QT QTLP670C-2, QTLP670C-3, QTLP670C-4, QTLP670C-7 Datasheet
PACKAGE DIMENSIONS DESCRIPTION
The QT Optoelectronics surface mount lamps are
designed with a flat top and sides for automatic
placement equipment. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment process.
The package size and configuration conform to the
EIA–535 BAAC standard specification for case 3528
tantalum capacitor.
■ Non-diffused package for backlighting and
coupling to light pipe
■ Low package profile
■ Low power dissipation
■ Wide viewing angle
FEATURES
SMT LED LAMP
PLCC–2 PACKAGE
HIGH EFFICIENCY RED QTLP670C–2 GREEN QTLP670C–4
YELLOW QTLP670C–3 AlGaAs RED QTLP670C–7
HER Yellow Green AlGaAs Red
QTLP 670C–2 670C–3 670C–4 670C–7 Units
DC forward current, I
F
30 20 30 30 mA
Operating temperature range –40° C to +85° C
Storage temperature range –40° C to +100° C
Lead soldering time 5 seconds @ 260° C
Peak forward current1, I
F
160 160 160 200 mA
Power dissipation Pd (mW) 100 100 100 100 mW
Reversed Voltage (VR)5555V
ABSOLUTE MAXIMUM RATINGS (TA = 25° C Unless otherwise specified)
NOTE: ALL DIMENSIONS ARE IN INCHES (mm)
.118 (3.0)
.102 (2.6)
.091 (2.3)
.083 (2.1)
.134 (3.4)
.118 (3.0)
.094
(2.4)
CATHODE
ANODE FOR QTLP670C–7
.083 (2.1)
.067 (1.7)
Ø .04
(.1)
.142 (3.6)
.126 (3.2)
.043 (1.1)
.020 (.5)
.007 (.18)
.005 (.12)
.024 (.6)
.016 (.4)
.035 (.9)
.028 (.7)
Notes:
1. Measured @ f=1.0 kHz, Duty factor = 1/10
HER = High Efficiency Red
SMT LED LAMP
PLCC–2 PACKAGE
AlGaAs
HER YELLOW GREEN RED TEST
QTLP 670C–2 670C–3 670C–4 670C–7 UNITS CONDITIONS
LUMINOUS INTENSITY
minimum 6 6 15 25 mcd I
F
= 20 mA
typical 10 10 25 40 mcd
FORWARD VOLTAGE
minimum 1.7 1.7 1.7 1.5 V I
F
= 20 mA
typical 2.0 2.0 2.1 1.7 V
maximum 2.8 2.8 2.8 2.4 V
PEAK WAVELENGTH 635 585 570 660 nm I
F
= 20 mA
SPECTRAL LINE HALF WIDTH 45 35 30 20 nm
VIEWING ANGLE 120° 120° 120° 120°
ELECTRO-OPTICAL CHARACTERISTICS (TA = 25° C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
SOLDERING
FIG. 1 - Recommended Solder Pad Patterns
FIG. 2 - Recommended IR Reflow Soldering Profile
INFRARED VAPOR PHASE
REFLOW SOLDERING
4.45
(.175)
1.65
(.065)
4.45
(.175)
1.65
(.065)
0.64 (.025) SQ.
CENTERED HOLE
COMPONENT LOCATION
ON PAD
COMPONENT LOCATION
ON PAD
2.41
(.095)
2.41
(.095)
240° MAX
5 s MAX
soldering time
60 – 120 sec
Preheating
+5° C/s MAX –5° C/s MAX
120 – 150° C MAX
Notes:
All dimensions are in millimeters (inches).
HER = High Efficiency Red
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