equipment, including but not limited to component substitution and circuitry changes. Changes
that impact this manual may subsequently be incorporated in a later revision of this manual.
Booster Amplifier Subrack System Integration Manual
Section 1. General Description
1-1 Introduction
This manual contains information and procedures for the installation, operation, and maintenance
of Powerwave Technologies, Inc.’s (Powerwave’s) Booster Amplifier Subrack (BAS) system. This
manual is organized into the following sections:
Section 1. General DescriptionAppendix A: Backplane Wiring Diagram
Section 2. InstallationAppendix B: Distribution PCB Pinout Location
Section 3. Operating InstructionsAppendix C: Power Setting Procedure
Section 4. Principles of Operation
Section 5. Maintenance
Section 6: Troubleshooting
1-2 General Description
Engineered to operate in a 2-way transceiver paging base station, the BAS system is a linear,
Multi-Carrier Power Amplifier (MCPA) system that operates in the 5 MHz frequency band from
869 MHz to 894 MHz. The system integrates the model MCR20830-1Booster Amplifier Subrack
(BAS) with two 60 Watt (model G3L-800-60) MCPAs to deliver a composite RF output of up to
100 Watts, after combined losses
Designed to function as a subrack (see Figures 1-2 thru 1-6) in the host base station, the enclosure has a one inch (right and left side) flanged front panel and eight mounting holes (four on
each side) to secure the Subrack into place (refer to Figure 1-3 for mounting hole locations). To
aid in maintaining the system’s operating temperature, the BAS is equipped with two cooling fans
mounted on the front access door (see Figures 1-3 and 1-4). Each 60W amplifier displaces approximately 1,900 BTUs of heat at full power.
The composite input signal is applied to a 30dB 10W input attenuator, followed by a voltage variable attenuator that is controlled via dip switches on the front panel (refer to Table 1-1 and Figure
4-1). The maximum composite input signal may not exceed +31dBm. The composite signal is
then fed to a two-way power splitter. The signals are applied to the amplifiers, and the amplifier
outputs are combined again (refer to Tables 1-2 through 1-7 for specifications). With both amplifiers installed, the system provides 20dB of gain.
The BAS also houses a distribution printed circuit board (PCB) for internal power and alarm distribution (refer to Appendix B). Accessible from the front panel is the DB9 external ALARM connector, the RF IN and RF OUT type N connectors.
Additionally, the front panel provides access to the +27 Vdc POWER IN connector, visibility of the
two MCPA’s fault alarm LED indicators and the GAIN CTRL dip switch. Refer to Table 1-1 for the
dip switch truth table and Fiqure 1-1 for pin designations.
With the access door open, the two amplifier modules are visible. All solid-state, the MCPAs are
designed for parallel operation for high peak power output. Their modular construction and
unique and highly effective LED-based operational status and fault indicators help minimize
downtime. The turn-on and turn-off sequence of voltages are fully automatic, as is overload protection and recycling. Inadvertent operator damage from front panel manipulation is virtually impossible. Refer to Figures 1-7 and 1-8 for drawing views of the amplifier module.
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Figure 1-1 Variable Attenuator, Voltage Regulator and Dip Switch Socket Pin Configuration
OUTPUT
GND
GND
GND
GND
INPUT
1-3 Functional and Physical Specifications
The BAS system’s functional and physical specifications are listed in Table 1-2. A functional block
diagram is provided in Section 4 of this manual to illustrate the system’s operational layout.
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1-3.1 MCR20830-1 Subrack Specifications
Table 1-2 MCR20830-1 Booster Amplifier Subrack System Specifications
Frequency869 – 894 MHz
Gain
+20 dBm, ± 0.2 dBm
RF Input Power+31 dBm composite w/variable attenuator set
to 0dB attenuation.
+46 dBm composite w/variable attenuator set
to 15 dB attenuation.
RF Output Power:
60W modules52.3 Watts (+47.18 dBm) 1 module
91.0 Watts (+49.59 dBm) 2 modules
Phase Variation
± 5°
Alarms+5 Vdc TTL
D.C. Power+ 27 Vdc, 55 Amps max
Total System Return Loss-19 dBm
Channel Spacing12.5 KHz
Operating Temperature0 to 50 degrees C
Subrack Dimensions12.22(H)x*17(W)x24.5(D) inches
Weight (Fully assembled)Approximately 80 Pounds (36.28 kilograms)
*Note: Does not include 1-inch right and left side mounting flanges.
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Table 1-3 Electrical Specifications for 2-Way Splitter
Insertion Loss
Amplitude Balance
Insertion Loss Flatness Over Frequency
-33dB Min. (TBD on actual part)
-48dB Max.
±0.2dB Max.
±0.3dB Max.
Input/Output Return Loss-20dB Min.
Port to Port Phase Delta
±5 Degrees Max.
Port to Port Isolation-20.0dB Min.
IP3 (Input Power = 5dBm)-90dBc Min.
Power Handling (Fixed Attenuator)20 Watts Max.
Power Handling (Variable Attenuator)3.16 Milliwatts Max.
Table 1-4 Electrical Specifications for 2-Way Combiner
Insertion Loss-0.6 dB (TBD on actual parts)
Amplitude Balance
Insertion Loss Flatness Over Frequency
±0.2dB Max.
±0.3dB Max.
Input/Output Coupled Port Return Loss-18.0 dB Min.
Port to Port Phase Delta
±5 Degrees Max.
Port to Port Isolation-20.0dB Min..
Power Handling120 Watts
Sampling Coupler
-25dB ±1dB
Sampling Coupler Directivity-18.0 dB Min.
IP3 (Input Power = TBD)-100 dBc Min
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1-3.2 GL3-800 Series Amplifier Sprecifications
Table 1-5 G3L-800 Series Amplifier’s Electrical Specifications
Frequency Range869-894 MHz
Channel Spacing12.5 KHz
Output Power:
GL3-900-60+47.8 dBm (60 Watts)
Input Power-10.0 dBm max.
RF Gain
1TX H10+27 V
2TX L11COM SV
3GND12AMP AO
4RX H13AMP A1
5RX L14AMP A2
6GND15AMP A3
7HERE LPA16NC
8FF LPA17NC
9RESERVED
MarkingsTBD
Front Panel LED DisplayLED type: SMD
RUNGREEN (When MCPA is enabled)
ALM
DC
Red (When any alarm occurred, LED is on)
Green (When DC Power is ON, LED is on)
MCPA Captive fastenerTBD
Front Panel color & silkTBD
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Table 1-7 Environmental Specifications for G3L-800 Series Amplifiers
ItemsSpecifications
Operating Temperature0 to + 50 C
Storage Temperature-40 to + 85 C
Relative Humidity5 to 90% RH (non-condensing)
Operating Air Pressure860 to 1060 mbar
Shock40 m/s s* @ 22 ms half sinusoid shock
PressureIntegral forced air cooling must operate correctly at
up to 0.3 inches back.
Vibration
Bellcore TR-NWT-000063 (1 m/s*s0.1∼200Hz)
Corrosion Resistance/ Salt FogThe MCPAs shall comply with the requirements of
AltitudeAll specifications shall be met at an altitude up to
15,000 feet where the maximum external ambient
temperature is decreased by 0.5 C/ 1000 feet above
sea level. The MCPAs shall not sustain damage
when being transported at altitude up to 40,000 feet
or uniformly applied pressure to 30 PSIA.
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1-4 Booster Amplifier Subrack (BAS) System Major Components
Table 1-8 lists the model numbers and descriptions of the major components that comprise the
BAS system and the document number (if available) of the manual related to each component.
Powerwave Technologies, Inc. reserves the right to make minor changes to the equipment, including but not limited to component substitution and circuitry changes. Changes that impact this
manual may be incorporated in a later revision of the manual.
044-05078 Rev. A1-8November 2000
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