2-3Electrical Service Recommendations..........................................................................................................2-1
2-4 Air Conditioning............................................................................................................................................2-1
2-5Unpacking and Inspection...........................................................................................................................2-2
2-7Amplifier Module Power, Alarm, Control, and RF Connector................................................................2-4
2-8Remote Control and Status..........................................................................................................................2-5
4-5.4Alarm Monitoring and Control ....................................................................................................................4-3
4-5.5Loop Control Circuit .....................................................................................................................................4-3
5-3Test Equipment Required For Test .............................................................................................................5-1
5-4Performance Test ...........................................................................................................................................5-2
5-4.1.2Gain Test .........................................................................................................................................................5-2
6-3Return for Service Procedures.....................................................................................................................6-1
6-3.1Obtaining an RMA........................................................................................................................................6-1
6-3.2Repackaging for Shipment...........................................................................................................................6-1
1-7GL3-900 Series Amplifier............................................................................................................................1-13
044-05075 Rev. BJanuary 2001iv
Booster Amplifier Subrack System Integration
Manual
1-8GL3-900 Series Amplifier – Rear, Top, Front Views ...............................................................................1-14
equipment, including but not limited to component substitution and circuitry changes. Changes
that impact this manual may subsequently be incorporated in a later revision of this manual.
January 2001
044-05075 Rev. BiiJanuary 2001
Booster Amplifier Subrack System Intergration Manual
Powerwave Technologies, Inc.Tel: (714) 466-1000
1801 E. St. Andrew PlaceFax: (714) 466-5800
Santa Ana, CA 92709Web Site: www.powerwave.com
044-05075 Rev. BiiiJanuary 2001
PRELIMINARYBooster Amplifier Subrack System Integration Manual
Section 1. General Description
1-1 Introduction
This manual contains information and procedures for the installation, operation, and maintenance
of Powerwave Technologies, Inc.’s (Powerwave’s) Booster Amplifier Subrack (BAS) system. This
manual is organized into the following sections:
Section 1. General DescriptionAppendix A: Backplane Wiring Diagram
Section 2. InstallationAppendix B: Distribution PCB Pinout Location
Section 3. Operating InstructionsAppendix C: Power Setting Procedure
Section 4. Principles of Operation
Section 5. Maintenance
Section 6: Troubleshooting
1-2 General Description
Engineered to operate in a 2-way transceiver paging base station, the BAS system is a linear,
Multi-Carrier Power Amplifier (MCPA) system that operates in the 5 MHz frequency band from
935 MHz to 940 MHz. The system integrates the model MCR20930-1-2 Booster Amplifier
Subrack (BAS) with two model G3L-900-50-005 MCPAs to deliver a composite RF output of
75.8 Watts (nominal), after combined losses. The system can also integrate two model G3L-90060-005 MCPAs to deliver a composite RF output of 91 Watts (nominal), after combined losses.
Designed to function as a subrack (see Figures 1-2 thru 1-6) in the host base station, the enclosure has a one inch (right and left side) flanged front panel and eight mounting holes (four on
each side) to secure the Subrack into place (refer to Figure 1-3 for mounting hole locations). To
aid in maintaining the system’s operating temperature, the BAS is equipped with two cooling fans
mounted on the front access door (see Figures 1-3 and 1-4). The G3L-900-50-005 amplifier displaces 1,672 BTUs of heat at full power. The G3L-900-60-005 amplifier displaces approximately
1,900 BTUs of heat at full power.
The composite input signal is applied to a 30dB 10W input attenuator, followed by a voltage variable attenuator that is controlled via dip switches on the front panel (refer to Table 1-1 and Figure
4-1). The maximum composite input signal may not exceed +31dBm. The composite signal is
then fed to a two-way power splitter. The signals are applied to the amplifiers, and the amplifier
outputs are combined again (refer to Tables 1-2 through 1-7 for specifications). With both amplifiers installed, the system provides 20dB of gain.
The BAS also houses a distribution printed circuit board (PCB) for internal power and alarm distribution (refer to Appendix B). Accessible from the front panel is the DB9 external ALARM connector, the RF IN and RF OUT type N connectors.
Additionally, the front panel provides access to the +27 Vdc POWER IN connector, visibility of the
two MCPA’s fault alarm LED indicators and the GAIN CTRL dip switch. Refer to Table 1-1 for the
dip switch truth table and Fiqure 1-1 for pin designations.
With the access door open, the two amplifier modules are visible. All solid-state, the MCPAs are
designed for parallel operation for high peak power output. Their modular construction and
unique and highly effective LED-based operational status and fault indicators help minimize
downtime. The turn-on and turn-off sequence of voltages are fully automatic, as is overload protection and recycling. Inadvertent operator damage from front panel manipulation is virtually impossible. Refer to Figures 1-7 and 1-8 for drawing views of the amplifier module.
044-05075 Rev. B
1-1
January 2001
PRELIMINARYBooster Amplifier Subrack System Integration Manual
Figure 1-1 Variable Attenuator, Voltage Regulator and Dip Switch Socket Pin Configuration
OUTPUT
GND
GND
GND
GND
INPUT
1-3 Functional and Physical Specifications
The BAS system’s functional and physical specifications are listed in Table 1-2. A functional block
diagram is provided in Section 4 of this manual to illustrate the system’s operational layout.
044-05075 Rev. B
1-2
January 2001
PRELIMINARYBooster Amplifier Subrack System Integration Manual
1-3.1 MCR20930-1-2 Subrack Specifications
Table 1-2 MCR20930-1-2 Booster Amplifier Subrack System Specifications
Frequency935-940 MHz
Gain
+20 dBm, ± 0.2 dBm
RF Input Power+31 dBm composite w/variable attenuator set to 0dB at-
tenuation.
+46 dBm composite w/variable attenuator set to 15 dB at-
tenuation.
RF Output Power:
G3L-900-50-005
G3L-900-60-005
Phase Variation
+47 dBm (50 Watts) nominal, 60 Watts (max.)
+47.8 dBm (60 Watts) nominal, 75 Watts (max.)
± 5°
Alarms+5 Vdc TTL
D.C. Power+ 27 Vdc, 55 Amps max
Total System Return Loss-19 dBm
Channel Spacing12.5 KHz
Operating Temperature0 to 65 degrees C
Subrack Dimensions12.22(H)x*17(W)x24.5(D) inches
Weight (Fully assembled)Approximately 80 Pounds (36.28 kilograms)
*Note: Does not include 1-inch right and left side mounting flanges.
044-05075 Rev. B
1-3
January 2001
PRELIMINARYBooster Amplifier Subrack System Integration Manual
Table 1-3 Electrical Specifications for 2-Way Splitter
Insertion Loss
Amplitude Balance
Insertion Loss Flatness Over Frequency
-33dB Min. (TBD on actual part)
-48dB Max.
±0.2dB Max.
±0.3dB Max.
Input/Output Return Loss-20dB Min.
Port to Port Phase Delta
±5 Degrees Max.
Port to Port Isolation-20.0dB Min.
IP3 (Input Power = 5dBm)-90dBc Min.
Power Handling (Fixed Attenuator)20 Watts Max.
Power Handling (Variable Attenuator)3.16 Milliwatts Max.
Table 1-4 Electrical Specifications for 2-Way Combiner
Insertion Loss-0.6 dB (TBD on actual parts)
Amplitude Balance
Insertion Loss Flatness Over Frequency
±0.2dB Max.
±0.3dB Max.
Input/Output Coupled Port Return Loss-18.0 dB Min.
Port to Port Phase Delta
±5 Degrees Max.
Port to Port Isolation-20.0dB Min..
Power Handling120 Watts
Sampling Coupler
-25dB ±1dB
Sampling Coupler Directivity-18.0 dB Min.
IP3 (Input Power = TBD)-100 dBc Min
044-05075 Rev. B
1-4
January 2001
PRELIMINARYBooster Amplifier Subrack System Integration Manual
1-3.2 GL3-900 Series Amplifier Sprecifications
Table 1-5 G3L-900 Series Amplifier’s Electrical Specifications
Frequency Range935-940 MHz
Channel Spacing12.5 KHz
Output Power: