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PAP3400 DUO
Service manual
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Prestigio PAP3400 DUO Service manual

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PAP3400DUO Service Manual V1.0
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Contents
1.1 PAP3400DUO brief introduction ........................................................................................ 3
1.2 Function diagram ................................................................................................................ 4
1.3 Mainboard component distribution diagram ....................................................................... 4
1.4 Main IC Names ................................................................................................................... 7
2.1 RF Overview ....................................................................................................................... 7
2.2 RF part service analysis .................................................................................................... 11
2.2.1 Launch part ............................................................................................................ 11
2.2.2 Receive access ........................................................................................................ 12
3.1 Outline ............................................................................................................................... 15
3.2 Common Failure Analysis and Maintenance ........................................................... 17
3.2.1 Power failure Check ............................................................................................... 17
3.2.2 Audio faults ............................................................................................................ 19
3.2.3 USB serial port malfunction ................................................................................... 23
3.2.4 LCD Fault .............................................................................................................. 23
3.2.5 FM .......................................................................................................................... 24
3.2.6 Bluetooth and wifi .................................................................................................. 25
3.2.7 Camera fault ........................................................................................................... 26
3.2.8 SIM card failure ..................................................................................................... 27
3.2.9 Motor test is invalid ............................................................................................... 27
3.2.10 Triaxial Gsensor ................................................................................................... 28
3.2.11 T-Flash fault.......................................................................................................... 29
3.2.12Touch Panel function ............................................................................................. 30
3.2.13Distance sensor fault ............................................................................................. 31
3.2.14 Cannot boot failure ............................................................................................... 31
3.2.15 Auto Powe r On ..................................................................................................... 32
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1. PAP3400DUO overview

1.1 PAP3400DUO brief introduction

The development and design of the PAP3400DUO PCBA is based on MTK MT6572
platform. The mainboard system mainly consists of the chip
MT6572A/W+MT6166A+MT6323A, which are responsible for t hree part functions, namely,
baseband, radio frequency and power management chip. PAP3400DUO PCBA is an all-in-one phone mainboard, w hich supports GSM, WCDMA, and covers Bluetooth, WIFI, Camera, FM functions, GSensor and so forth.
The maintenance of mainboard is one of the important links among mobile products rear-end producing. The speed and quality of maintenance relate to the rate of good products, production efficie ncy, and cost control throug hout the pr oducing. In the case of a reasonable design of product, in the end-producing, finding the significant proportion in the bad board should be SMT bad and component incoming material ba d. So, whe n maintaining, first, start with the two aspects. The principal means of fault diagnosis are: (1) find that bad welding spots or components b y microscopic examination and visua l inspection; (2) guess fail ure positions from the fault phenomena; (3) confirm the fault units by signal detection.
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1.2 Function diagram

EMI
SPI
CAM（parallel）
LCD（MIPI）
JTAG、UART
USB
LCD
CTP
Keypad
Debug port
MT6166
FEM
Filter
26M
Charge
VIB
Memory MCP
TF
Back CAM
三轴 Gsensor
NFI
MSDC1
MT6572
ABB
26M
MT6627
MT6323
BJT
32K
Audio
SIM
BAT

1.3 Mainboard component distribution diagram

Mainboard TOP
USB
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Mainboard BOTTOM
6
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1.4 Main IC Names

IC,MT6572W,GSM/EDGE/WCDMA/HSDPA/HSUPA BB+AP CHIP,1.3G,DC1318
IC,MT6323,Power Management Unit MT6323A U301
MT6572A/W U101
IC,MT6166,TD-SCDMA/HSDPA and GSM/GPRS/EDGE dual-mode Transceiver
IC,eMMC+LPDDR2,4GB+4Gb,1.8V/3.3V,x8/x32,19ns,TLC KMN5U000ZM-B203 U402
IC,MT6627N,WIFI/BT/FM/GPS 4 in 1 MT6627N U800
IC,SY7301,40V Step-Up LED Driver, PWM control SY7301ADC U801
IC,HRPF88183B,PA+4*TRX WCDMA ASM,Tx-Rx FEM for Quad-Band GSM/GPRS
IC,SKY77761,RF PA Module,LTE Band1/CDMA IMT,1920-1980MHz,3x3
TRANS,PNP,30V,3A WPT2F30 U303
MOSFET,N-Channel,-40V,-180mA,4.5Ω PNM723T703E0-2 U305
Schottky diode 1PS79SB30,115 D301,D302,D801
DIODE,ZENER,5.1V,500mW PZ3D4V2H D305
32.768KHz Crystal
26MHzCrystal(3225) X1E000021043400 X600
X-CAP,3.3V,0.01mAh,Φ3.8,1.5H XH311HG IV07E GB301
MT6166A//MT6166V U600
HRPF88183B U700
SKY77761 U703
Q13MC1461000200// Q13MC1462000200
X301
IC,MC3430,3-Axis Acceleration Sensor,Digital,8bit MC3430-I5 U1400
FILTER,BALUN,GSM,GSM850/PCS1900 OR EGSM900/DCS1800,2012 DUPLEXER,WCDMA BAND1， 1950MHZ/2140MHZ,BALANCED,2016
RFBLN2012090BM5T25 U602
PJ D6PE2G140P3AW-Z U609

2. RF

2.1 RF Overview

MT6166 is MTK's multi-mode and multi-frequency transceiver chip, supporting GSM/
GPRS/EDGE, WCDMA dual-band mobile phone.
The circuit description of Receiving part
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Receiving part functional block diagram
It can be seen from the schematic diagram, first, signal is received through antenna, reach RF coaxial switch (J700) through antenna matching, and then enter RF PA module U700.
Choose GSM signal through PA module (U700) inner switch, output from PIN20, into receiving filter U602, passing matching circuit, into MT6166 U600’s C1&D1 port, into MT6166 (U600) inner LNA;
Choose DCS signal through PA module (U700) inner switch, output from PIN19, into BALUN FILTER U602, passing matching circuit, into MT6166 U600’s E1&F1 port, into MT6166 (U600) inner LNA;
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Choose WCDMA B1 signal through PA module（U700） inner switch, output into antenna diplexer (BAND1-single-end RX) U609, divided into TX and RX two ways. RX passes the match, into MT6166 U600’ A2&A3 port, into the inner LNA.
The each ways’ signal above pass the inner down-conversion, amplification, and after ADC converting, into baseband.
The description of transmit part
Transmit part is the other way around,
GSM baseband signal within passes up-conversion and amplification, then output from U600.A11, through outputting and matching, into PA module U700’ PIN10, through signal amplification, and output into antenna port.
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DCS/TD(A/F) baseband signal within passes up-conversion and amplification, then output from U600.B8, through outputting and matching, into PA module U700’ PIN9, through signal amplification, and output into antenna port.
WCDMA B1 baseband signal within passes up-conversion and amplification, then output from U600.A8, passes matching circuit into WCDMA power amplifier. The power amplifier has in-built coupler, can coupling one part of signal to MT6166, to detect output signal. After PA signal amplification, output to the PA module（U700）inner switch, TX’s input foot, and then outputs to antenna transmit.
PA introduction
PA：HRPF88183B supports 2G four-band, the phone supports GSM/DCS two bands.
SKY77761 supports WCDMA’s BAND1
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2.2 RF part service analysis

2.2.1 Launch part
Test conditions 1：Vbatt=3.8v~4.2v
Test Equipment
Agilent8960, oscilloscope, frequency spectrograph, voltage-stabilized power, multimeter
If BT, F T find output power low or no power output, can follow the order below to check launch access by using multimeter, and also can choose middle some grade to confirm whether its front grade or rear grade has problems.
GSM/WCDMA Launch
1、 To check whether the RF test socket J700 is welded well b y visual inspection? Whether
the female polarity is correct? Whether the center of the female seat has foreign matter?
2、 To check whether the components of U700&U703&600&U609 transmit circuit are
patched abnormal by visual inspection
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3、 If the visual inspections above have no abnormality, replace U700(for 2G&3G) test
4、 If has no improvement by replacing U700, replace the U600(for 2G&3G) test
5、 If remains no improvement, replace the U703(for 3G) test
6、 If remains no improvement, replace the U609(for 3G) test
2.2.2 Receive access
Can follow the procedure below to check
1、 To check whether the RF test socket J700 be welded well by visual inspection? Female
polarity is correct? The center of the female has foreign body?
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2、 Whether filter U602(for 2G)&U609(for 3G) on the receive path, and matching circuit
welded well?
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WiFi/BT/FM Part
WIFI and BT share RF access, signal is entered by antenna. The clock uses 26M clock provided separately. Data transfer interface and audio interface are directly connected to the CPU.
WIFI main problems：
1. MT6627 chip has been calibrated before out of factory, production line directly do FT test.
The probability that it appears problems by WiFi test is ve ry low, the FT failure problems, please power off and restart the phone, first retest.
2. WIFI test EVM fail. This major and power, as well as the freq error, if the power is too high
or the freq too big EVM may also lead to excessive, please re-test.
3. WIFI RX fail, main receiving sensitivit y fai ls to pass, Generally, production line testing has
not shielded box, RX vulnerable to external signal interference, If come across such problems, can change the channel to do the test.
Bluetooth main problem：
Bluetooth does not need calibration, only need to check the function, if unable to search the device or Bluetooth cannot be opened, check whether the J800 is welding bad or body bad.
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3. Baseband section

3.1 Outline

Baseband circuit completes main functions: the procedure data storage, keyboard
input, and the communication between the RF module, RF power control, the control
of the power management module, RUIM card interface, serial download interface,
Camera, T-flash, G-Sensor, and MMI (man-machine interface, such as the display,
backlight, buzzer, speaker, microphone, motors, etc.).
3.1.1 Memory
The baseband part has an eMMC+LPDDR2 MCP. Wherein the amount of eMMC storage
4Gb, it stores a communication protocol layer and application layer software, and
storing various system parameters, calibration parameters, such as RF control
correction value of an audio signal, the IMEI number, and other important information
and store user settings data such as phone number, CALL volume, and tone; LPDDR memory
512MB, temporary variables stored phone program run。
3.1.2 Power Management
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PMU chip is MT6323，which contains 3 DC-DC and 23 LDO, one 0. 7W class D audio frequency power ampl ifier, 4-way current sink, SIM card level shift, and s o on.
3.1.3 Battery
1500mAh 3.7V lithium-ion battery.
3.1.4 32KHzCrystal
32KHz crystal is used for power-saving mode and real-time clock.
MT6572 platform supports 32K-less mode, PAP3400DUO does not adopt at present.
3.1.5 SIM Card
SIM card level shift integrates in MT6323, card 1 supports WCDMA and GSM dual modes.
3.1.6 Audio frequency
The largest impedance is 2.2KΩ.
Headset as a standard 3.5mm jack port, the nominal resistance 32Ω.
Speaker adopts 2014 specification, Receiver adopts 1506 specification.
3.1.7 I/O Interface
I/O Connector MICRO USB interface standard. Mainly used for software, download
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picture messages.
3.1.8 Display
The main screen is 4.0 TFT color screen 480*800（WVGA）.

3.2 Common Failure Analysis and Maintenance

Before cutting board after the completion of the production line SMT X-RAY inspection, according to the actual situation, X-RAY examination cannot be found 100% badness, X-RAY inspection may omissions some fault plate flow down. If found fault plate in the testing process, the first step is to re-check of the X-RAY and carefully to see if there is even welding, lap welding,
Weld, if normal, analyze the situation following the positioning。
3.2.1 Power failure Check
The failure phenomenon caused by a power failure: cannot boot, shutdown leakage current boot large current. The main reason for the problem: Weld, electrical the original filtering or ESD device to short-circuit, burning with the device is connected to a power source. Positioning as well as steps to solve this type of problem is as follows:
1， Troubleshoot and connected to the power supply components of the welding, Weld, or the
peripheral devices even tin.
2， with a multimeter rule out whether there is power to short-circuit, and step by step to
troubleshoot the cause of the short (mainly: even tin, IC burned ESD protection device breakdown, capacitor breakdown).
3， boot to test the power output is normal.
If a power output value is not normal, whether the view filter capacitor welding problems, whether the breakdown, filter capacitor is broken, replace; excluded one by one, and finally you can navigate to the main chip damage.
Each the power test position and the normal boot value is shown in the following table
power VPROC_PMU for BB VCCK,VCCK_CPU VSYS_PMU for PMU AVDD22_BUCK VA_PMU for PMU AVDD28_ABB,AVDD28_AUXADC VCN_2V8_PMU for 4 in 1 VTCXO_PMU for BB AVDD28_DAC,for MT6166 VCAMA_PMU for cam AVDD 2.8V VRTC for back up bat
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VM_PMU for BB VCCIO_EMI,for memory VRF18_PMU for MT6166 VIO18_PMU for 1.8V PERIPHERAL VIO28_PMU for 2.8V PERIPHERAL VCN_1V8_PMU for 4 in 1 VCAMD_PMU for cam DVDD 1.8V VCAMD_IO_PMU for cam DOVDD 1.8V VEMC_3V3_PMU / VMC_PMU for BB DVDD3_MC1 VMCH_PMU for TF card VUSB_PMU for BB AVDD33_USB VSIM1_PMU for SIM1 VSIM2_PMU for SIM2 CTP_2.8V_PMU for CTP 2.8V VIBR_PMU for VIBR VGP2 / CTP_1.8V_PMU for CTP 1.8V
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3.2.2 Audio faults
The audio part has main four parts including the speaker, receiver, mic and
headphone. First undesirable phenomena distinguish what part of the problem, and
then analyzed according to the following respective module.
（1）Speaker loop
The PAP3400DUO phone’s speaker circuit is as follo w. Speaker audio output diagram is as follows：
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Speaker Common faults and reasons：
1， SPK Ringtones reasons: 1) light board, SPK itself is bad, or the connection FPC
problem, the whole observation board board PFC Cartridge is skew, not in
place 2) B503、B504、R504、R518 relevant component there is dry welding 3 ) software problems
2: SPK ringtones or murmur: 1) software volume settings 2) SPK ontology reasons
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3. Switch machine ringtones, but engineering tests SPK OK: 1) scene mode is set to switch
machine ringer off 2) software problems, itself boot ringtones;
(2) Receiver circuit
PAP3400DUO phone receiver is embedded in the mobile phone front shell through shrapnel and motherboard connection. Mainly used for the call. Receiver circuit diagram as shown below.
Receive Loop
Receiver Common faults and reasons：
1, Receiver without sound: 1) Receiver assembly adverse, the shrapnel and board
poor contact 2) Receive ontology bad 3) the volume settings or software problems
2, Receiver noise or volume: 1) Receiver incoming material, whether caused by
pad short circuit 2) relevant components have solder skips 3) software problems
(3) Mic loop The PAP3400DUO contains two MIC circuits, the main MIC and headphone MIC. The main MIC was inserted needle. Loop schematic diagram as following: Main MIC common faults and causes 1 MIC unable to send words or recording: 1) MIC poor welding 2) MIC body bad 2 MIC noise or sound: 1) MIC ontology bad 2) software problems.
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Main MIC
（4）Headphone loop
PAP3400DUO phone use headphones with a standard 3.5mm headphone. Its circuit diagram is as follows: Headphones common faults and reasons:
1, headphones only one channel sound: 1) the headset is not inserted in place 2) R534、 R535、C503、C504、R532、R533、B509、B510 Relevant component Weld. 3) R528、 R529、C501、C502、FV509、FV511 Relevant component breakdown shorted to ground; 2 headphone left and right channels are no sound: 1) the headset is not inserted in place 2) Relevant component breakdown on the short circuit;
3, unplug the headphones bank borrowing does not recognize: 1) R530、R531 Relevant component Weld; 2) whether headphones Block shrapnel and motherboard good contact 3) software reasons
4 headset MIC no transmitter: 1) the headset is not inserted in place 2) B511、C565、R524、 R525、C563、C564 Relevant component Weld 3) FV512、C567、C568 Relevant component breakdown on short-circuit;
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Headset MIC AND 3.5mmHeadphone jack circuit
3.2.3 USB serial port malfunction
During the test, "open serial port failure" will often occur. Main reasons are:
1） phone is unable to power on, Please refer to the fail to power on malfunction
maintenance
2） USB test points are oxidized, not contacting with fixture well
3） USB connectors J1001 is bad welding
4） USB circuit problems
3.2.4 LCD Fault
PAP3400DUO adopts 4.0-inch TFT LCD, The part of the circuit schematic as shown below.
Common problems and causes of the LCD module:
1, LCD screen is blank. 1) LCD is not installed or and fixture poor contact)
LCD backlight circuit is bad, check backlight so that the foot is pulled, check
whether welding problems 3) LCD itself fault.
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