Queclink Wireless Solutions M10 User Manual

M10 User Manual
M10 User Manual
Contents
Contents ........................................................................................................................... 1
1. Introduction ................................................................................................................... 5
1.1. Reference ............................................................................................................. 5
3.1. Pin Assignment ..................................................................................................... 8
3.2. Placement rec ommendation................................................................................... 15
3.3. Placement clearance ............................................................................................. 15
4. Digital I/O Connection .................................................................................................. 17
5. VDD_EXT Pin ............................................................................................................ 18
6. Serial Interface and Debug Interface ............................................................................... 19
7. SIM Card .................................................................................................................... 20
8. SLEEP Mode ............................................................................................................... 21
9. Audio Trace................................................................................................................. 22
10. RF Design Guide ........................................................................................................ 23
10.1. Recommended Impedance Matching Circuit.......................................................... 23
10.2. Matched RF Transmission Line Design................................................................. 24
10.3. PCB Layout Consideration .................................................................................. 24
11. The Recommended Ramp-soak-spike Reflow Profile ...................................................... 28
M10 User Manual
Table Index
TABLE 2: DIGITAL I/O ELECTRICAL CHARA CTER ISTICS.................................................................. 17
M10 User Manual
Figure Index
FIGURE 1: PIN ASSIGNMENT ........................................................................................................................... 9
FIGURE 2: RECOMM ENDATION OF PLACEM ENT ................................................................................. 15
FIGURE 3: PLACEMENT CLEARANCE ................................................................................................... 16
FIGURE 4: CIRCUIT OF THE SIM CARD ............................................................................................... 20
FIGURE 5: A UDIO TRACE ROUTING EXAMPLE ..................................................................................... 22
FIGURE 6: T-T YPE MATCHING CIRCUIT.................................................................................................... 23
FIGURE 7: Π-TYPE MATCHING CIRCUIT ................................................................................................... 23
FIGURE 8: M10 RF_ANT PCB LAYOUT ....................................................................................................... 24
FIGURE 9: REFERENCE P CB DESIGN WITH ANTENNA PAD IN A FOUR-LAYER PCB ............. 26
FIGURE 10: REFERENCE PCB DESIGN WITH RF CONNECTOR IN A FOUR-LAYER PCB ........ 27
FIGURE 11: STACK-UP OF THE FOUR-LAYER PCB................................................................................ 27
FIGURE 12: THE RECOMM ENDED RAMP-SOAK-SPIKE REFLOW P ROFILE............................... 28
M10 User Manual
Revision
Date
Author
Description of change
1.00
Ken Ji/
Samuel Hong
Origin
0. Revision history
1. Introduction
This document gives recommendation for M10 module integration in a wireless application, such
as vehicle tracking system, smart metering and PDA. It gives some recommendations for design
notes, reference circuit and PCB layout.
The M10 is a Quad-band GSM/GPRS engine that works at frequencies of
GSM850, and PCS1900. M10 features GPRS and
supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.
With a tiny profile of 29mm × 29mm × 3.6 mm, the module can meet almost all the requirements
for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS,
Security, Telematics, Remote Controlling, etc.
M10 is an SMD type module, which can be embedded in customer application through its 64-pin
pads. It provides all hardware interfaces between the module and customer’s host board.
1.1. Reference
2. Product Concept
The M10 is a Quad-band GSM/GPRS engine that works at frequency bands of GSM850 and PCS
1900. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1,
CS-2, CS-3 and CS-4.
The M10 is an SMD type module with 64-pin pads and a tiny profile of 29mm x 29mm x 3.6 mm
(the thickness of PCB is 1.6mm), which can fit into almost all customers applications. It provides
all hardware interfaces between the module and customer’ host board.
External controller can communicate with M10 through its main UART port.
Two audio channels include two mic rophone inputs and two speaker outputs, which can be
easily configured by AT command.
The module is designed with power saving technique so that the current consumption could be very
low.
TCP/IP protocol stack has been integrated in the module. Moreover, extended TCP/IP AT
commands have been developed for customer to use the internal TCP/IP protocol easily, w hich is
very useful for data transfer application.
The module is fully RoHS compliant to EU regulation.
Mechanical dimensions of module
3. Placement
Please pay attention to the placement and the PCB layout in your application design.
3.1. Pin Assignment
The pin assignment of the M10 module is shown in Figure 1. Placement of module should be
carefully considered to make the RF_IN pad as close as possible to antenna so as to reduce overall
RF trace length. The longer the RF trace to antenna, the larger the RF insertion loss. In addition,
please keep RF part and antenna from the system crystal and the audio part in host board as far as
possible to reduce possible RF interference due to GSM transmission bursts from antenna and RF
trace.
M10 module include the following major functional parts:
The GSM baseband part
Flash and SRAM
The GSM radio frequency part
The SMT pads interface
LCD interface
SIM card interface
Audio interface
Key-board interface
UART interface
Power supply
RF interface
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