QPROX QT113-IS, QT113-S, QT113H-D, QT113H-IS, QT113H-S Datasheet

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APPLICATIONS -
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Elevator buttons
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Toys & games
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Access systems
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Pointing devices
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Appliance control
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Security systems
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Prox sensors
The QT113 charge-transfer (“QT’”) touch sensor is a self-contained digital IC capable of detecting near-proximity or touch. It will project a proxim it y sense field through air , via al m ost any dielectric, li ke glass, pl asti c, stone, cerami c, and m ost kinds of wood. It can also turn sm all m etal -bearing objects into i ntri nsic sensors, m aking them r esponsive to proximi ty or touch. Thi s capability coupled with its ability to self calibrate continuously can lead to entirely new product concepts.
It is designed specifically for human interfaces, like control panels, appliances, toys, lighting controls, or anywhere a mechanical switch or button m ay be found; it m ay also be used for some material sensing and control appl ications provided that t he presence duration of objects does not exceed the recalibration timeout interval.
The QT113 requires only a common inexpensive capacitor in order to function. Power consumption is only 600µA in most applications. I n most cases the power supply need only be minim al ly regulated, for example
by Zener diodes or an inexpensive 3-terminal regulator. The QT113’s RISC core employs signal processing techniques pioneered by Quantum ; these are specifically designed to make the
device survive real-world challenges, such as ‘stuck sensor’ conditions and signal drift. Even sensitivity is digitally determined and remains const ant in the face of large variations in sample capacitor C
S
and electrode CX. No external switches, opamps, or other
analog components aside from C
S
are usually required.
The option-selectable toggle mode perm its on/off touch contr ol, for example for li ght switch replacement. The Quantum-pi oneered HeartBeat™ signal is also incl uded, allowing a host m icrocontroller to m onitor the health of the QT113 continuously if desired. By using the charge transfer principle, the IC delivers a level of performance clearly superior to older technologies in a highly cost-effective package.
Quantum Research Group Ltd
Copyright Quantum Research Group Ltd
R1.10/0104
!
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! Projects a proximity field through air
!
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! Less expensive than many mechanical switches
!
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! Sensitivity easily adjusted via capacitor value
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! Turns small objects into intrinsic touch sensors
!
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! 100% autocal for life - no adjustments required
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! 2.5 to 5V, 600µµµµA single supply operation
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! Toggle mode for on/off control (strap option)
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! 10s, 60s, infinite auto-recal timeout (strap options)
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! Gain settings in 2 discrete levels
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! HeartBeat™ health indicator on output
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! Active-low (QT113) or active-high outputs (QT113H)
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! Only one external part required - a 1¢ capacitor
QProx™™ QT113 / QT113H
C
HARGE-TRANSFER TOUCH SENSO
R
Sn s2
Vss
Sn s1
GainOpt2
Opt1
Out
Vdd 1
2
3
45
6
7
8
QT113
-
QT113H-IS-400C to +850C
-
QT113-IS-400C to +850C
QT113H-DQT113H-S0
0
C to +700C
QT113-DQT113-S0
0
C to +700C
8-PIN DIPSOICT
A
AVAILABLE OPTIONS
1 - OVERVIEW
The QT113 is a digital burst mode charge-transfer (QT) sensor designed specifically for touch controls ; it incl udes all hardware and signal processing functions necessary to provide stable sensing under a wide variety of changing conditions. Only a single low cost, non-critical capacitor is required for operation.
Figure 1-1 shows the basic Q T113 circuit using the device, with a conventional output drive and power supply connections.
1.1 BASIC OPERATION
The QT113 employs bursts of charge-transfer cycles to acquire its signal. Burst mode permits power consumption in the microamp range, dramatically reduces RF emissions, lowers susceptibility to EMI, and yet permits excellent response time. Internally the signals are digitally processed to reject impulse noise, using a 'consensus' filter which requires three consecutive confirmations of a detection before the output is activated.
The QT switches and charge measurement hardware functions are all i nternal to the QT113 (Figure 1-2). A 14-bi t single-slope switched capacitor ADC includes both the required QT charge and transfer switches in a configurati on that provides direct ADC conversion. The ADC is designed to dynamically optimize the QT burst length according to the rate of charge buildup on Cs, which in turn depends on the values of Cs, Cx, and Vdd. Vdd is used as the charge reference voltage. Larger values of Cx cause the charge transferred into Cs to rise more rapidly, reducing available resolution; as a minimum resolution is required for proper operation, this can result in dramatically reduced apparent gain. Conversely, larger values of Cs reduce the rise of differential voltage across it, increasing available resolution by permitti ng longer QT bursts. The value of Cs can thus be increased to allow larger values of Cx to be tolerated (Figures 4-1, 4-2, 4-3 in Specifications, rear).
The IC is responsive to both Cx and Cs, and changes in Cs can result in substantial changes in sensor gain.
Option pins allow the selection or alteration of several special features and sensitivity.
1.2 ELECTRODE DRIVE
The internal ADC treats Cs as a floating t r ansf er capacitor; as a direct result, the sense electrode can be connected to either SNS1 or SNS2 with no performance difference. In both cases the rule Cs >> Cx must be observed for proper operation. The polarity of the charge buildup across Cs during a burst is the same in either case.
It is possibl e to connect separate Cx and Cx’ loads to SNS1 and SNS2 simul taneously, although the result i s no diff erent than if the loads were connected together at SNS1 (or SNS2). It is i mportant t o lim i t the amount of st r ay capacitance on both term inals, especially if t he load Cx is already large, for example by mini m izing tr ace lengths and widths so as not to exceed the Cx load specificat ion and to allow for a larger sensing electrode size if so desired.
The PCB traces, wiring, and any components associated with or in contact with SNS1 and SNS2 will become touch sensitive and should be treated with caution to li m it t he touch area to the desired location. Multiple touch electrodes can be used, for example to create a control button on bot h sides of an object, however it is impossible for the sensor to distinguish between the two touch areas.
1.3 ELECTRODE DESIGN
1.3.1 E
LECTRODE GEOMETRY AND SIZE
There is no restriction on the shape of the electrode; in most cases common sense and a little experimentation can result in a good electrode design. The QT113 will operate equally well with long, thin electrodes as with round or square ones; even random shapes are acceptable. The electrode can also be a 3-dimensional surface or object. Sensitivity is related to electrode surface area, orientation with respect to the object being sensed, object composition, and the ground coupling quality of both the sensor circuit and the sensed object.
If a rel ati vel y la rge el ectr ode s urf ac e is desired, and if tests show that the electrode has more capacitance than the QT113 can tolerate, the electrode
- 2 -
Figure 1-1 Standard mode options
SENSING ELECTRODE
C
s
10nF
3
46
5
1
+
2
.5 to 5
72
OUT
OPT1
OPT2
GAIN
SNS1
SNS2
Vss
Vdd
OUTPUT=DC TIMEOUT=10 Secs TOGGLE=OFF GAIN=HIGH
C
x
8
Figure 1-2 Internal Switching & Timing
C
s
C
x
SNS2
SNS1
ELECTRODE
Single-Slope 14-bit
Switched Capacitor ADC
Charge
Amp
Burst Controller
Result
Don e
Start
can be made into a sparse mesh (Figure 1-3) havi ng lower Cx than a solid plane. Sensitivity m ay even remain the same, as the sensor will be operating in a lower region of the gain curves.
1.3.2 K
IRCHOFF’S CURRENT LAW
Like all capacitance sensors, the QT113 relies on Kirchoff’s Current Law (Figure 1-4) to detect the change in capacit ance of the electrode. This law as applied to capacitive sensing requires that the sensor’s field current must complete a loop, returning back to its source in order for capacitance to be sensed. Although most designers relate to Kirchoff’s law wit h regard to hardwired circuits, it applies equally to capacitive field flows. By implication it requires that the signal ground and the target object must bot h be coupled together in some manner for a capaci ti ve sensor to operate properly. Note that there is no need to provide actual hardwired ground connections; capacitive coupling to ground (Cx1) is always sufficient, even if the coupling might seem very tenuous. For example, powering the sensor via an isolated transform er will provide ample ground coupling, since there is capacitance between the windings and/or the transform er core, and from the power wiring itself directly to 'local earth'. Even when battery powered, just the physical size of the PCB and the object into which the electronics is embedded will generally be enough to couple a few picofarads back to local earth.
1.3.3 V
IRTUAL CAPACITIVE GROUNDS
When detecting human contact (e.g. a fingertip), grounding
of the person is never required. The human body naturally has several hundred picofarads of ‘free space’ capacitance to the local environment (Cx3 in Figur e 1-4), which i s m ore than two orders of m agnitude greater than that requir ed to create a return path to the QT113 via earth. The QT113's PCB however can be physically quite sm all, so there may be little ‘free space’ coupling (Cx1 in Figure 1-4) between it and t he environment to com plete the return path. If t he QT113 circuit ground cannot be earth grounded by wire, for example via the supply connections, then a ‘virtual capacitive ground’ may be required to increase return coupling.
A ‘virtual capacit i v e ground’ can be created by connecting the QT113’s own circuit ground to:
(1) A nearby piece of metal or metallized housing; (2) A floating conductive ground plane; (3) A nail driven into a wall; (4) A larger electronic device (to which its output might be
connected anyway).
Free-floating ground planes such as metal foils should maximi ze exposed surface area in a flat plane if possible. A square of metal foil will have little effect if it is rolled up or
crumpled into a bal l. Virt ual ground pl anes are mor e effective and can be made smaller if they are physically bonded to other surfaces, for example a wall or floor.
1.3.4 F
IELD SHAPING
The electrode can be prevented from sensing in undesired directions with the assistance of metal shielding connected to circuit gr ound ( Figure 1-5). For example, on f lat sur faces, the field can spread laterally and create a larger touch area than desired. To stop field spreading, it is only necessary to surround the touch electrode on all sides with a ring of metal connected to circuit ground; the ring can be on the same or opposite side from the electrode. The ring will kill field spreading from that point outwards.
If one side of the panel to which the electrode is fixed has moving traffic near it, these objects can cause inadvertent detections. This is cal led ‘walk-by’ and is caused by the fact that the fields radiate from either surface of the electrode equally well. Again, shieldi ng in the form of a metal sheet or foil connected to circ uit ground will prevent walk-by; putting a small ai r gap between the grounded shield and the electrode will keep the value of Cx lower and is encouraged. In the case of the QT113, sensitivity can be high enough (depending on Cx and Cs) that 'walk-by' signals are a concern; if this is a probl em , then some form of rear shieldi ng may be required.
1.3.5 S
ENSITIVITY
The QT113 can be set for one of 2 gain levels using option pin 5 (Table 1-1). This sensiti vity change i s made by alt ering the internal num eri cal threshold level required for a detection. Note that sensitivity is also a functi on of other things: like the value of Cs, electrode size, shape, and orientation, the composition and aspect of the object to be sensed, the thickness and composi tion of any overlaying panel m aterial, and the degree of ground coupling of both sensor and object.
1.3.5.1 Increasing Sensitivity
In some cases it may be desirable to increase sensitivity further, for example when using the sensor with very thick panels having a low dielectric constant.
Sensitivity can often be increased by using a bigger electrode, reducing panel thickness, or altering panel compositi on. Increasing electrode size can have diminishi ng returns, as high values of Cx will reduce sensor gain (Figures
- 3 -
Figure 1-3 Mesh Electrode Geometry
Figure 1-4 Kirchoff's Current Law
Sense Electrode
C
X2
Surround ing e nv ironm en t
C
X3
SENSOR
C
X1
4-1 to 4-3). The value of Cs also has a dram atic effect on sensitivity, and t his can be increased in value (up to a limit ). Also, increasing the electrode's surface area will not substantially increase touch sensitivity if its diameter is already much larger in surface area than the object being detected. The panel or other intervening material can be made thinner, but again there are diminishing rewards for doing so. Panel material can also be changed to one having a higher dielectric constant, which will help propagate the field through to the front. Locally adding some conductive material to the panel (conductive materials essentially have an infinite dielectric constant) will also help; for example, adding carbon or metal fibers to a plastic panel will greatly increase frontal fi eld strength, even if the fiber density is too low to make the plastic bulk-conductive.
1.3.5.2 Decreasing Sensitivity
In some cases the QT113 may be too sensitive, even on low gain. In thi s case gain can be lowered further by a num ber of strategies: making the electrode smaller, making the electrode into a sparse mesh using a high space-to-conductor ratio (Figure 1-3), or by decreasing Cs.
2 - QT113 SPECIFICS
2.1 SIGNAL PROCESSING
The QT113 processes all signals using 16 bit math, usi ng a number of algorithm s pioneered by Quantum. The algorithms are specifically designed to provide for high 'survivability' in the face of numerous adverse environmental changes.
2.1.1 D
RIFT COMPENSATION ALGORITHM
Signal drift can occur because of changes in Cx and Cs over time. It is crucial that drift be compensated for, otherwise false detections, non-detections, and sensitivity shifts will follow.
Drift com pensation (Figur e 2-1) is perform ed by making t he reference level track the raw signal at a slow rate, but only while there is no detection in effect. The rate of adjustment must be performed slowly, otherwise legitimate detections could be ignored. The QT113 drift compensates using a slew-rate limit ed change to the reference level; the threshold and hysteresis values are slaved to this reference.
Once an object is sensed, the drift compensation mechanism ceases since the signal is legitimately high, and therefore should not cause the reference level to change.
The QT113's drift compensation is 'asymmetric': the reference level drift-com pensates in one direction faster than it does in the other. Specifically, it compensates faster for decreasing signals than for increasing signals. Increasing signals should not be compensated for quickly, since an approaching finger could be compensated for partially or entirely before even approaching the sense electrode. However, an obstruction over the sense pad, for which the sensor has already made full all owance for, could suddenly be removed leaving the sensor with an artificially elevated reference level and thus become insensitive to touch. In this latter case, the sensor will compensate for the object's removal very quickly, usually in only a few seconds.
With large values of Cs and small values of Cx, drift compensation will appear to operate more slowly than with
the converse.
Note that the positive and negative drift
compensation rates are different.
2.1.2 T
HRESHOLD CALCULATION
Unlike the QT110 device, the internal threshold level is fixed at one of two setting as determined by Table 1-1. These setting are fixed with respect to the internal reference level, which in turn can move in accordance with the drift compensation mechanism..
The QT113 employs a hysteresis dropout below the threshold level of 17% of the delta between the reference and threshold levels.
2.1.3 MAX ON-D
URATION
If an object or material obstructs the sense pad the signal may rise enough to create a detection, preventing further
- 4 -
Figure 1-5
Shielding Against Fringe Fields
Sense
wire
Sense
wire
Unshielded
Shielded
Figure 2-1 Drift Compensation
Threshold
Signal
Hysteresis
Reference
Output
Vss (Gnd)
Low - 12 counts
Vdd
High - 6 counts
Tie Pin 5 to:Gain
Table 1-1 Gain Setting Strap Options
operation. To prevent this, the sensor includes a tim er which monitors detections. If a detection exceeds the timer setting, the timer causes the sensor to perform a full recalibration (when not set to infinite). This is known as the Max On-Duration feature.
After the Max On-Duration interval, the sensor will once again function norm ally, even if partially or fully obstructed, to t he best of its ability given electrode conditions. There are two finite tim eout durations available via strap option: 10 and 60 seconds (Table 2-1).
2.1.4 D
ETECTION INTEGRATOR
It is desirable t o suppress detections generated by electrical noise or from quick brushes with an object. To accomplish this, the Q T113 incorpor ates a detect integrati on counter that increments with each detection until a limit i s reached, after which the output is acti vated. If no detection is sensed prior to the final count, the counter is reset immediately to zero. In the QT113, the required count is 3.
The Detection I nt egrator can also be viewed as a 'consensus' filter, that r equires three detections in three successive bursts to create an output.
2.1.5 F
ORCED SENSOR RECALIBRATION
The QT113 has no recalibration pin; a forced recalibrat ion is accomplished only when the device is powered up. However, supply drain is l ow so it is a simpl e matter to treat the entire IC as a controllabl e load; sim ply drivi ng the QT113's Vdd pin directly from another logic gate or a microcontroller port (Figure 2-2) will serve as both power and 'forced recal'. The source resistance of most CMOS gates and microcont rollers are low enough to provide direct power without pr oblem. Note that most 8051-based micros have only a weak pullup drive capability and will require CMOS buffering. 74HC or 74AC series gates can directly power the QT113, as can most ot her microcontrollers.
Option strap configurations are read by the QT113 only on powerup. Configurations can only be changed by powering the QT113 down and back up again; again, a mi crocontrol ler can directly alter m ost of the configurati ons and cycle power to put them in effect.
2.1.6 R
ESPONSE TIME
The QT113's response time is highly dependent on burst length, which in turn i s dependent on Cs and Cx (see Figures 4-1, 4-2). With increasing Cs, response time slows, while
increasing levels of Cs reduce response time. Figure 4-3 shows the typical effects of Cs and Cx on response time.
2.2 OUTPUT FEATURES
The QT113 is designed for maximum flexibility and can accommodate most popular sensing requirements. These are selectable using strap options on pins OPT1 and OPT2. All options are shown in Table 2-1.
2.2.1 DC M
ODE OUTPUT
The output of the QT113 can respond i n a DC mode, where the output is active-low upon detection. The output will remain active-low for the duration of the detection, or unt i l the Max On-Duration expires (if not infinite), whichever occurs first. If a max on-duration timeout occurs first, the sensor performs a ful l recali bration and the output becom es inactive until the next detection.
In this m ode, three Max On-Duration tim eouts are available: 10 seconds, 60 seconds, and infinite.
Infinite timeout is useful in applications where a prolonged detection can occur and where the output must reflect the detection no matter how long. In infinite timeout mode, the designer should take care to be sure that drift in Cs, Cx, and Vdd do not cause the device to ‘stick on’ inadvertently even when the target object is removed from the sense field.
2.2.2 T
OGGLE MODE OUTPUT
This makes the sensor respond in an on/off mode like a flip flop. I t i s m ost useful for cont roll ing power l oads, f or example in kitchen appliances, power tools, light switches, etc.
Max On-Duration in Toggle mode is fixed at 10 seconds. When a timeout occurs, the sensor recalibrates but leaves the output state unchanged.
2.2.3 H
EARTBEAT
™ O
UTPUT
The QT113 output has a full-time HeartBeat™ ‘health’ indicator superimposed on it. This operates by taking 'Out' into a 3-state mode for 300µs once after every QT burst. This output state can be used to determine that the sensor is operating properly, or, i t can be ignored using one of several simple methods.
The HeartBeat indicator can be sampled by usi ng a pull down resistor on Out, and feeding the resulting negative-going pulse into a counter, f lip fl op, one-shot, or other cir cuit. Since Out is normally high, a pulldown resistor will create negative HeartBeat pulses (Figure 2-3) when the sensor is not detecting an object; when detecting an object, the output will remain low for the duration of the detection, and no HeartBeat pulse will be evident.
If the sensor is wired to a m icrocontr oller as shown in Figure 2-4, the microcontroller can reconfigure the load resistor to either ground or Vcc depending on the output state of the QT113, so that the pulses are evident in either state.
- 5 -
infiniteVddGnd
DC Out
10sGndGnd
Toggle
60sGndVdd
DC Out
10sVddVdd
DC Out
Max On-
Duration
Tie
Pin 4 to:
Tie
Pin 3 to:
Table 2-1 Output Mode Strap Options
Figure 2-2 Powering From a CMOS Port Pin
0.01µF
CMO S
microcontroller
OUT
PORT X.m
PORT X.n
Vdd
Vss
QT110
Electromechanical devices like relays will usually ignore this short pulse. The pulse also has too low a duty cycle to visibly affect LED’s. It can be filtered completely if desired, by adding an RC timeconstant to fil t er the output, or if int erfaci ng directly and only to a high-i mpedance CMOS input, by doing nothing or at m ost adding a sm all non-crit ical capacit or from Out to ground (Figure 2-5).
The QT113H variant has an active-high output; the heartbeat signal of the QT113H works in exactly the same manner.
2.2.4 O
UTPUT DRIVE
The QT113’s `output is active low and can sink up to 5mA of non-inductive current. If an inducti ve load is used, such as a small relay, the load should be diode clamped to prevent damage. When set to operate in a proximity mode (at high gain) the current should be limited to 1mA to prevent gain shifting si de effects from occur ring, which happens when the load current creates voltage drops on the die and bonding wires; these small shifts can materially influence the signal level to cause detection instability as described below.
Care should be taken when the QT113 and the load are both powered from the same suppl y, and the supply is m inimall y regulated. The QT113 derives its internal references from the power supply, and sensitivity shifts can occur with changes in Vdd, as happens when loads are switched on. This can induce detection ‘cycling’, whereby an object is detected, the load is turned on, the supply sags, t he detection is no longer sensed, the load is turned off, the supply rises and the object is reacquired, ad infinitum. To prevent this occurrence, the output should only be lightl y loaded if the device is operated from an unregulated supply, e.g. batteries. Detection
‘stiction’, the opposite effect, can occur if a load is shed when Out is active.
The output of the QT113 can directly drive a resistively limi ted LED. The LED should be connected with its cathode to the output and it s anode towards Vcc, so that it l ights when the sensor is active. If desired the LED can be connected from Out to ground, and driven on when the sensor is inactive.
The QT113H variant has an active-high output.
3 - CIRCUIT GUIDELINES
3.1 SAMPLE CAPACITOR
Charge sampler Cs can be virtually any plastic film or medium-K ceramic capacitor. The acceptable Cs range is from 10nF to 500nF depending on the sensitivity required; larger values of Cs demand higher stability to ensure reliable sensing. Acceptable capacitor types include polycarbonate, PPS film, or NPO/C0G ceramic.
3.2 OPTION STRAPPING
The option pins Opt1 and Opt 2 should never be left floating. If they are floated, the device will draw excess power and the options will not be properly read on powerup. Intentionally, there are no pullup resistors on these lines, since pullup resistors add to power drain if tied low.
The Gain input should be connected to either Vdd or Gnd. Tables 1-1 and 2-1 show the option strap configurations
available.
3.4 POWER SUPPLY, PCB LAYOUT
The power supply can range from 2.5 to 5.0 volts. At 3 volts current drain averages less than 600µA in most cases, but can be higher if Cs is large. Increasing Cx values will actually decrease power drain. Operation can be from batteries, but be cautious about loads causing supply droop (see Output Drive, previous section).
As battery voltage sags with use or fluctuates slowly with temperature, the QT113 will track and compensate for these changes automatically with only minor changes in sensitivity.
If the power supply is shared with another electronic system, care should be taken to assure that the supply is free of
- 6 -
Figure 2-4
Using a micro to obtain HB pulses in either output state
Figure 2-3
Getting HearBeat pulses with a pull-down resistor
3
46
5
1
+2.5 to 5
72
OUT
OPT1
OPT2
GAIN
SNS1
SNS2
Vss
Vdd
8
Ro
HeartBeat™ Pulses
Microcontroller
PORT_M.x
PORT_M.y
3
46
5
72
OUT
OPT1
OPT2
GAIN
SNS1
SNS2
R
o
Figure 2-5 Eliminating HB Pulses
3
46
5
72
OUT
OPT1
OPT2
GAIN
SNS 1
SNS 2
CMOS
100pF
C
o
GATE OR
MICRO INPUT
digital spikes, sags, and surges which can adversely affect the QT113. The QT113 will track slow changes in Vdd, but it can be affected by rapid voltage steps.
if desired, the supply can be regulated using a conventional low current regulator, f or example CMOS regulators that have low quiescent currents.
3.5 ESD PROTECTION
In cases where the electrode is placed behind a dielectric panel, the QT113 will usually be adequately protected from direct static discharge. However, even with a plastic or glass panel, transients can still flow into the electrode via induction, or in extreme cases, via dielectric breakdown. Porous materials may allow a spark to tunnel right through the material; partially conducting materials like 'pink poly' will conduct the ESD right to the electrode. Testing is required to reveal any problems. The QT113 does have diode protection on its termi nals which can absorb and prot ect the device from most induced discharges, up to 20m A; the usefulness of the internal clamping will depending on the dielectric properties, panel thickness, and rise time of the ESD transients.
ESD dissipation can be aided further with an added diode protection network as shown in Figur e 3-1, i n extreme cases.
Because the charge and transfer times of the QT113 are relatively long, the circuit can tolerate very large values of Re, even to 100k ohms in most cases where electrode Cx is small. The added diodes shown (1N4150 or equivalent low-C diodes, or a singl e BAV99 dual-diode) will shunt the ESD transients away f r om the part, and Re1 will current limit the rest into the QT113's own internal clam p diodes. C1 should be around 10µF if it is to absor b positive transients from a hum an body model standpoint wi thout r isi ng in val ue by more than 1 volt. If desired C1 can be replaced with an appropriate Zener diode. Directly placing semiconductor transient protection devices, Zeners, or MOV's on the sense lead is not advised; these devices have extremely large amounts of unst able parasitic C which will swamp the QT113 and render it useless.
Re1 should be as large as possible given the load
value of Cx and the diode capacitances of D1 and D2, but Re1 should be low enough to permit at least 6 timeconstants of RC to occur during the charge and transfer phases.
Re2 functions to isol ate the transient from t he QT113's Vdd pin; values of around 1K ohms are reasonable.
As with all ESD protection networks, it is crucial that the transients be led away from the circui t. PCB ground layout i s crucial; the ground connections to D1, D2, and C1 shoul d all go back to the power supply ground or preferably, if available, a chassis ground connected to earth. The currents should not be allowed to traverse the area directly under the QT113.
If the QT113 is connected to an external circuit vi a a cable or long twisted pair, it is possible for ground-bounce to cause damage to the Out pin; even though the transients are led away from the QT113 itself, the connected signal or power ground line will act as an inductor, causing a hi gh differential voltage to build up on the Out wire with respect to ground. If this is a possibility, the Out pin should have a resistance Re3 in series with it to limit current; this resistor should be as large as can be tolerated by the load.
- 7 -
Figure 3-1 ESD Suppression Circuit
3
46
5
1
+2.5 to 5
72
OUT
OPT1
OPT2
GAIN
SNS1
SNS2
Vss
Vdd
8
R
C
D
D
R
R
e3
s
2
1
e2
e1
SENS IN G ELEC TRO D E
10µF
+
C1
4.1 ABSOLUTE MAXIMUM SPECIFICATIONS
Operating temp ............................................................ as designated by suffix
Storage temp ................................................................... -55
O
C to +125OC
V
DD
...............................................................................-0.5 to +6.5V
Max continuous pin current, any control or drive pin ............................................ ±20mA
Short circuit duration to ground, any pin ....................................................... infinite
Short circuit duration to V
DD
, any pin ......................................................... infinite
Voltage forced onto any pin ................................................. -0.6V to (Vdd + 0.6) Volts
4.2 RECOMMENDED OPERATING CONDITIONS
VDD ............................................................................... +2.5 to 5.5V
Short-term supply ripple+noise ...............................................................±5mV
Long-term supply stability ................................................................ ±100mV
Cs value ......................................................................... 10nF to 500nF
Cx value ............................................................................ 0 to 100pF
4.3 AC SPECIFICATIONS
Vdd = 3.0, Ta = recommended operating range
, Cs=100nF unless noted
µs300Heartbeat pulse widthT
HB
Cx = 10pF; See Figure 4-3ms30Response timeT
R
Cs = 10nF to 500nF; Cx = 0ms750.5Burst lengthT
BL
Cs = 10nF to 500nF; Cx = 0ms802.1Burst spacing intervalT
BS
µs2Transfer durationT
PT
µs2Charge durationT
PC
ms550Recalibration timeT
RC
NotesUnitsMaxTypMinDescriptionParameter
4.4 SIGNAL PROCESSING
Option pin selectedsecs10, 60, infinitePost-detection recalibration timer duration
ms/level100Negative drift compensation rate
ms/level1,000Positive drift compensation rate
samples3Consensus filter length
Note 1%17Hysteresis
Option pin selectedcounts6 or 12Threshold differential
NotesUnitsMaxTypMinDescription
Note 1: Percentage of signal threshold
- 8 -
4.5 DC SPECIFICATIONS
Vdd = 3.0V, Cs = 10nF, Cx = 5pF, TA = recommended range, unless otherwise noted
Note 2fF281,000Sensitivity rangeS
bits14Acquisition resolutionA
R
Resistance from SNS1 to SNS2
1MMin shunt resistanceI
X
pF1000Load capacitance rangeC
X
OPT1, OPT2µA±1Input leakage currentI
IL
OUT, 1mA sourceVVdd-0.7High output voltageV
OH
OUT, 4mA sinkV0.6Low output voltageV
OL
OPT1, OPT2V2.2High input logic levelV
HL
OPT1, OPT2V0.8Low input logic levelV
IL
Required for proper startupV/s100Supply turn-on slopeV
DDS
µA1,500600Supply currentI
DD
V5.252.45Supply voltageV
DD
NotesUnitsMaxTypMinDescriptionParameter
Note 2: Sensitivity depends on value of Cx and Cs. Refer to Figures 4-1, 4-2.
- 9 -
Figure 4-1 - Typical Threshold Sensitivity vs. Cx,
High Gain, at Selected Values of Cs; Vdd = 3.0
0.01
0.10
1.00
10.00
0 10203040
Cx Load, pF
Detection Threshold, pF
10nF 20nF 50nF 100nF 200nF 500nF
Figure 4-2 - T ypical Thres hold Sensitivity vs. Cx,
Low Gain, at Selected Values of Cs; Vdd = 3. 0
0.01
0.10
1.00
10.00
0 10203040
Cx Load, pF
Detection Threshold, pF
10nF 20nF 50nF 100nF 200nF 500nF
5 ORDERING INFORMATION
QT1 + KSOIC-8-40 - 85CQT113H-IS
QT1 + ESOIC-80 - 70CQT113H-S
QT1 + 13HPDIP0 - 70CQT113H-D
QT1 + FSOIC-8-40 - 85CQT113-IS
QT1 + 3SOIC-80 - 70CQT113-S
QT1 + 13PDIP0 - 70CQT113-D
MARKINGPACKAGETEMP RANGEPART
- 10 -
Chart 4-3 - Typical Response Time vs. Cx;
Vdd = 3.0
1.00
10.00
100.00
1000.00
0 10203040
Cx Load
Response Time, ms
10nF 20nF 50nF 100nF 200nF 500nF
0.0150.0080.3810.203Y
0.390.329.9068.128x
BSC0.30.3BSC7.0627.62Aa
0.16-4.064-S1
0.140.123.5563.048S
-0.015-0.381r
0.150.123.813.048R
Typical0.1020.098Typical2.5912.489F
0.0650.0551.6511.397L1
0.0220.0140.5590.355L
-0.01-0.254P
-0.035-0.889Q
BSC0.30.3BSC7.627.62m
Typical0.430.355Typical10.9229.017M
0.3250.38.2557.62A
0.280.247.112 6.096a
NotesMaxMinNotesMaxMin
InchesMillimeters
SYMBOL
Package type: 8-pin Dual-In-Line
Ø
0.030.2290.7620.381ß
0.010.0070.2490.19e
0.040.021.0160.508E
0.0190.0140.4830.355L
BSC0.050.050BSC1.271.27D
0.010.0040.7620.101h
0.0680.0541.7281.371H
0.1570.153.9883.81Aa
0.2440.2296.1985.816W
0.1960.1894.9794.800M
NotesMaxMinNotesMaxMin
InchesMillimeters
SYMBOL
Package type: 8-pin SOIC
- 11 -
Quantum Research Group Ltd
©2001QRG Ltd.
Patented and patents pending
651 Holiday Drive Bldg. 5 / 300
Pittsburgh, PA 15220 USA
Tel: 412-391-7367 Fax: 412-291-1015
admin@qprox.com
http://www.qprox.com
In the United Kingdom
Enterprise House, Southampton, Hants SO14 3XB
Tel: +44 (0)23 8045 3934 Fax: +44 (0)23 8045 3939
This device expressly not for use in any medical or human safety related
application without the express written consent of an officer of the company.
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