✔ 500 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ Bidirectional Configuration
✔ Available in 3.3V & 5V
✔ Protects Up to Six (6) Lines
✔ ESD Protection > 40 kilovolts
✔ ✔
✔
LOW CAPACITANCE: 15pF
✔ ✔
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SO-8 Package
✔ Weight 15 milligrams (Approximate)
✔ Flammability rating UL 94V-0
✔ 12mm Tape and Reel Per EIA Standard 481
✔ Marking: Logo, Marking Code, Date Code & Pin One Defined By Dot on Top of Package
PIN CONFIGURATION
SO-8
GNDI/O 6I/O 5I/O 4
8
1
I/O 1I/O 2+V
7
2
105110.R3 8/03www.protekdevices.com
6
3
REF
5
4
I/O 3
DEVICE CHARACTERISTICS
MAXIMUN RATINGS @ 25°C Unless Otherwise Specified
PSRDA3.3-6
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PSRDA05-6
PARAMETER
SYMBOLVALUE
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
Maximum Forward Voltage @ 100mA (See Note 1)Volts1.1V
Note 1: Measured between pins 8 to 1, 2, 3, 4, 5, 6 or 7.
P
PP
T
J
T
STG
F
500Watts
-55°C to 150°C
-55°C to 150°C
UNITS
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
PSRDA3.3-6
PSRDA05-6
Note 1: Capacitance measured at VWM = VCC connected between I/O pins to pin 8(Gnd). VR = VWM @ 1MHz. As shown in Figure 5, REF1 is con-
nected to ground, REF2 is connected to +VCC, and input applies to VCC = 5V, V
DEVICE
MARKING
SGG
SGH
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
3.3
5.0
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
4.0
6.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
V
C
VOLTS
6.5
9.8
= 30mV, F = 1 MHz.
sign
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ I
PP
10.9V @ 43.0A
13.5V @ 42.0A
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
µA
125
20
MAXIMUM
CAPACITANCE
(See Note 1)
(See Figure 5)
@0V, 1 MHz
C
j(SD)
pF
15
15
10,000
1,000
100
- Peak Pulse Current - Watts
PP
P
10
0.01 1 10 100 1,000 10,000
PEAK PULSE POWER VS PULSE TIME
FIGURE 1
500W, 8/20µs Waveform
td - Pulse Duration - µs
FIGURE 2
120
PP
100
80
60
40
- Peak Pulse Current - % of I
20
PP
I
0
0 5 10 15 20 25 30
2www.protekdevices.com05110.R3 8/03
PULSE WAVE FORM
t
f
Peak Value I
-t
e
td = t
t - Time - µs
PP
IPP/2
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
GRAPHS
G
PSRDA3.3-6
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PSRDA05-6
POWER DERATING CURVE
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
TL - Lead Temperature - °C
FIGURE 5
INPUT CAPACITANCE CIRCUIT
REF2
I/O
V
R
REF1
FIGURE 3
Peak Pulse Power
8/20µs
Average Power
+V
CC
OVERSHOOT & CLAMPING VOLTAGE FOR PSRDA05-6
40
30
20
10
5 Volts per Division
0
ESD Test Pulse: 8 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PSRDA05-6
12
8
4
- Clamping Voltage - Volts
C
V
0
FIGURE 4
0 5 10 15 20 25 30
I
- Peak Pulse Current - Amps
PP
TYPICAL REVERSE VOLTAGE VS CAPACITANCE FOR PSRDA05-6
FIGURE 7
8
6
4
C - Capacitance - pF
2
0
0 1 2 3 4 5
V
- Reverse Voltage - Volts
R
3www.protekdevices.com05110.R3 8/03
PSRDA3.3-6
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PSRDA05-6
APPLICATION NOTE
The PSRDAxx-6 Series are low capacitance, bidirectional TVS arrays that are designed to protect I/O or high speed data lines from the damaging
effects of ESD or EFT. This product series has a surge capability of 500 Watts PPP per line for an 8/20µs waveshape and offers ESD protection >
40kV.
DIFFERENTIAL-MODE CONFIGURATION (Figure 1)
Ideal for use in USB applications, the PSRDAxx-6 Series provides up to six (6) lines of protection in a differential mode configuration as depicted in
Figure 1.
Circuit connectivity is as follows:
✔Pins 1, 2, 4, 5, 6 and 7 are connected to the datalines.
✔Pin 8 is connected to ground.
✔Pin 3 is connected to the databus.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are
recommended:
✔The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
✔The path length between the TVS device and the
protected line should be minimized.
✔All conductive loops including power and ground loops
should be minimized.
Figure 1. Typical Differential-Mode USB Protection
GND
USB CONTROLLER
7
8
6
USB PORT
D+
D-
GND
USB PORT
D+
D-
GND
5
V
BUS
V
BUS
✔The transient current return path to ground should be
kept as short as possible to reduce parasitic inductance.
✔Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
1
2
V
BUS
4
3
USB PORT
D+
D-
GND
V
BUS
4www.protekdevices.com05110.R3 8/03
PACKAGE OUTLINE & DIMENSIONS
PSRDA3.3-6
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PSRDA05-6
G
-T-
0.010” (0.25 MM)
8 PL
PACKAGE OUTLINE
-A-
8
1
5
M
P
0.010” (0.25 MM)
4 PL
-B-
4
M
B
PACKAGE DIMENSIONS
MILLIMETERS
SO-8
INCHES
DIMMINMAXMINMAX
D
C
K
S
S
M
T
B
A
MOUNTING PAD
0.050” ± 0.005”
J
R X 45º
0.030” ± 0.005”
A
B
C
D
0º - 10º
F
G
F
J
K
P
R
NOTES
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold protrusion.
4. Maximum mold protrusion is 0.015” (0.380 mm) per side.
5. Dimensioning and tolerances per ANSI Y14.5M, 1982.
6. Dimensions are exclusive of mold flash and metal burrs.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
0.245” MIN
TAPE & REEL/BULK ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 12mm tape,
i.e.,
PSRDA05-6-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 12mm tape,
i.e.,
PSRDA05-6-T13.
4. No Suffix = Product Shipped in Tubes of 98 pcs per Tube.
Outline & Dimensions: Rev 1 - 11/01, 06009
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com