Pro-Log 7701 User Manual

STD

7000

7701 16K

Static

Ram

Memory

Card

USER'S

MANUAL

o

7701

16K Static Ram Memory Card

c

USER'S

MANUAL

10/81

7701

16K

STATIC

RAM

MEMORY

CARD

USER~S

MANUAL

o

SECTION SECTION SECTION

SECTION SECTION SECTION SECTION SECTION SECTION SECTION

2

3

4

5

6 7

8

9

10

TAB

Data Sheet Functional Card Address Read, Electrical Mechanical 2114

Schematic Assemb Ser i es

LEO

Wri

te,

1024

x 4

1 y Drawing

7000

F

CON

Description

Mapp

i,ng

and

Bus

Control

Spec

if i cat

Specificqtions

Bit

Memory

ions

Stat

i cRam

Card Timing

TEN

T S

Description

o

APPENDIX

A

Plan Using STD/Series 7000 Cards

#133

Thermal

Application

Note For

Microprocessor

Systems

o

u@@@

7701

o

~l(lc')

[~;)UJJ®~~~~~~~~--~-·-·:MEMORY

16K BYTE STATIC RAM MEMORY CARD

This card provides sockets for Read-Write type RAMs pairs

of type PROMs not

be mixed on the same card.

7701

The mapped into either 8K address space. An on-card jumper system users

microprocessor memory each FEATURES

• Sockets

PROMs User selectable card address

•

All

STO BUS lines buffered

• Minimal

All

Ie's

•

• Single

• Use Pro-Log 01004, 1Kx8 memories (two 2114L's)

or

PROM Memory. The card uses 2114

or

equivalent and has sockets for

RAMs. Alternately the card

or

equivalent. PROMs and RAMs can

decodes 16 address lines, and can

or

to

establish which 16K segment

for

16K bytes

logic

bus loading

socketed

+5V

operation

up

to

16K bytes

7701

of

2114L RAMs

16,384 bytes

wi"

accept

of

consecutive

allows

of

a 64K

occupies.

or

of

16

3625

be

3625

CARD

o

DATA

BUS

Do-D7

MEMRQ"

RD" WR"

MEMU"

ADDRESS

A13-A15

ADDRESS

A10-A12

3/

I

31

,

l

,.

-

II

I

-

READ

WRITE

CONTROL

CARD

SELECT

DECODER

CHIP

SELECT

DECODER

~

-

P-

1.0..

r-

3-STATE

CONTROL

) ,.

BUS

"\

11/

,

DATA

r

~

/

1/

,

RAM ARRAY

IK.I

""IW

DATA

~"E"

••

AV

IKd

-RIW

DATA

-Ill

'"

ADORE

II

~

HU

ADDRESS

Ao-A.

101

I

•

11K STATIC RAM

SHADING INDICATES SOCKETS ONL Y

BUF

101

,

/

7701

"INDICATES ACTIVE LOW LOGIC

1

2.

FUNCT10NAL

The

7701

statis

complement address address elements mapped designated

Each

memory

Assembly Diagram 102687)

DESCRIPTION

1s

organized

RAMs.

I/O. Each pa i r

'Although

of

21l4L

is

present

range

is

including

memory

block

to

chips,

even

chosen

processor

blocks

consists

accept

the

if

to

of

the

0 -15

16 card the memory prevent

of2

may

data

chips

on-card

211lll's

(MBO -MB1S).

each (1024

pair

be

populated

bus

contention

memory,

add 1 K

(32

sockets)

drivers are

not

other 8-b

x4)

2114L 1024 x

with

are

enabled

plugged

with

memory

it

bytes

2l14L

RAMs.

less

in.

other

of

than

anytime a

The

system

cards,

RAM,

(Reference

4-bit

the

card and

wh

full

valid

memory

i ch

are

o

;

\..

v 11.)

..

-~~----~

r----.....-..--

,

(v

......

---

r-,-------.............

I

(VIi)

~---

r-

--------~~

,

(YI

~---------

,

................

:

tUI'-)

~-

v('

""

~

.......

~---~

I~)

,v,,~+

M

BS

-

S)

N\

~~

.-

.....

M117

P (::

-----..,.

~

(V

________

-

......

.

<VLlj

-

----~

---.----.-. ----.

(V2.~;

------t

......................

(\.t

......

-----~.J

...-._

...... 1 ---

(V:l.4):

"-o"""~"

2..0:;:

1

_-,

-.j

l..l)

r---M"Bi

~

LV

lS)

..

---

.,

-

~~~)

1--' --..-.

'(\I

~

__________

-------4

-----

-........----

'''\l~

~~

1.'1)

M

~

'0

-,----...-...........

'l

V2.

~

")

M

~I

..:---

:

(v

,

1

1..,) --:'Vll\

... _ -_

r

-----

'lv

~~)

.--

,---

I(\J~\)

~-_,

......

-

------~

____

r--------,

I

(U'l'l.)

~---.

\I

f~'~(\'

-----"

-----_..J

......... ---

M &

'1

---

.-

1V1I~J"\-

~AB

----,

lU33)

--

..-

f

(,

_~J~_:J

-

~

(...J

.........

f

(v

,2:

-;-37):

.....

.-.....-

C'"

--------

.......

-.

(v~q)

~--l

1.5

(1I~~

~C'.y~\\...

~

.-~,

+

......

_,

as)

...J

-........-,

~

(,)

-----;

t

~)

---.

.---_,

-..J

:

,

:

;

I

o

PROM

OPTION

The

card

increase

same

10

of

card.

all

is

designed

in

card

If

ch

ips.

power consumption.

this

to

accept

option

type

is

exercised

3625

PROMs

2

PROMs

and

be

sure

in

place

RAMs

to

cut

may

of

2114

not

traces

RAMs

be mixed

and ground

with on

the

an

o

IW4U!1j.ui\ly!n!!i'j!!

o

...

----.l_.~~

3.

CARD

ADDRESS

0000

4000 8000 COOO

MAPPING

3FFF

7FFF BFFF FFFF

16K

BANKfl

SELECT

~

'A'tsn4*

o 0

{

0

001

o 1 0 o 1 1

1 0 0

1 0 1

1 1

0

1 1 1

SX1~

o =

Sy~,:

=

CARD ADDRESS

~

SO

0000"1 S 1 2000 S2

4000 +5FFF S3

6000~7FFF

S4

8000 S5

AOOO S6

COOO S 7

EOOO

(Lower (Upp'e r 8K)

SELECT

-t

3FFF

+9FFF -

."BFFF

-+DFFF

..,.

FFFF

8K)

RANGE

FFF

--Sy~;~

sx~'~

Lower Upper

8K

CARD

The

upper

for

card

four

(SX*)

I'IIt"'~~@-~

AI5

@

~'4.@-~-.

1

A

3@-

three

address

16

banks. Address

and

the

upper

14-1...S+~

D

(IJ~)

,~

c.

'4,

&

IS

A

(A15,

selection.

8K

s"

S5

.sc,...

S~

.$2..

S J

~o

SELECT

A14,

A13)

line

(SV*)

II

0-

16

DECOD I NG

address

A15

and

A13

is

decoded

of

the

16K

74LS42

lines

A14

bank.

(U4)

are

decoded

are

decoded

for

selection

} C

~

} 'I-

(:,'<>

'"

~.

~

()()<:)

""

<:)

~

»

J

o<::>~<:)...,

by

an

74LS42

to

select

f

~

f:~

'"]

1=1=='f.

of

I"Ff

t:

one

of

the

lower

('S\\-ll'l'E~

~\,<f'F

(U4)

8K

POf:>I\loo-I~

•

4-----.----;;

3

........

SY

.s

*"

X)t

0PflE1<

LOw€R

~K

~t£eT\~

cat<

s~LEc.·

..

noN

The

banks. U5

and

lower

U5and

u6

U6

are

three U6,

is

strobed

designated

AI\

addres:s 1 t'nes'

U5

is

strobed

by

Sy*

line

Chi'p

CHIP

Select

5ELECr

(A12~

bY'

a~d

All~

S.X"~

ltne

sel~cts

Decoders

DECODER~

Ala)

on

are

and

select~

the

upper

the

decoded

the

8

addres~

s:chematt'c

by.

two

lower

dt'agram,

8 addres:s

6ank~,

o

each

Each The and

chtp

lower

are

AIO

enable 1 ine ten

address 1 ines

buffered

@-'---";:+--

goes

bY'

U3

SKlf

to

are

and U7.

ptn

8

(cE~'~l

used

for

of

dlrect

a

patr

of

address

2114L

lng

of

chi'ps~p

the

1 K

(1

K

chi'p

block)

pat

o

rs,

o

4

o

FROM

SX~~

CARD

LOWER

SELECT

8K

DECODER

(U6)

CHIP

ENABLE

CE

t;.K~':

CE2K~~

CE3K1:

CE4K~':

CE5K~~

CE6K*

CE7K~~

CE8K

CHI.P

UPPER

U9 UIO U

11 Ul2 Ul3 U14 Ul5 Ul6

~ET

LOWE~

Ul7 Ul8

U19 U20 U21 U22 U23 u24

BLQCK

MBa MBI MB2 MB3 MB4 MB5 MB6

MB7

SH

I.

PPED

ADDRESS

RANGE

8000 -83FF 8400 -87FF 8800 -8BFF 8coo -8FFF 9000

...

93FF 9400 -97FF 9800 -9BFF

9COO

...

9FFF

c

FROM

SY~':

CARD

LOWER

SELECT

8K

DECODER

(U5)

CHIP

ENABLE

CE9K~':

CE

I

OK~':

CE11~'~

CE12K~'~

CE

l3K~':

CE

14K~':

CEI5K~':

CE

l6K~':

CH

I, P SET

UPPER U25 U26

U27 u28 U29 U30 U3l U32

LOWER

U33 U34 U35 U36 U37 U38 U39 u40

BLOCK

MB8 MB9 MBIO MBlI MBl2 MBl3 MBl4

MBl5

AOOO -A3FF A400 -A7FF A800 -ABFF ACOO -AFFF BOOO

...

B3FF B400 -B7FF B800 -BBFF BCOO

...

BFFF

5

pAGE

~

-------'---------------------------

.l[)MP:

e:

1\

0

1

2

4

3

6

5

8

7

A

9

B

0

C

E

~~t{t!J

F

O~

\~

2J(

3)(

4)(

Sx

(0'1.

1"1..

~~

q~

Av..

ax

<!.~

DX

E'(

F~

_IM1

,

1M!

J

1Mf,

I

J~

I

N\1

o 1

I

IN\

~Ll

J

I

M1

'9

I

M1

)\'2.

I

1M

~o

I

Ml

)t1

I

~el

'M]

I

1M

~'21

I

1M

~D

I

L\

I Ml:

>~1

I _

t

M1

I

II

>9,

I

M(

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f _

~J

)9,

),2.. I

I

I I

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I

I I I

I I

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J

I

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I

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1

I

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I

~I

1M

'M

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\J.~

1M

'M

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I

1M

J I I I

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1M

I

IN\;

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L'M

J

MSSI

I

I I I

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I

M

,

I

~51

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~q

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f I I

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,

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1

J

~l~,t

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I

T M

B\OI

f

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,

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(pI

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1M

BlOT

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1M

01'-\

1M

~2.

J'M

~I

1

fiJI

BIoi

1M

:W~:

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~'2..T

1M

IM~

)(p

_ I

I

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1Mf.

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1

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f

1

J

I

SS,

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>7

I

ht\E

(

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,

1M

r

I~

I

I Ml

f I

1

M~

I I

1M

I I

I

MF"

:

M~I\:

l"M

t

1

M1

I

1M

I I

1M]

I

IMl

,

I

)l\ I

~161

,

I

~~

I

~7r

l\1

)lS

1

~~

I

t

~ISl

J

_ 1

>3 I

~'1

I

1

~\\,

1

~15

I

,

~O

to

Sy

&1

TO

SX

,

~2,-

;0

4'1

10'3

TO

-~'I(

~"

"TO

~T

106

TO

sx

Sb

TO

SV

S7

,TO

~X

o

MEMORY

ADDRESS

MAP & JUMPER

Card

Add,...

SELECTION

Selection

6

TABLE

POR

lK

MEMORY

BLOCK

o

4.

READ,

WRITE,

AND

BUS

CONTROL

,

Q.V

-S

~~

?4L.S~~+

'f

f:-E.R S

o'J

u2

~fMirt

o

~

L---------u

The

write

BUS

BUFFER

Logic:

ROM;'·

=:

WRM;'·::=

strobe

di

[(SX + Sy) • MERQ • READ] [(SX + Sy) • MERo. • WR

to

the

recttonql

2114L chips.

control

is,

the

ITE]

qnd

the

read/wrrte

implementati"on

1

control

of

the

TO

WR\TE

wE*"

(p,~

MJ...

~\\A.\'-

s(gnals

followi'ng Booleqn

EN~

\0)

(!,H-\P$

for

($

If

Intel

of

the

for NOTE:

a

valid address elements mapped

this

Mask

WRM*

option.

The

Card's address range

including

I/O.

ROM

line

is

and ground

chosen

3625

data

is

(PROMs.

bus

present

to

processor

to

be

and

RAMs

drivers even prevent

on-card

used,

10

of may

(74LS244)

if

memory bus

7

It

is

necessary

qllmemory

not

be

chips

content

memory,

sockets!

mixed

Ul

and qre

ion wi'th

other

to

on

the

U2

are

not

plugged

other

memory

cut

the

two

Pads

qre

provided

same

card).

enabledanytlme

in.

system

cards,

memory

and

traces

The

card

memory

5.

ELECTRICAL

Vcc

:::;

SPECIFICATIONS

+5V

±5%

o

Icc = 2.08A

Power Sockets

8.0 fully

maximum watts

(typ rca

loaded

(l.6A

(65mA

typical)

1)

~'d~

per

RAM

with

maximum)

Address, Data, and Control Busses meet specifications 2

LSTTL

loads

except:

maximum

OvrPUT

INPUT

(LOADING)

MNEMONIC

+5

VOLTS

GROUND

-5V 07 06 05 04 A15 A14 A13 A12 A11 A10 A9 A8 RO' MEMRO' MEMEX' MCSYNC' STATUS

0'

BUSRO'

INTRO' NMIRO' PBRESET' CNTRl' PCI

AUX GNO

AUX

-v

A10,

All ~ A12 ~ These

each.

STD/7701 EDGE

NUMBER PIN NUMBER

(.DtU"e.) LS.,

.....

~L

',"

VCC GNO

55

1 1

5~

10

56

1 1 1 1 18 1 2 22 2 2 26 1 1 1 1 1 36

IN

"Designates Active Low Level

55

12 14 16

20

24

28 30 32 34

38 40 42 44 46 48

52 54 53 56 55

CONNECTOR

1

2 4

3

6 5

f---

I---

8 7

65

~!;

9

11

~'$

13

~5

15

17

19 21 23

25

27 29 31 33 35 37 39 41 43

45

47

50

49 51

OUT

RAM

all

STD

PIN LIST

OUTPUT

(DRIVE)

INPUT

MNEMONIC

+5

VOLTS

VCC

GNO GROUND

-5V 03

1

02

1

01

1 1

DO

1 A7

AS

1

A5

1

A4

1

A3

1

A2

1 1

A1

1

AO

WR'

1

IORO'

IOEXP'

REFRESH' STATUS BUSAK' INTAK'

WAITRO'

SYSRESET'

CLOCK'

PCO

AUX GNO

AUX

Logic

+V

BUS

address

L4S.

'\II..

(LOADING)

l'

general

bus

~1tt.

electrIcal

Inputs

present

o

**

See Appendix

A,

Thermal

Edge Connector Pin List

Considerations

8

--~-----------------------------

o

----

6.

MECHAN,CAL

$PEClF~CAT{QN$

o

The Series 7000 cards including those

STD

CONNECTOR

CARD

BUS

EDGE

shown.

conform

-+--~A------------------------------------~,'--~----~

to the STD BUS standards, with the

6.5 CM)

(16.51

.600

(1.52

CM)

(.64 CM)......

DATUM

.0150x45° BOTH

.06

MIN

SIDES ENTIRE

R,

2 PL

BEVEL

5.7

(14.48

LENGTH

CM)

following

.250

additional requirements,

.-

[.

CARD EJECTOR

(.64

4.1

(10.41

.250

CM)

(11.38

CM)

4.48

I/O

CM)

INTERFACE

CARD

EDGE

o

TOLERANCES: .XX =+.025, .XXX=+.0050

Series 7000 STD BUS Standard Card

3.375±.002 (8.57 CM)

.300+.005

-.000

(.76 CM)

Outline

Series 7000 STD BUS Edge Card Finger Specifications

9

MMfAiiliiliiiM'+\"':;&\Ik i J I

Jli.lI¥rlIM

i

7. 21141024 x 4

o

Ac,

As

C£)l'-.\F1QVRf»i'~"'"

BIT

STATIC

RAM

DESCRIPTION

b,;

(D?)

01

lo(.j

0;

t!)~)

I}~

(M')

o

2114 AO

DO

WE"~

RAM

Address

-

A9

03

-

CE"~

Chip Wri

Vee

-:!:-

NAMES

Data

Enable

te Power Ground

tnputs·

tnput/Output

Enable

(+5V)

ACTIVE

High

High Low

High

Read/Low

-

..

o

STATE

Write

o

10

~~"

..

:~:'"

'*

A'5

",4-

"13

Ale

Ail

AID

PCO

PC'

A9

AS

A"J

A4-

,.3

112

AO

Reo;

CIIRO

bELECT

pO:CC/,..R

+ 5

\I

12.

~

t:ll

18)

...

,

~Z/))

- .

13

iUS:

7

;

CE/~J('"

l.EISK

.j:-

14

a

..

s ..

CEI4K'R

51

S

!:.E.I~I(1-

15

A

53

...

C.E\2t:

....

~

c.£.'Ji<.:#

c.E'K.

..

CEa~~

C£'1K*

C'E6k.lf-

':ESk"~

C.f4-~'"

CE3,:::

.....

c.t:~<'*

®;

CE,K1t

~

AOORE&5

WfFERS

~.·=!V\RC4:0~r------------=

G~'>-I

-------

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m::"'f

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-----~------~~----~.~.~----~--------------~--~

TYP

(-TYP)

wr;M,.

'rID

WRM",---l

--------.

TYP

(TYP)

+5V

C

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7000

MEMORY

CARD

cards are designed

TIMING

to

communicate over the STD BUS backplane in any combination user timing considerations. The following information is provided memory

Figure added to the in Figure

chip

variations which can be used in the Series 7000 memory cards.

lO-'

shows the functional blocks

of

the 7700 Memory cards. The delays contributed by these blocks are

memory chip delays and access times to determine the

,o~

gives maximum propagation delays for the memory card. For exact delays use the IC

manufacturer's data sheets and the appropriate schematics.

to

accommodate the

AC

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without

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of

the card. The table

o

MEMlX·

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35 ns

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25

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160

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For

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Data

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is

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(20ns)

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RAM

•

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are

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presumed

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7701.

th

In

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to

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is

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14

---~-------~------.-~--

o

PLAN

#133

-

THERMAL

7000

APPL1'CATION

CARDS

NOTE

FOR

MICROPROCESSOR

SYSTEMS

USING

STD/SERIES

c

TABLE

SECTION SECTION SECTION SECTION SECTION SECTION SECTION

ILLUSTRATIONS

FIGURE

OF

CONTENTS

1

,2

3 It

5

6

7

1 2

INTRODUCTION

THERMAL

CONFIGURING A TYPICAL

FAILURE THERMAL FORCED CONCLUSION

THERMAL HEAT

CONSIDERATIONS

RATE

ACCELERATION

RESISTANCE

AIR

COOLING

AND

ELECTRICAL

FLOW

IN

ENCLOSED

OF

FOR

STD

SYSTEM

DUE

TO

ICs

ANALOGY

DIGITAL

SYSTEM

SYSTEMS

T

J

TABLES TABLE TABLE

TABLE

1

2

3

•

TYPICAL

THERMAL

FAILURE

NOMINAL RESISTANCE RATE

POWER

AS A FUNCTION

15

DISSIPATION

OF

TYPICAL

OF

__

IC

T

J

."'11:;

FOR

SERIES

PACKAGES

7000

CARDS

THERMAL

APPLICATION

NOTE

FOR

MICROPROCESSOR

SYSTEMS

USING

STD/SERIES

7000

CARDS

SECTION

The

failure

junction depends

over

and

dissipation

cabinet This

his

thermal

as

well

Heat flow and thermal

AT

1 -

INTRODUCTION

rate

temperature.

on

many

the

high

which houses

application

problems.

as

suggestions

is

analogous

equivalent

of

many

factors

dissipating

of

the

note

is

are

electfical

Temperature

such

as

components,

component, and

system.

intended

Sample for

to

analyses

minimizing

current

presented

rise

power

to

flow in

components

from density thermal

the

thermal

aid

the

user

of

two

thermal

an"

electrical

in

Figure

is

an

ambient

i.e.

watts/inch

·resistance characteristics

in

estimating

Series effects.

1.

7000

exponenti~l

to

Junction

.(junction-to-case)

Systems

circuit.

function temperature

3

air

,

of

and

are

The

velocity

the

solving

included,

electrical

of

TH£R.nAL

llT

CIRCuIT

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THE~"1AL

THERMAL

SYMBOL

P

T

R'

e

i

POWER

TEMPERATURE

-

THERMAL

EGuf-lTIONS

NAME

(HEAT

FLOW)

DIFFERE;NCE

RESISTANCE

UNITS

WATTS

°c

°C/W

/SYMBOL

I

V

I

j

R

I

~

I:l

V"~

ELECTRICAL

NAME

CURRENT

VOLTAGE

01

FF~:

ELECTRICAL

RESISTANCE

I.

Ii

UNITS

AMPS

VOL

TSI

OHMS!

I

!

I

i

o

I

r

FIGURE

1 -

THERMAL

AND

16

ELI

o

. -

Figure heat heat the

any

te~perature

raises

ReCAI

the

2 shows generated generated

different junction

the.

to

the

ambient

junctions

and

TJ encounters

case

ambient

temperature·outside

--

STD

cards by a card by

ICs

plus

the

case

temperature

air

as

heat

is

any

within

is

the

to

in

the

sources

the

sum

of singular the

IC.

assumed. Heat flow from an

junction-to-case

TC'

From

enclosure, the

enclosure

in

an

enclosed

numerous

components. Most An

average

the

and

heat

thermal

IC

case,

finally

sources:

thermal

the

.digital

heat

IC

resistance

heat

through

is

resistance

with a junction

flows ReA

system.

the

generated

ReJC

to

between

and

through

give

TA

The

in

c

I

L

__

HEAT

SOURCES

Tc..

TA

JUNCTION

ReJC

IC

CASE

ReCAI

AMB I ENT

ReA

- - -

AMBIENT

ENCLOSURE

IN

OUTSIDE

enclosure

I

l

r

I I

I

(

l

f

.J

--

ENCLOSURE

TJ TC -IC

TAl';" Ambient

TA

ReJC R

ReA

FIGURE

When

many

use

o

The techniques

solutions.

of

IC

- Ambient

- Thermal

eCAI

- Thermal

2 -

heat

sources

analysis

is

necessary

junction case

HEAT

with

temperature temperature temperature temperature

resistance, resistance,

resistance,

enclosure

FLOW

IN

are

involved,

assumptions,

to

understand

in

enclosure

outside

junction-to-case junction-to-ambient

ambient

ENCLOS£D

the

approximations,

the

17

enclosure

in

DIGITAL

thermal

problems

enclosure

SYSTEM

circuit

and

in

enclosu~e

to

ambient

becomes

experimental

find

practical

outside

quite

complex.

_

..

au

..

"~A

i

fP/!ihT#Mp

# 4

SECTION

2 -

THERMAL

CONSIDERATIONS

FOR

STD

SYSTEMS

Pro-Log higher. system.

Card placement and configuring contribute

tribution cards

In

7702 power dissipation

Further adjacent forced

This

Example 1 Example 2 for

Series

We This

of

lower power.

an STD/Series 7000

ROM,

distribution.

temperature

to

air

application

1"

spacing

7000 logi.c

recommend a

provides

a

system.

to

optimizing

can be

7602 I/O,

for

the

component

cooling

is

for

is

for

on component

card

achieved

7701

This

these

reduction

to

note

three six

cards

maximum

for a +300C

rack

Distribution

system

by

system a sequence

RAM,

sequence

and

other

side

improve

includes

fully

are ambient

orientation

performance

spacing

7502

Series

can be

of a high

air

circ~lation

sample

loaded

sequenced

side

of

designed

temperature

of

high

I/O,

was

achieved

7701

as

7701

with

free-air

are

power

and

power-dissipating

of

six

7604 I/O

used

7000

in

cards

power

calculations

RAM

cards

listed

RAM

card.

components

temperature

rise

imp~rtant

throughout

lifetime.

cards

is

Example

is

by

leaving a card

dissipating

in

the

above,

rated

of

over

on 1/21: and 1"

normal

considerations

the

card

Even

cards

such

as

7803

a good example

2.

Nominal

listed

card

for

(See

in

Table

card,

rack.

for

two

1/2"

centers

Configuring a Typical

at

+55°C

room

rack

power

between

CPU,

of

pO\'Jer

slot

empty

or

by·

system

centers.

+700C

for

temperatur~

in can dis-

even

1.

oi

this

providing

situations. and

again

system)O

To

determine

be

exceeded,

with

whether a particular

the

user

the

method

1.

Measure on

thermocouple

.selected

junction

2.

Use junction

~cceleration

Use

3.

to-case

accurate

4.

Using the

5.

Calculate

6.

If

'after

above for

outlined

the

card(s)

the

data

Table 3 to

for

the

device

the

card

the

TA,

the

system

can

case

IC's. temperature

temperature

the

caku'lations

manufacturer's

dissipates.

the

cage

temperature

subtract

calculate

below.

temperature

in

question.

probe

in

factors

maximum

imbedded

Typically Table 2 to

find

device

is

TA

by

this

the

enclosed,

card's

the

maximum

(TC)

This

in

silicone

this

(TJ).

for

different

approximate

or

devices

use

the

data

TA

acceptable.

has

stabilized.

from TA, and

amount.

Te

determine

This

ReJC sheets,

measure

temperature

acceptable

of

the

can be accompl

grease

will

table

being

result

the

shows

temperatures

thermal

considered.

from

the

determine

See sample

the

If

lO\A/er

parameters

hottest

in

maximum

different

resistance

specific

exhaust

this

temperature

the

acceptable

will

ambient

device

ished

the

acceptable

(TJ).

the

calculations.

temperature

or

by

placing

sockets

worst

failure

junctionFor more device

maximum

TA'

temperature

devices

a

under

case

device

manufacturer. power

(T

)

is

mu~h

calculated

O·

18

o

()

CARD.

NO

.. 7504 7502

7506,7503

7601 7602

7603 7604 7701 7702 7801 7802 7803

CARD

TRIAC

RELAY

OPTO

INPUT

TTL TTL TTL

TTL

RAM

CPU

ROM

8085

CPU

6800

CPU

z80

NAME

ISOLATE[

I/O IN I/O

110

NOMINAL

16.75W

1.

2.90

1.

2.3)

8.00 1 .00

5.00

6.30

6.00

POWER

(maximum)

50

50 10

75

WATTS

TABLE

1 -

TYPICAL

o

POWER

DISSIPATIONS

19

FOR

SERIES

7000

CARDS

I\)

o

EXAMPLE

1

SAMPLE

CALCULATIONS

7701

MEMORY

CARD

Equations,

Assumpti9ns and

Constants

a

Absolute T

J

=

125

C

Desired

Maximum

T

J

= 1t50C

Hottest

IC

for

],101

RAM

card

is

2114L

in

center

of

card &.

RWC = 450C/watt

Pmax(2l14L) =

0.37

w

T

J

=

Te + RSJC . (Pmax)

~T

= T

J

maximum

desired

- TJ calculated

Maximum

TA=

TA

measured

+AT

Calculations

for

7701

Memory

Card

with

16K/2114L's

convection/

coorlnq

1/2

i

'

Spacing &

TA = 23.2

0

e

TC = 93.20C (measured)

T

Jf.

93.

2°C

:'"

(45°C/W)

( ·

37W)

T L.93.20C +

17°C

= l10·.2oC

J - '

~T

=

115°C ~ l10.2oC =

4.8°c

Max i mum T A'

= 23. 2

o

C+.l

••

8°C=28°C

1"

Spacing &

TA = 23.2

0

e

Te = 65.2oC (measured)

T J

='6

5

;~;

20(:

+ ( 4

5°

c

/w·)

•

37W

T

=65'

~1oe

+ l7°e =

82.

2

0

e

I J

.6T =

l1s6e

~

~2.

2.

o

e =

32.8

Max i mum

T f( = 23.

2°C.

+ 32.

aOC=56°c

& The

data

taken

was

on

the

center

card

of

3 adjac-ent

memory

cards.

~

Abreviations:

TA

= Temperature ambient, TJ = Temperature

junction,

TC

= Temperature

case,

ReJC

= Thermal

resistance

junction

to

case,

P =

Power

&

The

data

was

taken

on

cards

mounted in a Pro-Log

card

cage

with

3/8"

rubber

feet

o & DJta

WJS

tJken

on

the

center

card

of

3

memoO~rds

on

the IndIcated spacing

i~

"\

~

o

SECTION The

three

to

distribute culations attained third

if

configured

it

is dissipated system

characteristics.

3 -

CONFIGURING A TYPICAL

card

spacing

power

arrangements

dissipation

in example 2 which

by

the

addition

also

on

the

system

the

card

may

component

adjacent

SYSTEM

and

follows.

of a space

not

be

side

to

below show heat.

An

improvement

near

the

optimal.

of

the

circuit

three

The

first

cODponent

The

RAM

card. side

possible two

of

side

additional

This

of

the

system correspond 6°C in

of

the

space

the

may

depends on

RA~

card

configurations

to

the

cal-

calculated

7701

RAM

card.

give

better

the

power

and

other

TA' was

The

result

o

First power

attempt

for

distribution

Example 2 (See sample

calculation

Second power

(~ee

attempt

distribution

example 2 sample

calculation

T

=

520C)

,

A

for

TA,=56OC)

s...

-0 -0

s...

ro

O~

Ql

C

Ql

x

Ql

""

0

00

'"'

N N

0

.........

'"'

0 0 0

'-'>

r-....

'"'

rt\

~

"'"

..:t

0

'-'>

'"'

0

i

lW

w

r

t--

7W---i 1-10.85W1

.

..-

8. 1 W

-I

t-

1

o.

1 W

-i

s...

Ql L

-0

L Q)

ro~

U x

-0

C

Q)

0

""

co

'"'

N N

0

'"'

0

~

'"'

[]

lW

Q)

U

ro

0-

(/)

&

OW

I

2

I

1

J75W

I

I-

1

2.0

5W-I

I:-

4.

rt\

0 0 0

'-'>

r-....

'"'

~

8\~

75

!

i

j

I

3W

05\01

..:::r-

'-0

........

m

W

;

I

i

I

2.i3W

I

-0

s...

ro

O~

-+

-0

s...

Ql

c

Q)

x

Ql

"'0

1-

ro

U+J

Q}

-0

C

Q}

x

Q}

A

11

cards

centers.

Power in

distribution

groups

slots

As

above excep t spacing side

on

of

on

1/2"

of 3 card

component

7701

RAM

.

111

card.

t--

-0

Third power

attempt distribution

(no sample

included

for

calculations

in

text)

L

I'O~

u x

+

I

1--7W

0

~

Primary for

the

consideration

high

power

should

dissipating

s...

Ql

C

Q.)

7W

0 0

""

00

'"' '"'

-1

~

8.

1 W

-t

1-2.

N

'"'

j

+

----4

t-8.1W""1

l-

2.

be

given

card.

1-=

9.

1 W

--f

f-

9. 7 5W

lW

-I

Ql

N

U

(/)

ro

0-

0 U

r-....

'"'

0

~

'"'

ill

11

I'

r

OW

1.

1W

!

'-9.1W~

l\.J-i

I-

to

21

8\~

I

8.

05W--l

I-

the

....

4.

05W

~

t-l2.05W-i

Q.)

CV"\

0

1'0

'-D

........

0-

(/)

[J

,~\

1

~

I

i

OW

t-

4.

05W-4

t--4.05'tH

9.

75W-{

space

-4

..:::t

0

'-'>

r-....

75W

2.J~J

provided

s...

Q)

-0

""0

L C

1'0

u~

Q.)

x

Q)

As

above

1"

space

sides

RA'1

of

card

except on 7701

~

I

on

the

component

106257

both

side

I\) I\)

EXAMPLE 2 -CALCULATION

STD/7000

MIXED

CARD

SYSTEM

Equations,

Assumptions and

Constants

7701

Memory

Card

with

16K/2114L's

convection

cooling

°

Absolute T

J

=

125

C

Desired

Maximum

T

J

=

115°C

Hottest

IC

for

7701

RAM

card

is

2114L

in

center

of

card

RaJc:: 45°C/watt

Pmax

(2114L) =

O.37W

TA ~ 24°C T J = T C + Raj C .

(Pmax)

1/2' t

spac i ng

TA

= 24.8°C

TC

= 70.8°C(measured)

°

T

J

=

70.8

C + (450C/W}(0.37W)

T

J

= 70.8°C +

17°C = 87.8°0

AT

= T

J

maximum

desired

- TJ Calculatedl

AT = 115°C -87.8°c

= 27.2°C

T

A'

maxi

mum

- T A measured +

AT

Maximum

T

A

= 24.8°C +

27.20C

°

TA,max = 52

C

I

1"

spac i

ng

component·

side

7701

on

1)

TA

of

24.8°C

TC

= 64.8°C(measured)

TJ "64.8°C +

(450C/W)(0.J7W)

TJ 64.8°C +

17°C = 81.8°c

AT

= l15

u

C -

8l.8uc =

33.2uC

Max

T

A

=

24.8°c + 33.20C =

58°C

T A

max. = 58°C

NOTE:

these

calculations

are

for

the

first

two

of

three

examples

of

configuring

a system

for

even power

(heat

distribution).

See

figure

The

data

taken

on

cards

mounted in a Pro-Log

CR16A

card

cage

with

3/8" rubber

feet.

o

~

SECTION

4 -

FAILURE

RATE

ACCELERATION

DUE

TO

T

J

Table 2 indicates based average temperature. may

Additional

analysis

length

on

the

assumption

activation

It

vary

from

should

of

RECOMMENDATIONS

Good Operating Range

Acceptable

Intermittant

Operation

those

design

time.

TABLE

the

energy

should

upon

margin

be done

2 -

FAILURE

for

relative

that

be

which

is

if

T

J

55°C 65°C 7SoC

85°C 95°C 10.04

lOSoC l150e

failure

the

Arrhenius

is

0.6eV. T

noted

the

that

the

recommended

designer's

RATE

ACCELERAT I ON

Relative

J

acceleration

AS A FUNCTION

1

.00

1.

3.39

5.92

16.56

26.62

rate

as a function

relationship

=

5SoC

different

if

TJ is

system

F~rrOltS

to

55 C

87

is

used

as device factors

above 10soe. causes

OF

Incremental

manufacturers'

TJ to

T

J

1

.8

1.87

1.7S

1.70

1.65

1 .61

of

junction

is

valid

the

in Table 1

and

reference

Also,

exceed

temperature

that

are

a more thorough

the

assumptions

based.

10SoC

for

any

Not Recommended

Example: The

will

the

l250e

MTBF

on

the

same

(mean

average

device

41.78

time

with

to

failure)

be

3.39

T

J

=

75

for a device

times

o

c .

longer

1

.57

than

with

the

T

=

J

MTBF

55°C for

•

23

SECTION

5 -

THERMAL

Typical packages antee, thermal following

but

RESISTANCE

thermal

are

represent

conditions

definitions

resistance

shown

OF

in Table

the

latest

are

assumed in

apply:

ICs

values

3.

The and

of

standard values best

the

plastic

shown

available

resistance

integrated

do

not

imply any

data.

measurements.

Steady-state

circuit

guar-

Also,

o

the

Table 3 Conditions

R

~JA-

PACKAGE

8-

14-

24-p i n

14-

DESCRIPTION

P 1

as

16-Pin

or

Plastic

l6-Pin

or

- Thermal

eJc

tic

resistance

sink.

(±5%)

Thermal package in a

on

DIP Plastic

DIP

Ceramic

of

test

This

correlation.

resistance

conditions

DIP

and

Definitions

from

parameter

from

specified

which

RaJC

junction

offers

junction

socket.

are

°C/WATT ±5%

52 45

35 20

to

good

difficult

reapeatability

to

This

&

RaJA

±15%

95 90

65 70

case

still

using

air

parameter

to

reproduce

SOCKET

RaJA

freon

(250C ambient)

is

MEASUREMENT

Augat Augat

Barnes Augat

as a heat

and a high degree

highly

USED

dependent

accurately.

FOR

with

POWER

(mW)

300 300

500

-

300

o

24

lead

Ceramic,

or

16

14

24

lead

14-

or

(a

14-Pin Ceramic

(g 1 ass

8-

or

(a l10y mounted)

8-

or

(glass

TABLE

~

lead

ceramic

l6-pin

lloy

mounted)

lO-Pin

10-Pin

mounted)

3 -

For more

THERMAL

Kovar

with

Ceramic

Flat

Plug-In

accurate

Lid

glass

seal

glass

Flat

Pak

RESISTANCE

seal Pak

calculations

OF

TYPICAL

15 27 12

45

70

40

90

use

160

120

170

IC

values

50

95

50

190

PACKAGES

given

by

Barnes

Mech-Pak

the

Carrier/

Contactor

Barnes

device

Carrier

manufacturer

500

300

400

700

()

24

o

SECTION

The of

of on

It

IC

temperature

200C

Note the

For

ture Pamotor

Ai

6 -

card

forced-air the

card

the

center

was

found

on

the

of

that,

center design

such

r flo\...,

FORCED

cage

cage.

card

(TC)

ambient (TA)'

without

of of

as

Corp.,

from

AIR

configuration cooling.

The

card

of

that

"How

for

was

at

of

forced-air

the

memory

systems

to

770

Airport

COOLING

A

37cfm

temperature

the

three

this the

top

the

hottest

chip

using

Select

shown

forced-air

forced-air, the

Blvd.,

below was used

(no head) fan

adjacent

center

2114Ls

cooling, array

Optimum

Burlingame,

was

cooling

of

rather

then

7701

the

was,

the

refer Fan

to

was

mounted

monitored

RAM

cards.

configuration,

memory

in

hot

than

to

for

Ca.,

every

spot

at

fan

Your

94010.

chip

the

evaluate

at

array.

instance,

on

the top

manufacturer Application"

the

over

different

the

card of

37

(yl

effects

each

hottest

The

within

was

the

card. litera-

by

cfw

sheet

diameter

8-slot

locations

case

at

fans

mour.ted

metal

plate

mounting

section

in

holes)

c

l~)

~r

~'~4-l~~J)

c

o

o I I I 1 =

~(-.4--:-

...............

~-b[-.iJ.

'-i-+1I~

card

exten'--der-_P-:-'l----,----A;-~-

,.urA-Tr"'"

u-rr-u..JlAAu~u~~

II

r+.:J::d

~~~:;.hl-+"';;

D

u\.-"I'T"""

,,0

\.(\()

I I I I

I i I I

I I I I

u-I:~

u~ufL-"TT"'""'

1.1.()'-

I J Y

----'--'--'-r

~:J

J

~c

--r=-r~-"::."'C"\t-'

1-:;~:;..L...L..:~~;~_11

u-...,-r-

u..l:~UIPl'ff4-u-rr-u-rr-U..Ol~ulr--~

1-

0

~

i

'-

J

~

I@

o

moved

different

(1/2"

in

loaded

mounting

groups

locations

ca

rd

of 3 to

of

rack

centers)

25

fully

L

3/8"

rubber

(4

pIes.)

feet

SECTION

If

system,

in

assumed.

requirements. It

ponents components,such

system. By can

expectan~y.

7 -

power the

should

applying

determine

dissipation

convection

enclosure

other

CONCLUSION

Rather

be

noted

the

cooling

at

the

that

than

the

ICs. For example,

as

batteries,

principles

thermal

is

evenly

an

acceptable

designer

the

distributed

is

often should

deslred

may

presented

profile

sufficient

level.

assess

ambient

the

add

additional

in

of

his

throughout

to

However

his

particular

~ay

also

temperature.limitations

this

application

system

and

an STD/Series 7000

maintain

this

should

be

limited

temperature

note,

optimize

the

ambient

never

system's

by

constraints

the

its

life

be thermal

com-

of

special

designer

to

o

the

o

26

•

2411

Garden

Monterey,

Telephone:

California

(408) 372-4593

TWX: 910-360-7082

Road

93940

1066908

5K

10/81

Pro-Log 7701 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual