Quectel BC660K-GL User Manual
BC660K-GL
Hardware Design
NB-IoT Module Series
Version: 1.0.0
Date: 2020-11-20
Status: Preliminary
www.quectel.com
NB-IoT Module Series
BC660K-GL Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance,
please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
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General Notes
Quectel offers the information as a service to its customers. The information provided is based upon
customers’ requirements. Quectel makes every effort to ensure the quality of the information it makes
available. Quectel does not make any warranty as to the information contained herein, and does not
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information. All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free from
errors, it is possible that these functions and features could contain errors, inaccuracies and omissions.
Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or
express, with respect to the use of features and functions under development. To the maximum extent
permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of
the functions and features under development, regardless of whether such loss or damage may have been
foreseeable.
Duty of Confidentiality
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Quectel will reserve the right to take legal action.
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Copyright
The information contained here is proprietary technical information of Quectel wireless solutions co., ltd.
Transmitting, reproducing, disseminating and editing this document as well as using the content without
permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in
the event of a patent grant or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.
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About the Document
Version
Date
Author
Description
-
2020-09-30
Clifton HE/
Ellison WANG/
Randy LI
Creation of the document
1.0.0
2020-11-20
Clifton HE/
Ellison WANG/
Randy LI
Preliminary
Revision History
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Contents
About the Document.................................................................................................................................................3
Contents....................................................................................................................................................................... 4
Table Index.................................................................................................................................................................. 6
Figure Index.................................................................................................................................................................7
1 Introduction......................................................................................................................................................... 8
1.1. Safety Information....................................................................................................................................9
2 Product Concept..............................................................................................................................................10
2.1. General Description...............................................................................................................................10
2.2. Key Features.......................................................................................................................................... 11
2.3. Functional Diagram............................................................................................................................... 12
2.4. Evaluation Board....................................................................................................................................13
3 Application Interfaces.................................................................................................................................... 14
3.1. Pin Assignment...................................................................................................................................... 15
3.2. Pin Description.......................................................................................................................................16
3.3. Operating Modes................................................................................................................................... 20
3.4. Power Saving......................................................................................................................................... 21
3.4.1. Light Sleep..................................................................................................................................21
3.4.2. Deep Sleep.................................................................................................................................21
3.5. Power Supply......................................................................................................................................... 22
3.5.1. Power Supply Pins....................................................................................................................22
3.5.2. Reference Design for Power Supply......................................................................................23
3.5.3. Power Supply Voltage Detection*.......................................................................................... 23
3.6. Power-up/Power-down Scenarios...................................................................................................... 24
3.6.1. Power-up.................................................................................................................................... 24
3.6.2. Power-down............................................................................................................................... 25
3.6.3. Reset........................................................................................................................................... 25
3.6.4. Download....................................................................................................................................26
3.7. UART Interfaces.................................................................................................................................... 27
3.7.1. Main UART Port........................................................................................................................ 28
3.7.2. Debug UART Port..................................................................................................................... 28
3.7.3. UART Application......................................................................................................................29
3.8. (U)SIM Interface.....................................................................................................................................31
3.9. ADC Interface*....................................................................................................................................... 33
3.10. RI Interface*............................................................................................................................................33
3.11. NETLIGHT Interface*............................................................................................................................34
4 Antenna Interface............................................................................................................................................ 36
4.1. Pin Definition.......................................................................................................................................... 36
4.2. Operating Frequencies......................................................................................................................... 36
4.3. RF Antenna Reference Design........................................................................................................... 37
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4.4. Reference Design of RF Layout..........................................................................................................38
4.5. Antenna Requirements.........................................................................................................................40
4.6. RF Output Power...................................................................................................................................41
4.7. RF Receiving Sensitivity.......................................................................................................................42
4.8. Recommended RF Connector for Antenna Installation.................................................................. 43
5 Reliability and Electrical Characteristics..................................................................................................45
5.1. Operating and Storage Temperatures............................................................................................... 45
5.2. Current Consumption............................................................................................................................46
5.3. Electrostatic Discharge.........................................................................................................................48
6 Mechanical Features.......................................................................................................................................49
6.1. Mechanical Dimensions........................................................................................................................49
6.2. Recommended Footprint......................................................................................................................51
6.3. Top and Bottom Views..........................................................................................................................52
7 Storage, Manufacturing and Packaging....................................................................................................53
7.1. Storage.................................................................................................................................................... 53
7.2. Manufacturing and Soldering...............................................................................................................54
7.3. Tape and Reel Packaging....................................................................................................................55
8 Appendix A References.................................................................................................................................57
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Table Index
Table 1: Frequency Bands of BC660K-GL............................................................................................................10
Table 2: BC660K-GL Key Features........................................................................................................................11
Table 3: I/O Parameters Definition......................................................................................................................... 16
Table 4: Pin Description........................................................................................................................................... 16
Table 5: AP Operating Modes................................................................................................................................. 20
Table 6: Modem Operating Modes.........................................................................................................................20
Table 7: Module Operating Modes......................................................................................................................... 20
Table 8: Power Supply Pins.....................................................................................................................................23
Table 9: Reset Pin Definition................................................................................................................................... 25
Table 10: Pin Definition of UART Interfaces......................................................................................................... 27
Table 11: Pin Definition of (U)SIM Interface......................................................................................................... 31
Table 12: Pin Definition of ADC Interface..............................................................................................................33
Table 13: RI Signal Status....................................................................................................................................... 33
Table 14: Pin Definition of NB-IoT Antenna Interface.........................................................................................36
Table 15: Module Operating Frequencies.............................................................................................................36
Table 16: Antenna Cable Insertion Loss Requirements.....................................................................................40
Table 17: Required Antenna Parameters..............................................................................................................40
Table 18: RF Conducted Output Power................................................................................................................ 41
Table 19: Receiving Sensitivity (with RF Retransmissions)...............................................................................42
Table 20: Operation and Storage Temperatures................................................................................................. 45
Table 21: Module Current Consumption (3.3 V VBAT Power Supply).............................................................46
Table 22: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)..................................... 48
Table 23: Recommended Thermal Profile Parameters...................................................................................... 55
Table 24: Related Documents.................................................................................................................................57
Table 25: Terms and Abbreviations....................................................................................................................... 57
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Figure Index
Figure 1: Functional Diagram.................................................................................................................................. 13
Figure 2: Pin Assignment......................................................................................................................................... 15
Figure 3: Module Power Consumption in Different Modes (Modem)............................................................... 21
Figure 4: Timing of Waking up Module from PSM............................................................................................... 22
Figure 5: Reference Circuit for Power Supply...................................................................................................... 23
Figure 6: Power-up Timing.......................................................................................................................................24
Figure 7: Power-down Timing..................................................................................................................................25
Figure 8: Reference Circuit of RESET_N by Using Driving Circuit...................................................................25
Figure 9: Reference Circuit of RESET_N by Using Button................................................................................ 26
Figure 10: Reference Circuit of BOOT by Using Button.....................................................................................27
Figure 11: Reference Design for Main UART Port.............................................................................................. 28
Figure 12: Reference Design of Debug UART Port............................................................................................ 28
Figure 13: Reference Circuit Design of UART..................................................................................................... 29
Figure 14: Sketch Map for RS-232 Interface Match............................................................................................30
Figure 15: Reference Circuit with Transistor Circuit............................................................................................31
Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector..............................32
Figure 17: RI Behaviour When a URC is Received.............................................................................................34
Figure 18: Reference Design of NETLIGHT.........................................................................................................35
Figure 19: Reference Design of NB-IoT Antenna Interface............................................................................... 38
Figure 20: Microstrip Design on a 2-layer PCB....................................................................................................38
Figure 21: Coplanar Waveguide Design on a 2-layer PCB................................................................................39
Figure 22: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).......................39
Figure 23: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).......................39
Figure 24: Dimensions of the U.FL-R-SMT Connector (Unit: mm)...................................................................43
Figure 25: Mechanicals of U.FL-LP Connectors.................................................................................................. 43
Figure 26: Space Factor of Mated Connector (Unit: mm).................................................................................. 44
Figure 27: BC660K-GL Top and Side Dimensions (Unit: mm)..........................................................................49
Figure 28: Module Bottom Dimension (Bottom View).........................................................................................50
Figure 29: Recommended Footprint (Unit: mm)...................................................................................................51
Figure 30: Top View of the Module.........................................................................................................................52
Figure 31: Bottom View of the Module...................................................................................................................52
Figure 32: Recommended Reflow Soldering Thermal Profile........................................................................... 54
Figure 33: Tape Dimensions (Unit: mm)................................................................................................................56
Figure 34: Reel Dimensions (Unit: mm)................................................................................................................ 56
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1 Introduction
This document defines the BC660K-GL module and describes its air interfaces and hardware interface
which are connected with the customers’ applications.
This document helps customers quickly understand the interface specifications, electrical and mechanical
details, as well as other related information of the module. To facilitate application designs, it also
includes some reference designs for customers’ reference. The document, coupled with application notes
and user guides, makes it easy to design and set up mobile applications with BC660K-GL.
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Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergency help is needed in
such conditions, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on in a service area
with adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as mobile phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
BC660K-GL Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
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“*” means under development.
Mode
BC660K-GL
H-FDD
B1/B2/B3/B4/B5/B8/B12/B13/B14/B17/B18/B19/B20/B25/B28/B66/B70/B85
NOTE
BC660K-GL Hardware Design
2 Product Concept
2.1. General Description
BC660K-GL is a high-performance NB-IoT module with extremely low power consumption. It is designed
to communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP
Rel-13 and 3GPP Rel-14). BC660K-GL supports a broad range of frequency bands as listed below.
Table 1: Frequency Bands of BC660K-GL
BC660K-GL is an SMD type module with LCC and LGA package, and has an ultra-compact profile of
17.7 mm × 15.8 mm × 2.0 mm, which makes it easily embedded into size-constrained applications and
provide reliable connectivity with the applications.
BC660K-GL provides abundant external interfaces (UART, ADC, (U)SIM, etc) and protocol stacks
(UDP/TCP/LwM2M*/MQTT*, etc.), which provide great convenience for customers' applications.
Due to compact form factor, ultra-low power consumption and extended temperature range, BC660K-GL
is a best choice for a wide range of IoT applications, such as smart metering, bike sharing, smart
wearables, smart parking, smart city, home appliances, security and asset tracking, agricultural and
environmental monitoring, etc. It is able to provide a complete range of SMS* and data transmission
services to meet customers’ demands.
The module fully complies with the RoHS directive of the European Union.
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Feature
Details
Power Supply
Supply voltage: 2.2–4.3 V
Typical supply voltage: 3.3 V
Power Saving
Typical power consumption: 800 nA
Frequency Bands
LTE Cat NB2:
B1/B2/B3/B4/B5/B8/B12/B13/B14/B17/B18/B19/B20/B25/B28/B66/B70/
B85
Transmitting Power
23 dBm ±2 dB
(U)SIM Interface
Support 1.8/3.0 V (U)SIM card
UART Interfaces
Main UART Port:
Used for AT command communication and data transmission, the baud
rate is 115200 bps by default. For more details, see Chapter 3.7.1.
Used for firmware upgrade, and in such case, the baud rate is 921600
bps by default.
Debug UART Port:
Used for firmware debugging
Default baud rate: 6 Mbps
Network Protocols
UDP/TCP/SNTP/LwM2M*/MQTT*/TLS*/DTLS*
SMS*Text/PDU Mode
Data Transmission
Features
Single-tone (max): 25.5 kbps (DL)/16.7 kbps (UL)
Multi-tone (max): 127 kbps (DL)/158.5 kbps (UL)
AT Commands
3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel-13 and
3GPP Rel-14) and Quectel enhanced AT commands
Firmware Update
Upgrade firmware via main UART port
Upgrade firmware via DFOTA
Real Time Clock
Supported
Physical Characteristics
Size: (17.7 ±0.15) mm × (15.8 ±0.15) mm × (2.0 ±0.2) mm
Weight: 1.0 ±0.2 g
Temperature Range
Operating temperature range: -35 to +75 °C
1)
Extended temperature range: -40 to +85 °C
2)
Storage temperature range: -40 to +90 °C
2.2. Key Features
The following table describes the detailed features of BC660K-GL module.
Table 2: BC660K-GL Key Features
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1.
1)
Within operating temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain
functions such as SMS* and data transmission, without any unrecoverable malfunction. Radio
spectrum and radio network will not be influenced, while one or more specifications, such as Pout,
may exceed the specified tolerances of 3GPP. When the temperature returns to the normal operation
temperature levels, the module will meet 3GPP specifications again.
3. "*" means under development.
Antenna Interface
50 Ω impedance control
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES
BC660K-GL Hardware Design
2.3. Functional Diagram
The following figure shows a block diagram of BC660K-GL and illustrates the major functional parts.
Radio frequency
Baseband
Power management
Peripheral interfaces
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Figure 1: Functional Diagram
2.4. Evaluation Board
Quectel provides a complete set of development tools to facilitate the use and testing of BC660K-GL
module. The development tool kit includes the TE-B board, a USB cable, an antenna and other
peripherals. For more details, see document [1].
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"*" means under development.
NOTE
BC660K-GL Hardware Design
3 Application Interfaces
BC660K-GL is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent
chapters will provide detailed descriptions of the following functions/pins/interfaces:
Power Supply
PSM_EINT
RESET_N
BOOT
UART Interfaces
(U)SIM Interface
ADC Interface*
RI Interface*
NETLIGHT Interface*
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3.1. Pin Assignment
Keep all reserved and unused pins unconnected.
NOTE
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Figure 2: Pin Assignment
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3.2. Pin Description
Type
Description
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
IO
Bidirectional
PI
Power input
PO
Power output
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT
42, 43
PI
Power supply for
the module
Vmax = 4.3 V
Vmin = 2.2 V
Vnorm = 3.3 V
VDD_EXT
24
PO
1.8/3.3 V output
for external
circuit
Vnorm = 1.8/3.3 V
No voltage output in
Deep Sleep/Light
Sleep mode.
It is intended to supply
power for the module’s
pull-up circuits, and is
not recommended to
be used as the power
supply for external
circuits.
GND
1, 27, 34, 36, 37, 40, 41, 56, 57, 58
Power Key Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
Table 3: I/O Parameters Definition
NB-IoT Module Series
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Table 4: Pin Description
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BOOT
7
DI
Control module
enter download
mode
VILmax = 0.2 × VDD_EXT
VIHmin = 0.7 × VDD_EXT
Active low.
Reset Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RESET_N
15
DI
Reset the
module
VILmax = 0.38 V
VIHmin = 1.33 V
VIHmax = 3.6 V
Active low.
PSM_EINT Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PSM_EINT
19
DI
Dedicated
external interrupt
pin used to wake
up the module
from Deep
Sleep/Light
Sleep mode..
VILmax = 0.38 V
VIHmin = 1.33 V
VIHmax = 3.6 V
Active on falling
edge.
Network Status Indication*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
NETLIGHT
16
DO
Indicate the
module's
network activity
status
VOLmax = 0.15 × VDD_EXT
VOHmin = 0.8 × VDD_EXT
ADC Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ADC0
9
AI
General-purpose
analog to digital
converter
interface
Voltage range:
0–1.2 V
Main UART Port
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
MAIN_RXD
18
DI
Main UART
receive
VILmax = 0.2×VDD_EXT
VIHmin = 0.7×VDD_EXT
MAIN_TXD
17
DO
Main UART
transmit
VOLmax = 0.15 × VDD_EXT
VOHmin = 0.8 × VDD_EXT
VDD_EXT
power domain.
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Debug UART Port
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
DBG_RXD
38
DI
Debug UART
receive
VILmax = 0.2 × VDD_EXT
VIHmin = 0.7 × VDD_EXT
VDD_EXT
power domain.
DBG_TXD
39
DO
Debug UART
transmit
VOLmax = 0.15×VDD_EXT
VOHmin = 0.8×VDD_EXT
Ringing Signal*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RI20DO
Ring indication
VOLmax = 0.15×VDD_EXT
VOHmin = 0.8×VDD_EXT
VDD_EXT
power domain.
(U)SIM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
(U)SIM_VDD
14
DO
(U)SIM card
power supply
Vnorm = 1.8/3.0 V
(U)SIM_RST
12
DO
(U)SIM card
reset
VOLmax = 0.15 × (U)SIM_VDD
VOHmin = 0.8 × (U)SIM_VDD
(U)SIM_DAT
A
11
IO
(U)SIM card
data
VILmax = 0.2 × (U)SIM_VDD
VIHmin = 0.7 × (U)SIM_VDD
VOLmax = 0.15 × (U)SIM_VDD
VOHmin = 0.8 ×(U)SIM_VDD
(U)SIM_CLK
13
DO
(U)SIM card
clock
VOLmax = 0.15 × (U)SIM_VDD
VOHmin = 0.8 × (U)SIM_VDD
(U)SIM_GND
10
Specified
ground for
(U)SIM card
Antenna Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_RF
35
IO
RF antenna
interface
50 Ω
characteristic
impedance
GPIO Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
GPIO1
3
IO
General-purpose
input/output
VILmax = 0.2×VDD_EXT
VIHmin = 0.7×VDD_EXT
VOLmax = 0.15×VDD_EXT
VOHmin = 0.8 × VDD_EXT
VDD_EXT
power domain.
GPIO2
4
IO
General-purpose
input/output
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NB-IoT Module Series
1. Keep all reserved and unused pins unconnected.
2. When VIO_SEL is grounded and VBAT ˂ 3.3 V, VDD_EXT = VBAT;
When VIO_SEL is grounded and VBAT ≥ 3.3 V, VDD_EXT = 3.3 V;
When VIO_SEL is floating, VDD_EXT = 1.8 V.
3. “*” means under development.
If unused, keep
these pins open.
GPIO3
5
IO
General-purpose
input/output
GPIO4
6
IO
General-purpose
input/output
GRFC Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
GRFC1
54
DO
Generic RF
controller
1.8 V power
domain.
If unused, keep
these pins open.
GRFC2
55
DO
Generic RF
controller
Other Interface Pin
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VIO_SEL
52
DI
IO Voltage
selection
Floating: 1.8 V
0: 3.3 V
Control
VDD_EXT
voltage select
1.8 V or 3.3 V
Reserved Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RESERVED
2, 8, 21–23, 25, 26, 28–33, 44–51, 53
Keep these pins
open.
NOTES
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Mode
Description
Normal
In normal mode, the AP handles tasks, such as AT command communication.
Idle
When all tasks are suspended, the AP will enter idle mode.
Mode
Description
Connected
The network is connected and the module supports data transmission. In such a case,
the modem can switch to DRX/eDRX mode.
DRX/eDRX
The modem is in idle mode, and downlink data can be received during PTW only. In
such a case, the modem can switch to PSM or connected mode.
PSM
In power saving mode, the modem is disconnected from the network and cannot
receive any downlink data. In such a case, the modem can switch to eDRX/DRX.
Mode
Description
Active
When the AP is in normal mode or the modem is in connected mode, the module will be
active and supports all services and functions.
The current consumption in active mode is higher than that in sleep modes.
Light Sleep
Generally, when the AP is in idle mode and the modem is in DRX/eDRX mode, the
module will enter Light Sleep mode. In such a case, the AP tasks will be suspended and
the modem will be able to receive downlink data during PTW only.
In Light Sleep mode, the current consumption of the module is reduced greatly.
Deep Sleep
When the AP is in idle mode and the modem is idle or inactive, the module will enter
deep sleep mode in which the CPU is powered off and only the 32 kHz RTC clock is
working.
In deep sleep mode, the current consumption will be reduced to the minimum (typical
value: 800 nA).
3.3. Operating Modes
The following table describes the three working modes of the module briefly.
Table 5: AP Operating Modes
NB-IoT Module Series
Table 6: Modem Operating Modes
Table 7: Module Operating Modes
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