
SMF05C
05138
Only One Name Means ProTek’Tion™
STANDARD CAPACITANCE TVS ARRAY
APPLICATIONS
✔ Notebook Computers
✔ Cellular Phone Base Stations
✔ Personnal Digital Assistant (PDA)
✔ Digital Cameras
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ 100 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ Monolithic Design
✔ Available in Multiple Voltage Types Ranging From 5V to 24V
✔ Protect 4 Lines Bidirectional and 5 Lines Unidirectional
✔ ESD Protection > 25 kilovolts
✔ Low Clamping Voltage
thru
SMF24C
SC-70-6L
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SC-70-6L Package
✔ Weight 14 milligrams (Approximate)
✔ Flammability rating UL 94V-0
✔ 8mm Tape and Reel Per EIA Standard 481
✔ Marking: Marking Code & Pin One Defined By DOT on Package
PIN CONFIGURATIONS
1
2
3
6
5
4
105138.R4 9/03 www.protekdevices.com

DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SMF05C
thru
SMF24C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL VALUE
P
PP
T
J
T
STG
100 Watts
-55°C to 150°C
-55°C to 150°C°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
SMF05C
SMF12C
SMF15C
SMF24C
Note 1: Pins 1, 3, 4, 5 or 6 to pin 2.
DEVICE
MARKING
05C
12C
15C
24C
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
12.0
15.0
24.0
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
6.0
13.3
16.7
26.7
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
= 5A
@ I
P
V
C
VOLTS
9.8
-
-
-
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ I
PP
10.0V @ 10.0A
23.8V @ 4.2A
33.3V @ 3.0A
55.5V @ 1.8A
MAXIMUM
LEAKAGE
CURRENT
@V
I
D
µA
5
1
1
1
WM
UNITS
°C
TYPICAL
CAPACITANCE
(See Note 1)
@0V, 1 MHz
C
J
pF
60
30
25
20
10,000
1,000
100
- Peak Pulse Power - Watts
PP
P
10
0.1 1 10 100 1,000 10,000
PEAK PULSE POWER VS PULSE TIME
FIGURE 1
100W 8/20µs Waveform
td - Pulse Duration - µs
FIGURE 2
120
PP
100
80
60
40
- Peak Pulse Current - % of I
20
PP
I
0
0 5 10 15 20 25 30
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PULSE WAVE FORM
t
f
Peak Value I
-t
e
td = t
t - Time - µs
PP
IPP/2
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs

GRAPHS
SMF05C
thru
SMF24C
POWER DERATING CURVE
FIGURE 3
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
T
- Lead Temperature - °C
L
Peak Pulse Power
8/20µs
Average Power
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SMF05C
FIGURE 4
16
12
8
4
- Clamping Voltage - Volts
C
V
0
0 2 4 6 8 10
I
- Peak Pulse Current - Amps
PP
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SMF05C
thru
SMF24C
APPLICATION NOTE
The SMFC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides both
unidirectional and bidirectional protection, with a surge capability of 100 Watts PPP per line for an 8/20µs waveshape and ESD protection > 25 kilovolts.
UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
The SMFC Series provides up to four (4) lines of protection in a common-mode
configuration as depicted in Figure 1.
Circuit connectivity is as follows:
✔ Line 1 is connected to Pin 1.
✔ Line 2 is connected to Pin 3.
✔ Line 3 is connected to Pin 4.
✔ Line 4 is connected to Pin 6.
✔ Pin 2 is connected to ground.
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 2)
The SMFC Series provides up to five (5) lines of protection in a differential-mode
configuration as depicted in Figure 2.
Circuit connectivity is as follows:
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
3
I/O PORT
2
LINE 1
LINE 2
1
✔ Line 1 is connected to Pin 1.
✔ Line 2 is connected to Pin 3.
✔ Line 3 is connected to Pin 4.
✔ Line 4 is connected to Pin 5.
✔ Line 5 is connected to Pin 6.
✔ Pin 2 is not connected.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔ The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
✔ The path length between the TVS device and the
protected line should be minimized.
✔ All conductive loops including power and ground
loops should be minimized.
✔ The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔ Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
4
Figure 2 - Bidirectional Configuration
Differential-Mode I/O Port Protection
3
I/O PORT
4
5
2
5
6
LINE 3
LINE 4
LINE 1
LINE 2
1
6
LINE 3
LINE 4
LINE 5
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PACKAGE OUTLINE & DIMENSIONS
SMF05C
thru
SMF24C
D
6
1
V
TYPICAL
DIM
Millimeters Inches
1
0.50
2
1.30
3
0.65
4
2.40
5
0.60
6
0.70
7
2.50
E
54
2
3
F
A
0.020
0.051
0.026
0.094
0.024
0.028
0.098
PACKAGE OUTLINE
K
L
G
C
MOUNTING PAD
4
1
6
7
SC70-6L
0º - 8º
J
J
B
3
2
5
M
PACKAGE DIMENSIONS
MILLIMETERS
DIM MIN MAX MIN MAX
A
B
C
D
E
F
G
J
K
L
M
NOTES
1. Dimensioning and tolerances per ANSI Y14.5M, 1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal burrs.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape,
1.90
1.15
0.80
0.15
0.65 BSC
1.30 BSC
0.80
0.08
2.00
0
0.26
with EIA-481.
SMF05C-T7.
i.e.,
2.15
1.35
1.00
0.30
-
-
1.10
0.25
2.20
0.10
0.46
Outline & Dimensions: Rev 1 - 11/01, 06019
INCHES
0.074
0.045
0.031
0.006
0.0255 BSC
0.0512 BSC
0.031
0.003
0.078
0
0.010
0.084
0.055
0.040
0.012
-
-
0.043
0.010
0.086
0.004
0.018
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
5 www.protekdevices.com05138.R4 9/03