Quectel BC660K-GL User Manual

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BC660K-GL

Hardware Design

NB-IoT Module Series

Version: 1.0.0

Date: 2020-11-20

Status: Preliminary

www.quectel.com

NB-IoT Module Series

BC660K-GL Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance,

please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai

200233, China

Tel: +86 21 5108 6236

Email: info@quectel.com

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm.

For technical support, or to report documentation errors, please visit:

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Or email to support@quectel.com.

General Notes

Quectel offers the information as a service to its customers. The information provided is based upon

customers’ requirements. Quectel makes every effort to ensure the quality of the information it makes

available. Quectel does not make any warranty as to the information contained herein, and does not

accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the

information. All information supplied herein is subject to change without prior notice.

Disclaimer

While Quectel has made efforts to ensure that the functions and features under development are free from

errors, it is possible that these functions and features could contain errors, inaccuracies and omissions.

Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or

express, with respect to the use of features and functions under development. To the maximum extent

permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of

the functions and features under development, regardless of whether such loss or damage may have been

foreseeable.

Duty of Confidentiality

The Receiving Party shall keep confidential all documentation and information provided by Quectel, except

when the specific permission has been granted by Quectel. The Receiving Party shall not access or use

Quectel’s documentation and information for any purpose except as expressly provided herein.

Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to

any third party without the prior written consent by Quectel. For any noncompliance to the above

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Quectel will reserve the right to take legal action.

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The information contained here is proprietary technical information of Quectel wireless solutions co., ltd.

Transmitting, reproducing, disseminating and editing this document as well as using the content without

permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in

the event of a patent grant or registration of a utility model or design.

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About the Document

Version

Date

Author

Description

2020-09-30

Clifton HE/

Ellison WANG/

Randy LI

Creation of the document

1.0.0

2020-11-20

Clifton HE/

Ellison WANG/

Randy LI

Preliminary

Revision History

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Contents

About the Document.................................................................................................................................................3

Contents....................................................................................................................................................................... 4

Table Index.................................................................................................................................................................. 6

Figure Index.................................................................................................................................................................7

1 Introduction......................................................................................................................................................... 8

1.1. Safety Information....................................................................................................................................9

2 Product Concept..............................................................................................................................................10

2.1. General Description...............................................................................................................................10

2.2. Key Features.......................................................................................................................................... 11

2.3. Functional Diagram............................................................................................................................... 12

2.4. Evaluation Board....................................................................................................................................13

3 Application Interfaces.................................................................................................................................... 14

3.1. Pin Assignment...................................................................................................................................... 15

3.2. Pin Description.......................................................................................................................................16

3.3. Operating Modes................................................................................................................................... 20

3.4. Power Saving......................................................................................................................................... 21

3.4.1. Light Sleep..................................................................................................................................21

3.4.2. Deep Sleep.................................................................................................................................21

3.5. Power Supply......................................................................................................................................... 22

3.5.1. Power Supply Pins....................................................................................................................22

3.5.2. Reference Design for Power Supply......................................................................................23

3.5.3. Power Supply Voltage Detection*.......................................................................................... 23

3.6. Power-up/Power-down Scenarios...................................................................................................... 24

3.6.1. Power-up.................................................................................................................................... 24

3.6.2. Power-down............................................................................................................................... 25

3.6.3. Reset........................................................................................................................................... 25

3.6.4. Download....................................................................................................................................26

3.7. UART Interfaces.................................................................................................................................... 27

3.7.1. Main UART Port........................................................................................................................ 28

3.7.2. Debug UART Port..................................................................................................................... 28

3.7.3. UART Application......................................................................................................................29

3.8. (U)SIM Interface.....................................................................................................................................31

3.9. ADC Interface*....................................................................................................................................... 33

3.10. RI Interface*............................................................................................................................................33

3.11. NETLIGHT Interface*............................................................................................................................34

4 Antenna Interface............................................................................................................................................ 36

4.1. Pin Definition.......................................................................................................................................... 36

4.2. Operating Frequencies......................................................................................................................... 36

4.3. RF Antenna Reference Design........................................................................................................... 37

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4.4. Reference Design of RF Layout..........................................................................................................38

4.5. Antenna Requirements.........................................................................................................................40

4.6. RF Output Power...................................................................................................................................41

4.7. RF Receiving Sensitivity.......................................................................................................................42

4.8. Recommended RF Connector for Antenna Installation.................................................................. 43

5 Reliability and Electrical Characteristics..................................................................................................45

5.1. Operating and Storage Temperatures............................................................................................... 45

5.2. Current Consumption............................................................................................................................46

5.3. Electrostatic Discharge.........................................................................................................................48

6 Mechanical Features.......................................................................................................................................49

6.1. Mechanical Dimensions........................................................................................................................49

6.2. Recommended Footprint......................................................................................................................51

6.3. Top and Bottom Views..........................................................................................................................52

7 Storage, Manufacturing and Packaging....................................................................................................53

7.1. Storage.................................................................................................................................................... 53

7.2. Manufacturing and Soldering...............................................................................................................54

7.3. Tape and Reel Packaging....................................................................................................................55

8 Appendix A References.................................................................................................................................57

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Table Index

Table 1: Frequency Bands of BC660K-GL............................................................................................................10

Table 2: BC660K-GL Key Features........................................................................................................................11

Table 3: I/O Parameters Definition......................................................................................................................... 16

Table 4: Pin Description........................................................................................................................................... 16

Table 5: AP Operating Modes................................................................................................................................. 20

Table 6: Modem Operating Modes.........................................................................................................................20

Table 7: Module Operating Modes......................................................................................................................... 20

Table 8: Power Supply Pins.....................................................................................................................................23

Table 9: Reset Pin Definition................................................................................................................................... 25

Table 10: Pin Definition of UART Interfaces......................................................................................................... 27

Table 11: Pin Definition of (U)SIM Interface......................................................................................................... 31

Table 12: Pin Definition of ADC Interface..............................................................................................................33

Table 13: RI Signal Status....................................................................................................................................... 33

Table 14: Pin Definition of NB-IoT Antenna Interface.........................................................................................36

Table 15: Module Operating Frequencies.............................................................................................................36

Table 16: Antenna Cable Insertion Loss Requirements.....................................................................................40

Table 17: Required Antenna Parameters..............................................................................................................40

Table 18: RF Conducted Output Power................................................................................................................ 41

Table 19: Receiving Sensitivity (with RF Retransmissions)...............................................................................42

Table 20: Operation and Storage Temperatures................................................................................................. 45

Table 21: Module Current Consumption (3.3 V VBAT Power Supply).............................................................46

Table 22: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)..................................... 48

Table 23: Recommended Thermal Profile Parameters...................................................................................... 55

Table 24: Related Documents.................................................................................................................................57

Table 25: Terms and Abbreviations....................................................................................................................... 57

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Figure Index

Figure 1: Functional Diagram.................................................................................................................................. 13

Figure 2: Pin Assignment......................................................................................................................................... 15

Figure 3: Module Power Consumption in Different Modes (Modem)............................................................... 21

Figure 4: Timing of Waking up Module from PSM............................................................................................... 22

Figure 5: Reference Circuit for Power Supply...................................................................................................... 23

Figure 6: Power-up Timing.......................................................................................................................................24

Figure 7: Power-down Timing..................................................................................................................................25

Figure 8: Reference Circuit of RESET_N by Using Driving Circuit...................................................................25

Figure 9: Reference Circuit of RESET_N by Using Button................................................................................ 26

Figure 10: Reference Circuit of BOOT by Using Button.....................................................................................27

Figure 11: Reference Design for Main UART Port.............................................................................................. 28

Figure 12: Reference Design of Debug UART Port............................................................................................ 28

Figure 13: Reference Circuit Design of UART..................................................................................................... 29

Figure 14: Sketch Map for RS-232 Interface Match............................................................................................30

Figure 15: Reference Circuit with Transistor Circuit............................................................................................31

Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector..............................32

Figure 17: RI Behaviour When a URC is Received.............................................................................................34

Figure 18: Reference Design of NETLIGHT.........................................................................................................35

Figure 19: Reference Design of NB-IoT Antenna Interface............................................................................... 38

Figure 20: Microstrip Design on a 2-layer PCB....................................................................................................38

Figure 21: Coplanar Waveguide Design on a 2-layer PCB................................................................................39

Figure 22: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).......................39

Figure 23: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).......................39

Figure 24: Dimensions of the U.FL-R-SMT Connector (Unit: mm)...................................................................43

Figure 25: Mechanicals of U.FL-LP Connectors.................................................................................................. 43

Figure 26: Space Factor of Mated Connector (Unit: mm).................................................................................. 44

Figure 27: BC660K-GL Top and Side Dimensions (Unit: mm)..........................................................................49

Figure 28: Module Bottom Dimension (Bottom View).........................................................................................50

Figure 29: Recommended Footprint (Unit: mm)...................................................................................................51

Figure 30: Top View of the Module.........................................................................................................................52

Figure 31: Bottom View of the Module...................................................................................................................52

Figure 32: Recommended Reflow Soldering Thermal Profile........................................................................... 54

Figure 33: Tape Dimensions (Unit: mm)................................................................................................................56

Figure 34: Reel Dimensions (Unit: mm)................................................................................................................ 56

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1 Introduction

This document defines the BC660K-GL module and describes its air interfaces and hardware interface

which are connected with the customers’ applications.

This document helps customers quickly understand the interface specifications, electrical and mechanical

details, as well as other related information of the module. To facilitate application designs, it also

includes some reference designs for customers’ reference. The document, coupled with application notes

and user guides, makes it easy to design and set up mobile applications with BC660K-GL.

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Full attention must be paid to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation

of wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If there is an Airplane Mode, it should be enabled prior to

boarding an aircraft. Please consult the airline staff for more restrictions on the use

of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network

cannot be guaranteed to connect in all possible conditions (for example, with

unpaid bills or with an invalid (U)SIM card). When emergency help is needed in

such conditions, please remember using emergency call. In order to make or

receive a call, the cellular terminal or mobile must be switched on in a service area

with adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it

receives and transmits radio frequency signals. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as mobile phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

BC660K-GL Hardware Design

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal

should notify users and operating personnel of the following safety information by incorporating these

guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to

comply with these precautions.

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“*” means under development.

Mode

BC660K-GL

H-FDD

B1/B2/B3/B4/B5/B8/B12/B13/B14/B17/B18/B19/B20/B25/B28/B66/B70/B85

NOTE

BC660K-GL Hardware Design

2 Product Concept

2.1. General Description

BC660K-GL is a high-performance NB-IoT module with extremely low power consumption. It is designed

to communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP

Rel-13 and 3GPP Rel-14). BC660K-GL supports a broad range of frequency bands as listed below.

Table 1: Frequency Bands of BC660K-GL

BC660K-GL is an SMD type module with LCC and LGA package, and has an ultra-compact profile of

17.7 mm × 15.8 mm × 2.0 mm, which makes it easily embedded into size-constrained applications and

provide reliable connectivity with the applications.

BC660K-GL provides abundant external interfaces (UART, ADC, (U)SIM, etc) and protocol stacks

(UDP/TCP/LwM2M*/MQTT*, etc.), which provide great convenience for customers' applications.

Due to compact form factor, ultra-low power consumption and extended temperature range, BC660K-GL

is a best choice for a wide range of IoT applications, such as smart metering, bike sharing, smart

wearables, smart parking, smart city, home appliances, security and asset tracking, agricultural and

environmental monitoring, etc. It is able to provide a complete range of SMS* and data transmission

services to meet customers’ demands.

The module fully complies with the RoHS directive of the European Union.

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Feature

Details

Power Supply

 Supply voltage: 2.2–4.3 V

 Typical supply voltage: 3.3 V

Power Saving



Typical power consumption: 800 nA

Frequency Bands

LTE Cat NB2:

 B1/B2/B3/B4/B5/B8/B12/B13/B14/B17/B18/B19/B20/B25/B28/B66/B70/

B85

Transmitting Power



23 dBm ±2 dB

(U)SIM Interface



Support 1.8/3.0 V (U)SIM card

UART Interfaces

Main UART Port:

 Used for AT command communication and data transmission, the baud

rate is 115200 bps by default. For more details, see Chapter 3.7.1.

 Used for firmware upgrade, and in such case, the baud rate is 921600

bps by default.

Debug UART Port:

 Used for firmware debugging

 Default baud rate: 6 Mbps

Network Protocols



UDP/TCP/SNTP/LwM2M*/MQTT*/TLS*/DTLS*

SMS*Text/PDU Mode

Data Transmission

Features

 Single-tone (max): 25.5 kbps (DL)/16.7 kbps (UL)

 Multi-tone (max): 127 kbps (DL)/158.5 kbps (UL)

AT Commands

 3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel-13 and

3GPP Rel-14) and Quectel enhanced AT commands

Firmware Update



Upgrade firmware via main UART port



Upgrade firmware via DFOTA

Real Time Clock

 Supported

Physical Characteristics

 Size: (17.7 ±0.15) mm × (15.8 ±0.15) mm × (2.0 ±0.2) mm

 Weight: 1.0 ±0.2 g

Temperature Range

 Operating temperature range: -35 to +75 °C

 Extended temperature range: -40 to +85 °C

 Storage temperature range: -40 to +90 °C

2.2. Key Features

The following table describes the detailed features of BC660K-GL module.

Table 2: BC660K-GL Key Features

NB-IoT Module Series

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Within operating temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain

functions such as SMS* and data transmission, without any unrecoverable malfunction. Radio

spectrum and radio network will not be influenced, while one or more specifications, such as Pout,

may exceed the specified tolerances of 3GPP. When the temperature returns to the normal operation

temperature levels, the module will meet 3GPP specifications again.

3. "*" means under development.

Antenna Interface



50 Ω impedance control

RoHS

 All hardware components are fully compliant with EU RoHS directive

NOTES

BC660K-GL Hardware Design

2.3. Functional Diagram

The following figure shows a block diagram of BC660K-GL and illustrates the major functional parts.

 Radio frequency

 Baseband

 Power management

 Peripheral interfaces

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Figure 1: Functional Diagram

2.4. Evaluation Board

Quectel provides a complete set of development tools to facilitate the use and testing of BC660K-GL

module. The development tool kit includes the TE-B board, a USB cable, an antenna and other

peripherals. For more details, see document [1].

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"*" means under development.

NOTE

BC660K-GL Hardware Design

3 Application Interfaces

BC660K-GL is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent

chapters will provide detailed descriptions of the following functions/pins/interfaces:

Power Supply



PSM_EINT



RESET_N



BOOT



UART Interfaces



(U)SIM Interface



ADC Interface*



RI Interface*



NETLIGHT Interface*



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3.1. Pin Assignment

Keep all reserved and unused pins unconnected.

NOTE

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Figure 2: Pin Assignment

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3.2. Pin Description

Type

Description

Analog input

Analog output

Digital input

Digital output

Bidirectional

Power input

Power output

Power Supply

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

VBAT

42, 43

Power supply for

the module

Vmax = 4.3 V

Vmin = 2.2 V

Vnorm = 3.3 V

VDD_EXT

1.8/3.3 V output

for external

circuit

Vnorm = 1.8/3.3 V

No voltage output in

Deep Sleep/Light

Sleep mode.

It is intended to supply

power for the module’s

pull-up circuits, and is

not recommended to

be used as the power

supply for external

circuits.

GND

1, 27, 34, 36, 37, 40, 41, 56, 57, 58

Power Key Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

Table 3: I/O Parameters Definition

NB-IoT Module Series

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Table 4: Pin Description

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BOOT

Control module

enter download

mode

VILmax = 0.2 × VDD_EXT

VIHmin = 0.7 × VDD_EXT

Active low.

Reset Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

RESET_N

Reset the

module

VILmax = 0.38 V

VIHmin = 1.33 V

VIHmax = 3.6 V

Active low.

PSM_EINT Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

PSM_EINT

Dedicated

external interrupt

pin used to wake

up the module

from Deep

Sleep/Light

Sleep mode..

VILmax = 0.38 V

VIHmin = 1.33 V

VIHmax = 3.6 V

Active on falling

edge.

Network Status Indication*

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

NETLIGHT

Indicate the

module's

network activity

status

VOLmax = 0.15 × VDD_EXT

VOHmin = 0.8 × VDD_EXT

ADC Interface*

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

ADC0

General-purpose

analog to digital

converter

interface

Voltage range:

0–1.2 V

Main UART Port

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

MAIN_RXD

Main UART

receive

VILmax = 0.2×VDD_EXT

VIHmin = 0.7×VDD_EXT

MAIN_TXD

Main UART

transmit

VOLmax = 0.15 × VDD_EXT

VOHmin = 0.8 × VDD_EXT

VDD_EXT

power domain.

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Debug UART Port

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

DBG_RXD

Debug UART

receive

VILmax = 0.2 × VDD_EXT

VIHmin = 0.7 × VDD_EXT

VDD_EXT

power domain. DBG_TXD

Debug UART

transmit

VOLmax = 0.15×VDD_EXT

VOHmin = 0.8×VDD_EXT

Ringing Signal*

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

RI20DO

Ring indication

VOLmax = 0.15×VDD_EXT

VOHmin = 0.8×VDD_EXT

VDD_EXT

power domain.

(U)SIM Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

(U)SIM_VDD

(U)SIM card

power supply

Vnorm = 1.8/3.0 V

(U)SIM_RST

(U)SIM card

reset

VOLmax = 0.15 × (U)SIM_VDD

VOHmin = 0.8 × (U)SIM_VDD

(U)SIM_DAT

(U)SIM card

data

VILmax = 0.2 × (U)SIM_VDD VIHmin = 0.7 × (U)SIM_VDD VOLmax = 0.15 × (U)SIM_VDD VOHmin = 0.8 ×(U)SIM_VDD

(U)SIM_CLK

(U)SIM card

clock

VOLmax = 0.15 × (U)SIM_VDD

VOHmin = 0.8 × (U)SIM_VDD

(U)SIM_GND

Specified

ground for

(U)SIM card

Antenna Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

ANT_RF

RF antenna

interface

50 Ω

characteristic

impedance

GPIO Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

GPIO1

General-purpose

input/output

VILmax = 0.2×VDD_EXT

VIHmin = 0.7×VDD_EXT

VOLmax = 0.15×VDD_EXT

VOHmin = 0.8 × VDD_EXT

VDD_EXT

power domain.

GPIO2

General-purpose

input/output

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1. Keep all reserved and unused pins unconnected.

2. When VIO_SEL is grounded and VBAT ˂ 3.3 V, VDD_EXT = VBAT;

When VIO_SEL is grounded and VBAT ≥ 3.3 V, VDD_EXT = 3.3 V;

When VIO_SEL is floating, VDD_EXT = 1.8 V.

3. “*” means under development.

If unused, keep

these pins open.

GPIO3

General-purpose

input/output

GPIO4

General-purpose

input/output

GRFC Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

GRFC1

Generic RF

controller

1.8 V power

domain.

If unused, keep

these pins open.

GRFC2

Generic RF

controller

Other Interface Pin

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

VIO_SEL

IO Voltage

selection

Floating: 1.8 V

0: 3.3 V

Control

VDD_EXT

voltage select

1.8 V or 3.3 V

Reserved Pins

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

RESERVED

2, 8, 21–23, 25, 26, 28–33, 44–51, 53

Keep these pins

open.

NOTES

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Mode

Description

Normal

In normal mode, the AP handles tasks, such as AT command communication.

Idle

When all tasks are suspended, the AP will enter idle mode.

Mode

Description

Connected

The network is connected and the module supports data transmission. In such a case,

the modem can switch to DRX/eDRX mode.

DRX/eDRX

The modem is in idle mode, and downlink data can be received during PTW only. In

such a case, the modem can switch to PSM or connected mode.

PSM

In power saving mode, the modem is disconnected from the network and cannot

receive any downlink data. In such a case, the modem can switch to eDRX/DRX.

Mode

Description

Active

When the AP is in normal mode or the modem is in connected mode, the module will be

active and supports all services and functions.

The current consumption in active mode is higher than that in sleep modes.

Light Sleep

Generally, when the AP is in idle mode and the modem is in DRX/eDRX mode, the

module will enter Light Sleep mode. In such a case, the AP tasks will be suspended and

the modem will be able to receive downlink data during PTW only.

In Light Sleep mode, the current consumption of the module is reduced greatly.

Deep Sleep

When the AP is in idle mode and the modem is idle or inactive, the module will enter

deep sleep mode in which the CPU is powered off and only the 32 kHz RTC clock is

working.

In deep sleep mode, the current consumption will be reduced to the minimum (typical

value: 800 nA).

3.3. Operating Modes

The following table describes the three working modes of the module briefly.

Table 5: AP Operating Modes

NB-IoT Module Series

Table 6: Modem Operating Modes

Table 7: Module Operating Modes

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3.4. Power Saving

Upon system requirement, there are several ways to drive the module to enter low current consumption

status.

3.4.1. Light Sleep

In Light Sleep mode, the serial port does not work, and the module can be woken up through the falling

edge of PSM_EINT.

In this mode, the UART port is inactive and the module can be awakened through the main UART port.

3.4.2. Deep Sleep

The module consumes extremely low current in Deep Sleep mode (typical value: 800 nA). The main

purpose of Deep Sleep is to reduce the power consumption of the module and prolong the power supply

time of the battery.

In Deep Sleep mode, the serial port does not work. The following figure shows the power consumption

diagram of the module in different modes.

Figure 3: Module Power Consumption in Different Modes (Modem)

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BC660K-GL Hardware Design

When the modem remains in PSM and the AP is in idle mode, the module will enter deep sleep mode.

The procedure of the modem entering PSM is as follows:

The modem requests to enable PSM in ATTACH REQUEST or TAU REQUEST message during

ATTACH/TAU (Tracking Area Update) procedure. Then the network accepts the request and provides an

active time value (T3324) to the modem and the mobile reachable timer starts. When the T3324 timer

expires, the modem enters PSM for the duration of T3412 (periodic TAU timer). Please note that the

module cannot request entering PSM when it is establishing an emergency attachment or initializing the

PDN (Public Data Network) connection

When the module is in deep sleep mode, it will be woken up in the following cases:

After the T3412 timer expires, the module will exit deep sleep automatically.



Send an AT command to the module (this AT command will be lost), pull down the MAIN_RXD, and



in falling edge, the module will be woken up from deep sleep.

Pulling down PSM_EINT (falling edge) will wake up the module from deep sleep.



The timing of waking up the module from PSM is illustrated below.

Figure 4: Timing of Waking up Module from PSM

3.5. Power Supply

3.5.1. Power Supply Pins

The module provides two VBAT pins for connection with an external power supply. The table below

describes the module's VBAT and ground pins.

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NB-IoT Module Series

Pin Name

Pin No.

Description

Min.

Typ.

Max.

Unit

VBAT

42, 43

Power supply for the

module

2.2

3.3

4.3

GND

1, 27, 34, 36,

37, 40, 41, 56,

57, 58

GND

BC660K-GL Hardware Design

Table 8: Power Supply Pins

3.5.2. Reference Design for Power Supply

Power design for a module is critical to its performance. It is recommended to use a low quiescent current LDO with output current capacity of 0.5 A as the power supply for BC660K-GL.

(Li-SOCl2) batteries and Lithium manganese oxide (LiMn2O4) batteries

supply. The supply voltage of the module ranges from 2.2 V to 4.3 V. When the module is working, ensure

its input voltage will never drop below 2.2 V; otherwise the module will be abnormal.

can also be used as the power

Lithium-thionyl chloride

For better power performance, it is recommended to place a 100 μF tantalum capacitor with low ESR

(ESR = 0.7 Ω) and three ceramic capacitors (100 nF, 100 pF and 22 pF) near the VBAT pins. Also, it is

recommended to add a TVS diode on the VBAT trace (near VBAT pins) to improve surge voltage

withstand capability. In principle, the longer the VBAT trace is, the wider it should be. A reference circuit

for power supply is illustrated in the following figure.

3.5.3. Power Supply Voltage Detection*

You can use AT+CBC to monitor and query the current VBAT voltage. The unit of the voltage value is

millivolt. For detailed information about the command, see document [2].

BC660K-GL_Hardware_Design

Figure 5: Reference Circuit for Power Supply

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NB-IoT Module Series

“*” means under development.

1. After the VBAT is powered down, its voltage must be lower than 0.7 V. The specific discharge time

needs to be evaluated based on the actual circuit test, and enough margin is left to avoid abnormal

startup when the it is powered on again.

2. The power-up time of VBAT must be within 10 ms.

3. It is recommended that the MCU retain the RESET_N control pin. When the abnormal power-on

sequence causes the module to start abnormally, the RESET_N control pin can control the module to

reset to exit the abnormal state.

4. After VBAT is powered on, RESET_N and BOOT automatically rise to high level due to internal

pull-ups.

NOTES

NOTE

BC660K-GL Hardware Design

3.6. Power-up/Power-down Scenarios

3.6.1. Power-up

After the module VBAT is powered on, keep the RESET_N and BOOT inputs not being pulled down, and

the module can turn on automatically. The power-up timing is illustrated in the following figure.

Figure 6: Power-up Timing

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3.6.2. Power-down

Pin Name

Pin No.

Description

Reset Pull-down Time

RESET_N

Reset the module.

Active low.

≥

50 ms

The module can be shut down through disconnecting VBAT power supply.

Figure 7: Power-down Timing

NB-IoT Module Series

BC660K-GL Hardware Design

3.6.3. Reset

Driving RESET_N low for at least 50 ms will reset the module.

Table 9: Reset Pin Definition

The recommended circuits of resetting the module are shown below. An open drain/collector driver or

button can be used to control the RESET_N pin.

BC660K-GL_Hardware_Design

Figure 8: Reference Circuit of RESET_N by Using Driving Circuit

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NB-IoT Module Series

1. When the high level output of RESET_CONTROL is more than 1.7 V and less than 3.6 V, and the low

level output is less than 0.35 V, it is recommended to use the direct connection method to control the

RESET_N pin of the module. In other cases, it must be controlled by an open collector drive circuit.

2. It is recommended to reserve a 100 nF capacitor position, which is not mounted by default.

NOTES

BC660K-GL Hardware Design

Figure 9: Reference Circuit of RESET_N by Using Button

3.6.4. Download

In the process of system reset or power-on, keep the BOOT pin input low and the module will enter the

download mode.

In download mode, the firmware can be downloaded through the main serial port. After the download is

complete, the module needs to be reset to exit the download mode.

An open drain/collector driver or button can be used to control the BOOT pin.

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NB-IoT Module Series

If the BOOT pin is connected to a filter capacitor in parallel, the capacitance of the capacitor cannot be

higher than 33 pF.

Interface

Pin Name

Pin No.

Description

Main UART Port MAIN_TXD

Main UART transmit

MAIN_RXD

Main UART receive

Debug UART Port DBG_RXD

Debug UART receive

DBG_TXD

Debug UART transmit

Ring Indication

RI*

Ring indication (when there is a SMS or a URC

output, the module will inform DTE with the RI pin)

NOTE

BC660K-GL Hardware Design

Figure 10: Reference Circuit of BOOT by Using Button

3.7. UART Interfaces

The module provides two UART ports: main UART port and debug UART port. The module is designed

as DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment)

connection.

Table 10: Pin Definition of UART Interfaces

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3.7.1. Main UART Port

The main UART port supports AT command communication, data transmission and firmware upgrade.

 Default baud rate: 115200 bps

 Fixed baud rates: 2400 bps, 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps,

230400 bps, 460800 bps

When the port is used for firmware upgrade, the baud rate is 921600 bps by default.

When the module enters Deep Sleep/Light Sleep mode, it can wake up the module by sending AT

commands through the main serial port. It is generally recommended to send the command AT

continuously until OK is returned before sending AT commands to other services.

The figure below shows the connection between DCE and DTE.

Figure 11: Reference Design for Main UART Port

3.7.2. Debug UART Port

Through debug tools, the debug UART port can be used to output logs for firmware debugging. Its baud

rate is 6 Mbps by default. The following is a reference design of debug UART port.

Figure 12: Reference Design of Debug UART Port

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3.7.3. UART Application

The serial port voltage domain of this module is optional. Customers can select the appropriate voltage

domain through VIO_SEL according to the actual situation. When VIO_SEL is floating, the VDD_EXT

voltage domain is 1.8 V; when VIO_SEL is grounded, the VDD_EXT voltage domain is 3.3 V.

If the voltage domain of the customer application system is 1.8 V, VIO_SEL can be floating; If the voltage

domain of the customer application system is 3.3 V, VIO_SEL can be grounded.

The following figure shows the reference circuit design:

Figure 13: Reference Circuit Design of UART

The following circuit shows a reference design for the communication between the module and a PC with

standard RS-232 interface. Make sure to select appropriate voltage domain through VIO_SEL according

to the actual situation.

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NB-IoT Module Series

1. If the voltage domain of your application system is 1.8 V, keep the R1 marked in red not mounted; If

the voltage domain of your application system is 3.3 V, keep the R1 marked in red mounted.

2. “ ” represents the test points of UART interfaces. It is also recommended to reserve the test points of VBAT, BOOT and RESET_N, for convenient firmware upgrade and debugging when necessary.

3. VDD_EXT cannot pull up the module MAIN_RXD directly. If VDD_EXT need pull up the module

MAIN_RXD, you need to connect a Schottky diode in series first, and then pull up the module

MAIN_RXD through a 4.7-20 kΩ resistor. For more details, see document [3].

4. When VIO_SEL is grounded and VBAT ˂ 3.3 V, VDD_EXT = VBAT;

When VIO_SEL is grounded and VBAT ≥ 3.3 V, VDD_EXT = 3.3 V;

When VIO_SEL is floating, VDD_EXT = 1.8 V.

NOTES

BC660K-GL Hardware Design

Figure 14: Sketch Map for RS-232 Interface Match

Please visit vendors’ websites to select a suitable RS-232 transceiver, such as: http://www.exar.com and

http://www.maximintegrated.com.

When the serial port voltage is neither 1.8 V nor 3.3 V, it is recommended to use a transistor level

conversion circuit. The circuit design of dotted line section can refer to the design of solid line section, in

terms of both module input and output circuit designs, but please pay attention to the direction of

connection.

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BC660K-GL Hardware Design

1. VDD_EXT cannot pull up MAIN_RXD directly. Due to the anti-backflow design of the MAIN_RXD pin,

MAIN_RXD pin can be directly connected to the TXD of DTE in the 1.8–3.3 V voltage domain. If the

Deep Sleep/Light Sleep mode wake-up function of the MAIN_RXD is enabled, it is recommended

that MAIN_RXD does not use a level conversion circuit to avoid abnormal wake-up.

2. If you choose the transistor conversion circuit, don’t mount the R1 marked in red.

3. If VDD_EXT need pull up the module MAIN_RXD, you need to connect a Schottky diode in series

first, and then pull up the module MAIN_RXD through a 4.7-20 kΩ resistor. For more details, see

document [3].

4. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps.

Pin Name

No.

Description

Comment

(U)SIM_VDD

(U)SIM card power supply

When 3.0 V ≤ VBAT ≤ 4.3 V, support

1.8/3.0 V (U)SIM card;

When 2.2 V ≤ VBAT < 3 V, only support

1.8 V (U)SIM card;

Maximum supply current: about 80 mA.

NOTES

Figure 15: Reference Circuit with Transistor Circuit

NB-IoT Module Series

3.8. (U)SIM Interface

The (U)SIM card is powered by an internal regulator in the module. Both 1.8 V and 3.0 V (U)SIM cards

are supported.

Table 11: Pin Definition of (U)SIM Interface

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NB-IoT Module Series

(U)SIM_CLK

(U)SIM card clock

(U)SIM_DATA

(U)SIM card data

(U)SIM_RST

(U)SIM card reset

(U)SIM_GND

Specified ground for (U)SIM card

BC660K-GL Hardware Design

A reference circuit design for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated below.

Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector

To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in

(U)SIM circuit design:

Keep the placement of (U)SIM card connector as close to the module as possible. Keep the trace



length as less than 200 mm as possible.

Keep (U)SIM card signals away from RF and VBAT traces.



Assure the trace between the ground of the module and that of (U)SIM card connector is short and



wide. Keep the trace width of the ground no less than 0.5 mm to maintain the same electric potential.

The decoupling capacitor between (U)SIM_VDD and GND should be not more than 1 μF and be

placed close to the (U)SIM card connector.

To avoid cross-talk between (U)SIM_DATA and (U)SIM_CLK, keep them away from each other and



shield them separately with the surrounded ground.

In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic



capacitance should be not more than 50 pF. The ESD protection device should be placed as close to

(U)SIM card connector as possible, and ensure the (U)SIM card signal lines go through the ESD

protection device first from (U)SIM card connector and then to the module. The 22 Ω resistors should

be connected in series between the module and the (U)SIM card connector to suppress EMI spurious

transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be

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NB-IoT Module Series

It is necessary (U)SIM_DATA must add a 10 kΩ pull-up resistor to (U)SIM_VDD to improve

anti-interference ability.

1. 320 kΩ pull-down resistor is integrated inside the ADC pin. This resistor needs to be considered

when calculating the resistor divider relationship.

2. “*” means under development.

Pin Name

Pin No.

Description

Sample Range

ADC0

Analog to digital converter interface

0–1.2 V

Module Status

RI Signal Level

Standby

High pulse

URC

When a URC is received, RI outputs 120 ms low pulse and starts data output.

NOTES

NOTE

BC660K-GL Hardware Design

close to the (U)SIM card connector.

The pull-up resistor on the SIM_DATA line can improve anti-jamming capability and should be placed



close to the (U)SIM card connector.

3.9. ADC Interface*

The module provides a 12-bit ADC input channel to read the voltage value.

Table 12: Pin Definition of ADC Interface

3.10. RI Interface*

When there is a message received or a URC output, the module will notify DTE through the RI interface.

Table 13: RI Signal Status

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“*” means under development.

NOTE

Figure 17: RI Behaviour When a URC is Received

NB-IoT Module Series

3.11. NETLIGHT Interface*

NETLIGHT can be used to indicate the network status of the module. The following table illustrates the

module status indicated by NETLIGHT.

A reference circuit is shown as below.

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“*” means under development.

NOTE

Figure 18: Reference Design of NETLIGHT

NB-IoT Module Series

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Pin Name

Pin No.

Description

ANT_RF

RF antenna interface

GND

34, 36, 37

Ground

Frequency Band

Receiving Frequency

Transmitting Frequency

2110–2170 MHz

1920–1980 MHz

1930–1990 MHz

1850–1910 MHz

1805–1880 MHz

1710–1785 MHz

2110–2155 MHz

1710–1755 MHz

869–894 MHz

824–849 MHz

925–960 MHz

880–915 MHz

B12

729–746 MHz

699–716 MHz

B13

746–756 MHz

777–787 MHz

4 Antenna Interface

The pin 35 is the RF antenna pad. The antenna port has an impedance of 50 Ω.

4.1. Pin Definition

Table 14: Pin Definition of NB-IoT Antenna Interface

NB-IoT Module Series

4.2. Operating Frequencies

Table 15: Module Operating Frequencies

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NB-IoT Module Series

B14

758–768 MHz

788–798 MHz

B17

734–746 MHz

704–716 MHz

B18

860–875 MHz

815–830 MHz

B19

875–890 MHz

830–845 MHz

B20

791–821 MHz

832–862 MHz

B25

1930–1995 MHz

1850–1915 MHz

B28

758–803 MHz

703–748 MHz

B66

2110–2180 MHz

1710–1780 MHz

B70

1995–2020 MHz

1695–1710 MHz

B85

728–746 MHz

698–716 MHz

BC660K-GL Hardware Design

4.3. RF Antenna Reference Design

BC660K-GL provides an RF antenna pin for external NB-IoT antenna connection.

 The RF trace on host PCB connected to the module’s RF antenna pad should be coplanar

waveguide or microstrip, whose characteristic impedance should be close to 50 Ω.

 The module comes with ground pads which are next to the antenna pad to give a better grounding.

 In order to achieve better RF performance, it is recommended to reserve a π type matching circuit

and place the π-type matching components (R1/C1/C2) as close to the antenna as possible. By

default, the capacitors (C1/C2) are not mounted and a 0 Ω resistor is mounted on R1.

A reference design of the RF interface is shown as below.

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Figure 19: Reference Design of NB-IoT Antenna Interface

4.4. Reference Design of RF Layout

NB-IoT Module Series

BC660K-GL Hardware Design

For users’ PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

height from the reference ground to the signal layer (H), and the clearance between RF traces and

grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic

impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB

structures.

Figure 20: Microstrip Design on a 2-layer PCB

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BC660K-GL Hardware Design

Figure 21: Coplanar Waveguide Design on a 2-layer PCB

Figure 22: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 23: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

To ensure RF performance and reliability, the following principles should be complied with in RF layout

design:

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NB-IoT Module Series

Band

Requirements

LTE B5/B8/B12/B13/B14/B17/B18/B19/B20/B28/B85

Cable insertion loss: < 1 dB

LTE B1/B2/B3/B4/B25/B66/B70

Cable insertion loss: < 1.5 dB

Parameters

Requirements

Frequency Range

698–2200 MHz

VSWR

≤ 2

Efficiency

> 30 %

Max Input Power (W)

Input Impedance (Ω)

BC660K-GL Hardware Design

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to



50 Ω.

The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully



connected to ground.

The distance between the RF pins and the RF connector should be as short as possible, and all the



right-angle traces should be changed to curved ones.

There should be clearance under the signal pin of the antenna connector or solder joint.



The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around



RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times as wide as RF signal traces (2 × W).

For more details, see document [4].

4.5. Antenna Requirements

To minimize the loss on RF trace and RF cable, pay attention to the antenna design. The following tables

show the requirements on NB-IoT antenna.

Table 16: Antenna Cable Insertion Loss Requirements

Table 17: Required Antenna Parameters

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4.6. RF Output Power

The design conforms to the NB-IoT radio protocols in 3GPP Rel.13.

Frequency Band

Max.

Min.

23 dBm ±2 dB

< -39 dBm

23 dBm ±2 dB

< -39 dBm

23 dBm ±2 dB

< -39 dBm

23 dBm ±2 dB

< -39 dBm

23 dBm ±2 dB

< -39 dBm

23 dBm ±2 dB

< -39 dBm

B12

23 dBm ±2 dB

< -39 dBm

B13

23 dBm ±2 dB

< -39 dBm

B14

23 dBm ±2 dB

< -39 dBm

B17

23 dBm ±2 dB

< -39 dBm

B18

23 dBm ±2 dB

< -39 dBm

B19

23 dBm ±2 dB

< -39 dBm

B20

23 dBm ±2 dB

< -39 dBm

B25

23 dBm ±2 dB

< -39 dBm

B28

23 dBm ±2 dB

< -39 dBm

B66

23 dBm ±2 dB

< -39 dBm

B70

23 dBm ±2 dB

< -39 dBm

B85

23 dBm ±2 dB

< -39 dBm

NOTE

Table 18: RF Conducted Output Power

NB-IoT Module Series

BC660K-GL Hardware Design

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4.7. RF Receiving Sensitivity

Frequency Band

Receiving Sensitivity

≤ -129 dBm

B12

≤ -129 dBm

B13

≤ -129 dBm

B14

≤ -129 dBm

B17

≤ -129 dBm

B18

≤ -129 dBm

B19

≤ -129 dBm

B20

≤ -129 dBm

B25

≤ -129 dBm

B28

≤ -129 dBm

B66

≤ -129 dBm

B70

≤ -129 dBm

B85

≤ -129 dBm

Table 19: Receiving Sensitivity (with RF Retransmissions)

NB-IoT Module Series

BC660K-GL Hardware Design

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BC660K-GL Hardware Design

4.8. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector

provided by HIROSE.

Figure 24: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

Figure 25: Mechanicals of U.FL-LP Connectors

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The following figure describes the space factor of mated connector.

NB-IoT Module Series

BC660K-GL Hardware Design

Figure 26: Space Factor of Mated Connector (Unit: mm)

For more details, please visit http://www.hirose.com.

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BC660K-GL Hardware Design

Within operating temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain

functions such as SMS* and data transmission, without any unrecoverable malfunction. Radio

spectrum and radio network will not be influenced, while one or more specifications, such as Pout,

may exceed the specified tolerances of 3GPP. When the temperature returns to the normal operation

temperature levels, the module will meet 3GPP specifications again.

3. “*” means under development.

Parameter

Min.

Typ.

Max.

Unit

Operating Temperature Range

-35

+25

+75

ºC

Extended Temperature Range

-40

+85

ºC

Storage Temperature Range

-40

+90

ºC

NOTES

5 Reliability and Electrical

Characteristics

5.1. Operating and Storage Temperatures

The following table lists the operating and storage temperatures of the module.

NB-IoT Module Series

Table 20: Operation and Storage Temperatures

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NB-IoT Module Series

Deep Sleep

AP Mode

Modem Mode

Min.

Typ.

Max.

Unit

Idle

PSM

0.8/μA

Light Sleep

AP Mode

Modem Mode

Min.

Typ.

Max.

Unit

Idle

eDRX = 40.96 s, PTW = 10.24 s, ECL = 0

/38/

µA

@ DRX = 1.28 s

220/μA

@ DRX = 2.56 s

110/μA

Active

AP Mode

Modem Mode

Min.

Typ.

Max.

Unit

Normal

Single-tone

(15 kHz subcarrier

spacing)

B1 @ 23dBm

111

300

B2 @ 23 dBm

108

305

B3 @ 23 dBm

100

280

B4 @ 23 dBm

100

277

B5 @ 23 dBm

/98270

B8 @ 23 dBm

105

299

B12 @ 23 dBm

120

332

B13 @ 23 dBm

100

283

B14 @ 23 dBm

100

282

B17 @ 23 dBm

115

325

B18 @ 23 dBm

/94265

BC660K-GL Hardware Design

5.2. Current Consumption

The table below lists the current consumption of BC660K-GL under different states.

Table 21: Module Current Consumption (3.3 V VBAT Power Supply)

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B19 @ 23 dBm

/95270

B20 @ 23 dBm

/98272

B25 @ 23 dBm

108

301

B28 @ 23 dBm

109

310

B66 @ 23 dBm

101

280

B70 @ 23 dBm

104

276

B85 @ 23 dBm

115

329

Single-tone

(3.75 kHz subcarrier

spacing)

B1 @ 23 dBm

240

311

B2 @ 23 dBm

230

296

B3 @ 23 dBm

213

274

B4 @ 23 dBm

212

273

B5 @ 23 dBm

202

263

B8 @ 23 dBm

221

298

B12 @ 23 dBm

259

328

B13 @ 23 dBm

218

279

B14 @ 23 dBm

217

278

B17 @ 23 dBm

252

325

B18 @ 23 dBm

199

258

B19 @ 23 dBm

201

260

B20 @ 23 dBm

207

267

B25 @ 23 dBm

232

297

B28 @ 23 dBm

240

306

B66 @ 23 dBm

213

274

B70 @ 23 dBm

216

273

B85 @ 23 dBm

252

323

BC660K-GL Hardware Design

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NB-IoT Module Series

Power consumption under instrument test condition.

The “maximum value” in “Active” mode refers to the maximum pulse current during RF emission.

Tested Interfaces

Contact Discharge

Air Discharge

Unit

VBAT, GND

±5

±10

Antenna interface

±5

±10

Other interfaces

±0.5

±1

NOTES

BC660K-GL Hardware Design

5.3. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module’s electrostatic discharge characteristics.

Table 22: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)

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NB-IoT Module Series

17.7 ±0.15

15.8 ±0.15

14.15 ±0.15

16.05 ±0.15

2.0 ±0.2

0.6 ±0.1

0.7

Pin 1

BC660K-GL Hardware Design

6 Mechanical Features

This chapter describes the mechanical dimensions of the module. All dimensions are measured in

millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified.

6.1. Mechanical Dimensions

BC660K-GL_Hardware_Design

Figure 27: BC660K-GL Top and Side Dimensions (Unit: mm)

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NB-IoT Module Series

3.7

0.7

1.1

17.7

15.8

4.4

1.5

3.5

1.0

4.35

4.3

1.8

1.9

2.25

4.4

±0.15

0.7

The package warpage level of the module conforms to JEITA ED-7306 standard.

Pin 1

NOTE

BC660K-GL Hardware Design

Figure 28: Module Bottom Dimension (Bottom View)

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6.2. Recommended Footprint

0.70

0.35

1.10

4.35

1.00

17.70±0.15 20.00±0.15

15.80±0.15

18.10±0.15

1.00

2.50

0.35

4.30

1.80

0.35

6.10

6.15

For easy maintenance of the module, it is recommended to keep about 3 mm between the module and

other components on the motherboard.

NOTE

Pin 1

NB-IoT Module Series

BC660K-GL Hardware Design

Figure 29: Recommended Footprint (Unit: mm)

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6.3. Top and Bottom Views

Images above are for illustration purpose only and may differ from the actual module. For authentic

appearance and label, please refer to the module received from Quectel.

NOTE

NB-IoT Module Series

BC660K-GL Hardware Design

Figure 30: Top View of the Module

Figure 31: Bottom View of the Module

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NB-IoT Module Series

BC660K-GL Hardware Design

7 Storage, Manufacturing and

Packaging

7.1. Storage

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage

requirements are shown below.

1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity

should be 35–60 %.

2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.

3. The floor life of the module is 168 hours1)in a plant where the temperature is 23 ±5 °C and relative

humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be

processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the

module should be stored in an environment where the relative humidity is less than 10 % (e.g. a

drying cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under

the following circumstances:

 The module is not stored in Recommended Storage Condition;

 Violation of the third requirement above occurs;

 Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

 Before module repairing.

5. If needed, the pre-baking should follow the requirements below:

 The module should be baked for 8 hours at 120 ±5 °C;

 All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be

put in a dry environment such as in a drying oven.

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1.1)This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033.

2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules

to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or

the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours

after the package is removed. And do not remove the packages of tremendous modules if they are

not ready for soldering.

3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before

the baking. If shorter baking time is desired, please refer to IPC/JEDEC J-STD-033 for baking

procedure.

7.2. Manufacturing and Soldering

NOTES

NB-IoT Module Series

BC660K-GL Hardware Design

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the

stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly

so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the

thickness of stencil for the module is recommended to be 0.15–0.18 mm. For more details, see

document [5].

It is suggested that the peak reflow temperature is 238–245 ºC, and the absolute maximum reflow

temperature is 245 ºC. To avoid damage to the module caused by repeated heating, it is strongly

recommended that the module should be mounted after reflow soldering for the other side of PCB has

been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and

related parameters are shown below.

BC660K-GL_Hardware_Design

Figure 32: Recommended Reflow Soldering Thermal Profile

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Table 23: Recommended Thermal Profile Parameters

1. During manufacturing and soldering, or any other processes that may contact the module directly,

NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,

isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.

2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12

hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly

identifiable and the QR code is still readable, although white rust may be found.

3. If a conformal coating is necessary for the module, do NOT use any coating material that may

chemically react with the PCB or shielding cover, and prevent the coating material from flowing into

the module.

Factor

Recommendation

Soak Zone

Max slope

1–3 °C/s

Soak time (between A and B: 150°C and 200°C)

70–120 s

Reflow Zone

Max slope

2–3 °C/s

Reflow time (D: over 220°C)

45–70 s

Max temperature

238 to 246 °C

Cooling down slope

-1.5 to -3 °C/s

Reflow Cycle

Max reflow cycle

NOTES

NB-IoT Module Series

BC660K-GL Hardware Design

7.3. Tape and Reel Packaging

The modules are stored in a vacuum-sealed bag which is ESD-proof. The bag should not be opened until

the devices are ready to be soldered onto the application.

The reel is 330 mm in diameter and each reel contains 250 modules.

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NB-IoT Module Series

BC660K-GL Hardware Design

Figure 33: Tape Dimensions (Unit: mm)

Figure 34: Reel Dimensions (Unit: mm)

BC660K-GL_Hardware_Design

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8 Appendix A References

Document Name

Description

[1]

Quectel_BC660K-GL-TE-B_User_Guide

BC660K-GL-TE-B User Guide

[2]

Quectel_BC660K-GL_AT_Commands_Manual

BC660K-GL AT Commands Manual

[3]

Quectel_BC660K-GL_Reference_Design

BC660K-GL Reference Design

[4]

Quectel_RF_Layout_Application_Note

RF Layout Application Note

[5]

Quectel_Module_Secondary_SMT_User_Guide

Module Secondary SMT User Guide

Abbreviation

Description

ADC

Analog-to-Digital Converter

DCE

Data Communications Equipment (typically module)

DRX

Discontinuous Reception

DTE

Data Terminal Equipment (typically computer, external controller)

DTLS

Datagram Transport Layer Security

eDRX

extended Discontinuous Reception

EMI

Electromagnetic Interference

ESD

Electrostatic Discharge

H-FDD

Half Frequency Division Duplexing

HTTP

Hyper Text Transfer Protocol

HTTPS

Hyper Text Transfer Protocol over Secure Socket Layer

Table 24: Related Documents

NB-IoT Module Series

BC660K-GL Hardware Design

Table 25: Terms and Abbreviations

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NB-IoT Module Series

I/O

Input/Output

kbps

Kilo Bits Per Second

LED

Light Emitting Diode

LTE

Long Term Evolution

LwM2M

Lightweight M2M

MQTT

Message Queuing Telemetry Transport

NB-IoT

arrow Band- Internet of Things

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PSM

Power Save Mode

PTW

Paging Time Window

Radio Frequency

RTC

Real Time Clock

RXD

Receive Data

SMS

Short Message Service

TCP

Transmission Control Protocol

Terminal Equipment

TLS

Transport Layer Security

TXD

Transmitting Data

UART

Universal Asynchronous Receiver & Transmitter

UDP

User Datagram Protocol

URC

Unsolicited Result Code

(U)SIM

Universal Subscriber Identification Module

VSWR

Voltage Standing Wave Ratio

Vmax

Maximum Voltage Value

BC660K-GL Hardware Design

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Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VInorm Absolute Normal Input Voltage Value

VImin Absolute Minimum Input Voltage Value

NB-IoT Module Series

BC660K-GL Hardware Design

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

Installation engineers need to be aware of the potential risk of the thermal effects of radio frequency energy and how to stay protected against undue risk. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter.

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OEM/Integrators Installation Manual

Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module

is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate

approval is required for all other operating configurations, including portable configurations with respect

to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host

manufacturer is responsible for additional testing to verify compliance as a composite system. When

testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show

compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The

modules should be transmitting and the evaluation should confirm that the module's intentional

emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must

verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart

B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note

notice that any deviation(s) from the defined parameters of the antenna trace, as described by the

instructions, require that the host product manufacturer must notify to Quectel that they wish to change

the antenna trace design. In this case, a Class II permissive change application is required to be filed by

the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a window

on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a

second label must be placed on the outside of the final device that contains the following text: “Contains

FCC ID: XMR2021BC660KGL” “Contains IC: 10224A-2021BC660GL”. when all FCC/IC compliance requirements are met.

The FCC ID/IC ID can be used only

Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna.

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC

ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible

for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed

Test Mode

Antenna Gain (dBi)

Test Mode

Antenna Gain (dBi)

NB-IoT Band 2

8.00

NB-IoT Band 14

5.00

NB-IoT Band 4*

8.00

NB-IoT Band 17

5.00

NB-IoT Band 5

5.00

NB-IoT Band 25

8.00

NB-IoT Band 12

5.00

NB-IoT Band 66*

8.00

NB-IoT Band 13

5.00

NB-IoT Band 85

5.00

Note: “*” means when using these max gain antenna, the host manufacturer should reduce the conducted power to meet the FCC maximum RF output power limit.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void

the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules

This module has been tested and found to comply with part 22, part 24, part 27, part 90 requirements for Modular Approval.

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules)

listed on the grant, and that the host product manufacturer is responsible for compliance to any other

FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the

grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

Industry Canada Statement

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20 cm between the radiator & your body

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2

conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et

2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront

pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation

with another transmitter), then the Canada authorization is no longer considered valid and the IC ID

cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada

n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces

circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such

that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2021BC660GL”.

Plaque signalétique du produit final

Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut

être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les

utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2021BC660GL ".

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la

façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.

Quectel BC660K-GL User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Table Index

Figure Index

1 Introduction

1.1. Safety Information

2 Product Concept

2.1. General Description

2.2. Key Features

2.3. Functional Diagram

2.4. Evaluation Board

3 Application Interfaces

3.1. Pin Assignment

3.2. Pin Description

3.3. Operating Modes

3.4. Power Saving

3.4.1. Light Sleep

3.4.2. Deep Sleep

3.5. Power Supply

3.5.1. Power Supply Pins

3.5.2. Reference Design for Power Supply

3.5.3. Power Supply Voltage Detection*

3.6. Power-up/Power-down Scenarios

3.6.1. Power-up

3.6.2. Power-down

3.6.3. Reset

3.6.4. Download

3.7. UART Interfaces

3.7.1. Main UART Port

3.7.2. Debug UART Port

3.7.3. UART Application

3.8. (U)SIM Interface

3.9. ADC Interface*

3.10. RI Interface*

3.11. NETLIGHT Interface*

4 Antenna Interface

4.1. Pin Definition

4.2. Operating Frequencies

4.3. RF Antenna Reference Design

4.4. Reference Design of RF Layout

4.5. Antenna Requirements

4.6. RF Output Power

4.7. RF Receiving Sensitivity

4.8. Recommended RF Connector for Antenna Installation

5.1. Operating and Storage Temperatures

5.2. Current Consumption

6 Mechanical Features

6.1. Mechanical Dimensions

6.2. Recommended Footprint

6.3. Top and Bottom Views

7.1. Storage

7.2. Manufacturing and Soldering

7.3. Tape and Reel Packaging

8 Appendix A References