e 0.100 bsc
eA 0.300 bsc
eB - - 0.430
eC 0.000 - 0.060
L 0.115 0.130 0.150
PRE1.0 9 of 14
Page 10
Notes:
1. Controlling Dimension: INCHES.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimensions A, A1 and L are measured with the package seated in JEDEC Seating Plane Gauge GS-3.
4. D, D1 and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010
inch.
5. E and eA measured with the leads constrained to be perpendicular to datum -C-.
6. eB and eA are measured at the lead tips with the leads unconstrained.
7. N is the maximum number of terminal positions (N=16).
8. Pointed or rounded lead tips are preferred to ease insertion.
9. b2 and b3 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010
(0.25mm).
10. Variation AB is a full lead package.
11. Distance between leads including dambar protrusions to be 0.005 in minimum.
12. Datum plane -H- coincident with the bottom of lead where lead exits body.
13. Refer to JEDEC MS-001 Variation AB.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT5622
PRE1.0 10 of 14
Page 11
16 PINS, SOP, 150MIL
PT5622
PRE1.0 11 of 14
Page 12
Symbol Min. Typ. Max.
A 1.35 - 1.75
A1 0.10 - 0.25
A2 1.25 - 1.65
b 0.31 - 0.51
b1 0.28 - 0.48
c 0.17 - 0.25
c1 0.17 - 0.23
D 9.90 BSC.
E 6.00 BSC.
E1 3.90 BSC.
e 1.27 BSC.
L 0.40 - 1.27
L1 1.04 REF.
L2 0.25 BSC.
R 0.07 - -
R1 0.07 -
h 0.25 - 0.50
θ 0° - 8°
θ1 5° - 15°
θ2 0° - -
Notes:
1. Dimensioning and tolerancing per ANSI Y 14.5M-1994
2. Controlling Dimension: MILLIMETERS.
3. Dimension D does not include mold flash protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not
exceed 0.15 mm (0.006 in) per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or
protrusion shall not exceed 0.25mm per side. D and E1 dimensions are determined at datum H.
4. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost
extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any
mismatch between the top and bottom of the plastic body.
5. Datums A & B to be determined at datum H.
6. N is the number of terminal positions. (N=16)
7. The dimensions apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.
8. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of
the “b” dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot.
9. This chamfer feature is optional. If it is not present, then a pin 1 identifier must be located within the index area
indicated.
10. Refer to JEDEC MS-012, Variation AC.
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.
PT5622
PRE1.0 12 of 14
Page 13
PT5622
IMPORTANT NOTICE
Princeton Technology Corporation (PTC) reserves the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and to discontinue any product without notice at any time.
PTC cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a PTC product. No
circuit patent licenses are implied.