POWER-ONE OBS025YH, OBS025ZJ, OBS025YJ, OBS017ZE, OBS025ZH Datasheet

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High Density - Board Mounted Power Division
Powering Communications and Technology
55
60
65
70
75
80
85
90
95
10 20 30 40 50 60 70 80 90 100
EFFICIENCY %
EFF. OBS017ZE
EFF. OBS025ZG
EFF. OBS025ZH
Efficiency vs. Load (48V Input)
65
70
75
80
85
90
95
10 20 30 40 50 60 70 80 90 100
LO AD %
EFFICIENCY %
EFF. OBS025YG
EFF. OBS025YH
EFF. OBS025YJ
Efficiency vs. Load (24V Input)
• Trim And Enable Pins
• Fixed Frequency
• 1500V Isolation
• 6-Sided Shielding
DESCRIPTION
FEATURES
OBS SERIES
25 WATT
OBS single output DC/DC converters provide up to 25 Watts of output power in an industry standard package and footprint. The OBS units feature excellent efficiency, six­sided shielding, and fixed switching frequency. With 100°C case operation, the OBS converters are especially suited to telecom, networking, and industrial applications. These units are 100% surface-mount construction and fully compatible with production board washing processes.
• Industry standard package
• 24 and 48V input versions
• 25W output power
• 100°C baseplate operation
General
Turn-On Time: 24 & 48V
in
10 ms Remote Shutdown Positive Remote Shutdown Reference VinNegative Switching Frequency 400 kHz Isolation
Input - Output 1500 VDC Input - Case (24 Vinunits) 500 VDC
Output - Case (48 Vinunits) 500 VDC Temperature Coefficient 0.03%/°C Case Temperature
Operating Range -40 to +100°C
Storage Range -40 to +125°C Humidity Max., Non-Condensing 95% Vibration, 3 Axes, 5 Min Each 5 g, 10 - 55 Hz MTBF†(Bellcore TR-NWT-000332) 1.8 x 106hrs Safety UL, cUL, TUV Weight (Approx.) 1.9 oz
TECHNICAL SPECIFICATIONS
Input
Voltage Range
24 VDC Nominal 18 - 36 VDC 48 VDC Nominal 34 - 75 VDC
Reflected Ripple 25 mA Input Reverse Voltage Protection Shunt Diode
Output
Setpoint Accuracy ±1% Line Regulation VinMin - VinMax., I
out
Rated 0.2% V
out
Load Regulation I
out
Min. - I
out
Max., VinNom. 0.5% V
out
Minimum Output Current 10 % I
out
Rated
Dynamic Regulation, Loadstep 25% I
out
Pk Deviation 4% V
out
Settling Time 500 µs
Voltage Trim Range ±10% I
out
Rated Short Circuit / Overcurrent Protection Hiccup Current Limit Threshold Range, % of I
out
Rated 110 - 140%
OVP Trip Range 115 - 140%V
out
Nom.
OVP Hiccup
Notes
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load, unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully compatible with commercial wave-soldering equipment.
Units are water-washable and fully compatible with commercial spray or immersion post wave-solder washing equipment.
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MECHANICAL DRAWING
Thermal Impedance
Natural Convection 10.3 °C/W 100 LFM 7.7 °C/W 200 LFM 6.3 °C/W 300 LFM 5.1 °C/W 400 LFM 4.0 °C/W
Tolerances
Note: Thermal impedance data is dependent on many environmental factors. The exact thermal performance should be validated for specific application.
Pin Function
1+V
in
2-V
in
3 No Conn.
4 Enable
5 No Pin
6+V
out
7-V
out
8 Trim
Inches: (Millimeters) .XX ± 0.020 .X ± 0.5 .XXX ± 0.010 .XX ± 0.25
Pin: ± 0.002 ± 0.05
Case: + 0.04, - 0.00 + 1.0, - 0.00
(Dimensions as listed unless otherwise specified.)
OBS SERIES
25 WATT
MODELS - (See the last page of Section for options.)
High Density - Board Mounted Power Division
Powering Communications and Technology
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HY520SBO
JY520SBO EZ710SBO GZ520SBO HZ520SBO JZ520SBO
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42 42 84 84 84 84
.tuptuodetar,niVlanimontA**
0.600"(15.2mm)
0.400"(10.2mm)
0.200"(5.1mm)
egnaRniV
)stloV(
63-81 63-81 57-43 57-43 57-43 57-43
(50.8mm)
1
BOTTOM VIEW
2 3
0
4
2.00"
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09.1
09.1
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5
6
7
8
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21 51
3.3
5
21 51
1.100"(27.9mm)
0.700"(17.8mm)
0.300"(7.6mm)
-0.100"(-2.5mm)
2.00"
(50.8mm)
1.2
7.1
0.5
0.5
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DIA 0.040"
(1.0mm)
021
051 57 57
021
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0.18" MIN. (4.6mm)
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-0.50"(-12.7mm)
-0.10"
(-2.5mm)
0
1.800"
(45.7mm)
0.42"
(10.7mm)
OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and add them to the model number. Example ordering options are located below the options table.
Example Options: HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink. LES015YJ-3N = LES015YJ with optional trim and enable, negative logic. QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu­factured. Specifications are subject to change without notice.
OPTIONS SUFFIX APPLICABLE SERIES REMARKS
Negative Logic N HAS, HBD, HBS, HES, HLS, LES, TTL "Low" Turns Module ON
QBS, QES, QLS, TES, TQD TTL "High" Turns Module OFF
Lucent Compatible Trim T
HAS, HBD, HBS, HES, HLS, QBS, QES, QLS
Terminal Strip TS XWS, XWD, XWT
Trim 1 IAS, LES
Enable 2 IAD, IAS, LES, SMS
Trim and Enable 3 IAS, LES
Current Share 4 SMS
Headerless Y Encapsulated EWS, IWS, OWS
PIN LENGTH AND HEATSINK OPTIONS
Standard Pin Length is 0.180" (4.6mm)
0.110" (2.8mm) Pin Length 8 All Units (Except SMS)
0.150" (3.8mm) Pin Length 9 All Units (Except SMS)
0.24" (6.1mm) Horizontal Heatsink
1H
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.24" (6.1mm) Vertical Heatsink 1V
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.45" (11.4mm) Horizontal Heatsink
2H
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.45" (11.4mm) Vertical Heatsink 2V
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.95" (24.1mm) Horizontal Heatsink
3H
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.95" (24.1mm) Vertical Heatsink 3V
All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
High Density - Board Mounted Power Division
Powering Communications and Technology
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