
Extest Instruction. The Extest instruction performs a PCB interconnect test. This test
places a device into an external boundary test mode, selecting the boundary scan register to be connected between the TAP's Test Data In (TDI) and Test Data Out (TDO) pins. Boundary scan cells are preloaded with test patterns (via the Sample/Preload Instruction), and input boundary cells capture the input data for analysis.
Sample/Preload Instruction. This instruction allows a device to remain in its
functional mode, while selecting the boundary scan register to be connected between the TDI and TDO pins. For this test, the boundary scan register can be accessed via a data scan operation, allowing users to sample the functional data entering and leaving the device.
Bypass Instruction. The Bypass instruction allows data to skip a device's boundary
scan entirely, so the data passes through the bypass register. The Bypass instruction allows users to test a device without passing through other devices. The bypass register is connected between the TDI and TDO pins, allowing serial data to be transferred through a device without affecting the operation of the device.
12
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
Pin Descriptions
Ordering Information
* Contact QuickLogic regarding availability (see Contact Information)
Table 9: Pin Descriptions
Pin Function Description
TDI Test Data In for JTAG
Hold HIGH during normal operation. Connect to V
CC
if not used for JTAG.
TRSTB Active low Reset for JTAG
Hold LOW during normal operation. Connect to ground if not used for JTAG.
TMS Test Mode Select for JTAG
Hold HIGH during normal operation. Connect to V
CC
if not used for JTAG.
TCK Test Clock for JTAG
Hold HIGH or LOW during normal operation. Connect to VCC or ground if not used for JTAG.
TDO Test data out for JTAG
Output that must be left unconnected if not used for JTAG.
STM Special Test Mode Must be grounded during normal operation.
I/ACLK
High-drive input and/or array
network driver
Can be configured as either or both.
I/GCLK
High-drive input and/or global
network driver
Can be configured as either or both.
I High-drive input Use for input signals with high fanout.
I/O Input/Output pin Can be configured as an input and/or output.
V
CC
Power supply pin Connect to 3.3 V supply.
V
CCIO
Input voltage tolerance pin
Connect to 5.0 V supply if 5 V input tolerance is required, otherwise connect to 3.3 V supply.
GND Ground pin Connect to ground.
QL 3060 - 1 PQ208 C
QuickLogic device
pASIC 3 device part number
Speed Grade 0 = Quick 1 = Fast 2 = Faster 3 = Faster *4 = Wow
Operating Range
C = Commercial I = Industrial M = Military
Package Code
PQ208 = 208-pin PQFP PB456 = 456-pin PBGA
© 2002 QuickLogic Corporation
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13
QL3060 pASIC 3 FPGA Data Sheet Rev D
208 PQFP Pinout Diagram
Figure 8: Top View of 208 Pin PQFP
Pin 1
Pin 53 Pin 105
Pin 157
QL3060-1PQ208C
pASIC 3
14
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
208 PQFP Pinout Table
Table 10: 208 PQFP Pinout Table
208
PQFP
Function
208
PQFP
Function
208
PQFP
Function
208
PQFP
Function
208
PQFP
Function
208
I/O
43
GND
84
I/O
125
I/O
168
I/O
1
I/O
44
I/O
85
I/O
126
I/O
169
I/O
2
I/O
45
I/O
86
I/O
127
GND
NC
I/O
3
I/O
46
I/O
87
I/O
128
I/O
170
I/O
4
I/O
47
I/O
88
I/O
NC
I/O
171
I/O
5
I/O
48
I/O
89
I/O
129
GCLK / I
172
I/O
NC
I/O
NC
I/O
90
I/O
130
ACLK / I
173
I/O
6
I/O
49
I/O
91
I/O
131
V
CC
174
I/O
7
I/O
50
I/O
92
I/O
132
GCLK / I
175
I/O
8
I/O
51
I/O
NC
I/O
133
GCLK / I
NC
I/O
9
I/O
52
I/O
93
I/O
134
V
CC
176
I/O
10
V
CC
53
I/O
94
I/O
135
I/O
177
GND
11
I/O
54
TDI
95
GND
136
I/O
178
I/O
12
GND
NC
I/O
96
I/O
NC
I/O
179
I/O
13
I/O
NC
I/O
97
V
CC
137
I/O
NC
I/O
14
I/O
55
I/O
98
I/O
NC
GND
180
I/O
NC
I/O
56
I/O
99
I/O
138
I/O
181
I/O
15
I/O
NC
I/O
100
I/O
139
I/O
182
GND
16
I/O
57
I/O
NC
I/O
140
I/O
NC
V
CC
17
I/O
58
I/O
101
I/O
141
I/O
183
I/O
18
I/O
59
GND
NC
I/O
142
I/O
184
I/O
19
I/O
60
I/O
102
I/O
NC
I/O
185
I/O
20
I/O
61
V
CC
NC
I/O
143
I/O
186
I/O
NC
I/O
62
I/O
NC
I/O
144
I/O
187
V
CCIO
21
I/O
63
I/O
103
TRSTB
145
V
CC
188
I/O
22
I/O
64
I/O
104
TMS
NC
I/O
NC
I/O
23
GND
NC
I/O
105
I/O
146
I/O
189
I/O
24
I/O
65
I/O
NC
I/O
147
GND
190
I/O
25
GCLK / I
66
I/O
106
I/O
148
I/O
191
I/O
26
ACLK / I
67
I/O
107
I/O
149
I/O
192
I/O
27
V
CC
NC
I/O
108
I/O
150
I/O
193
I/O
28
GCLK / I
68
I/O
109
I/O
151
I/O
194
I/O
29
GCLK / I
69
I/O
NC
I/O
152
I/O
NC
I/O
30
V
CC
70
I/O
110
I/O
153
I/O
195
I/O
31
I/O
NC
I/O
111
I/O
154
I/O
196
I/O
32
I/O
71
I/O
112
I/O
155
I/O
197
I/O
NC
GND
NC
I/O
113
I/O
156
I/O
198
I/O
33
I/O
72
I/O
114
V
CC
157
TCK
NC
I/O
NC
I/O
73
GND
115
I/O
158
STM
199
GND
34
I/O
74
I/O
116
GND
NC
I/O
200
I/O
35
I/O
NC
V
CC
117
I/O
159
I/O
201
V
CC
36
I/O
75
I/O
NC
I/O
160
I/O
202
I/O
NC
I/O
76
I/O
118
I/O
161
I/O
203
I/O
37
I/O
77
I/O
119
I/O
162
I/O
204
I/O
38
I/O
78
GND
120
I/O
163
GND
205
I/O
39
I/O
79
I/O
121
I/O
164
I/O
206
I/O
NC
I/O
80
I/O
NC
I/O
165
V
CC
207
TDO
40
I/O
81
I/O
122
I/O
166
I/O
41
V
CC
82
I/O
123
I/O
NC
I/O
42
I/O
83
V
CCIO
124
I/O
167
I/O
© 2002 QuickLogic Corporation
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15
QL3060 pASIC 3 FPGA Data Sheet Rev D
456 PBGA Pinout Diagram
Figure 9: 456-Pin PBGA Pinout Diagram
QL3060-1PB456C
pASIC 3
BOTTOM View
PIN A1 CORNER
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A B C D E F G H J K
L M N P R T U V W Y
AA AB AC AD AE AF
16
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© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
456 PBGA Pinout Table
Table 11: 456 PBGA Pinout Table
456 Function 456 Function 456 Function 456 Function 456 Function
A1
I/O
B26
STM
D25
I/O
H4
I/O
M14
GND/THERM
A2
I/O
C1
I/O
D26
I/O
H5
NC
M15
GND/THERM
A3
I/O
C2
I/O
E1
I/O
H22
NC
M16
GND/THERM
A4
I/O
C3
I/O
E2
I/O
H23
I/O
M22
NC
A5
I/O
C4
TDO
E3
I/O
H24
I/O
M23
NC
A6
I/O
C5
I/O
E4
I/O
H25
I/O
M24
I/O
A7
I/O
C6
I/O
E5
GND
H26
I/O
M25
I/O
A8
I/O
C7
I/O
E6
V
CC
J1
I/O
M26
I/O
A9
I/O
C8
I/O
E7
GND
J2
I/O
N1
GCLK/I
A10
I/O
C9
I/O
E8
NC
J3
I/O
N2
I/O
A11
I/O
C10
I/O
E9
GND
J4
NC
N3
I/O
A12
V
CCIO
C11
I/O
E10
I/O
J5
GND
N4
GCLK/I
A13
I/O
C12
I/O
E11
GND
J22
NC
N5
V
CC
A14
I/O
C13
I/O
E12
GND
J23
NC
N11
GND/THERM
A15
I/O
C14
I/O
E13
V
CC
J24
I/O
N12
GND/THERM
A16
I/O
C15
I/O
E14
GND
J25
I/O
N13
GND/THERM
A17
I/O
C16
I/O
E15
GND
J26
I/O
N14
GND/THERM
A18
I/O
C17
I/O
E16
GND
K1
I/O
N15
GND/THERM
A19
I/O
C18
I/O
E17
NC
K2
I/O
N16
GND/THERM
A20
I/O
C19
I/O
E18
GND
K3
I/O
N22
GND
A21
I/O
C20
I/O
E19
NC
K4
I/O
N23
I/O
A22
I/O
C21
I/O
E20
GND
K5
V
CC
N24
I/O
A23
I/O
C22
I/O
E21
V
CC
K22
GND
N25
I/O
A24
I/O
C23
I/O
E22
GND
K23
I/O
N26
I/O
A25
I/O
C24
I/O
E23
I/O
K24
I/O
P1
I/O
A26
I/O
C25
TCK
E24
I/O
K25
I/O
P2
I/O
B1
I/O
C26
I/O
E25
I/O
K26
I/O
P3
I/O
B2
I/O
D1
I/O
E26
I/O
L1
I/O
P4
I/O
B3
I/O
D2
I/O
F1
I/O
L2
I/O
P5
NC
B4
I/O
D3
I/O
F2
I/O
L3
I/O
P11
GND/THERM
B5
I/O
D4
GND
F3
I/O
L4
I/O
P12
GND/THERM
B6
I/O
D5
I/O
F4
NC
L5
NC
P13
GND/THERM
B7
I/O
D6
NC
F5
V
CC
L11
GND/THERM
P14
GND/THERM
B8
I/O
D7
I/O
F22
V
CC
L12
GND/THERM
P15
GND/THERM
B9
I/O
D8
I/O
F23
NC
L13
GND/THERM
P16
GND/THERM
B10
I/O
D9
GND
F24
I/O
L14
GND/THERM
P22
NC
B11
I/O
D10
I/O
F25
I/O
L15
GND/THERM
P23
GCLK / I
B12
I/O
D11
I/O
F26
I/O
L16
GND/THERM
P24
GCLK / I
B13
I/O
D12
GND
G1
I/O
L22
NC
P25
I/O
B14
I/O
D13
I/O
G2
I/O
L23
I/O
P26
ACLK / I
B15
I/O
D14
I/O
G3
I/O
L24
I/O
R1
I/O
B16
I/O
D15
GND
G4
I/O
L25
I/O
R2
I/O
B17
I/O
D16
I/O
G5
NC
L26
I/O
R3
I/O
B18
I/O
D17
I/O
G22
GND
M1
ACLK / I
R4
NC
B19
I/O
D18
GND
G23
I/O
M2
GCLK/I
R5
NC
B20
I/O
D19
I/O
G24
I/O
M3
I/O
R11
GND/THERM
B21
I/O
D20
I/O
G25
I/O
M4
NC
R12
GND/THERM
B22
I/O
D21
NC
G26
I/O
M5
GND
R13
GND/THERM
B23
I/O
D22
I/O
H1
I/O
M11
GND/THERM
R14
GND/THERM
B24
I/O
D23
GND
H2
I/O
M12
GND/THERM
R15
GND/THERM
B25
I/O
D24
I/O
H3
I/O
M13
GND/THERM
R16
GND/THERM
(Sheet 1 of 2)
© 2002 QuickLogic Corporation
www.quicklogic.com
17
QL3060 pASIC 3 FPGA Data Sheet Rev D
R22 V
CC
W1 I/O AB12 NC AD1 I/O AE16 I/O R23 NC W2 I/O AB13 I/O AD2 NC AE17 I/O R24 I/O W3 I/O AB14 GND AD3 I/O AE18 I/O R25 I/O W4 I/O AB15 V
CC
AD4 I/O AE19 I/O
R26 GCLK / I W5 NC AB16 I/O AD5 I/O AE20 I/O
T1 I/O W22 NC AB17 NC AD6 I/O AE21 I/O T2 I/O W23 I/O AB18 V
CC
AD7 I/O AE22 I/O T3 I/O W24 I/O AB19 GND AD8 I/O AE23 NC T4 I/O W25 I/O AB20 NC AD9 I/O AE24 TMS T5 V
CC
W26 I/O AB21 V
CC
AD10 I/O AE25 I/O T11 GND/THERMAL Y1 I/O AB22 GND AD11 I/O AE26 I/O T12 GND/THERMAL Y2 I/O AB23 I/O AD12 I/O AF1 I/O T13 GND/THERMAL Y3 I/O AB24 I/O AD13 I/O AF2 I/O T14 GND/THERMAL Y4 I/O AB25 I/O AD14 I/O AF3 I/O T15 GND/THERMAL Y5 I/O AB26 I/O AD15 I/O AF4 I/O T16 GND/THERMAL Y22 GND AC1 I/O AD16 I/O AF5 I/O T22 GND Y23 I/O AC2 I/O AD17 I/O AF6 I/O T23 I/O Y24 I/O AC3 NC AD18 I/O AF7 I/O T24 I/O Y25 I/O AC4 GND AD19 I/O AF8 I/O T25 I/O Y26 I/O AC5 I/O AD20 I/O AF9 I/O T26 I/O AA1 I/O AC6 NC AD21 I/O AF10 I/O
U1 I/O AA2 I/O AC7 I/O AD22 I/O AF11 I/O U2 I/O AA3 NC AC8 I/O AD23 TRSTB AF12 I/O U3 I/O AA4 NC AC9 NC AD24 I/O AF13 I/O U4 I/O AA5 V
CC
AC10 I/O AD25 I/O AF14 I/O
U5 GND AA22 V
CC
AC11 I/O AD26 I/O AF15 I/O U22 NC AA23 NC AC12 NC AE1 TDI AF16 I/O U23 I/O AA24 I/O AC13 I/O AE2 I/O AF17 I/O U24 I/O AA25 I/O AC14 V
CCIO
AE3 I/O AF18 I/O U25 I/O AA26 I/O AC15 NC AE4 I/O AF19 I/O U26 I/O AB1 I/O AC16 I/O AE5 I/O AF20 I/O
V1 I/O AB2 I/O AC17 I/O AE6 I/O AF21 I/O V2 I/O AB3 I/O AC18 NC AE7 I/O AF22 I/O V3 I/O AB4 I/O AC19 I/O AE8 I/O AF23 I/O V4 NC AB5 GND AC20 I/O AE9 I/O AF24 I/O V5 NC AB6 V
CC
AC21 I/O AE10 I/O AF25 I/O V22 GND AB7 NC AC22 NC AE11 I/O AF26 I/O V23 NC AB8 NC AC23 GND AE12 I/O V24 I/O AB9 NC AC24 I/O AE13 I/O V25 I/O AB10 V
CC
AC25 I/O AE14 I/O V26 I/O AB11 GND AC26 I/O AE15 I/O
Table 11: 456 PBGA Pinout Table (Continued)
456 Function 456 Function 456 Function 456 Function 456 Function
(Sheet 2 of 2)
18
www.quicklogic.com
© 2002 QuickLogic Corporation
QL3060 pASIC 3 FPGA Data Sheet Rev D
456 PBGA Mechanical Drawing
Figure 10: 456 PBGA Mechanical Drawing
© 2002 QuickLogic Corporation
www.quicklogic.com
19
QL3060 pASIC 3 FPGA Data Sheet Rev D
Contact Information
Telephone: 408 990 4000 (US)
416 497 8884 (Canada)
44 1932 57 9011 (Europe)
49 89 930 86 170 (Germany)
852 8106 9091 (Asia)
81 45 470 5525 (Japan)
E-mail: info@quicklogic.com
Support: support@quicklogic.com
Web site: http://www.quicklogic.com/
Revision History
Copyright Information
Copyright © 2002 QuickLogic Corporation.
All Rights Reserved.
The information contained in this product brief, and the accompanying software programs are protected by copyright. All rights are reserved by QuickLogic Corporation. QuickLogic Corporation reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this product without the prior written consent of an authorized representative of QuickLogic is prohibited.
QuickLogic, QuickWorks, pASIC, and ViaLink are registered trademarks of QuickLogic Corporation.
Verilog is a registered trademark of Cadence Design Systems, Inc.
All trademarks and registered trademarks are the property of their respective owners.
Table 12: Revision History
Revision Date Comments
A not avail. First release.
B not avail.
C May 2001 Update of AC/DC Specs and reformat
D June 2002
Added Kfactor, Power-up, JTAG and mechanical
drawing information. Reformatted.
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