Prestigio PAP4000 Service Manual
PAP4000 Service Manual
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Contents
1. Summary ................................................................................................................................................ 2
1.1. Product summary ............................................................................................................................. 2
1.2. Appearance and corresponding functionalities ................................................................................ 2
1.3. Abbreviations .................................................................................................................................. 3
2. Specifications and features.................................................................................................................... 3
2.1. Technological specifications............................................................................................................ 4
2.2. Hardware features ............................................................................................................................ 4
3. Upgrade guides ...................................................................................................................................... 6
3.1. Upgrade of main program ............................................................................................................... 6
4. Guides of disassembling and assembling ............................................................................................. 9
4.1. Tools of disassembling and assembling ........................................................................................... 9
4.2. Steps of disassembling and assembling ........................................................................................... 9
5. Maintenance technologies ................................................................................................................... 16
5.1. Solutions to frequent failures ......................................................................................................... 16
5.1.1. The name and location of main board ................................................................................... 16
5.1.2. Hardware system framework ................................................................................................. 18
5.1.3. Basic principles and analyses and maintenance of frequent failures ..................................... 18
（A）Functional failures .............................................................................................................. 19
A． The failure of powering on ................................................................................................... 19
B. Failures of receiving voice and ringtones ....................................................................... 20
C．The failures of displaying ....................................................................................................... 21
D．The failures of identifying SIM/UIM card and T card ............................................................ 23
E．The failures of Bluetooth ......................................................................................................... 24
F．The failures of shooting photos and recording videos ............................................................. 25
G. The failures of keys ................................................................................................................... 25
H. The failures of motor ................................................................................................................ 26
I. The failures of charging ...................................................................................................... 26
J. The failures of WIFI ................................................................................................................ 27
（B）. RF section ......................................................................................................................... 29
A. RF section of WCDMA ............................................................................................................ 29
B、GSM The working principle of RF circuit for GSM ............................................................... 34
6. Quality inspection ................................................................................................................................ 35
6.1. Inspection tools .............................................................................................................................. 35
6.2. Inspection objects .......................................................................................................................... 35
6.3. Inspection items ............................................................................................................................. 35
7. Technological support ......................................................................................................................... 38
7.1. FTP Server (ftp://119.147.25.41/) .................................................................................................. 38
8. FAQ ....................................................................................................................................................... 38
9. Appendix .............................................................................................................................................. 42
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1. Summary
1.1. Product summary
1）WCDMA:850/2100MHz，GSM 900/1800/1900MHz；
2）WVGA HD capacitance screen with 4.0 inch;
3） Handwriting input under capacitance touchscreen;
4）Qualcomm 7227-A（1GHz）CPU;
5）Supporting syncing with PC, connecting to PC with USB port conveniently;
6） Supporting GPS navigation;
7） Supporting BT/WIFI
1.2. Appearance and corresponding functionalities
Keys Functionalities
Menu key Tap to pop up the menu at the functionality interface
Back key Tap to go back to the previous interface
Volume key Adjust call, ringtone, music and video volumes
Power key When the backlight is on, press the button shortly to turn off the backlight, while
the device is asleep, press the button shortly to wake it up.
Home key Tap to go back to the functionality interface from the application interface
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1.3. Abbreviations
For your convenience, this handbook adopts the following abbreviations:
AP Application processor
BB Basic band
TD TD-SCDMA, full name is: Time Division Duplex-Synchronization
Code Division Multiple Access.
HSDPA Full name is: High Speed Downlink Packet Access
GSM Global system of mobile communication
GPRS General packet radio service
TW Touch Window
dBm Decibel (referenced to milliwatts)
BL (Boot Loader）Hardware to initialize functionalities and build
mapping for internal space (full name: Boot Loader)
DSP Processing digital signals （ full name: Digital Signal
Processor）
RF Radio frequency
ESD Electrostatic discharge
FPC Flexible printed circuit
LCD Liquid crystal display
LDO Low dropout regulator
LED Light emitting diode
PCB Printed circuit board
PCM Pulse Code Modulation
PGA Programmable gain amplifier
PLL Phase locked loop
PMU Power Management Unit
RAM Random Access Memory
ROM Read Only Memory
RTC Real-Time Clock
SAW Surface acoustic wave
SIM Subscriber identity module
SLR Send loudness rating
SOC System On Chip
SRAM Static random access memory
STMR Side tone masking rating
TA Travel adapter
TDD Time division duplex
UART Universal asynchronous receiver transmitter
VCO Voltage controlled oscillator
VCTCXO Voltage controlled temperature compensated crystal oscillator
2. Specifications and features
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2.1. Technological specifications
Basic specifications
Size 123×65.8×11.8mm
Type Bar
Antenna Built-in
Phone card Mini-inserted card
Network mode WCDMA:850/2100MHz，GSM 900/1800/1900MHz
Operation system Android2.3
Processor
Qualcomm 7227-A (1GHz)
Memory
ROM:512MB+RAM：512 MB
SD card Support T-FLSHA card with 32GB at most
Camera camera with 3.2 megapixels （AF）
Port MINI-USB
Screen parameters
Type WVGA
Size 4.0 inch
Resolution 800*480
Main supported functionalities (take actual device for real)
Input method
Language Simplified Chinese
Input method Handwriting
Contacts Max Contact number 5000 pieces
Call log Max number 2000 pieces
Picture (picture
viewer)
Supported format jpg、jpeg、bmp、png、wbmp、gif
Messages Max storage 3000 pieces
Accessories
Battery
Battery name Lithium-ion chargeable battery
Specific capacity 1400mAh
Normal voltage 3.7V
2.2. Hardware features
1. Hardware configurations:
Name Specifications
CPU Qualcomm 7227-A
Power manager Qualcomm PM8029
Audio Qualcomm 7227-A
BT BROADCOM BCM4330FKUBG
Memory ROM 512MB+RAM 512MB
Primary camera Auto-focused camera with 3.2 megapixels
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Secondary
camera
Null
2. Feature parameters
Series
No.
Items Specifications
2 Battery capacity
Number of battery Voltage
0 3.500V~3.660V
1 3.660V~3.730V
2 3.730V~3.800V
3 3.800~3.930V
4 >3.930V
24 Low voltage alarm
Incoming calls: if the voltage floats over
100mV, the current may come from module, so it
needs to lower the limit of low voltage
threshold, namely, primary card 3400 millivolt,
secondary card 3450 millivolt.
Standby: when the phone is at standby, and if
the voltage is lower than 3600 millivolt, it
needs to shut the communication functionality
down on secondary card, and if the voltage is
lower than 3550 millivolt, it needs to shut the
communication functionality down on primary
card.
25
The voltage of forcing
to power off
3.40±0.03V
26 Battery
The voltage of full battery：4.2V
Capacity：1080mAh
27 Travel charger
AC input：100~240V，50/60Hz
DC input：5V，1000mA
3. Current parameters
Item names Test data
Power on ≤300mA
Calls CDMA ≤300mA
Standby Base current（Not connected to BT）≤2mA
Current of powering off ≤0.1mA
Charging loop -400~-580mA
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3. Upgrade guides
3.1. Upgrade of main program
Preparations for upgrade:
Series
No.
Name Specifications Quantity Notes
1 Computer No requirement 1
2 Data cable
Standardized data cable (slotted 5PIN data
cable)
1
3 Phone 1
4 Battery 1
adequate
battery
5 Software
Version software, upgrade tools, phone
driver and others.
Instructions：
1) Upgrade will lose the data stored in phone, so please note to save and backup the user data first
before performing upgrade for the occurrence of data losing.
2) The upgrade platform is installation-free version and supports multiport download, if it is needed,
it is advised to apply active USB-HUB to improve its stability.
Brief steps to upgrade：
1) It needs to install port driver of the device for the first time to connect to
computer.
2) To run the upgrade platform with installation-free version “Assemble customer
service Downloader.exe”.
3) When the phone is powered off, press its Volume + key and plug USB cable to computer
at the same time, and release when the screen displays “Communicating„Boot status
and version No.”. Click Start to download upgrade when the upgrade platform has
detected Online device.
Driver installation：
1) When the driver is installed, the phone is needed to be powered on.
2) Enable USB debug mode: Setting menu Select Application Select
Development Click and confirm Allow USB debug.
1) Connect phone to computer (Click No need to open USB memory device at USB large
memory dialogue). When the computer finds uninstalled new hardware, click Select from list or
designated location to install (Advanced), and select directory file of driver path (generally, it
locates in PC Driver directory) in Search includes this location, and then finish the installation
based on the instructions on computer. It needs to perform five-time installation for hardware
update wizard, as the following figure shows (installed device driver in device manager):
2)
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Detailed steps of upgrade
1) To run installation-free platform tool ；
2) When the phone is powered off, press its Volume + key and plug USB cable to computer
at the same time, and release when the screen displays “Communicating„Boot status
and version No.”. It indicates is working under upgrade module and communication
can be downloaded, when the upgrade platform has detected Online device.
Note: if the device cannot be Online with the platform in the course of upgrading,
the solution is to turn off the platform and turn it on again and get COM port set
well.
3) When the platform has detected being Online with device, click Start to enable
download upgrade.
Download the driver that APP
needs. If it prompts Apps failed to
search device at tool status bar, please
check if adb driver is normal and USB
debug is enabled.
Get port set
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4) When Integrated test is displayed in the tool status bar, it indicates the upgrade
of PAP4000 is done, please plug off its data cable for the next device.
Click Start to
enable
upgrade
Integrated test
is displayed,
which means its
upgrade is
done.
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5) Copy GPS map package/pre-installed resource package/install pack:
7260+ GPS map package is external; please copy it to memory card to use.
Copy COOLMAP package (decompressed) to memory card directory.
5.1. 7260+ pre-installed resource package, presetapp-7260+.zip, (do not need to
be decompressed), copy it to COOLPAD directory located in memory card.
Note: the pre-installed resource package, presetapp-7260+.zip, included in
the new released software version may be different from that of the form one,
please re-copy the pre-installed resource package to its corresponding
directory in the memory card after the upgrade is done.
Precautions
1) If the device cannot be Online with the platform in the course of upgrading, the
solution is to turn off the platform and turn it on again (but the premise are the
following two points, a. the driver of USB port is installed well; b. the phone
is switched to upgrade mode successfully);
2) The default configuration of upgrade platform is not to perform Delete all, and
using QPST to backup NV parameters before performing upgrade is advised.
4. Guides of disassembling and assembling
4.1. Tools of disassembling and assembling
Device, instruments, jigs and tools
NO Name of product Specification Quantity
1 tweezers 1
2 screwdriver Cross shape 1
3
anti-electrostatic wrist
strap/anti-electrostatic glove
1
4 Disassemble plate 1
5 Knife 1
4.2. Steps of disassembling and assembling
4.2.1. Disassembling screws of the back shell
There are eight screws (cross shape) in 7260+ back shell, shown as the following figure:
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4.2.2. Separate the back shell
Use Disassemble plate to separate alongside with the seam.
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4.2.3. Separate the front shell
a. Disassembling tow screws and taking off the RF connection line;
b. Open TW/LCD/small board connector;
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4.2.4. Disassembling main board set
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4.2.5. Disassembling the set of the side shell
Disassemble FPCBA set
Open the connector
and turn over to the
back of the main
board.
Take off the RF
coaxial line
Open the connector and
take out the camera
use the tweezers or other
sharp objects to take off
positioning pillars.
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