Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion All-in-One MS200 PC
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
(Mother board, Inverter)
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries (Coin battery)
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries (mercury in
lamps)
2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps (LCD panel)
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part
Description
Weight (grams)
ISO 11469:2000 Plastic
Part Mark
Optional: Photo
Rear Cover
Rear Cover
498
>PC+ABS (FR40) <
Front Bezel
Front Bezel
228.1
>PC+ABS (FR40) <
Stand Back Cover
Stand Back Cover
93
>ABS <
Stand Base Cover
Stand Base Cover
91
>ABS <
Stand Back Cover
Stand Back Cover
81
>ABS <
HDD Door
HDD Door
64
>PC+ABS (FR40) <
Hinge Door
Hinge Door
54.4
>PC+ABS (FR40) <
Fan Housing
Fan Housing
26
>PPS<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Screw driver
1
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release screws for Stand-ASSY, then remove Stand-ASSY.
2. Release screws for RAM-door and HDD-door, then remove those doors.
3. Release screw for ODD-module, then use screw driver to push ODD-module out of system.
4. Remove Rear-Cover-ASSY.
5. Release screws for inventer, and then remove inventer(Figure 1 )
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
6. Release screws for M/B shielding, then remove M/B shielding. (Figure 2 )
7. Release RTC battery form motherboard(Figure 2)
8. Release screws for Thermal, Fan, all PCBAs and Speaker, then remove all of them.
9. Release screws form Panel-ASSY to Bezel, then remove Panel-ASSY.(Figure 3)
10. Release screws for Panel-ASSY, then remove middle-frame.
11. Please refer below figure 4 for detailed disassembly steps.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 1 Inverter
Figure 2 Motherboard
Figure 3
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 4 Disassembly instructions for LCD panel
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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