Datasheet QL3012-1PL84M, QL3012-0PL84M, QL3012-2PL84M, QL3025-2PQ208M, QL3040-0PQ208M Datasheet (QUICK LOGIC)

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Military Plastic pASIC 3 Family

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

Military pASIC 3 - 3.3V Family

EVICE HIGHLIGHTS

Device Highlights

High Performance and High Density

■ 60,000 Usable PLD Gates with 316 I/Os

■ 16-bit counter speeds over 300 MHZ, data path

speeds over 400 MHz

■ 0.35um four-layer metal non-volatile CMOS

process for smallest die sizes

EATURES

Features

Total of 180 I/O pins

■ 308 bidirectional input/output pins, PCI-compliant

for 5.0 volt and 3.3 volt buses for -1/-2 speed grades

■ 8 high-drive input/distributed network pins

Eight Low-Skew Distributed Networks

Easy to Use/Fast Development Cycles

■ 100% routable with 100% utilization and complete

pin-out stability

■ Variable-grain logic cells provide high performance

and 100% utilization

■ Comprehensive design tools include high quality

Verilog/VHDL synthesis

Advanced I/O Capabilities

■ Interfaces with both 3.3 volt and 5.0 volt devices

■ PCI compliant with 3.3V and 5.0V buses for -1/-2

speed grades

■ Full JTAG boundary scan

■ Registered I/O cells with individually controlled

clocks and output enables

Device

QL3012 8,000 12,000 84PLCC 68 M 3.3V QL3025 16,000 25,000 208PQFP 174 M 3.3V QL3040 24,000 40,000 208PQFP 174 M 3.3V QL3060 36,000 60,000 208PQFP 174 M 3.3V

M = Military Temperature (-55 to +125 degrees C)

ASIC

Gates

PLD

Gates

TABLE 1: Selector Table

■ Two array clock/control networks available to the

logic cell flip-flop clock, set and reset inputs - each driven by an input-only pin

■ Up to six global clock/control networks available

to the logic cell F1, clock, set and reset inputs and the input and I/O register clock, reset and enable inputs as well as the output enable control - each driven by an input-only or I/O pin, or any logic cell output or I/O cell feedback

High Performance

■ Input + logic cell + output total delays under 6 ns

■ Data path speeds exceeding 400 MHz

■ Counter speeds over 300 MHz

Max

Package

I/O

Qualification

Level

Supply

Voltage

Rev B

8-23

Product Summary

Military Plastic pASIC 3 Family

RODUCT SUMMARY

The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using QuickLogic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme ease-of-use.

The pASIC 3 product family contains 1,584 logic cells. With a maximum of 316 I/Os, and is available in 208-PQFP and 84-PLCC packages.

INOUT DIAGRAM

Pinout Diagram 68-Pin CPGA

Software support for the complete pASIC 3 family is available through three basic packages. The turnkey

QuickWorks

FPGA software solution from design entry to logic synthesis, to place and route, to simulation. The

QuickWorks vide a solution for designers who use Cadence, Exemplar, Mentor, Synopsys, Synplicity, Viewlogic, Veribest, or other third-party tools for design entry, synthesis, or simulation.

package provides the most complete

-Lite and QuickTo o l s

packages pro-

84-PIN PLCC

TABLE 2: 84-pin PLCC

8-24 24 Preliminary

Military Plastic pASIC 3 Family

INOUT DIAGRAM

Pinout Diagram 208-Pin PQFP

208-PIN PQFP

Pin #1

Pin #157

pASIC

QL3060-1PQ208M

Pin #53

Pin #105

8-25

Military Plastic pASIC 3 Family

PQFP 208-P

208 Function 208 Function 208 Function 208 Function 208 Function

PQFP PQFP PQFP PQFP PQFP

208 I/O 43 GND 84 I/O 125 I/O 168 I/O

1 I/O 44 I/O 85 I/O 126 I/O 169 I/O 2 I/O 45 I/O 86 I/O 127 GND NC I/O 3 I/O 46 I/O 87 I/O 128 I/O 170 I/O 4 I/O 47 I/O 88 I/O NC I/O 171 I/O 5 I/O 48 I/O 89 I/O 129 GCLK / I 172 I/O

NC I/O NC I/O 90 I/O 130 ACLK / I 173 I/O

6 I/O 49 I/O 91 I/O 131 VCC 174 I/O 7 I/O 50 I/O 92 I/O 132 GCLK / I 175 I/O 8 I/O 51 I/O NC I/O 133 GCLK / I NC I/O

9 I/O 52 I/O 93 I/O 134 VCC 176 I/O 10 VCC 53 I/O 94 I/O 135 I/O 177 GND 11 I/O 54 TDI 95 GND 136 I/O 178 I/O 12 GND NC I/O 96 I/O NC I/O 179 I/O 13 I/O NC I/O 97 VCC 137 I/O NC I/O 14 I/O 55 I/O 98 I/O NC GND 180 I/O

NC I/O 56 I/O 99 I/O 138 I/O 181 I/O

15 I/O NC I/O 100 I/O 139 I/O 182 GND 16 I/O 57 I/O NC I/O 140 I/O NC VCC 17 I/O 58 I/O 101 I/O 141 I/O 183 I/O 18 I/O 59 GND NC I/O 142 I/O 184 I/O 19 I/O 60 I/O 102 I/O NC I/O 185 I/O 20 I/O 61 VCC NC I/O 143 I/O 186 I/O

NC I/O 62 I/O NC I/O 144 I/O 187 VCCIO

21 I/O 63 I/O 103 TRSTB 145 VCC 188 I/O 22 I/O 64 I/O 104 TMS NC I/O NC I/O 23 GND NC I/O 105 I/O 146 I/O 189 I/O 24 I/O 65 I/O NC I/O 147 GND 190 I/O 25 GCLK / I 66 I/O 106 I/O 148 I/O 191 I/O 26 ACLK / I 67 I/O 107 I/O 149 I/O 192 I/O 27 VCC NC I/O 108 I/O 150 I/O 193 I/O 28 GCLK / I 68 I/O 109 I/O 151 I/O 194 I/O 29 GCLK / I 69 I/O NC I/O 152 I/O NC I/O 30 VCC 70 I/O 110 I/O 153 I/O 195 I/O 31 I/O NC I/O 111 I/O 154 I/O 196 I/O 32 I/O 71 I/O 112 I/O 155 I/O 197 I/O

NC GND NC I/O 113 I/O 156 I/O 198 I/O

33 I/O 72 I/O 114 VCC 157 TCK NC I/O

NC I/O 73 GND 115 I/O 158 STM 199 GND

34 I/O 74 I/O 116 GND NC I/O 200 I/O 35 I/O NC VCC 117 I/O 159 I/O 201 VCC 36 I/O 75 I/O NC I/O 160 I/O 202 I/O

NC I/O 76 I/O 118 I/O 161 I/O 203 I/O

37 I/O 77 I/O 119 I/O 162 I/O 204 I/O 38 I/O 78 GND 120 I/O 163 GND 205 I/O 39 I/O 79 I/O 121 I/O 164 I/O 206 I/O

NC I/O 80 I/O NC I/O 165 VCC 207 TDO

40 I/O 81 I/O 122 I/O 166 I/O 41 VCC 82 I/O 123 I/O NC I/O 42 I/O 83 VCCIO 124 I/O 167 I/O

INOUT TABLE

PQFP 208 Pinout Table

8-26 26 Preliminary

Military Plastic pASIC 3 Family

ABSOLUTE MAXIMUM RATINGS

VCC Voltage...........................-0.5 to 4.6V

VCCIO Voltage .......................-0.5 to 7.0V

Input Voltage.............. -0.5 to VCCIO+0.5V

Latch-up Immunity

.................. ±200 mA

DC Input Current ...................... ±20 mA

ESD Pad Protection....................±2000V

Storage Temperature .......-65

°C to +150°C

Lead Temperature ...........................300

OPERATING RANGE

Symbol Parameter Military Unit

Min Max

VCC Supply Voltage 3.0 3.6 V VCCIO I/O Input Tolerance Voltage 3.0 5.5 V TA Ambient Temperature -55 TC Case Temperature 125

-0 Speed Grade 0.42 2.03

K Delay Factor -1 Speed Grade 0.42 1.64

-2 Speed Grade 0.42 1.37

DC CHARACTERISTICS

Symbol Parameter Conditions Min Max Unit

VIH Input HIGH Voltage 0.5VCC VCCIO+0.5 V VIL Input LOW Voltage -0.5 0.3VCC V VOH Output HIGH Voltage IOH = -12 mA 2.4 V

IOH = -500 µA

VOL Output LOW Voltage IOL = 8 mA [1] 0.45 V

IOL = 1.5 mA 0.1VCC V II I or I/O Input Leakage Current VI = VCCIO or GND -10 10 IOZ 3-State Output Leakage Current VI = VCCIO or GND -10 10 CI Input Capacitance [2] 10 pF IOS Output Short Circuit Current [3] VO = GND -15 -180 mA

VO = VCC 40 210 mA ICC D.C. Supply Current [4] VI, VIO = VCCIO or GND 0.50 (typ) 5 mA ICCIO D.C. Supply Current on VCCIO 0 100

0.9VCC V

°C

°C °C

µA µA

µA

Notes: [1] Military devices have 8 mA IOL specifications. [2] Capacitance is sample tested only. Clock pins are 12 pF maximum. [3] Only one output at a time. Duration should not exceed 30 seconds. [4] Maximum ICC is 5 mA for all military grade devices. For AC conditions, contact QuickLogic

customer engineering.

8-27

Military Plastic pASIC 3 Family

QL3012

AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)

(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)

Logic Cells

Propagation Delays (ns)

Symbol Parameter

12348

tPD Combinatorial Delay [6] 1.4 1.7 1.9 2.2 3.2 tSU Setup Time [6] 1.7 1.7 1.7 1.7 1.7 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8

Fanout [5]

Input-Only/Clock Cells

Propagation Delays (ns)

Symbol Parameter

123481224

tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 1.9 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tlCLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tlRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0

Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C.

Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.

[6] These limits are derived from a r epresentative selection of the slowest paths through th e p ASIC 3 lo gic

cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.

Fanout [5]

8-28 28 Preliminary

Military Plastic pASIC 3 Family

QL3012 Clock Cells

Propagation Delays (ns)

Symbol Parameter

tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3

I/O Cells

Symbol Parameter

tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6

tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tlOCLK Input Register Clock To Q 0.7 1.0 1.2 1.5 2.5 3.0 tlORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tlESU Input Register clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tlEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0

Loads per Half Column [7]

123481011

Propagation Delays (ns)

Fanout [5]

1234810

Propagation Delays (ns)

Symbol Parameter

tOUTLH Output Delay Low to High 2.1 2 .5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2 .6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2

Output Load Capacitance (pF)

30 50 75 100 150

Notes: [7] The array distributed network s consist of 40 half columns and the glob al distributed net works consist of

44 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer del ay. The array clock has up to 8 loads per half column. The global clock has up t o 11 loads per half c olumn.

[8] The following loads are used for tPXZ:

tPHZ

Ω

5 pF

Ω

tPLZ

5 pF

8-29

Military Plastic pASIC 3 Family

QL3025

AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)

(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)

Logic Cells

Propagation Delays (ns)

Symbol Parameter

12348

Fanout [5]

Input-Only/Clock Cells

Propagation Delays (ns)

Symbol Parameter

123481224

Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C. Multi-

ply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.

[6] These limits are derived from a representative selection of the slo west paths through the pASIC 3 logic cell

including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.

Fanout [5]

8-30 30 Preliminary

Military Plastic pASIC 3 Family

QL3025 Clock Cells

Propagation Delays (ns)

Symbol Parameter

12348101215

tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4

I/O Cells

Symbol Parameter

tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6

Loads per Half Column [7]

Propagation Delays (ns)

Fanout [5]

1234810

Propagation Delays (ns)

Symbol Parameter

tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2

Output Load Capacitance (pF)

30 50 75 100 150

Notes: [7] The array distributed net works consist of 56 half columns and the global di stributed net works cons ist of

60 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 12 loads per half column. The global clock has up to 15 loads per half column.

[8] The following loads are used for tPXZ:

tPHZ

Ω

5 pF

Ω

tPLZ

5 pF

8-31

Military Plastic pASIC 3 Family

QL3040

AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)

(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)

Logic Cells

Propagation Delays (ns)

Symbol Parameter

12348

Fanout [5]

Input-Only/Clock Cells

Propagation Delays (ns)

Symbol Parameter

123481224

Notes: [5] Stated timing for worst case Propagation Delay over process variation at VCC=3.3V and TA=25°C.

Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.

[6] These limits are derived from a representative selection of the slowest paths through the pASIC 3 logic

cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.

Fanout [5]

8-32 32 Preliminary

Military Plastic pASIC 3 Family

QL3040 Clock Cells

Propagation Delays (ns)

Symbol Parameter

1 2 3 4 8 10 12 14 16

tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 1.9 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4 1.5

I/O Cells

Symbol Parameter

tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6

Loads per Half Column [7]

Propagation Delays (ns)

Fanout [5]

1234810

Propagation Delays (ns)

Symbol Parameter

tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2

Output Load Capacitance (pF)

30 50 75 100 150

Notes: [7] The array distributed netwo rks consist of 72 half columns and the global dis tributed ne tworks consist of

76 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 14 loads per half column. The global clock has up to 16 loads per half column.

[8] The following loads are used for tPXZ:

1KΩ

tPHZ

5 pF

1KΩ

tPLZ

5 pF

8-33

Military Plastic pASIC 3 Family

QL3060

AC CHARACTERISTICS at VCC = 3.3V, TA = 25°C (K = 1.00)

(To calculate delays, multiply the appropriate K factor in the "Operating Range" section by the following numbers.)

Logic Cells

Propagation Delays (ns)

Symbol Parameter

12348

Fanout [5]

Input-Only/Clock Cells

Propagation Delays (ns)

Symbol Parameter

123481224

Notes: [5] Stated timing fo r worst case Propagati on Delay over pro cess variation at V CC=3.3V and TA=25°C.

Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.

[6] These limits are derived from a representative selectio n of the slo west paths through the pASIC 3

logic cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design.

Fanout [5]

8-34 34 Preliminary

Military Plastic pASIC 3 Family

QL3060 Clock Cells

Propagation Delays (ns)

Symbol Parameter

12348101214161820

tACK Array Clo ck Delay tGCKP Global Clock Pin Delay tGCKB Global Clock Buffer Delay

1.2 1.2 1.3 1.3 1.5 1.6 1.7 1.8 1.9 2 2.1

0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7 0.7

0.8 0.8 0.9 0.9 1.1 1.2 1.3 1.4 1.5 1.6 1.7

I/O Cells

Symbol Parameter

tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6

Loads per Half Column [7]

Propagation Delays (ns)

Fanout [5]

1234810

Propagation Delays (ns)

Symbol Parameter

tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-State [8] 2.0 tPLZ Output Delay Low to Tri-State [8] 1.2

Output Load Capacitance (pF)

30 50 75 100 150

Notes: [7] The array distributed networks consist of 88 half columns and the global distributed networks

consist of 92 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer d elay. The array clock has up to 18 loads per half column. The global clock has up to 20 loads per half column.

[8] The following loads are used for tPXZ:

1KΩ

tPHZ

5 pF

1KΩ

tPLZ

5 pF

8-35

Military Plastic pASIC 3 Family

Pin Descriptions

Pin Function Description

TDI Test Data In for JTAG Hold HIGH during normal operation. Connect to

VCC if not used for JTAG.

TRSTB Active low Reset for JTAG Hold LOW during normal operation. Connect to

ground if not used for JTAG.

TMS Test Mode Select for JTAG Hold HIGH during normal operation. Connect to

VCC if not used for JTAG.

TCK Test Clock for JTAG Hold HIGH or LOW during normal operation.

Connect to VCC or ground if not used for JTAG.

TDO Test data out for JTAG Output that must be left unconnected if not used for

JTAG. STM Special Test Mode Must be grounded during normal operation. I/ACLK High-drive input and/or

array network driver

I/GCLK High-drive input and/or

global network driver I High-drive input Use for input signals with high fanout. I/O Input/Output pin Can be configured as an input and/or output. VCC Power supply pin Connect to 3.3V supply. VCCIO Input voltage tolerance pin Connect to 5.0 volt supply if 5 volt input tolerance is

GND Ground pin Connect to ground. GND/THERM Ground/Thermal pin Available on 456-PBGA only. Connect to ground

Can be configured as either or both.

required, otherwise connect to 3.3V supply.

plane on PCB if heat sinking desired. Otherwise may be left unconnected.

Ordering Information

QL 3060 –1 PQ208 M

QuickLogic

pASIC device

pASIC 3 device

part number

3012 3025 3040 3060

Speed Grade 0 = quick 1 = fast 2 = faster

8-36 36 Preliminary

Operating Ran ge M = Military

Package Code PL84 = 84-pin PLCC

PQ208 = 208-pin PQFP

Datasheet QL3012-1PL84M, QL3012-0PL84M, QL3012-2PL84M, QL3025-2PQ208M, QL3040-0PQ208M Datasheet (QUICK LOGIC)

Specifications and Main Features

Frequently Asked Questions

User Manual