QUICK LOGIC QL3012-1PL84M, QL3012-0PL84M, QL3012-2PL84M, QL3025-2PQ208M, QL3040-0PQ208M Datasheet

...
Military Plastic pASIC 3 Family
60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density
Military pASIC 3 - 3.3V Family
D
EVICE HIGHLIGHTS
Device Highlights
High Performance and High Density
60,000 Usable PLD Gates with 316 I/Os
speeds over 400 MHz
0.35um four-layer metal non-volatile CMOS
process for smallest die sizes
F
EATURES
Features
Total of 180 I/O pins
308 bidirectional input/output pins, PCI-compliant
for 5.0 volt and 3.3 volt buses for -1/-2 speed grades
8 high-drive input/distributed network pins
Eight Low-Skew Distributed Networks
Easy to Use/Fast Development Cycles
100% routable with 100% utilization and complete
pin-out stability
Variable-grain logic cells provide high performance
and 100% utilization
Comprehensive design tools include high quality
Verilog/VHDL synthesis
Advanced I/O Capabilities
Interfaces with both 3.3 volt and 5.0 volt devices
PCI compliant with 3.3V and 5.0V buses for -1/-2
speed grades
Full JTAG boundary scan
Registered I/O cells with individually controlled
clocks and output enables
Device
QL3012 8,000 12,000 84PLCC 68 M 3.3V QL3025 16,000 25,000 208PQFP 174 M 3.3V QL3040 24,000 40,000 208PQFP 174 M 3.3V QL3060 36,000 60,000 208PQFP 174 M 3.3V
M = Military Temperature (-55 to +125 degrees C)
ASIC
Gates
PLD
Gates
TABLE 1: Selector Table
Two array clock/control networks available to the
logic cell flip-flop clock, set and reset inputs - each driven by an input-only pin
Up to six global clock/control networks available
to the logic cell F1, clock, set and reset inputs and the input and I/O register clock, reset and enable inputs as well as the output enable control - each driven by an input-only or I/O pin, or any logic cell output or I/O cell feedback
High Performance
Input + logic cell + output total delays under 6 ns
Data path speeds exceeding 400 MHz
Counter speeds over 300 MHz
Max
Package
I/O
Qualification
Level
Supply
Voltage
Rev B
8-23
P
Product Summary
Military Plastic pASIC 3 Family
RODUCT SUMMARY
The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick­Logic’s patented ViaLink technology to provide a unique combination of high performance, high den­sity, low cost, and extreme ease-of-use.
The pASIC 3 product family contains 1,584 logic cells. With a maximum of 316 I/Os, and is available in 208-PQFP and 84-PLCC packages.
P
INOUT DIAGRAM
Pinout Diagram 68-Pin CPGA
Software support for the complete pASIC 3 family is available through three basic packages. The turnkey
®
QuickWorks
FPGA software solution from design entry to logic synthesis, to place and route, to simulation. The
QuickWorks vide a solution for designers who use Cadence, Exemplar, Mentor, Synopsys, Synplicity, Viewlogic, Veribest, or other third-party tools for design entry, synthesis, or simulation.
package provides the most complete
TM
-Lite and QuickTo o l s
TM
packages pro-
84-PIN PLCC
TABLE 2: 84-pin PLCC
8-24 24 Preliminary
Military Plastic pASIC 3 Family
P
INOUT DIAGRAM
Pinout Diagram 208-Pin PQFP
208-PIN PQFP
Pin #1
Pin #157
pASIC
QL3060-1PQ208M
Pin #53
Pin #105
8-25
Military Plastic pASIC 3 Family
PQFP 208-P
208 Function 208 Function 208 Function 208 Function 208 Function
PQFP PQFP PQFP PQFP PQFP
208 I/O 43 GND 84 I/O 125 I/O 168 I/O
1 I/O 44 I/O 85 I/O 126 I/O 169 I/O 2 I/O 45 I/O 86 I/O 127 GND NC I/O 3 I/O 46 I/O 87 I/O 128 I/O 170 I/O 4 I/O 47 I/O 88 I/O NC I/O 171 I/O 5 I/O 48 I/O 89 I/O 129 GCLK / I 172 I/O
NC I/O NC I/O 90 I/O 130 ACLK / I 173 I/O
6 I/O 49 I/O 91 I/O 131 VCC 174 I/O 7 I/O 50 I/O 92 I/O 132 GCLK / I 175 I/O 8 I/O 51 I/O NC I/O 133 GCLK / I NC I/O
9 I/O 52 I/O 93 I/O 134 VCC 176 I/O 10 VCC 53 I/O 94 I/O 135 I/O 177 GND 11 I/O 54 TDI 95 GND 136 I/O 178 I/O 12 GND NC I/O 96 I/O NC I/O 179 I/O 13 I/O NC I/O 97 VCC 137 I/O NC I/O 14 I/O 55 I/O 98 I/O NC GND 180 I/O
NC I/O 56 I/O 99 I/O 138 I/O 181 I/O
15 I/O NC I/O 100 I/O 139 I/O 182 GND 16 I/O 57 I/O NC I/O 140 I/O NC VCC 17 I/O 58 I/O 101 I/O 141 I/O 183 I/O 18 I/O 59 GND NC I/O 142 I/O 184 I/O 19 I/O 60 I/O 102 I/O NC I/O 185 I/O 20 I/O 61 VCC NC I/O 143 I/O 186 I/O
NC I/O 62 I/O NC I/O 144 I/O 187 VCCIO
21 I/O 63 I/O 103 TRSTB 145 VCC 188 I/O 22 I/O 64 I/O 104 TMS NC I/O NC I/O 23 GND NC I/O 105 I/O 146 I/O 189 I/O 24 I/O 65 I/O NC I/O 147 GND 190 I/O 25 GCLK / I 66 I/O 106 I/O 148 I/O 191 I/O 26 ACLK / I 67 I/O 107 I/O 149 I/O 192 I/O 27 VCC NC I/O 108 I/O 150 I/O 193 I/O 28 GCLK / I 68 I/O 109 I/O 151 I/O 194 I/O 29 GCLK / I 69 I/O NC I/O 152 I/O NC I/O 30 VCC 70 I/O 110 I/O 153 I/O 195 I/O 31 I/O NC I/O 111 I/O 154 I/O 196 I/O 32 I/O 71 I/O 112 I/O 155 I/O 197 I/O
NC GND NC I/O 113 I/O 156 I/O 198 I/O
33 I/O 72 I/O 114 VCC 157 TCK NC I/O
NC I/O 73 GND 115 I/O 158 STM 199 GND
34 I/O 74 I/O 116 GND NC I/O 200 I/O 35 I/O NC VCC 117 I/O 159 I/O 201 VCC 36 I/O 75 I/O NC I/O 160 I/O 202 I/O
NC I/O 76 I/O 118 I/O 161 I/O 203 I/O
37 I/O 77 I/O 119 I/O 162 I/O 204 I/O 38 I/O 78 GND 120 I/O 163 GND 205 I/O 39 I/O 79 I/O 121 I/O 164 I/O 206 I/O
NC I/O 80 I/O NC I/O 165 VCC 207 TDO
40 I/O 81 I/O 122 I/O 166 I/O 41 VCC 82 I/O 123 I/O NC I/O 42 I/O 83 VCCIO 124 I/O 167 I/O
INOUT TABLE
PQFP 208 Pinout Table
8-26 26 Preliminary
Military Plastic pASIC 3 Family
ABSOLUTE MAXIMUM RATINGS
VCC Voltage...........................-0.5 to 4.6V
VCCIO Voltage .......................-0.5 to 7.0V
Input Voltage.............. -0.5 to VCCIO+0.5V
Latch-up Immunity
.................. ±200 mA
DC Input Current ...................... ±20 mA
ESD Pad Protection....................±2000V
Storage Temperature .......-65
°C to +150°C
Lead Temperature ...........................300
OPERATING RANGE
Symbol Parameter Military Unit
Min Max
VCC Supply Voltage 3.0 3.6 V VCCIO I/O Input Tolerance Voltage 3.0 5.5 V TA Ambient Temperature -55 TC Case Temperature 125
-0 Speed Grade 0.42 2.03
K Delay Factor -1 Speed Grade 0.42 1.64
-2 Speed Grade 0.42 1.37
DC CHARACTERISTICS
Symbol Parameter Conditions Min Max Unit
VIH Input HIGH Voltage 0.5VCC VCCIO+0.5 V VIL Input LOW Voltage -0.5 0.3VCC V VOH Output HIGH Voltage IOH = -12 mA 2.4 V
IOH = -500 µA
VOL Output LOW Voltage IOL = 8 mA [1] 0.45 V
IOL = 1.5 mA 0.1VCC V II I or I/O Input Leakage Current VI = VCCIO or GND -10 10 IOZ 3-State Output Leakage Current VI = VCCIO or GND -10 10 CI Input Capacitance [2] 10 pF IOS Output Short Circuit Current [3] VO = GND -15 -180 mA
VO = VCC 40 210 mA ICC D.C. Supply Current [4] VI, VIO = VCCIO or GND 0.50 (typ) 5 mA ICCIO D.C. Supply Current on VCCIO 0 100
0.9VCC V
°C
°C °C
µA µA
µA
Notes: [1] Military devices have 8 mA IOL specifications. [2] Capacitance is sample tested only. Clock pins are 12 pF maximum. [3] Only one output at a time. Duration should not exceed 30 seconds. [4] Maximum ICC is 5 mA for all military grade devices. For AC conditions, contact QuickLogic
customer engineering.
8-27
Military Plastic pASIC 3 Family
QL3012
QL3012
AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)
(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)
Logic Cells
Propagation Delays (ns)
Symbol Parameter
12348
tPD Combinatorial Delay [6] 1.4 1.7 1.9 2.2 3.2 tSU Setup Time [6] 1.7 1.7 1.7 1.7 1.7 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Fanout [5]
Input-Only/Clock Cells
Propagation Delays (ns)
Symbol Parameter
123481224
tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tlCLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tlRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0
Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as speci­fied in the Operating Range.
[6] These limits are derived from a r epresentative selection of the slowest paths through th e p ASIC 3 lo gic
cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.
Fanout [5]
8-28 28 Preliminary
Military Plastic pASIC 3 Family
QL3012 Clock Cells
Propagation Delays (ns)
Symbol Parameter
tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3
I/O Cells
Symbol Parameter
tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6
tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tlOCLK Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0 tlORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
Loads per Half Column [7]
123481011
Propagation Delays (ns)
Fanout [5]
1234810
Propagation Delays (ns)
Symbol Parameter
tOUTLH Output Delay Low to High 2.1 2 .5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2 .6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2
Output Load Capacitance (pF)
30 50 75 100 150
Notes: [7] The array distributed network s consist of 40 half columns and the glob al distributed net works consist of
44 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer del ay. The array clock has up to 8 loads per half column. The global clock has up t o 11 loads per half c olumn.
[8] The following loads are used for tPXZ:
1K
tPHZ
5 pF
1K
tPLZ
5 pF
8-29
Military Plastic pASIC 3 Family
QL3025
QL3025
AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)
(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)
Logic Cells
Propagation Delays (ns)
Symbol Parameter
12348
tPD Combinatorial Delay [6] 1.4 1.7 1.9 2.2 3.2 tSU Setup Time [6] 1.7 1.7 1.7 1.7 1.7 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Fanout [5]
Input-Only/Clock Cells
Propagation Delays (ns)
Symbol Parameter
123481224
tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tlCLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tlRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0 .0 0.0
Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C. Multi-
ply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.
[6] These limits are derived from a representative selection of the slo west paths through the pASIC 3 logic cell
including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.
Fanout [5]
8-30 30 Preliminary
Military Plastic pASIC 3 Family
QL3025 Clock Cells
Propagation Delays (ns)
Symbol Parameter
12348101215
tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4
I/O Cells
Symbol Parameter
tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6
tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tlOCLK Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0 tlORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
Loads per Half Column [7]
Propagation Delays (ns)
Fanout [5]
1234810
Propagation Delays (ns)
Symbol Parameter
tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2
Output Load Capacitance (pF)
30 50 75 100 150
Notes: [7] The array distributed net works consist of 56 half columns and the global di stributed net works cons ist of
60 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 12 loads per half column. The global clock has up to 15 loads per half column.
[8] The following loads are used for tPXZ:
1K
tPHZ
5 pF
1K
tPLZ
5 pF
8-31
Military Plastic pASIC 3 Family
QL3040
QL3040
AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)
(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)
Logic Cells
Propagation Delays (ns)
Symbol Parameter
12348
tPD Combinatorial Delay [6] 1.4 1.7 1.9 2.2 3.2 tSU Setup Time [6] 1.7 1.7 1.7 1.7 1.7 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Fanout [5]
Input-Only/Clock Cells
Propagation Delays (ns)
Symbol Parameter
123481224
tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tlCLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tlRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0
Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.
[6] These limits are derived from a representative selection of the slowest paths through the pASIC 3 logic
cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.
Fanout [5]
8-32 32 Preliminary
Military Plastic pASIC 3 Family
QL3040 Clock Cells
Propagation Delays (ns)
Symbol Parameter
1 2 3 4 8 10 12 14 16
tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 1.9 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4 1.5
I/O Cells
Symbol Parameter
tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6
tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tlOCLK Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0 tlORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
Loads per Half Column [7]
Propagation Delays (ns)
Fanout [5]
1234810
Propagation Delays (ns)
Symbol Parameter
tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2
Output Load Capacitance (pF)
30 50 75 100 150
Notes: [7] The array distributed netwo rks consist of 72 half columns and the global dis tributed ne tworks consist of
76 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 14 loads per half column. The global clock has up to 16 loads per half column.
[8] The following loads are used for tPXZ:
1K
tPHZ
5 pF
1K
tPLZ
5 pF
8-33
Military Plastic pASIC 3 Family
QL3060
QL3060
AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)
(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)
Logic Cells
Propagation Delays (ns)
Symbol Parameter
12348
tPD Combinatorial Delay [6] 1.4 1.7 1.9 2.2 3.2 tSU Setup Time [6] 1.7 1.7 1.7 1.7 1.7 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Fanout [5]
Input-Only/Clock Cells
Propagation Delays (ns)
Symbol Parameter
123481224
tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tlCLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tlRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0
Notes: [5] Stated timing fo r worst case Propagati on Delay over pro cess variation at V CC=3.3V and TA=25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.
[6] These limits are derived from a representative selectio n of the slo west paths through the pASIC 3
logic cell including typical net delays. Worst case delay values for specific paths should be deter­mined from timing analysis of your particular design.
Fanout [5]
8-34 34 Preliminary
Military Plastic pASIC 3 Family
QL3060 Clock Cells
Propagation Delays (ns)
Symbol Parameter
12348101214161820
tACK Array Clo ck Delay tGCKP Global Clock Pin Delay tGCKB Global Clock Buffer Delay
1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 1.9 2 2.1
0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7
0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4 1.5 1.6 1.7
I/O Cells
Symbol Parameter
tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6
tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tlOCLK Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0 tlORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0
Loads per Half Column [7]
Propagation Delays (ns)
Fanout [5]
1234810
Propagation Delays (ns)
Symbol Parameter
tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2
Output Load Capacitance (pF)
30 50 75 100 150
Notes: [7] The array distributed networks consist of 88 half columns and the global distributed networks
consist of 92 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer d elay. The array clock has up to 18 loads per half column. The global clock has up to 20 loads per half column.
[8] The following loads are used for tPXZ:
1K
tPHZ
5 pF
1K
tPLZ
5 pF
8-35
Military Plastic pASIC 3 Family
Pin Descriptions
Pin Function Description
TDI Test Data In for JTAG Hold HIGH during normal operation. Connect to
VCC if not used for JTAG.
TRSTB Active low Reset for JTAG Hold LOW during normal operation. Connect to
ground if not used for JTAG.
TMS Test Mode Select for JTAG Hold HIGH during normal operation. Connect to
VCC if not used for JTAG.
TCK Test Clock for JTAG Hold HIGH or LOW during normal operation.
Connect to VCC or ground if not used for JTAG.
TDO Test data out for JTAG Output that must be left unconnected if not used for
JTAG. STM Special Test Mode Must be grounded during normal operation. I/ACLK High-drive input and/or
array network driver
I/GCLK High-drive input and/or
global network driver I High-drive input Use for input signals with high fanout. I/O Input/Output pin Can be configured as an input and/or output. VCC Power supply pin Connect to 3.3V supply. VCCIO Input voltage tolerance pin Connect to 5.0 volt supply if 5 volt input tolerance is
GND Ground pin Connect to ground. GND/THERM Ground/Thermal pin Available on 456-PBGA only. Connect to ground
Can be configured as either or both.
Can be configured as either or both.
required, otherwise connect to 3.3V supply.
plane on PCB if heat sinking desired. Otherwise may be left unconnected.
Ordering Information
QL 3060 –1 PQ208 M
QuickLogic
pASIC device
pASIC 3 device
part number
3012 3025 3040 3060
Speed Grade 0 = quick 1 = fast 2 = faster
8-36 36 Preliminary
Operating Ran ge M = Military
Package Code PL84 = 84-pin PLCC
PQ208 = 208-pin PQFP
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