05157
Only One Name Means ProTek’Tion™
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
LC0404FC3.3C
thru
LC0404FC24C
LOW CAPACITANCE FLIP CHIP ARRAY
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Six Voltage Types Ranging From 3.3V to 24V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 to 3 Lines
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0404
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
0404
(Single Chip Shown)
PIN CONFIGURATION
105157.R3 8/03 www.protekdevices.com
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
LC0404FC3.3C
thru
LC0404FC24C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL VALUE
P
PP
T
J
T
STG
200 Watts
-55°C to 150°C
-55°C to 150°C°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
(See Note 1)
LC0404FC3.3C
LC0404FC05C
LC0404FC08C
LC0404FC12C
LC0404FC15C
LC0404FC24C
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
3.3
5.9
8.0
12.0
15.0
24.0
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
1
1
1
1
UNITS
°C
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
70
35
32
30
25
20
10,000
1,000
100
- Peak Pulse Current - Watts
PP
P
10
0.01 1 10 100 1,000 10,000
PEAK PULSE POWER VS PULSE TIME
FIGURE 1
t
- Pulse Duration - µs
d
200W, 8/20µs Waveform
FIGURE 2
120
PP
100
80
60
40
- Peak Pulse Current - % of I
20
PP
I
0
0 5 10 15 20 25 30
2 www.protekdevices.com05157.R3 8/03
PULSE WAVE FORM
t
f
Peak Value I
-t
e
td = t
t - Time - µs
PP
IPP/2
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
GRAPHS
LC0404FC3.3C
thru
LC0404FC24C
POWER DERATING CURVE
FIGURE 3
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
TL - Lead Temperature - °C
Peak Pulse Power
8/20µs
Average Power
REFLOW SOLDER PROFILE
200°C
100°C
Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
Instantaneous
to 200°C
1-2 Minutes
to 150°C
Pre-Heat
Time
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0404FC05C
35
25
FIGURE 4
225°C
5-10 sec
1-2 Minutes to 25°C
Soldering
Time
Cool Down
Time
15
5 Volts per Division
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0404FC05C
14
12
10
8
6
4
- Clamping Voltage - Volts
C
V
2
0
0 5 10 15 20
- Peak Pulse Current - Amps
I
PP
3 www.protekdevices.com05157.R3 8/03
PACKAGE OUTLINE & DIMENSIONS
LC0404FC3.3C
thru
LC0404FC24C
PACKAGE OUTLINE
B
A
TOP
END
F
E
C
G
H
I
MOUNTING PAD LAYOUT - Option 1
C
A
E
SIDE
D
DIE
SOLDER
BUMP
PACKAGE DIMENSIONS
MILLIMETERS
DIM
A
B
C
E
F
G
H
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
0.56 NOM
0.86 NOM
1.0 ± 0.02
0.15 SQ
1.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.039 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
PAD DIMENSIONS
DIM
A
C
D
E
F
G
H
I
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
SOLDER PRINT
0.010” - 0.012” DIA.
G
H
I
SOLDER PADS
SOLDER MASK
F
4 www.protekdevices.com05157.R3 8/03
NOTE:
1.
Preferred:
Outline & Dimensions: Rev 3 - 11/02, 06022
Using 0.1mm (0.004”) stencil.
PACKAGE OUTLINE & DIMENSIONS
LC0404FC3.3C
thru
LC0404FC24C
MOUNTING PAD LAYOUT - Option 2
COPPER
CONTACTS
0.009” [0.23] DIA.
G
H
SOLDER PRINT
0.014” - [0.36] DIA.
I
A
SOLDER MASK
F
DIE
SOLDER
BUMP
PACKAGE DIMENSIONS
MILLIMETERS
DIM
A
F
G
H
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Outline & Dimensions: Rev 3 - 11/02, 06022
0.51
0.15 SQ
0.71
0.99
0.51
Using 0.1mm (0.004”) stencil.
INCHES
0.020
0.006 SQ
0.028
0.039
0.020
TAPE & REEL ORIENTATION
Dual Die - 0404
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0404FC05C-T75-1).
3.
8mm Paper Tape:
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0404FC05C-T710-2).
7 Inch Reels - 5,000
7 Inch Reels - 10,000
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
5 www.protekdevices.com05157.R3 8/03
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