✔ 3,600 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ 600 Watts Peak Pulse Power per Line (tp=10/1000µs)
✔ 100A (2/10µs) per Bellcore GR-1089 (Intra-Building)
✔ Bidirectional Configuration
✔ High Surge Capability: 80A (10/1000µs)
✔ Available in 2 Voltages: 6.5V & 12V
✔ Protects Two (2) Bidirectional Lines
✔ ✔
✔
LOW CAPACITANCE: < 30pF per LINE PAIR
✔ ✔
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SO-16 Package
✔ Weight 0.15 grams (Approximate)
✔ Flammability rating UL 94V-0
✔ 16mm Tape and Reel Per EIA Standard 481
✔ Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package
SO-16
16
PIN CONFIGURATION
15
1
2
14
3
13
4
12
5
105105.R3 8/03www.protekdevices.com
11
6
10
78
9
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SMLC6.5C-2
thru
SMLC12C-2
PARAMETER
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Power (tp = 10/1000µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOLVALUE
P
PP
PP
T
J
T
STG
3,600
600P
-55°C to 150°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
SMLC6.5C-2
SMLC12C-2
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
6.5
12.0
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
7.2
13.3
MAXIMUM
LEAKAGE
CURRENT
@ V
WM
I
D
µA
300
2
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IPP = 10A
V
C
VOLTS
12.4
19.9
UNITS
Watts
Watts
°C-55°C to 150°C
°C
TYPICAL
CAPACITANCE
@0V, 1MHz
C
pF
30
30
100
10
1
- Peak Pulse Power - kW
PP
P
0.1
0.1 1 10 100 1,000 10,000 100,000
PEAK PULSE POWER VS PULSE TIME
FIGURE 1
600W 10/1000µs Waveform
td - Pulse Duration - µs
FIGURE 2
100
PP
50
- Peak Pulse Current - % of I
PP
I
0
0 1 2 3
2www.protekdevices.com05105.R3 8/03
PULSE WAVE FORM
t
f
Peak Value I
PP
t - Time - µs
td = t
TEST
WAVEFORM
PARAMETERS
tf = 10µs
td = 1,000µs
IPP/2
-t
e
GRAPHS
SMLC6.5C-2
thru
SMLC12C-2
POWER DERATING CURVE
FIGURE 3
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
T
- Lead Temperature - °C
L
Peak Pulse Power
10/1000µs
Average Power
OVERSHOOT & CLAMPING VOLTAGE FOR SMLC6.5C-2
35
25
15
5
5 Volts per Division
-5
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SMLC6.5C-2
16
12
8
FIGURE 4
20 db
Ref 0 db
10 db per Division
-20 db
-50 db
4
- Clamping Voltage - Volts
C
V
0
0 10 20 30 40
FIGURE 6
INSERTION LOSS - SMLC6.5C-2
100 MHz per Division
I
- Peak Pulse Current - Amps
PP
RETURN LOSS - SMLC6.5C-2
FIGURE 7
20 db
Ref 0 db
10 db per Division
-20 db
-50 db
100 MHz per Division
3www.protekdevices.com05105.R3 8/03
SMLC6.5C-2
thru
SMLC12C-2
APPLICATION NOTE
The SMLCxxC-2 Series are low capacitance, bidirectional TVS arrays that are designed to protect I/O or high speed data lines from the damaging
effects of ESD or EFT. This product series has a surge capability of 600 Watts PPP per line for an 10/1000µs waveform and ESD protection > 40kV.
Ideal for use multimode transceiver I/O lines, telecommunications and wireless circuits, the SMLCxxC-2 Series provides up to two (2) line pairs of
protection in a differential-mode T1/E1 application as depicted in Figure 1.
Circuit connectivity is as follows:
✔Line 1 is connected to Pins 1, 2, 15 & 16.
✔Line 2 is connected to Pins 3, 4, 13 & 14.
✔Line 3 is connected to Pins 5, 6, 11, & 12.
✔Line 4 is connected to Pins 7, 8, 9 & 10.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
Figure 1. Differential-Mode Protection For T1/E1 Applications
✔The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
✔The path length between the TVS device and the
protected line should be minimized.
✔All conductive loops including power and ground
loops should be minimized.
✔The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4www.protekdevices.com05105.R3 8/03
PACKAGE OUTLINE & DIMENSIONS
SMLC6.5C-2
thru
SMLC12C-2
G
16
1
0.010” (0.25 MM)
-A-
16 PL
M
0.050” TYP
0.160” ± 0.005”
0.045” ± 0.005”
PACKAGE OUTLINE
9
P
-B-
8
K
D
S
T
B
S
A
8 PL
C
-T-
0.010” (0.25 MM)
0º - 7º
M
MOUNTING PAD
M
M
B
R X 45º
0.030” ± 0.005”
0.245” MIN
SO-16
PACKAGE DIMENSIONS
MILLIMETERS
DIMMINMAXMINMAX
A
B
C
D
F
J
F
G
J
K
P
R
NOTES
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
5.80
0.25
10.00
4.00
1.75
0.49
1.25
1.27 BSC
0.25
0.25
6.20
0.50
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold
protrusions.
4. Maximum mold protrusion is 0.015” (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape,
SMLC6.5C-2-T7.
i.e.,
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape,
i.e.,
SMLC6.5C-2-T13.
4. No Suffix = Product Shipped in Tubes of 37 pcs per Tube.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
Outline & Dimensions: Rev 1 - 11/01, 06007
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
5www.protekdevices.com05105.R3 8/03
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