Datasheet P0404FC12C, P0404FC24C, P0404FC15C, P0404FC3.3C, P0404FC05C Datasheet (PROTEK)

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05154
Only One Name Means ProTek’Tion™
APPLICATIONS
IEC COMPATIBILITY (EN61000-4)
P0404FC3.3C*
thru
P0404FC36C*
FLIP CHIP ARRAY
61000-4-2 (ESD): Air - 15kV, Contact - 8kV61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovoltsAvailable in Multiple Voltage Types Ranging From 3.3V to 36V250 Watts Peak Pulse Power per Line (tp = 8/20µs)Bidirectional Configuration & Monolithic StructureProtects 1 to 3 Lines
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0404Weight 0.73 milligrams (Approximate)Flammability Rating UL 94V-08mm Plastic & Paper Tape and Reel Per EIA Standard 481Device Marking On ReelTop Contacts: Solder Bump 0.004” in Height (Nominal)
0404
(Single Chip Shown)
PIN CONFIGURATION
105154.R3 8/03 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
P0404FC3.3C*
thru
P0404FC36C*
PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature
SYMBOL VALUE
P
PP
T
J
T
STG
250 Watts
-55°C to 150°C
-55°C to 150°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
(See Note 1)
P0404FC3.3C P0404FC05C P0404FC08C P0404FC12C P0404FC15C P0404FC24C P0404FC36C
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
3.3
5.0
8.0
12.0
15.0
24.0
36.0
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
V
C
VOLTS
7.0
9.8
13.4
19.0
24.0
43.0
64.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
MAXIMUM LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
10***
1 1 1 1
UNITS
°C
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
150 100
75 50 40 30 25
10,000
1,000
100
- Peak Pulse Current - Watts
PP
P
10
0.01 1 10 100 1,000 10,000
PEAK PULSE POWER VS PULSE TIME
FIGURE 1
t
- Pulse Duration - µs
d
250W, 8/20µs Waveform
FIGURE 2
120
PP
100
80
60
40
- Peak Pulse Current - % of I
20
PP
I
0
0 5 10 15 20 25 30
2 www.protekdevices.com05157.R3 8/03
PULSE WAVE FORM
t
f
Peak Value I
-t
e
td = t
t - Time - µs
*U.S. Patent No. Des. “D456,367S”
PP
IPP/2
TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs
GRAPHS
P0404FC3.3C*
thru
P0404FC24C*
POWER DERATING CURVE
FIGURE 3
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
TL - Lead Temperature - °C
Peak Pulse Power
8/20µs
Average Power
REFLOW SOLDER PROFILE
200°C
100°C
Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.
Instantaneous
to 200°C
1-2 Minutes
to 150°C
Pre-Heat
Time
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR P0404FC05C
35
25
FIGURE 4
225°C
5-10 sec
1-2 Minutes to 25°C
Soldering
Time
Cool Down
Time
15
5 Volts per Division
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0404FC05C
14
12
10
8
6
4
- Clamping Voltage - Volts
C
V
2
0
0 5 10 15 20
- Peak Pulse Current - Amps
I
PP
3 www.protekdevices.com05154.R3 8/03
*U.S. Patent No. Des. “D456,367S”
PACKAGE OUTLINE & DIMENSIONS
P0404FC3.3C*
thru
P0404FC36C*
PACKAGE OUTLINE
B
A
TOP
END
F
E
C
G
H
I
MOUNTING PAD LAYOUT - Option 1
C
A
E
SIDE
D
DIE SOLDER BUMP
PACKAGE DIMENSIONS
MILLIMETERS
DIM
A B C E
F G H
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”).
0.56 NOM
0.86 NOM
1.0 ± 0.02
0.15 SQ
1.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.039 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
PAD DIMENSIONS
DIM
A C D E F
G
H
I
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
SOLDER PRINT
0.010” - 0.012” DIA.
G
H
I
SOLDER PADS
SOLDER MASK
F
4 www.protekdevices.com05157.R3 8/03
NOTE:
1.
Preferred:
Outline & Dimensions: Rev 3 - 11/02, 06022
Using 0.1mm (0.004) stencil.
*U.S. Patent No. Des. “D456,367S”
PACKAGE OUTLINE & DIMENSIONS
P0404FC3.3C*
thru
P0404FC24C*
MOUNTING PAD LAYOUT - Option 2
COPPER CONTACTS
0.009” [0.23] DIA.
G
H
SOLDER PRINT
0.014” - [0.36] DIA.
I
A
SOLDER MASK
F
DIE SOLDER BUMP
PACKAGE DIMENSIONS
MILLIMETERS
DIM
A F
G
H
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Outline & Dimensions: Rev 3 - 11/02, 06022
0.51
0.15 SQ
0.71
0.99
0.51
Using 0.1mm (0.004) stencil.
INCHES
0.020
0.006 SQ
0.028
0.039
0.020
TAPE & REEL ORIENTATION
Dual Die - 0404
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyers and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
pieces per reel. Ordering Suffix: -T75-1 (i.e., P0404FC05C-T75-1).
3.
8mm Paper Tape:
pieces per reel. Ordering Suffix: -T710-2 (i.e., P0404FC05C-T710-2).
7 Inch Reels - 5,000
7 Inch Reels - 10,000
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
5 www.protekdevices.com05154.R3 8/03
*U.S. Patent No. Des. “D456,367S”
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