Quectel M10 Hardware Description

M10

Quectel Cellular Engine

Hardware Design

M10_HD_V1.00

M10 Hardware Design

Quectel

Document Title Revision Date Status Document Control ID

General Notes

Quectel offers this information as a service to its customers, to support application and

engineering efforts that use the products designed by Quectel. The information provided is

based upon requirements specifically provided to Quectel by the customers. Quectel has not

undertaken any independent search for additional relevant information, including any

information that may be in the customer’s possession. Furthermore, system validation of this

product designed by Quectel within a larger electronic system remains the responsibility of

the customer or the customer’s system integrator. All specifications supplied herein are

subject to change.

This document contains proprietary technical information which is the property of Quectel

Limited., copying of this document and giving it to others and the using or communication of

the contents thereof, are forbidden without express authority. Offenders are liable to the

a utility model or design. All specification supplied herein are subject to change without

notice at any time.

M10 Hardware Design

1.00

2009-06-27

Release

M10_HD_V1.00

M10_HD_V1.00 - 1 -

M10 Hardware Design

Quectel

Contents ............................................................................................................................................2

0 Revision history........................................................................................................................... 7

1 Introduction ..................................................................................................................................8

1.1 Related documents ............................................................................................................... 8

1.2 Terms and abbreviations.......................................................................................................9

1.3 Safety caution..................................................................................................................... 11

2 Product concept ........................................................................................................................13

2.1 Key features .......................................................................................................................13

2.2 Functional diagram.............................................................................................................15

2.3 Evaluation board ................................................................................................................16

3 Application interface.................................................................................................................17

3.1 Pin description....................................................................................................................17

3.2 Operating modes ................................................................................................................20

3.3 Power supply ......................................................................................................................21

3.3.1 Power supply pins ....................................................................................................23

3.3.2 Minimizing power losses..........................................................................................23

3.3.3 Monitoring power supply .........................................................................................23

3.4 Power up and power down scenarios .................................................................................24

3.4.1 Turn on .....................................................................................................................24

3.4.2 Turn off.....................................................................................................................26

3.4.3 Restart module using the PWRKEY pin...................................................................29

3.5 Power saving ......................................................................................................................30

3.5.1 Minimum functionality mode...................................................................................30

3.5.2 SLEEP mode (slow clock mode)..............................................................................31

3.5.3 Wake up module from SLEEP mode .......................................................................31

3.6 Summary of state transitions (except SLEEP mode)..........................................................31

3.7 RTC backup .......................................................................................................................32

3.8 Serial interfaces..................................................................................................................33

3.8.1 Function of serial port & debug port supporting......................................................35

3.8.2 Software upgrade and software debug......................................................................36

3.9 Audio interfaces..................................................................................................................38

3.9.1 Microphone interfaces configuration........................................................................40

3.9.2 Speaker interface configuration................................................................................41

3.9.3 Earphone interface configuration .............................................................................43

3.10 Buzzer ..............................................................................................................................44

3.11 SIM card interface............................................................................................................45

3.11.1 SIM card application ..............................................................................................45

3.11.2 Design considerations for SIM card holder............................................................46

3.12 LCD interface...................................................................................................................48

3.13 Keypad interface ..............................................................................................................49

3.14 ADC..................................................................................................................................50

M10_HD_V1.00 - 2 -

M10 Hardware Design

Quectel

3.15 Behaviors of the RI ..........................................................................................................51

3.16 Network status indication.................................................................................................52

3.17 General purpose input & output (GPIO) ..........................................................................53

3.18 Open drain output (LIGHT_MOS)...................................................................................53

4 Antenna interface......................................................................................................................55

4.1 Antenna installation............................................................................................................55

4.2 RF output power.................................................................................................................55

4.3 RF receive sensitivity.........................................................................................................56

4.4 Operating frequencies ........................................................................................................56

5 Electrical, reliability and radio characteristics....................................................................... 57

5.1 PIN assignment of the module ........................................................................................... 57

5.2 Absolute maximum ratings.................................................................................................59

5.3 Operating temperatures ...................................................................................................... 59

5.4 Power supply ratings ..........................................................................................................59

5.5 Current consumption..........................................................................................................60

5.6 Electro-static discharge ...................................................................................................... 62

6 Product information...................................................................................................................64

7 Mechanics.................................................................................................................................. 65

7.1 Mechanical dimensions of module..................................................................................... 65

7.2 Footprint of recommendation.............................................................................................67

7.3 Top view of the module .....................................................................................................69

7.4 Bottom view of the module................................................................................................ 69

M10_HD_V1.00 - 3 -

M10 Hardware Design

Quectel

Table Index

TABLE 1: RELATED DOCUMENTS.....................................................................................................8

TABLE 2: TERMS AND ABBREVIATIONS ......................................................................................... 9

TABLE 3: MODULE KEY FEATURES................................................................................................13

TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .. 15

TABLE 5: PIN DESCRIPTION .............................................................................................................17

TABLE 6: OVERVIEW OF OPERATING MODES..............................................................................20

TABLE 7: AT COMMANDS USED IN ALARM MODE .....................................................................26

TABLE 8: SUMMARY OF STATE TRANSITIONS.............................................................................31

TABLE 9: LOGIC LEVELS OF THE SERIAL PORT AND DEBUG PORT .......................................34

TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES ........................................................34

TABLE 11: PIN DEFINITION OF AUDIO INTERFACE .................................................................... 39

TABLE 12: MIC INPUT CHARACTERISTICS...................................................................................43

TABLE 13: SPK OUTPUT CHARACTERISTICS ...............................................................................43

TABLE 14: PIN DEFINITION OF THE BUZZER ...............................................................................44

TABLE 15: BUZZER OUTPUT CHARACTERISTICS ....................................................................... 44

TABLE 16: PIN DEFINITION OF THE SIM INTERFACE .................................................................45

TABLE 17: PIN DESCRIPTION (AMPHENOL SIM CARD HOLDER) ............................................ 47

TABLE 18: PIN DESCRIPTION (MOLEX SIM CARD HOLDER) ....................................................48

TABLE 19: PIN DEFINITION OF THE LCD INTERFACE ................................................................49

TABLE 20: PIN DEFINITION OF THE KEYPAD INTERFACE ........................................................49

TABLE 21: PIN DEFINITION OF THE ADC.......................................................................................51

TABLE 22: CHARACTERISTICS OF THE ADC ................................................................................51

TABLE 23: BEHAVIOURS OF THE RI................................................................................................51

TABLE 24: WORKING STATE OF THE NETLIGHT .........................................................................52

TABLE 25: PIN DEFINITION OF THE GPIO INTERFACE ............................................................... 53

TABLE 26: PIN DEFINITION OF THE LIGHT_MOS ........................................................................54

TABLE 27: PIN DEFINITION OF THE RF_ANT................................................................................ 55

TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ....................................................55

TABLE 29: THE MODULE CONDUCTED RF RECEIVE SENSITIVITY ........................................56

TABLE 30: THE MODULE OPERATING FREQUENCIES................................................................56

TABLE 31: M10 CONNECTION DIAGRAMS....................................................................................58

TABLE 32: ABSOLUTE MAXIMUM RATINGS.................................................................................59

TABLE 33: OPERATING TEMPERATURE......................................................................................... 59

TABLE 34: THE MODULE POWER SUPPLY RATINGS................................................................... 59

TABLE 35: THE MODULE CURRENT CONSUMPTION..................................................................60

TABLE 36: THE ESD ENDURE STATUE MEASURED TABLE (TEMPERATURE: 25℃,

HUMIDITY: 45 %) ........................................................................................................................ 62

TABLE 37: ORDERING INFORMATION ...........................................................................................64

M10_HD_V1.00 - 4 -

M10 Hardware Design

Quectel

Figure Index

FIGURE 1: MODULE FUNCTIONAL DIAGRAM .............................................................................16

FIGURE 2: REFERENCE CIRCUIT OF THE VBAT INPUT ..............................................................22

FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT...........................22

FIGURE 4: POWER SUPPLY LIMITS DURING TRANSMITTING BURST .................................... 23

FIGURE 5: TURN ON THE MODULE USING DRIVING CIRCUIT.................................................24

FIGURE 6: TURN ON THE MODULE USING KEYSTROKE...........................................................25

FIGURE 7: TIMING OF TURN ON SYSTEM ..................................................................................... 25

FIGURE 8: TIMING OF TURN OFF SYSTEM ...................................................................................27

FIGURE 9: REFERENCE CIRCUIT FOR EMERG_OFF USING DRIVING CIRCUIT .................... 28

FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF USING KEYSTOKE ...............................29

FIGURE 11 : TIMING OF RESTART SYSTEM...................................................................................29

FIGURE 12 : TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN.................... 30

FIGURE 13: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ...............................................32

FIGURE 14: RTC SUPPLY FROM RECHARGEABLE BATTERY ....................................................32

FIGURE 15: RTC SUPPLY FROM CAPACITOR ................................................................................33

FIGURE 16: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC ...............................................33

FIGURE 17: CONNECTION OF SERIAL INTERFACES ...................................................................35

FIGURE 18: CONNECTION OF SOFTWARE UPGRADE.................................................................37

FIGURE 19: CONNECTION OF SOFTWARE DEBUG......................................................................37

FIGURE 20: RS232 LEVEL CONVERTER CIRCUIT .........................................................................38

FIGURE 21: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2 ............................40

FIGURE 22: SPEAKER INTERFACE CONFIGURATION OF AOUT1 ............................................. 41

FIGURE 23: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1 ............41

FIGURE 24: SPEAKER INTERFACE CONFIGURATION OF AOUT2 ............................................. 42

FIGURE 25: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2 ............42

FIGURE 26: EARPHONE INTERFACE CONFIGURATION..............................................................43

FIGURE 27: REFERENCE CIRCUIT FOR BUZZER..........................................................................44

FIGURE 28: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD....................................................46

FIGURE 29: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD....................................................46

FIGURE 30: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER.............................................. 47

FIGURE 31: MOLEX 91228 SIM CARD HOLDER ............................................................................48

FIGURE 32: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE.............................................50

FIGURE 33: INTERNAL CIRCUIT OF THE ADC..............................................................................51

FIGURE 34: MODULE SERVICES AS RECEIVER............................................................................52

FIGURE 35 : MODULE SERVICES AS CALLER...............................................................................52

FIGURE 36: REFERENCE CIRCUIT OF THE NETLIGHT................................................................53

FIGURE 37: REFERENCE CIRCUIT OF THE LIGHT_MOS.............................................................54

FIGURE 38: M10 TOP AND SIDE DIMENSIONS（UNIT: MM）....................................................65

FIGURE 39: M10 BOTTOM DIMENSIONS（UNIT: MM） .............................................................66

M10_HD_V1.00 - 5 -

M10 Hardware Design

Quectel

FIGURE 40: PAD BOTTOM DIMENSIONS（UNIT: MM） .............................................................66

FIGURE 41: FOOTPRINT OF RECOMMENDATION（UNIT: MM）..............................................68

FIGURE 42: TOP VIEW OF THE MODULE .......................................................................................69

FIGURE 43: BOTTOM VIEW OF THE MODULE..............................................................................69

M10_HD_V1.00 - 6 -

M10 Hardware Design

Quectel

0 Revision history

Revision Date Author Description of change

1.00 2009-06-27 Tracy ZHANG Initial

M10_HD_V1.00 - 7 -

M10 Hardware Design

Quectel

1 Introduction

This document defines and specifies the M10 module series. For detail product information,

please refer to the chapter 6

of the Quectel’s M10 module series that connects to the specific application and the air interface.

This document can help you quickly understand module interface specifications, electrical and

mechanical details. With the help of this document and other M10 application notes, user guide,

you can use M10 module to design and set up mobile applications quickly.

1.1 Related documents

Table 1: Related documents

Product Information.This document describes the hardware interface

SN Document name Remark

[ 1 ] M1 0 _ AT C AT co m m a n d s s e ts

[2] ITU-T Draft new

recommendation

V.25ter:

[3] GSM 07.07: Digital cellular telecommunications (Phase 2+); AT command

[4] GSM 07.10: Support GSM 07.10 multiplexing protocol

[5] GSM 07.05: Digital cellular telecommunications (Phase 2+); Use of Data

[6] GSM 11.14: Digital cellular telecommunications system (Phase 2+);

[7] GSM 11.11: Digital cellular telecommunications system (Phase 2+);

[8] GSM 03.38: Digital cellular telecommunications system (Phase 2+);

[9] GSM 11.10 Digital cellular telecommunications system (Phase 2) ；

[10] GSM_UART_AN The document of UART port application notes

[11] M10_HD_AN01 The document of M10 hardware design application notes

Serial asynchronous automatic dialing and control

set for GSM Mobile Equipment (ME)

Terminal Equipment – Data Circuit terminating Equipment

(DTE – DCE) interface for Short Message Service (SMS) and

Cell Broadcast Service (CBS)

Specification of the SIM Application Toolkit for the Subscriber

Identity module – Mobile Equipment (SIM – ME) interface

Specification of the Subscriber Identity module – Mobile

Equipment (SIM – ME) interface

Alphabets and language-specific information

Mobile Station (MS) conformance specification ； Part 1:

Conformance specification

M10_HD_V1.00 - 8 -

M10 Hardware Design

Quectel

1.2 Terms and abbreviations

Table 2: Terms and abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AMR Adaptive Multi-Rate

ARP Antenna Reference Point

ASIC Application Specific Integrated Circuit

BER Bit Error Rate

BTS Base Transceiver Station

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DAC Digital-to-Analog Converter

DRX Discontinuous Reception

DSP Digital Signal Processor

DTE Data Terminal Equipment (typically computer, terminal, printer)

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

EGSM Enhanced GSM

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)

FDMA Frequency Division Multiple Access

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

HR Half Rate

I/O Input/Output

IC Integrated Circuit

IMEI International Mobile Equipment Identity

Inorm Normal Current

Imax Maximum Load Current

kbps Kilo bits per second

LED Light Emitting Diode

Li-Ion Lithium-Ion

ESD Electro-Static discharge

M10_HD_V1.00 - 9 -

M10 Hardware Design

Quectel

Abbreviation Description

MO Mobile Originated

MS Mobile Station (GSM engine), also referred to as TE

MT Mobile Terminated

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PDU Protocol Data Unit

PPP Point-to-point protocol

RF Radio Frequency

RMS Root Mean Square (value)

RTC Real Time Clock

Rx Receive Direction

SIM Subscriber Identification Module

SMS Short Message Service

TDMA Time Division Multiple Access

TE Terminal Equipment, also referred to as DTE

TX Transmitting Direction

UART Universal Asynchronous Receiver & Transmitter

URC Unsolicited Result Code

USSD Unstructured Supplementary Service Data

VSWR Voltage Standing Wave Ratio

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

Phonebook abbreviations

FD SIM fix dialing phonebook

LD SIM last dialing phonebook (list of numbers most recently dialed)

MC Mobile Equipment list of unanswered MT calls (missed calls)

ON SIM (or ME) own numbers (MSISDNs) list

M10_HD_V1.00 - 10 -

M10 Hardware Design

Quectel

Abbreviation Description

RC Mobile Equipment list of received calls

SM SIM phonebook

FWP Fixed Wireless Phone

FWT Fixed Wireless Terminal

NC Not connect

1.3 Safety caution

The following safety precautions must be observed during all phases of the operation. Usage ,

service or repair of any cellular terminal or mobile incorporating M10 module. Manufactures of

the cellular terminal should send words the following safety information to users and operating

personnel and to incorporate these guidelines into all manuals supplied with the product. If not so,

Quectel does not take on any liability for customer failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions about the

use of mobiles. Switch the cellular terminal or mobile off, medical equipment

may be sensitive to not operate normally for RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft.

Make sure it be switched off. The operation of wireless appliances in an

aircraft is forbidden to prevent interference with communication systems.

Forget to think much of these instructions may lead to the flight safety or

offend against local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable

gases or fumes. Switch off the cellular terminal when you are near petrol

stations, fuel depots, chemical plants or where blasting operations are in

progress. Operation of any electrical equipment in potentially explosive

atmos

heres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency

energy while switched on. RF interference can occur if it is used close to TV

sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile

when driving a vehicle, unless it is securely mounted in a holder for

handsfree operation. Before making a call with a hand-held terminal or

mobile, park the vehicle.

M10_HD_V1.00 - 11 -

M10 Hardware Design

Quectel

GSM cellular terminals or mobiles operate over radio frequency signals and

cellular networks and cannot be guaranteed to connect in all conditions, for

example no mobile fee or a invalid SIM card. While you are in this condition

and need emergent help, Please Remember using emergency calls. In order to

make or receive calls, the cellular terminal or mobile must be switched on

and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services

or phone features are in use (e.g. lock functions, fixed dialing etc.). You may

have to deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the

cellular terminal or mobile.

M10_HD_V1.00 - 12 -

M10 Hardware Design

Quectel

2 Product concept

The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850, EGSM 900

MHz, DCS 1800 MHz and PCS 1900 MHz. The M10 features GPRS multi-slot class 12(default)/

class 10/class8 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.

With a tiny profile of 29mm x 29mm x 3.6 mm(the thickness of PCB is 1.6mm), the module can

meet almost all the requirements, such as M2M, Telemetry and other mobile data communication

systems.

The M10 is a an SMD type module, which can be embedded in customer applications through it’s

64-pin pads. It provides all hardware interfaces between the module and customers’ boards.

z The keypad and LCD interface are flexible to develop customized applications. z Serial port can help you easily develop your applications. z Two audio channels include two microphone inputs and two speaker outputs. This can be

easily configured by AT command.

The module is designed with power saving technique so that the current consumption is as low as

1.1 mA in SLEEP mode.

The M10 is integrated with the TCP/IP protocol; extended TCP/IP AT commands are developed

for customers to use the TCP/IP protocol easily, which is very useful for those data transfer

applications.

The modules are fully RoHS compliant to EU regulation.

2.1 Key features

Table 3: Module key features

Feature Implementation

Power supply Single supply voltage 3.4V – 4.5V

Power saving Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5

0.7 mA@ DRX=9

Frequency bands

GSM class Small MS

Transmitting power z Class 4 (2W) at GSM 850 and EGSM 900

M10_HD_V1.00 - 13 -

z Quad-band: GSM850, EGSM 900, DCS1800, PCS1900. z The module can search these frequency bands automatically.

The frequency bands also can be set by AT command.

z Compliant to GSM Phase 2/2+

M10 Hardware Design

Quectel

z Class 1 (1W) at DCS 1800 and PCS 1900

GPRS connectivity

Temperature range

DATA GPRS:

CSD:

SMS z MT, MO, CB, Text and PDU mode

FAX Group 3 Class 1

SIM interface Support SIM card: 1.8V, 3V

Antenna interface Connected via 50 Ohm antenna pad

Audio features Speech codec modes:

Serial port and Debug port z Serial Port: Seven lines on Serial Port Interface

Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.

SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99

Real time clock Implemented

Alarm function Programmable via AT command

Physical characteristics Size:

z GPRS multi-slot class 12 （default） z GPRS multi-slot class 10 (option) z GPRS multi-slot class 8 (option) z GPRS mobile station class B

z Normal operation: -35°C ~ +80°C

z Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C z Storage temperature: -45°C ~ +90°C

z GPRS data downlink transfer: max. 85.6 kbps z GPRS data uplink transfer: max. 85.6 kbps z Coding scheme: CS-1, CS-2, CS-3 and CS-4 z Supports the protocols PAP (Password Authentication Protocol)

usually used for PPP connections.

z Integrates the TCP/IP protocol. z Support Packet Switched Broadcast Control Channel (PBCCH) z CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps,

non-transparent

z Unstructured Supplementary Services Data (USSD) support

z SMS storage: SIM card

z Half Rate (ETS 06.20) z Full Rate (ETS 06.10) z Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) z Adaptive multi rate (AMR) z Echo Cancellation z Echo Suppression z Noise Reduction

z Serial Port can be used for CSD FAX, GPRS service and send

AT command of controlling module.

z Serial Port can use multiplexing function. z Autobauding supports baud rate from 4800 bps to 115200bps. z Debug Port: Two lines on Serial Port Interface /TXD and /RXD z Debug Port only used for debugging

○

M10_HD_V1.00 - 14 -

M10 Hardware Design

Quectel

29±0.15 x 29±0.15 x 3.6±0.3mm

Weight: 8g

Firmware upgrade Firmware upgrade over serial port

○

When the module works in this temperature range, the deviations from the GSM specification

might occur. For example, the frequency error or the phase error could increase.

Table 4: Coding schemes and maximum net data rates over air interface

Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot

CS-1: 9.05kbps 18.1kbps 36.2kbps

CS-2: 13.4kbps 26.8kbps 53.6kbps

CS-3: 15.6kbps 31.2kbps 62.4kbps

CS-4: 21.4kbps 42.8kbps 85.6kbps

2.2 Functional diagram

The following figure shows a block diagram of the M10 module and illustrates the major

functional part:

z The GSM baseband engine z Flash and SRAM z The GSM radio frequency part z The SMT pads interface

—LCD interface —SIM card interface —Audio interface —Key board interface —UART interface —Power supply —RF interface

M10_HD_V1.00 - 15 -

M10 Hardware Design

Quectel

Figure 1

2.3 Evaluation board

In order to help you on the application of M10, Quectel can supply an Evaluation Board (EVB)

and a link-board that interfaces the module directly with appropriate power supply, SIM card

holder, RS232 serial interface, handset port, earphone port, antenna and all GPIOs of the module.

For details, please refer to the M10_EVB_UGD document.

: Module functional diagram

M10_HD_V1.00 - 16 -

M10 Hardware Design

Quectel

3 Application interface

The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular

application platform. Sub-interfaces included in these pads are described in detail in following

chapters:

z Power supply ( z Serial interfaces ( z Two analog audio interfaces ( z SIM interface (refer to Chapter 3.11)

Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter7.

3.1 Pin description

refer to Chapter 3.3)

refer to Chapter 3.8)

refer to Chapter 3.9)

Table 5: Pin description

Power Supply

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

VBAT I VBAT pins of the SMT pad

are dedicated to connect the

supply voltage. The power

supply of module has to be a

single voltage source of

VBAT= 3.4V...4.5V. It must

be able to provide sufficient

current in a transmitting

burst which typically rises to

2A.mostly, These 3 pins are

voltage inputs.

VRTC I/O Current input for RTC when

the battery is not supplied for

the system.

Current output for backup

battery when the main

battery is present and the

backup battery is in low

voltage state.

VDD_EXT O Supply 2.8V voltage for

external circuit. By

measuring this pin, user can

Vmax= 4.5V

Vmin=3.4V

Vnorm=4.0V

Vmax=2.85V

Vmin=2.6V

Vnorm=2.75V

Iout(max)= 730uA

Iin=2.6~5 uA

Vmax=2.9V

Vmin=2.7V

Vnorm=2.8V

Recommend to

connected to a

battery or a

capacitor.

1.If unused,keep

pin open.

2. Recommend

M10_HD_V1.00 - 17 -

M10 Hardware Design

Quectel

judge whether the system is

power on or off. When the

voltage is low, the system is

power off. Otherwise, the

system is power on.

GND Digital ground

Power on or power off

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

PWRKEY I Voltage input for power

on/off key. PWRKEY should

be pulled down to turn on or

turn off the system. The user

should keep pressing the key

for a moment when turn on

or turn off the system.

Because the system need

margin time in order to assert

the software.

Emergency shutdown

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

EMERG_OFF I Voltage input for emergency

shutdown under emergent

situation. EMERG_OFF

should be pulled down for at

least 20ms to emergency

shutdown the system. The

module can restart if

PWRKEY is activated after

emergency shutdown.

Audio interfaces

Imax=20mA

VILmax=0.3*VBAT

VIHmin=0.7*VBAT

VImax=VBAT

VILmax=0.4V

VIHmin=2.2V

max=2.8V

open

to add a

2.2~4.7uF bypass

capacitor, when

using this pin for

power supply.

Pull up to VBAT

Internally.

Open

drain/collector

driver required in

cellular device

application.

If unused keep

pin open.

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

MIC1P

MIC1N

MIC2P

MIC2N

SPK1P

SPK1N

SPK2P O Auxiliary positive

AGND AGND is separate ground

BUZZER O Buzzer output If unused keep

M10_HD_V1.00 - 18 -

I Positive and negative

voice-band input

I Auxiliary positive and

negative voice-band input

O Positive and negative

voice-band output

connection for external audio

circuits.

Audio DC Characteristics

refer to chapter 3.9.4

If unused keep

pins open

pin open

pins open.

M10 Hardware Design

Quectel

pin open

General purpose input/output

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

KBC0~KBC4 I If unused keep

KBR0~KBR4 O

DISP_DATA I/O

DISP_CLK O

DISP_CS O

DISP_D/C O

DISP_RST O

NETLIGHT O Network status indication

GPIO0 I/O Normal input/output port

GPIO1_KBC5 I/O Normal input/output

LIGHT_MOS O Open drain output port Imax=100mA If unused keep

Serial port

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

DTR I Data terminal ready

RXD I Receive data

TXD O Transmitting data

RTS I Request to send

CTS O Clear to send

RI O Ring indicator

DCD O Data carrier detection

Debug port

DBG_TXD O

DBG_RXD I

Keypad interface

LCD display interface If unused keep

port/Keypad interface

Serial interface for

debugging only.

VILmin=0V

VILmax=0.67V

VIHmin=1.7V

VIHmax= VDD_EXT+0.3

VOLmin=GND

VOLmax=0.34V

VOHmin=2.0V

VOHmax= VDD_EXT

VILmin=0V

VILmax=0.67V

VIHmin=1.7V

VIHmax= VDD_EXT+0.3

VOLmin=GND

VOLmax=0.34V

VOHmin=2.0V

VOHmax= VDD_EXT

pins open

Pull up to

VDD_EXT, if

unused keep pins

open

pins open

If unused keep

pins open

pin open

If only use TXD

RXD GND to

communicate,

RTS pin should

connect to GND

directly.

If unused keep

pins open.

If unused keep

pins open

SIM interface

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

SIM_VDD O Voltage supply for SIM card The voltage can be

selected by software

automatically either 1.8V

or 3V

SIM_DATA I/O SIM data output

SIM_CLK O SIM clock

M10_HD_V1.00 - 19 -

VIHmin=0.7*SIM_VDD

VOHmin=0.8*SIM_VDD

All signals of

SIM interface

should be

protected against

ESD with a TVS

diode array.

M10 Hardware Design

Quectel

SIM_RST O SIM reset VOLmax=0.4V

When SIM_VDD=3V

VILmax=0.4V

When SIM_VDD=1.8V

VILmax=0.2* SIM_VDD

VOHmin=0.9*SIM_VDD

When SIM_VDD=3V

VOLmax=0.4V

When SIM_VDD=1.8V

VOLmax=0.2* SIM_VDD

SIM_PRESE

NCE

AUXADC

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

ADC0 I General purpose analog to

TEMP_BAT I ADC input for battery

RF interface

PIN NAME I/O DESCRIPTION DC CHARACTERISTICS COMMENT

RF_ANT I/O RF antenna pad. impedance of 50Ω Refer to chapter

I SIM card detection VILmax=0.67V

VIHmin=1.7V

voltage range: 0V to 2.8V If unused keep

digital converter.

voltage range: 0V to 2.8V NTC should be

temperature over NTC

resistor.

Maximum cable

length 200mm

from the module

pad to SIM card

holder.

If unused , keep

pin open.

pin open

installed inside

or near battery

pack to deliver

temperature

values.

If unused keep

pin open.

3.2 Operating modes

The table below briefly summarizes the various operating modes referred to in the following

chapters.

Table 6: Overview of operating modes

Mode Function

Normal operation GSM/GPRS

SLEEP

M10_HD_V1.00 - 20 -

The module will automatically go into SLEEP mode if DTR is

set to high level and there is no interrupt (such as GPIO

interrupt or data on serial port).

In this case, the current consumption of module will reduce to

the minimal level.

During SLEEP mode, the module can still receive paging

M10 Hardware Design

Quectel

message and SMS from the system normally.

GSM IDLE Software is active. The module has registered to the GSM

network, and the module is ready to send and receive.

GSM TALK Connection is going on between two subscribers. In this case,

the power consumption depends on network settings such as

DTX off/on, FR/EFR/HR, hopping sequences.

GPRS

STANDBY

GPRS DATA There is GPRS data in transfer (PPP or TCP or UDP). In this

POWER DOWN Normal shutdown by sending the “AT+QPOWD=1” command, using the

PWRKEY or using the EMERG_OFF

disconnects the power supply from the base band part of the module, and only

the power supply for the RTC is remained. Software is not active. The serial

interfaces are not accessible. Operating voltage (connected to VBAT) remains

applied.

Minimum

functionality

mode (without

remove power

supply)

Alarm mode RTC alert function launches this restricted operation while the module is in

Use the “AT+CFUN” command can set the module to a minimum functionality

mode without remove the power supply. In this case, the RF part of the module

will not work or the SIM card will not be accessible, or both RF part and SIM

card will be closed all, and the serial interface is still accessible. The power

consumption in this case is very low.

POWER DOWN mode. The module will not be registered to GSM network and

only parts of AT commands can be available.

The module is ready for GPRS data transfer, but no data is

currently sent or received. In this case, power consumption

depends on network settings and GPRS configuration.

case, power consumption is related with network settings (e.g.

power control level), uplink / downlink data rates and GPRS

configuration (e.g. used multi-slot settings).

①. The power management ASIC

①Use the EMERG_OFF only when, due to serious problems. Please refer to chapter3.4.2.4.

3.3 Power supply

The power supply of module is from a single voltage source of VBAT= 3.4V...4.5V. In some case,

the ripple in a transmitting burst may cause voltage drops when current consumption rise to

typical peaks of 2A. So the power supply must be able to provide sufficient current up to 2A.For

the VBAT input, a local bypass capacitor is recommended. A capacitor (about 100 µF, low ESR)

is recommended. Multi-layer ceramic chip (MLCC) capacitors can provide the best combination

of low ESR and small size but may not be cost effective. A lower cost choice may be a 100 µF

tantalum capacitor (low ESR) with a small (0.1µF to 1µF) ceramic in parallel, which is illustrated

as following figure. The capacitors should put as close as possible to the M10 VBAT pins. The

following figure is the recommended circuit.

M10_HD_V1.00 - 21 -

+ 49 hidden pages

Quectel M10 Hardware Description

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

Table Index

Figure Index

0 Revision history

1 Introduction

1.1 Related documents

1.2 Terms and abbreviations

1.3 Safety caution

2 Product concept

2.1 Key features

2.3 Evaluation board

3 Application interface

3.1 Pin description

3.2 Operating modes

3.3 Power supply