Preparation for Assembly.................................................................................................................................................................................................3
Parts Inventory...........................................................................................................................................................................................................3
Assembly, Part I......................................................................................................................................................................................................11
Assembly, Part II.....................................................................................................................................................................................................24
Alignment and Installation....................................................................................................................................................................................41
Power Calibration (R26 and R27)...................................................................................................................................................................................45
Temperature Calibration (CAL tPA)................................................................................................................................................................................45
KPA100 Power Supply Test..........................................................................................................................................................................................45
Fan Test.....................................................................................................................................................................................................................46
External Amplifier Keying Test (PA KEY).......................................................................................................................................................................46
Bias Current Adjustment...............................................................................................................................................................................................46
Using the K2/100 at High Power.........................................................................................................................................................................49
Power Supply..............................................................................................................................................................................................................49
Remote Control using the RS232 Port...............................................................................................................................................................51
Control Board Preparation.............................................................................................................................................................................................51
RS-232 Interface Setup and Test.....................................................................................................................................................................................52
Troubleshooting and Repair................................................................................................................................................................................57
Parts Placement Drawing.....................................................................................................................................................................................63
2
Introduction
Pre-Wound Toroids
Appendix G describes assembly of the K2/100 transceiver's internal
100-watt final output stage (KPA100 board). The PC board includes
two conservatively-rated RF power transistors, low-pass filters, SWR
bridge, monitoring circuits, speaker, and an RS232 interface. Filter
switching, T-R sequencing, and other configuration is handled by the
K2/100's main microcontroller.
KPA100 assembly and installation should be done only after the
transceiver has been aligned and tested at the 10-watt level.
Preparation for Assembly
With all equipment that operates at high power levels, proper
assembly and alignment are critical for safe and reliable operation.
Follow the instructions carefully and make all of the recommended
measurements. Do not substitute components or perform any assembly
steps out of order.
Please read the following information regarding tools and
toroids before proceeding.
Tools Required
The following tools are required to build this kit:
diagonal cutters are not suitable for flush-cutting (trimming leads
very close to the board).
• Temperature-controlled soldering station with a fine-point,
800-degree (F) tip. Do not use a high-wattage iron or gun with
small components, since this can damage pads, traces, or the parts
themselves.
•Larger iron or soldering gun. This will be used only for
installation of power transistors, output transformer, and DC
power wiring. A low-wattage iron cannot be used for these steps.
•Digital Multimeter (DMM). A DMM with capacitance
measurement capability is desirable, though not required.
Refer to our web site for tool sources and solder recommendations.
The toroids on the KPA100 board are not difficult to wind, and
detailed instructions are provided (beginning on page 24). All toroids
must be wound and prepared correctly, or the power transistors
may be damaged.
If you prefer not to wind the toroids yourself, you can obtain a full set
of pre-wound toroids (with leads stripped and tinned) from an Elecraftqualified source. A toroid order form may have been supplied with your
kit. You can also find ordering information at www.elecraft.com. You
do not need to send your cores or wire to the winding service.
Parts Inventory
Set the heat sink and painted panels aside until needed. Leave
them wrapped to protect their finish.
You should do a complete inventory (parts list starts on page 4),
which will take 2 to 3 hours. If anything is missing, contact Elecraft.
Color codes and other markings are shown in parentheses. Refer to
Appendix A of the owner's manual for additional parts photos.
Some components in this kit can be damaged by static
discharge. Before handling diodes, transistors, and ICs, touch
a grounded, unpainted metal surface, or use a wrist strap.
Parts List Notes:
• LS = lead spacing (0.1" = 2.5 mm, 0.2" = 5 mm, 0.4" = 10 mm.)
• In some cases, two capacitor types will have the same value
but different voltage ratings or lead spacing (LS). To avoid
assembly errors, you must positively identify these
capacitors and keep them separate from each other. Use
your DMM to verify values if possible.
• Parts shown in bold are for use on the K2 RF or Control boards.
• Flat-head screws are measured from the top of the head; pan head
screws are measured from beneath the head.
3
PictureRef. Designator(s)QTYDescriptionPart #
C5B1Cap., 18 pF ("18"), 5%, 500V or 1KV disc, 0.2" LS (may have black band)E530088
C3B,C4B2Cap., 27 pF ("27"), 5%, 500V or 1KV disc, 0.2" LSE530089
C5F1Cap., 33 pF ("33"), 5%, 500V or 1KV disc, 0.2" LSE530090
C3H1Cap., 39 pF ("39"), 5%, 500V or 1KV disc, 0.2" LSE530091
C5D1Cap., 47 pF ("47"), 5%, 500V or 1KV disc, 0.2" LSE530092
C4D1Cap., 56 pF ("56"), 5%, 500V or 1KV disc, 0.2" LS (may have black band)E530093
C5A,C6C2Cap., 68 pF ("68"), 5%, 500V or 1KV disc, 0.2" LSE530094
C3E,C5G2Cap., 82 pF ("82"), 5%, 500V or 1KV disc, 0.2" LSE530095
C4E1Cap., 120 pF ("121"), 5%, 500V or 1KV disc, 0.2" LSE530096
C3G,C4A,C5C,C5E,
HDWR1Fuse holder spring, for 1.25" long fuseE980049
HDWR2Fuse, 20A, Littlefuse #312020 or equivalent (1 spare)E980050
HDWR2Standoff, M-F, 3/16 dia. x 3/16" long hex 4-40 thd (for J8)E700052
HDWR5Standoff, 3/16 dia. x 3/16" long hex 4-40 thd (between PCB and heat sink)E700068
HDWR2Standoff, 3/16 dia. x 1/2" long hex 4-40 thd (between PCB and shield)E700061
HDWR5Standoff, 3/16 dia. x 5/8" long hex 4-40 thd (between PCB and shield)E700060
HDWR14Screw, 4-40 x 3/16" pan head, black anodized (2 spares)E700015
HDWR5Screw, 4-40 x 3/16" undercut flathead, black anodized (1 spare)E700025
HDWR19Screw, 4-40 x 1/4" panhead (2 spares)E700005
HDWR3Screw, 4-40 x 1/4" flathead (1 spare)E700063
HDWR5Screw, 4-40 x 9/16" undercut flathead (1 spare)E700064
HDWR8Set screw, 4-40 x 1/2", .05" hex socket head, stainless steel (1 spare)E700066
HDWR12Nut, 4-40 small pattern (2 spares)E700055
HDWR1Nut, 6-32 hex, stainless steel (for GND screw)E700069
HDWR33Lock washer, #4 split (3 spares)E700004
HDWR2Flat washer, #6, Stainless SteelE700067
HDWR1Solder lug (used for grounding J2)E700062
8
PictureRef. Designator(s)QTYDescriptionPart #
HDWR1Thumbscrew, 6-32 x 1/2", black plastic knob (for GND screw, E1)E700070
HDWR5Fibre washer for speaker, #4, .047" thick x 0.25" dia. (1 spare)E700028
MISC1Heat sink, KPA100, approx. 7.6" W x 6" L (19.23 x 15.2 cm)E100127
MISC1Shield, KPA100, approx. 7.3" W x 6" L (18.5 x 15.2 cm)E100137
MISC1PC board, KPA100E100134
MISC1Top cover trim panel, KPA100, painted (wrapped in paper)E100135
MISC1Rear panel, KPA100, painted and silk-screened (wrapped in paper)E100136
MISC1Grille cloth, black, approx. 3 x 3" (7.5 x 7.5 cm)E980053
MISC2Thermal pad for flange-mount power transistor (Q1 and Q2)E980051
MISC1BNC connector cap, plastic (to cap K2's BNC antenna jack)E980006
MISC26 ft. Enamel wire, #22 red (for all lowpass filter toroids and L18)E760018
MISC9 ft.Enamel wire, #26 red (for T3, T4, L15, L16)E760002
MISC3 ft.Enamel wire, #26 green (for T3 and T4)E760004
MISC5 ft.2-conductor wire, #12 stranded, red/black (for DC power wiring)E760017
MISC1 ft.RG174 coax (for RF cable to K2 RF board)E760010
MISC110-conductor ribbon cable with pre-installed connectors; 4" longE980045
MISC1 ft.2-conductor speaker cable, #24 stranded (for J5 and speaker)E760012
MISC10 ft. 4-conductor shielded cable (serial I/O cable)E760009
9
PictureRef. Designator(s)QTYDescriptionPart #
MISC1 ft.Stranded insulated hookup wire, #20 black (for DC cable to K2 RF board)E760006
MISC1 ft.Stranded insulated hookup wire, #20 red (for DC cable to K2 RF board)E760007
MISC1 ft.Hookup wire, #24, solid conductor, green ins. (for K2 Control board mod)E760008
MISC1 ft.Stranded, Teflon-insulated wire, #22 gray (for T1)E760020
MISC2 ft.Stranded, Teflon-insulated wire, #18 gray (for T2)E760021
MISC3Cable tie, 3"E980002
MISC1Allen wrench, .05", short handled (for 1/2" heat sink set screws)E980008
MISC1Sand paper, 180-grit (for heat sink preparation)E980055
10
Assembly, Part I
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Place the KPA100 PC board as shown in Figure 1, and identify
the top side, which has most of the components. (A complete parts
placement drawing can be found at the end of this appendix.) The
"Front Edge" and "Back Edge" designations are based on the board's
orientation when installed in the K2.
With the bottom side of the board facing you (speaker cutout at
the upper right), locate the position for resistor R28, along the back
edge, far right. The label "R28" is just above of the resistor’s outline.
Install a 200-ohm, 1-watt resistor (red-black-brown) at R28.
Form the leads to fit the given pad spacing. Bend the leads to hold the
resistor in place. Note: It's a good idea to orient all resistors in one
direction for ease in reading the color codes later. Orient R28 with its
first color band (red) toward the left.
Back Edge
KPA100 REV A
(Top Side)
J7
Figure 1
J3
Front Edge
J6
J8
Make sure R28 is seated flat on the board, with no excess lead
length exposed. This is necessary to keep the resistor from touching
the heat sink, which will be attached later.
Solder R28 from the top side of the board. Do not use an
excessive amount of solder. Trim the leads to about 1/16" (1.5 mm) or
shorter.
i
If your solder joints are not clean and shiny, your iron
may not be hot enough, or you may be using the wrong type of
solder. These "cold" solder joints will likely result in poor
performance, reliability problems, or component failure.
Before proceeding, consult our web site for additional
soldering instructions and tool recommendations.
11
On the top side of the board, locate the component outline for
.005-ohm current-sensing resistor R7 (near the DC power connector,
J3). Each of R7's pads has three holes.
i
The leads on small capacitors are fragile. Do not pull
on the leads or bend them excessively.
Bend the leads of the .005-ohm, 3-watt resistor to match the
spacing between R7s innermost pair of holes (see Figure 2a). Install the
resistor, pressing it down onto the board as far as it will go.
On the bottom side, fold R7's leads outward so they lay flat
against the pads (Figure 2b). Trim the leads to match the size of the
pads. Solder each lead over the full length of the pad.
Note: Components may be soldered one at a time or in groups. Leads
can be trimmed either before or after soldering. Flush trimming
(trimming very close to the board) is required only when specified.
Otherwise, trim leads to about 1/16" [1.5 mm] or less in length.
(a)
(b)
Sort all capacitors into groups by capacitance value. Start by
grouping them by physical appearance (size, color, etc.).
In all cases where two or more capacitor types have the same
value, further sort them by lead spacing and voltage rating. The parts
list provides identification details for specific capacitor types.
Locate an 0.1- µF ("104") capacitor with 0.1" lead spacing for
use at C75.
Install C75 at its indicated location on the bottom of the board,
near the back edge. The capacitor must be seated as close to the board
as possible, with 1/16" (3 mm) or less lead length exposed. Remove
any U-shaped bends or folds using long-nose pliers. Solder C75 from
the top side of the board.
Install a .01-µF ("103") capacitor with 0.1" lead spacing at
C65. C65 is located on the bottom side of the board, near the front
edge. Keep the lead length short, as described in the previous step.
Figure 2
12
The color bands on 1/4-watt 1% resistors can be difficult to read.
Use a DMM (digital multimeter) to verify the values of all these
resistors. Tape them to a piece of paper with their values labeled.
Install the resistors listed below on the top side of the board. Start
with R3, which is at the front edge of the board, near the "KPA100"
label.
In general, assembly proceeds from left to right and from front edge to
back edge on the PC board.
__ R3, 2.7 ohms, 1/4 W (red-violet-gold)
__ R24 and __ R25, 8.45 k, 1%, 1/4 W (gray-yellow-green-brown)
__ R15 and __ R16, 3.3 k, 1/4 W (orange-orange-red)
__ R31, 200 ohms, 1 W (red-black-brown)
__ R4, 100 k, 1/4 W (brown-black-yellow)
__ R10, 47 ohms, 1/4 W (yellow-violet-black)
__ R5, 15 k, 1/4 W (brown-green-orange)
__ R8, 10 k, 1/4 W (brown-black-orange)
__ R30, 3.09 k, 1% (orange-black-white-brown)
__ R32, 100 ohms, 1%, 1/4 W (brown-black-black-black)
__ R14, 470 ohms, 1 W (YEL-VIO-BRN) (located near back edge)
__ R11, 510 k, 1/4 W (green-brown-yellow)
__ R12, 180 k, 1/4 W (brown-gray-yellow)
__ R13, 100 ohms, 3 watts
__ R1, 3.3 k, 1/4 W (orange-orange-red)
__ R2, 2.7 ohms, 1/4 W (red-violet-gold)
__ R29, 3.3 k, 1/4 W (orange-orange-red), location: far left, near small notch
Install RFC11 on the bottom side of the board. Its location is
close to the cutout for power transistor Q1.
Make sure RFC11 is pressed against the board as far as it will go,
then solder it from the top side of the board.
Install and solder the RF chokes listed below. Limit soldering time
on miniature chokes (2 to 3 seconds per lead). All chokes are on the
top side of the board near connectors J3 and J8.
Check the resistance across each RF choke using the lowest
resistance scale of your DMM. This will ensure that the chokes were
not damaged during soldering. All readings should be under 10 ohms.
Sort all of the diodes according to type. Use a magnifying glass if
necessary to positively identify glass diodes (1N4148 and 1N5711).
Install diodes D1-D8 (1N4148) on the bottom side of the board,
near the large cutout, but do not solder yet. Bend the leads very close
to the body to fit the given pad spacing. The banded end of each diode
(cathode) must be aligned with the band on its component outline.
Make sure D1-D8 are seated as far down on the PC board as
possible. Solder and trim the leads.
Sort all of the RF chokes by size and value. Do not pull on the
leads, which are fragile and can be easily damaged.
Locate a small 100-µH RF choke for use at RFC11 (tan body,
BRN-BLK-BRN color code, 0.4" lead spacing). Do not use one of the
miniature 100-µH RF chokes, which has a much smaller lead spacing.
13
Install the remaining diodes on the top side of the board. Start
with D17, at the lower left-hand corner near the small notch.
Use a ruler to check the height of all capacitors just installed, as
well as C65 (near the front edge) and C75 (near the back edge). If any
capacitor body extends to 3/16" (4.5 mm) or more above the surface
of the board, fold it down toward the board. The capacitors should not
touch any adjacent pads.
Note: D14, 12, and 11 are not all oriented in the same direction
__ D14, 1N4007__ D12, 1N4007__ D11, 1N4007
(Save the 1N4007 leads for use as jumpers, etc., in later steps)
__ D9, SB530
Using the diode check scale on your DMM, test all of the diodes
on the board. (This will ensure that diodes have not been damaged
during installation.) First, touch the red (+) lead of the DMM to the
anode (non-banded end), and the black (-) lead to the cathode (banded
end); the meter should indicate a forward voltage in the range of 0.1 to
0.7 volts, varying with diode type. Next, reverse the leads; the DMM
should show an open-circuit indication (flashing "3.000" or "0.000,"
etc.).
Near the "ELECRAFT" label, you’ll find a short jumper location,
identified by a ground symbol (). Use a discarded 1N4007 diode lead
to make a 3/4" (19 mm) U-shaped wire for this jumper. Mount the
jumper on the top side of the board, with the top of the U-shape
approx. 1/4" (6 mm) above the board. Solder it from the bottom side.
Install the following capacitors on the bottom side of the PC
board, but do not solder yet. Capacitors must be seated as close to the
board as possible. About 1/16" (3 mm) of lead length may remain
exposed. Remove any U-shaped bends or folds using long-nose pliers.
Note: These capacitors are all .01 µF (103), with 0.1" lead spacing.
Solder the capacitors from the top side. Use just enough solder
to fill the hole, since the leads will be flush-trimmed in the
next step.
i
Important: Relays K1-K12 will be installed on the top side of
the board, opposite capacitors C13-C22 and C29. This requires that
the capacitor leads and their surrounding solder filets be trimmed as
close to the PC board as possible.
Flush-trim the leads of C13-C22 and C29 on the top side of the
board. After trimming, the leads and surrounding solder filets should be
no more than 1/32" (0.8 mm) high.
Install the 0.2" lead spacing capacitors listed below on the top
side of the board. Start with C11, which is along the front edge of the
board near the "KPA100" label.
Place relays at locations K1-K12, excluding K3. (K3 will be
installed after the output transformer, T2.) Each relay can only be
installed one way; the white mark on the relay must be oriented as
indicated by the mark on the component outline. Do not solder therelays yet, and do not clip or bend the relay leads.
Inspect each relay to make sure that it is seated flat against the
board. If not, remove it and flush-trim the leads which are preventing
it from sitting flat against the board.
Make sure that you have not installed relay K3.
Using a book or other flat object to hold the relays in place on
the top side of the board, flip the board over. Solder two diagonal
corner pins on each relay.
Inspect the 11 relays closely to make sure that they’re seated flat
against the PC board. If not, re-heat the corner pins one a time while
pressing down on the relay. Once all relays are properly seated, solder
the remaining pins. Do not trim relay leads, which can cause
mechanical stress, reducing the life of the relay.
Install the small capacitors listed below. (The first capacitor in
the list, C50, is near trimmer C27). Lead spacing (LS) and voltage
are shown where required to identify the capacitor type.
__ C82, 1200 pF (122), 50V (do not confuse with 1200 pF, 500-V mica)
__ C66, 180 pF (181)
__ C28 .01 µF (103), 0.1" LS (far left side of the board near K4)
__ C12, .01 µF (103), 0.1" LS
Install resistor network RP1 near the "KPA100" label at the
front edge of the board. The dotted (pin 1) end of RP1 should be
oriented to the left. (RP1 is symmetrical and can be reversed, but this
orientation will help visually identify the pin 1 end.)
Install trimmer potentiometers R26 and R27 (100 k, "104") near
the speaker cutout. The trimmers will sit a small distance above the PC
board on the pin shoulders. Set the trimmers to their midpoints.
Install trimmer potentiometer R6 (1 k, "102") at the right side of
the board near T1. Set the trimmer fully counter-clockwise.
Install the 5 to 30 pF ceramic trimmer capacitors, C1 and C27.
C1 is at the far left near the small notch. C27 is near the
microcontroller, U1 (16F872). Orient the flat side of each trimmer as
indicated.
Using a small flat-blade screwdriver, set both trimmers to their
midpoints (screwdriver slot perpendicular to the flat side).
Install the low-pass filter capacitors listed below. All are 500 V or
1KV (1000 V) disc, with 0.2" lead spacing. These capacitors are
located on the left side of the board between the two rows of relays
(K3-K12).
Note: Some of these capacitors are arranged in close-spaced groups of
three on the board. Look at all of the reference designators in a
group to be sure you know which capacitors they refer to.
__ C5B, 18 pF (may have black band on top and no marked voltage)
__ C3B, and __ C4B, 27 pF
__ C5F, 33 pF (Do not confuse with C26, which is 33 pF, 50 volts)
__ C3H, 39 pF
__ C5D, 47 pF
__ C4D, 56 pF (may have black band on top and no marked voltage)
__ C5A, 68 pF
__ C6C, 68 pF (note: C6D pertains to the large cap to the left of C6C)
__ C3E, and __ C5G, 82 pF
__ C4E, 120 pF (121)
__ C3G, __ C4A, __ C5C, __ C5E, and __ C6E, 150 pF (151)
__ C2B, __ C3C, and __ C3J, 220 pF (221)
__ C3A, __ C3D, __ C4C, and __ C6F, 270 pF (271)
__ C3F, __ C6A, __ C6B, and __ C6G, 330 pF (331)
__ C2D, 390 pF (391)
Install the 4 MHz crystal (X2) near the microcontroller (U1).
X2 must be seated flat against the board, with no insulators or
other spacers, or the metal shield will not fit correctly.
Cut two 3/4" (19 mm) bare wires (use small component leads).
Insert a bare wire into the grounding hole provided just to the left
of X2. Solder this wire to the side of the crystal can, not the
top, or it will prevent installation of the shield in a later step.
Keep soldering time below 5 seconds; if it takes longer, your iron may
not be hot enough, or your iron tip may not be making good contact
with the crystal can.
Turn the board over, then solder and trim X2's ground wire.
Ground crystal X1 using the second bare wire. X1 is low profile, so
the wire can be soldered to the top of the can. Avoid overheating.
Install the 10-pin, dual-row (5x2) male connector at P1, but do
not solder yet. Figure 3 shows P1 as viewed from right side of the
board. The plastic part of the connector must be on the top side of the
board, with the long end of the pins pointed up. The short ends are
inserted into the board.
Install the .039 µF capacitor, C79 (0.4" lead spacing, "393" or
".039 µF" label). C79 is located near relay K2.
Install a .0018 µF ("182") capacitor with 0.4" lead spacing at
C64. C64 is located near relay K2.
Install the electrolytic capacitors, C51 and C60. C51 (470 µF) is
near the large transformer, T2. C60 (100 µF) is near T1. The (+) lead
must be installed in the hole marked with a "+". The (+) lead is usually
longer than the (–) lead, and the (–) lead is identified by a black or
white stripe.
Install the low-profile 16.289 MHz crystal ("S162ECSL") at X1,
near the speaker cutout. Make sure the crystal is seated flat against the
board, then solder. Use a minimum amount of solder to avoid a short
under the can. Note: Insulators are not needed for crystals. The solder
mask on the top of the board provides adequate insulation.
P1
Figure 3
Solder just one pin of P1, from the bottom side. Note: P1's plastic
body can melt if too much heat is applied, causing the pins to be mispositioned. Limit soldering time to 2 to 3 seconds.
Examine the placement of P1. If it is not flat against the board,
re-heat the soldered pin while pressing down on the connector.
Once P1 is in the right position, solder the remaining pins. Do not
trim the leads.
16
Install a 2N3904 transistor at Q8, near X1. (Use a magnifying
glass if necessary to identify TO-92 package transistors.) The flat side
of the transistor must be oriented toward the flat side of its outline as
shown in Figure 4a.
ZVN
(a)
(b)
Figure 4
4424A
MOSFET transistors Q6 and Q7 (ZVN4424) have a modified
TO-92 package that must be oriented as shown in Figure 4b. The
labeled side of these transistors faces away from the flat side
of the outline. Install and solder Q6 and Q7, which are located
between relays K1 and K2.
Q9 is a TO-220 package MOSFET (IRF830 or IRL620) with a
metal tab. The tab may have been cut off already. If not, you'll need to
trim it. Using heavy wire cutters or tin snips, cut off most of the tab
(see Figure 5). This is necessary to prevent the tab from shorting to
the shield in later steps. Do not use flush cutters or other small
cutting tools to cut off the tab; this may damage the tool.
Install Q9 vertically as shown below. The transistor will sit above
the board due to the shoulders on the leads. The tab must beoriented toward J7 as indicated by the component outline. Trim
the pins on the bottom after soldering.
Install another 2N3904 at Q5, which is on the right side of the
board near potentiometer R6 (labeled "BIAS SET").
Install voltage regulator U3 (78L05), which has a 3-lead TO-92
package like the 2N3904 transistor. U3 is located in the right-front
corner of the board near connector P1.
i
The MOSFET transistors to be installed in the following
steps can be easily damaged by static discharge. Before and
during installation of these devices, touch an unpainted,
grounded metal surface.
Install MOSFET transistors Q10, Q11, Q12 (2N7000), which are
located near the "KPA100" label. The flat side of each transistor must
be aligned with the flat side of its outline as shown in Figure 4a.
Shortened Tab
Back edge of PCB
Figure 5
17
Transistor Q3 (MJE182) will be installed on the bottom side of
the board, near the board cutout for power transistor Q2. Place the
transistor over its outline, with the metal side of the packagefacing away from the board. Bend the three leads at right angles to
match the given pad locations, but do not solder yet. Note: the leads
will break if bent too many times.
Bend two opposite corner pins on the bottom side to hold the IC
in place. Solder all 8 pins (about 1 to 2 seconds per pin).
Install the ICs listed below. All are located to the right of U5.
Compare the part number on the IC to the number printed on the
board, and make sure that the pin 1 end is oriented correctly.
Insert Q3's leads into their holes. Center the transistor's plastic
body within its component outline. Re-form the leads if necessary.
Verify that Q3's metal side is facing away from the board, then
solder the leads from the top side, keeping the transistor pressed down
against the board.
Install Q4 in the same manner.
i
Before handling ICs, touch a metal surface. ICs
damaged by electrostatic discharge can become intermittent,
and the resulting problems may be difficult to troubleshoot.
Note: The pin 1 end of ICs can be identified by a notch or dimple as
shown in Figure 6. This end must be oriented toward the notched end
of the component outline.
Notch
Pin 1
Dimple
Pin 1
Figure 6
Install U5 (LM358, 8 pins), which is located on the top side of
the board, left of the "KPA100" label. A portion of the part number is
printed on the board under the IC ("358"). Do not solder yet.
Install the 28-pin IC socket at U1. The notched end of the socket
must be aligned with the notched end of its outline.
i
In the following steps you'll be installing several
connectors at the back edge of the PC board (top side). These
connectors must be installed correctly in order for the rear
panel to fit onto the PC board. Figure 32 (page 38) shows how the
rear-panel connectors will appear once installed.
Install the external speaker jack, J6, at the back edge of the
board. Solder the center pin only. Make sure that the jack is pressed
down flat against the board while soldering.
If J6 does not appear to be aligned with its PC board outline, or it
is tilted, re-heat the center pin while adjusting the connector's
position. Once it is positioned correctly, solder the other two pins.
Locate screw terminal E1. If it was supplied with a screw, remove
it. The screw will not be used.
Place E1 in its indicated position, with the threaded hole facing
the rear edge of the board. Solder just one pin. CAUTION: This
part will get hot; don’t touch it with your finger while soldering.
If necessary, reheat the soldered pin of E1 and adjust it so that all
four pins are pressed down on the board as far as they'll go. Then
solder all pins.
18
Install the RCA jack, J7. The small plastic standoffs on the
bottom of the connector should be inserted in the holes provided.
While soldering, hold J7 flat against the board, and keep it centered
within its component outline. Clip the leads on the bottom side.
Locate J8, the 9-pin "D" connector, and temporarily place it in
its indicated location (far right side of the board). Note that the leads
of capacitors C97-C99 on the bottom of the board interfere with the
proper seating of J8. To avoid this, you will need to trim off the
plastic extensions on both sides of the connector. First, bend upward
and cut off the thin metal tabs above the plastic extensions (do not use
flush cutters for this--you may damage them) . Then trim the plastic
away so that it doesn't interfere with the leads of C97-C99.
Install J8 and solder just one of the 9 pins. Adjust the position of
J8 as you did for the other connectors, making sure the connector is
flat against the board. Then solder the remaining pins.
i
You may have received two 16F872 microcontrollers with
your kit. The one marked "KPA100" or "PA" should be used here.
Before handling U1 (16F872), touch a grounded surface.
Straighten the leads of U1 (PIC16F872) as shown below. The rows
of pins must be straight and parallel to each other to establish the
proper pin spacing. To straighten the pins, rest one row of pins against
a hard, flat surface. Press down gently on the other row of pins and
rock the IC forward to bend the pins into position as shown below.
Insert U1 into its socket, with the notched or dimpled end of the
IC aligned with the notched end of its component outline.
Examine U1 closely. If any pins are bent, remove the IC and
straighten them. (To remove U1 from its socket, pry it up gently on
each end using a small flat-blade screwdriver.)
Visual Inspection
i
Nearly all problems with kits are caused by poorly-
soldered component leads or incorrectly-installed components.
You can locate and correct most assembly errors ahead of time
with a simple visual inspection. This is especially important at
high power levels, where an unsoldered or reversed component
could cause damage to the power transistors.
closely for all of the following: cold solder joints (dull rather than
shiny appearance), solder bridges, and leads that are not soldered. Reheat any suspect joints.
re-check the orientation of all __ Diodes, __ Transistors, __ ICs.
Using a magnifying glass, examine the bottom of the PC board
Using the parts placement drawing at the end of the appendix,
Flared
Straight
Figure 7
19
Initial Tests
Make the resistance measurements listed below, touching the
DMM's (+) and (-) leads to the indicated points. The (-) lead will go to
ground in all cases except the first measurement (relay coils).
i
The symbol > means greater than. Your DMM may indicate
infinite resistance (all digits flashing) for readings that are listed as
"> 10 k." (Do not use an analog VOM.) Other readings should be
+/- 10 %. K4 reads higher resistance than the other relays because K3
is not yet installed (the two coils are in parallel).
KPA100 Test Points (+, -)Resistance
(+) and (-) leads of relays K1,K2,K4-K12
(on bottom of board, marked)
U1 pin 1, ground> 1 k
U1 pin 2, ground> 10 k
U1 pin 3, ground> 10 k
U1 pin 4, ground3.1 k
U1 pin 13, ground> 10 k
U1 pin 14, ground> 10 k
U1 pin 27, ground> 10 k
U1 pin 28, ground> 10 k
U4 pin 1, ground> 10 k
U4 pin 8, ground> 10 k
"AF" pad (measure from bottom), ground> 10 k
D10 banded end, ground> 10 k
Determine what revision of firmware your K2 has installed at
present by turning the K2 on while holding any switch. Record the
number shown at the left end of the LCD (e.g., 2 . 0 1 H ): _______.
Turn off the K2. Disconnect all external cables.
Remove the six K2 top cover screws shown in Figure 8.
Remove the top cover. Disconnect the speaker and all options.
Store the top cover in a safe place to protect the finish.
650-800 (K4)
325-400 (others)
i
You can easily remove the KPA100 and re-install the original
top cover at any time, returning the K2 to its low-power field
configuration.
12
34
56
Figure 8
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Before handling the Control board in the following
steps, touch a grounded surface.
panel board. Also remove the KAF2 audio filter board if present.
the Control board up at the point marked "LIFT HERE" on the RF
board. Then unplug the Control board.Place it in front of you with the
component side up.
the voltage selector switch, S1. If the present value of this capacitor is
.01 µF ("103"), replace it with an 0.1 µF capacitor ("104"). Use a
capacitor with 0.2" lead spacing. Note: If you have an older Control
board (rev XC) that does not include C42, solder the 0.1 µF capacitor
between pins 4 and 8 of U3 (LMC6482, on the Control board).
Remove the screws that hold the K2 Control board to the front
Use the long-handled Allen wrench supplied with the K2 to pry
Locate C42 on the K2 Control board (CTRL-C42), which is near
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