Datasheet P0402FC12C, P0402FC24C, P0402FC15C, P0402FC3.3C, P0402FC8C Datasheet (PROTEK)

P0402FC3.3C*

thru

P0402FC36C*

105107.R8 8/03 www.protekdevices.com

FLIP CHIP ARRAY

Only One Name Means ProTek’Tion™

*U.S. Patent No. Des. “D456,367S”

APPLICATIONS

✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0402
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)

0402

05107

PIN CONFIGURATION

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P0402FC3.3C*

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P0402FC36C*

*U.S. Patent No. Des. “D456,367S”

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

Operating Temperature

SYMBOL VALUE

-55°C to 150°C°C

°C

-55°C to 150°C

UNITS

T

J

T

STG

PARAMETER

Storage Temperature

Peak Pulse Power (tp = 8/20µs) - See Figure 1

P

PP

250 Watts

0 5 10 15 20 25 30

t - Time - µs

0

20

40

60

80

100

120

I

PP

- Peak Pulse Current - % of I

PP

TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs

t

f

Peak Value I

PP

e

-t

td = t

IPP/2

FIGURE 2

PULSE WAVE FORM

0.01 1 10 100 1,000 10,000
t

d

- Pulse Duration - µs

10

100

1,000

10,000

P

PP

- Peak Pulse Current - Watts

FIGURE 1

PEAK PULSE POWER VS PULSE TIME

250W, 8/20µs Waveform

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

MINIMUM

BREAKDOWN

VOLTAGE

@ 1mA

V

(BR)

VOLTS

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ IP = 1A

V

C

VOLTS

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF

P0402FC3.3C
P0402FC05C
P0402FC08C
P0402FC12C
P0402FC15C
P0402FC24C
P0402FC36C

3.3

5.0

8.0

12.0

15.0

24.0

36.0

4.0

6.0

8.5

13.3

16.7

26.7

40.0

7.0

9.8

13.4

19.0

24.0

43.0

64.0

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

150
100

75
50
40
30
25

MAXIMUM
LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

10***

1
1
1
1

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.

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P0402FC3.3C*

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P0402FC24C*

*U.S. Patent No. Des. “D456,367S”

GRAPHS

0 5 10 15 20

V

C

- Clamping Voltage - Volts

0

4

8

12

14

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0402FC05C

10

6

2

I

PP

- Peak Pulse Current - Amps

225°C

5-10 sec

Instantaneous

to 200°C

Soldering

Time

Cool Down

Time

1-2 Minutes

to 150°C

1-2 Minutes to 25°C

Pre-Heat

Time

100°C

200°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.

0 25 50 75 100 125 150

TL - Lead Temperature - °C

20

40

60

80

100

% Of Rated Power

Peak Pulse Power

8/20µs

Average Power

FIGURE 3

POWER DERATING CURVE

0

FIGURE 4

REFLOW SOLDER PROFILE

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR P0402FC05C

5 Volts per Division

-5

5

15

25

35

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P0402FC3.3C*

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P0402FC36C*

*U.S. Patent No. Des. “D456,367S”

PACKAGE OUTLINE & DIMENSIONS

COPYRIGHT © ProTek Devices 2003

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0402FC05C-T75-1).

3.

8mm Paper Tape:

7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2).

A
B
C
D
E
F
G
H

I

0.46 NOM

0.86 NOM

0.99 ± 0.0254

0.10 NOM

0.35 NOM

0.483 ± 0.0254

0.20 NOM

0.127 MAX

0.076 MIN

0.406 NOM

0.018 NOM

0.034 NOM

0.039 ± 0.001

0.004 NOM

0.014 NOM

0.019 ± 0.001

0.008 NOM

0.005 MAX

0.003 MIN

0.016 NOM

DIM

MILLIMETERS

INCHES

PACKAGE DIMENSIONS

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).

3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).

PACKAGE OUTLINE

0402

MOUNTING PAD

NOTE:

1.

Preferred:

Using 0.1mm (0.004”) stencil.

A
B
C
D
E

F
G
H

I

0.23

0.48

0.69

0.46

0.99

0.20

0.20

0.66

0.13

0.009

0.019

0.027

0.018

0.039

0.008

0.008

0.026

0.005

DIM

MILLIMETERS

INCHES

PAD DIMENSIONS

NOTE:

1. Top view of tape. Metal contacts are face down in tape
package.

TAPE & REEL ORIENTATION

Single Die - 0402

Outline & Dimensions: Rev 3 - 11/02, 06001

G

D

H

E
F

I

SIDE

A

B

C

TOP

END

B

C

SOLDER

BUMP

A

H

D

I

SOLDER PRINT

DIAMETER 0.010” -

0.012”

F

G

DIE

E

SOLDER PAD