Datasheet U0404FC24C, U0404FC15C, U0404FC12C, U0404FC08C, U0404FC05C Datasheet (PROTEK)

05159

Only One Name Means ProTek’Tion™

APPLICATIONS

✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 to 3 Lines

U0404FC3.3C

thru

U0404FC36C

UNBUMPED FLIP CHIP ARRAY

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0404
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel

PIN CONFIGURATION

105159.R2 8/03 www.protekdevices.com

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

U0404FC3.3C

thru

U0404FC36C

PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

250 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

U0404FC3.3C
U0404FC05C
U0404FC08C
U0404FC12C
U0404FC15C
U0404FC24C
U0404FC36C

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

3.3

5.0

8.0

12.0

15.0

24.0

36.0

MINIMUM

BREAKDOWN

VOLTAGE

@ 1mA

V

(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

40.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ IP = 1A

V

C

VOLTS

7.0

9.8

13.4

19.0

24.0

43.0

64.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

MAXIMUM

LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

10***

1
1
1
1

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF

150
100

75
50
40
30
25

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

250W, 8/20µs Waveform

td - Pulse Duration - µs

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

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PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

PP

IPP/2

TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs

GRAPHS

U0404FC3.3C

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U0404FC36C

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

REFLOW SOLDER PROFILE

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

Pre-Heat

Time

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR U0404FC05C

35

25

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Soldering

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0404FC05C

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

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PACKAGE OUTLINE & DIMENSIONS

U0404FC3.3C

thru

U0404FC36C

PACKAGE OUTLINE

B

A

TOP

E

F

Metalized Die Contacts

END

C

I

MOUNTING PAD LAYOUT - Option 1

C

A

SIDE

E

D

DIE
SOLDER
CONTACT

PACKAGE DIMENSIONS

MILLIMETERS

DIM

A
B
C
E

F

I

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).

0.56 NOM

0.86 NOM

1.0 ± 0.02

0.15 SQ

1.0 ± 0.0254

0.406 NOM

INCHES

0.022 NOM

0.034 NOM

0.039 ± 0.001

0.006 SQ

0.039 ± 0.001

0.016 NOM

PAD DIMENSIONS

DIM

A
C
D
E
F

G

H

I

MILLIMETERS

0.51

0.30

0.46

0.20

0.15 SQ

0.71

0.99

0.51

INCHES

0.020

0.012

0.018

0.008

0.006 SQ

0.028

0.039

0.020

SOLDER PRINT

0.010” - 0.012” DIA.

G

H

I

SOLDER PADS

SOLDER MASK

F

4 www.protekdevices.com05159.R2 8/03

NOTE:

1.

Preferred:

Outline & Dimensions: Rev 2 - 11/02, 06024

Using 0.1mm (0.004”) stencil.

PACKAGE OUTLINE & DIMENSIONS

U0404FC3.3C

thru

U0404FC36C

MOUNTING PAD LAYOUT - Option 2

COPPER
CONTACTS

0.009” [0.23] DIA.

G

H

SOLDER PRINT

0.014” - [0.36] DIA.

I

A

SOLDER MASK

F

DIE
SOLDER
CONTACT

PACKAGE DIMENSIONS

MILLIMETERS

DIM

A
F

G

H

I

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).

3.

Preferred:

Outline & Dimensions: Rev 2 - 11/02, 06024

0.51

0.15 SQ

0.71

0.99

0.51

Using 0.1mm (0.004”) stencil.

INCHES

0.020

0.006 SQ

0.028

0.039

0.020

TAPE & REEL ORIENTATION

Dual Die - 0404

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

COPYRIGHT © ProTek Devices 2003

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and
reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

pieces per reel. Ordering Suffix: -T75-1
(i.e., U0404FC05C-T75-1).

3.

8mm Paper Tape:

pieces per reel. Ordering Suffix: -T710-2
(i.e., U0404FC05C-T710-2).

7 Inch Reels - 5,000

7 Inch Reels - 10,000

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com

5 www.protekdevices.com05159.R2 8/03