QUICK LOGIC QL24x32B-0PF144C, QL24x32B-0PF144I, QL24x32B-0PF144M, QL24x32B-0PQ208C, QL24x32B-0PQ208I Datasheet

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QL24x32B
pASIC
®
1 Family
Very-High-Speed CMOS FPGA
4-31
Very High Speed
– ViaLink
metal-to-metal programmable–via antifuse technology, allows counter speeds over 150 MHz and logic cell delays of under 2 ns.
High Usable Density
– An 24-by-32 array of 768 logic cells provides 8,000 usable ASIC gates (14,000 PLD gates) in 144-pin TQFP, 208-pin PQFP and 208-pin CQFP packages.
PCI-Output Drive
– Fully PCI 2.1 compliant input/output
capability. (including drive current)
Low-Cost, Easy-to-Use Design Tools
– Designs entered and simulated using QuickLogic's new QuickWorks development environment, or with third-party CAE tools including Viewlogic, Synopsys, Mentor, Cadence and Veribest. Fast, fully automatic place and route on PC and workstation platforms using QuickLogic software.
=
Up to 172 prog. I/O cells, 6 Input high-drive cells, 2 Input/Clk (high-drive) cells
pASIC 1
4
pASIC
HIGHLIGHTS
QL24x32B
Block Diagram
…8,000
usable ASIC gates,
180 I/O pins
768 Logic Cells
QL24x32B
4-32
The QL24x32B is a member of the pASIC 1 Family of very-high-speed CMOS user-programmable ASIC devices. The 768 logic cell field­programmable gate array (FPGA) offers 8,000 usable ASIC gates (equivalent to 14,000 PLD gates) of high-performance general-purpose logic in 144-pin TQFP and 208-pin PQFP and CQFP packages.
Low-impedance, metal-to-metal, ViaLink interconnect technology provides nonvolatile custom logic capable of operating above 150 MHz. Logic cell delays under 2 ns, combined with input delays of under 1.5 ns and output delays under 3 ns, permit high-density programmable devices to be used with today’s fastest microprocessors and DSPs.
Designs can be entered using QuickLogic’s QuickWorks Toolkit or most populart third-party CAE tools. QuickWorks combines Verilog/VHDL design entry and simulation tools with device-specific place & route and programming software. Ample on-chip routing channels allow fast, fully automatic place and route of designs using up to 100% of the logic and I/O cells, while maintaining fixed pin-outs
Total of 180 I/O pins – 172 Bidirectional Input/Output pins – 6 Dedicated Input/High-Drive pins – 2 Clock/Dedicated input pins with fanout-independent, low-skew
clock networks – PCI 2.1 Compliant I/Os Input + logic cell + output delays under 6 ns Chip-to-chip operating frequencies up to 110 MHz Internal state machine frequencies up to 150 MHz Clock skew < 0.5 ns Input hysteresis provides high noise immunity Built-in scan path permits 100% factory testing of logic and I/O cells
and functional testing with Automatic Test Vector Generation (ATVG) software after programming
144-pin TQFP compatible with QL16x24B
0.65µ CMOS process with ViaLink programming technology
PRODUCT
SUMMARY
FEATURES
QL24x32B
4-33
pASIC 1
4
Pinout Diagram 144-pin TQFP
QL24x32B
4-34
QL24X32B-1PQ208C
pASIC
Pinout Diagram
208-pin PQFP/CQFP
PIN # 1
PIN # 157
PIN # 105
PIN # 53
QL24x32B
4-35
PQFP/CQFP 208 Function/Connector Table
PIN FUN PIN FUN PIN FUN PIN FUN PIN FUN PIN FUN PIN FUN PIN FUN
1 I/O 27 VCC 53 I/O 79 I/O 105 I/O 131 VCC 157 I/O 183 I/O 2 I/O 28 I/P 54 I/O 80 I/O 106 I/O 132 I 158 I/O 184 I/O 3 I/O 29 I 55 I/O 81 I/O 107 I/O 133 I/SO 159 I/O 185 I/O 4 I/O 30 VCC 56 I/O 82 I/O 108 I/O 134 VCC 160 I/O 186 I/O 5 I/O 31 I/O 57 I/O 83 VCC 109 I/O 135 I/O 161 I/O 187 VCC 6 I/O 32 I/O 58 I/O 84 I/O 110 I/O 136 I/O 162 I/O 188 I/O 7 I/O 33 I/O 59 GND 85 I/O 111 I/O 137 I/O 163 GND 189 I/O 8 I/O 34 I/O 60 I/O 86 I/O 112 I/O 138 I/O 164 I/O 190 I/O
9 I/O 35 I/O 61 VCC 87 I/O 113 I/O 139 I/O 165 VCC 191 I/O 10 VCC 36 I/O 62 I/O 88 I/O 114 VCC 140 I/O 166 I/O 192 I/O 11 I/O 37 I/O 63 I/O 89 I/O 115 I/O 141 I/O 167 I/O 193 I/O 12 GND 38 I/O 64 I/O 90 I/O 116 GND 142 I/O 168 I/O 194 I/O 13 I/O 39 I/O 65 I/O 91 I/O 117 I/O 143 I/O 169 I/O 195 I/O 14 I/O 40 I/O 66 I/O 92 I/O 118 I/O 144 I/O 170 I/O 196 I/O 15 I/O 41 VCC 67 I/O 93 I/O 119 I/O 145 VCC 171 I/O 197 I/O 16 I/O 42 I/O 68 I/O 94 I/O 120 I/O 146 I/O 172 I/O 198 I/O 17 I/O 43 GND 69 I/O 95 GND 121 I/O 147 GND 173 I/O 199 GND 18 I/O 44 I/O 70 I/O 96 I/O 122 I/O 148 I/O 174 I/O 200 I/O 19 I/O 45 I/O 71 I/O 97 VCC 123 I/O 149 I/O 175 I/O 201 VCC 20 I/O 46 I/O 72 I/O 98 I/O 124 I/O 150 I/O 176 I/O 202 I/O 21 I/O 47 I/O 73 GND 99 I/O 125 I/O 151 I/O 177 GND 203 I/O 22 I/O 48 I/O 74 I/O 100 I/O 126 I/O 152 I/O 178 I/O 204 I/O 23 GND 49 I/O 75 I/O 101 I/O 127 GND 153 I/O 179 I/O 205 I/O 24 I/O 50 I/O 76 I/O 102 I/O 128 I/O 154 I/O 180 I/O 206 I/O 25 I/Sck 51 I/O 77 I/O 103 I/O 129 I/SI 155 I/O 181 I/O 207 I/O 26 I/Clk 52 I/O 78 GND 104 I/O 130 I/Clk 156 I/O 182 GND 208 I/O
pASIC 1
4
QL24x32B
4-36
ABSOLUTE MAXIMUM RATINGS
Supply Voltage................................. –0.5 to 7.0V Storage Temperature.......–65°C to + 150°C
Input Voltage....................... –0.5 to VCC +0.5V Lead Temperature ...................................300°C
ESD Pad Protection.................................. ±2000V
DC Input Current...................................... ±20 mA
Latch-up Immunity................................. ±200 mA
OPERATING RANGE
Symbol Parameter Military Industrial Commercial Unit
Min Max Min Max Min Max
VCC Supply Voltage 4.5 5.5 4.5 5.5 4.75 5.25 V TA Ambient Temperature -55 -40 85 0 70
°C
TC Case Temperature 125
°C
-X Speed Grade 0.4 2.75 0.46 2.55
K Delay Factor -0 Speed Grade 0.39 1.82 0.4 1.67 0.46 1.55
-1 Speed Grade 0.39 1.56 0.4 1.43 0.46 1.33
-2 Speed Grade 0.4 1.35 0.46 1.25
DC CHARACTERISTICS over operating range
Symbol Parameter Conditions Min Max Unit
VIH Input HIGH Voltage 2.0 V VIL Input LOW Voltage 0.8 V
IOH = -4 mA 3.7 V
VOH Output HIGH Voltage [0] IOH = 16 mA 2.4 V
IOH = -10 µA
VCC-0.1 V
VOL Output LOW Voltage [0] IOL = 24 mA* 0.4 V
IOL = 10 µA
0.1 V
II Input Leakage Current VI = VCC or GND -10 10
µA
IOZ 3-State Output Leakage Current VI = VCC or GND -10 10
µA CI Input Capacitance [1] 10 pF IOS Output Short Circuit Current [2] VO = GND -10 -90 mA
VO = VCC 40 160 mA
ICC D.C. Supply Current [3] VI, VIO = VCC or GND 10 mA
*IOL = 24 mA for commercial range only. IOL = 12 mA for the industrial and military ranges. Notes: [1] Capacitance is sample tested only. CI = 20 pF max on I/(SI).
[2] Only one output at a time. Duration should not exceed 30 seconds. [3] Commercial temperature grade only. Maximum Icc for industrial grade is 15mA and for military grade is
20 mA. For AC conditions use the formula described in the Section 9 — Power vs Operating Frequency.
[4] Stated timing for worst case Propagation Delay over process variation at VCC = 5.0V and TA = 25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range.
[5] These limits are derived from a representative selection of the slowest paths through the pASIC logic cell
including net delays
. Worst case delay values for specific paths should be determined from timing analysis
of your particular design.
QL24x32B
4-37
AC CHARACTERISTICS at VCC = 5V, TA = 25°C (K = 1.00) Logic Cell
Input Cells
Output Cell
Propagation Delays (ns)
[4]
Symbol Parameter Output Load Capacitance (pF)
30 50 75 100 150
tOUTLH Output Delay Low to High 2.7 3.3 3.8 4.3 5.4 tOUTHL Output Delay High to Low 2.8 3.6 4.5 5.3 6.9 tPZH Output Delay Tri-state to High 2.1 2.6 3.1 3.7 4.8
tPZL Output Delay Tri-state to Low 2.6 3.3 4.1 4.9 6.5 tPHZ Output Delay High to Tri-state [8] 2.9 tPLZ Output Delay Low to Tri-state [8] 3.3
Notes: [6] See High Drive Buffer Table for more information.
[7] Clock buffer fanout refers to the maximum number of flip flops per half column. The number of half
columns used does not affect clock buffer delay.
[8] The following loads are used for tPXZ:
Propagation Delays (ns)
Symbol Parameter Fanout
12348
tPD Combinatorial Delay [5] 1.7 2.1 2.7 3.3 5.5 tSU Setup Time [5] 2.1 2.1 2.1 2.1 2.1 tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 1.0 1.5 1.9 2.7 4.9 tCWHI Clock High Time 2.0 2.0 2.0 2.0 2.0 tCWLO Clock Low Time 2.0 2.0 2.0 2.0 2.0 tSET Set Delay 1.7 2.2 2.7 3.3 5.5 tRESET Reset Delay 1.5 1.9 2.3 2.8 4.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Symbol Parameter
Propagation Delays (ns)
[4]
123481216
tIN High Drive Input Delay [6] 3.1 3.2 3.3 3.4 4.4 5.8 6.5 tINI High Drive Input, Inverting Delay [6] 3.3 3.4 3.5 3.6 4.6 6.0 6.7 tIO Input Delay (bidirectional pad) 1.4 1.9 2.3 3.0 4.8 6.7 8.5 tGCK Clock Buffer Delay [7] 2.7 2.8 2.9 3.0 3.1 3.3 3.4 tGCKHI Clock Buffer Min High [7] 2.0 2.0 2.0 2.0 2.0 2.0 2.0 tGCKLO Clock Buffer Min Low [7] 2.0 2.0 2.0 2.0 2.0 2.0 2.0
pASIC 1
4
5 pF
1K
5 pF
1K
tPHZ
tPLZ
QL24x32B
4-38
High Drive Buffer
Clock Drivers Propagation Delays (ns)
[4]
Symbol Parameter Wired Together Fanout
12 24 48 72 96
1 5.8 7.2
tIN High Drive Input Delay 2 5.0 7.1
3 5.8 6.7 7.7 4 5.9 6.8 1 6.0 7.4
tINI High Drive Input, 2 5.2 7.3
Inverting Delay 3 6.0 6.9 7.9
4 6.1 7.0
AC Performance
Propagation delays depend on routing, fanout, load capacitance, supply voltage, junction temperature, and process variation. The AC Characteristics are a design guide to provide initial timing estimates at nominal conditions. Worst case estimates are obtained when nominal propagation delays are multiplied by the appropriate Delay Factor, K, as specified in the Delay Factor table (Operating Range). The effects of voltage and temperature variation are illustrated in the graphs on page 4-47, K Factor versus Voltage and Temperature. The pASIC Development Tools incorporate data sheet AC Characteristics into the QDIF database for pre-place-and-route timing analysis. The SpDE Delay Modeler extracts specific timing parameters for precise path analysis or simulation results following place and route.
ORDERING
INFORMATION
QL 24x32B - 1 PQ208 C
QuickLogic
pASIC device
pASIC device part number
B = 0.65 micron CMOS
Operating Range
C = Commercial I = Industrial M = Military M/883C = MIL STD 883
Package Code PF144 = 144-pin TQFP PQ208 = 208-pin PQFP CF208 = 208-pin CQFP
Speed Grade X = quick 0 = fast 1 = faster 2 = fastest
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