POWER INTEGRATIONS TOP 245PN Datasheet

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TOP242-250 TOPSwitch-GX Family

Extended Power, Design Flexible, EcoSmart, Integrated Off-Line Switcher

Product Highlights

Lower System Cost, High Design Flexibility

• Extended power range for higher power applications

• No heat sink required up to 34 W using P/G packages

• Features eliminate or reduce cost of external components

• Fully integrated soft-start for minimum stress/overshoot

• Externally programmable accurate current limit

• Wider duty cycle for more power, smaller input capacitor

• Separate line sense and current limit pins on Y/R/F packages

• Line undervoltage (UV) detection: no turn off glitches

• Line overvoltage (OV) shutdown extends line surge limit

• Line feed-forward with maximum duty cycle (DC reduction rejects line ripple and limits DC

at high line

MAX

)

• Frequency jittering reduces EMI and EMI ﬁltering costs

• Regulates to zero load without dummy loading

• 132 kHz frequency reduces transformer/power supply size

• Half frequency option in Y/R/F packages for video applications

• Hysteretic thermal shutdown for automatic fault recovery

• Large thermal hysteresis prevents PC board overheating

EcoSmart™– Energy Efﬁcient

• Extremely low consumption in remote off mode (80 mW at 110 VAC, 160 mW at 230 VAC)

• Frequency lowered with load for high standby efﬁciency

• Allows shutdown/wake-up via LAN/input port

Description

TOPSwitch™-GX uses the same proven topology as TOPSwitch, cost effectively integrating the high voltage power MOSFET, PWM control, fault protection and other control circuitry onto a single CMOS chip. Many new functions are integrated to reduce system cost and improve design ﬂexibility, performance and energy efﬁciency.

Depending on package type, either 1 or 3 additional pins over the TOPSwitch standard DRAIN, SOURCE and CONTROL terminals allow the following functions: line sensing (OV/UV, line feed-forward/DC current limit, remote ON/OFF, synchronization to an external lower frequency, and frequency selection (132 kHz/ 66 kHz).

All package types provide the following transparent features: Soft-start, 132 kHz switching frequency (automatically reduced at light load), frequency jittering for lower EMI, wider DC

, hysteretic thermal shutdown, and larger

MAX

creepage packages. In addition, all critical parameters (i.e. current limit, frequency, PWM gain) have tighter temperature and absolute tolerances to simplify design and optimize system cost.

reduction), accurate externally set

MAX

TOPSwitch-GX

Figure 1. Typical Flyback Application.

CONTROL

PI-2632-060200

OUT

OUTPUT POWER TABLE

Open

Frame

15 W 22 W 22 W 25 W 45 W 45 W 28 W 50 W 65 W 30 W 57 W 85 W 34 W 64 W

125 W

70 W

165 W

75 W

205 W

79 W

250 W

82 W

290 W

Adapter

6.5 W 11 W

17 W 15 W 11 W 20 W 20 W 13 W 23 W 26 W 15 W 26 W 40 W 28 W 55 W 30 W 70 W 31 W 80 W 32 W 90 W

85-265 VAC

Open

Frame

10 W

14 W 7 W 9 W

14 W

15 W

23 W

30 W

20 W

28 W

45 W

22 W

33 W

60 W

26 W

38 W

90 W

43 W

125 W

48 W

155 W

53 W

180 W

55 W

210 W

230 VAC ±15%

PRODUCT

TOP242 P or G

TOP242 R

TOP242 Y or F

TOP243 P or G

TOP243 R

TOP243 Y or F

TOP244 P or G

TOP244 R

TOP244 Y or F

TOP245 P or G

TOP245 R

TOP245 Y or F

TOP246 P or G

TOP246 R

TOP246 Y or F

TOP247 R

TOP247 Y or F

TOP248 R

TOP248 Y or F

TOP249 R

TOP249 Y or F

TOP250 R

TOP250 Y or F

Table 1.

Notes: 1. Typical continuous power in a non-ventilated enclosed adapter measured at 50 °C ambient. 2. Maximum practical continuous power in an open frame design at 50 °C ambient. See Key Applications for detailed conditions. 3. For lead-free package options, see Part Ordering Information. 4. 230 VAC or 100/115 VAC with doubler.

Adapter

9 W 15 W 10 W 13 W 29 W 20 W 16 W 34 W 30 W 19 W 37 W 40 W 21 W 40 W 60 W 42 W 85 W 43 W

105 W

44 W

120 W

45 W

135 W

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TOP242-250

Section List

Functional Block Diagram ....................................................................................................................................... 3

Pin Functional Description ...................................................................................................................................... 4

TOPSwitch-GX Family Functional Description ....................................................................................................... 5

CONTROL (C) Pin Operation .................................................................................................................................... 6

Oscillator and Switching Frequency .......................................................................................................................... 6

Pulse Width Modulator and Maximum Duty Cycle .................................................................................................... 7

Light Load Frequency Reduction .............................................................................................................................. 7

Error Ampliﬁer .......................................................................................................................................................... 7

On-Chip Current Limit with External Programmability ............................................................................................... 7

Line Undervoltage Detection (UV) ............................................................................................................................. 8

Line Overvoltage Shutdown (OV) .............................................................................................................................. 8

Line Feed-Forward with DC

Remote ON/OFF and Synchronization ...................................................................................................................... 9

Soft-Start ................................................................................................................................................................. 9

Shutdown/Auto-Restart ........................................................................................................................................... 9

Hysteretic Over-Temperature Protection ................................................................................................................... 9

Bandgap Reference ............................................................................................................................................... 10

High-Voltage Bias Current Source .......................................................................................................................... 10

Using Feature Pins ................................................................................................................................................... 10

FREQUENCY (F) Pin Operation .............................................................................................................................. 10

LINE-SENSE (L) Pin Operation ............................................................................................................................... 10

EXTERNAL CURRENT LIMIT (X) Pin Operation ....................................................................................................... 11

MULTI-FUNCTION (M) Pin Operation ...................................................................................................................... 11

Typical Uses of FREQUENCY (F) Pin ...................................................................................................................... 14

Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins ....................................................... 15

Typical Uses of MULTI-FUNCTION (M) Pin ........................................................................................................... 17

Application Examples .............................................................................................................................................. 20

A High Efﬁciency, 30 W, Universal Input Power Supply ........................................................................................... 20

A High Efﬁciency, Enclosed, 70 W, Universal Adapter Supply ................................................................................. 20

A High Efﬁciency, 250 W, 250-380 VDC Input Power Supply .................................................................................. 22

Multiple Output, 60 W, 185-265 VAC Input Power Supply ...................................................................................... 23

Processor Controlled Supply Turn On/Off ............................................................................................................... 24

Key Application Considerations .............................................................................................................................. 26

TOPSwitch-II vs. TOPSwitch-GX ........................................................................................................................ 26

TOPSwitch-FX vs. TOPSwitch-GX ...................................................................................................................... 28

TOPSwitch-GXDesign Considerations .............................................................................................................. 28

TOPSwitch-GX Layout Considerations ............................................................................................................... 30

Quick Design Checklist ........................................................................................................................................ 32

Design Tools ......................................................................................................................................................... 32

Product Speciﬁcations and Test Conditions .......................................................................................................... 33

Typical Performance Characteristics .................................................................................................................... 40

Part Ordering Information ....................................................................................................................................... 46

Package Outlines ..................................................................................................................................................... 47

Reduction ................................................................................................................ 8

MAX

Rev. Q 08/16

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TOP242-250

PI-2641-031915

CONTROL

(C)

EXTERNAL

CURRENT LIMIT

(X)

LINE-SENSE

(L)

FREQUENCY

(F)

SHUNT REGULATOR/

ERROR AMPLIFIER

CURRENT

LIMIT

ADJUST

LINE

SENSE

1 V

OV/UV

5.8 V

I (LIMIT)

SOFT

START

ON/OFF

+ V

MAX

5.8 V

4.8 V

INTERNAL UV

COMPARATOR

STOP

LOGIC

SOFT-

STOP

START

MAX

CLOCK

SAW

HALF FREQ.

OSCILLATOR WITH JITTER

LIGHT LOAD FREQUENCY REDUCTION

SOFT START

COMPARATOR

÷ 8

SHUTDOWN/

AUTO-RESTART

HYSTERETIC

THERMAL

SHUTDOWN

PWM

INTERNAL SUPPLY

SRQ

CURRENT LIMIT

COMPARATOR

CONTROLLED

TURN-ON

GATE DRIVER

LEADING

EDGE

BLANKING

DRAIN

(D)

SOURCE

(S)

Figure 2a. Functional Block Diagram (Y, R or F Package).

CONTROL

(C)

MULTI-

FUNCTION

(M)

SHUNT REGULATOR/

ERROR AMPLIFIER

CURRENT

LIMIT

ADJUST

LINE

SENSE

5.8 V

I (LIMIT)

SOFT

START

ON/OFF

OV/UV

MAX

4.8 V

INTERNAL UV

COMPARATOR

STOP

LOGIC

STOP

MAX

SOFTSTART

5.8 V

+ V

OSCILLATOR WITH JITTER

MAX

CLOCK

SAW

LIGHT LOAD FREQUENCY REDUCTION

SOFT START

COMPARATOR

÷ 8

SHUTDOWN/

AUTO-RESTART

HYSTERETIC

THERMAL

SHUTDOWN

PWM

INTERNAL SUPPLY

SRQ

CURRENT LIMIT

COMPARATOR

CONTROLLED

TURN-ON

GATE DRIVER

LEADING

EDGE

BLANKING

PI-2639-031915

DRAIN

(D)

SOURCE

(S)

Figure 2b. Functional Block Diagram (P or G Package).

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TOP242-250

PI-2629-092203

Pin Functional Description

DRAIN (D) Pin:

High voltage power MOSFET drain output. The internal start-up bias current is drawn from this pin through a switched high-voltage current source. Internal current limit sense point for drain current.

CONTROL (C) Pin:

Error ampliﬁer and feedback current input pin for duty cycle control. Internal shunt regulator connection to provide internal bias current during normal operation. It is also used as the connection point for the supply bypass and autorestart/compensation capacitor.

LINE-SENSE (L) Pin: (Y, R or F package only)

Input pin for OV, UV, line feed forward with DC remote ON/OFF and synchronization. A connection to SOURCE pin disables all functions on this pin.

EXTERNAL CURRENT LIMIT (X) Pin: (Y, R or F package only)

Input pin for external current limit adjustment, remote ON/OFF, and synchronization. A connection to SOURCE pin disables all functions on this pin.

MULTI-FUNCTION (M) Pin: (P or G package only)

This pin combines the functions of the LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) pins of the Y package into one pin. Input pin for OV, UV, line feed forward with DC reduction, external current limit adjustment, remote ON/OFF and synchronization. A connection to SOURCE pin disables all functions on this pin and makes TOPSwitch-GX operate in simple three terminal mode (like TOPSwitch-II).

Y Package (TO-220-7C)

Tab Internally

Connected to

SOURCE Pin

R Package (TO-263-7C) F Package (TO-262-7C)

P Package (DIP-8B)

G Package (SMD-8B)

Figure 3. Pin Conﬁguration (top view).

123457

CLXS FD

reduction,

MAX

7 D

5 F 4 S 3 X 2 L 1 C

PI-2724-010802

MAX

FREQUENCY (F) Pin: (Y, R or F package only)

Input pin for selecting switching frequency: 132 kHz if connected to SOURCE pin and 66 kHz if connected to CONTROL pin. The switching frequency is internally set for ﬁxed 132 kHz operation in P and G packages.

SOURCE (S) Pin:

Output MOSFET source connection for high voltage power return. Primary side control circuit common and reference point.

2 M

VUV = IUV x R V

OV = IOV x RLS

For RLS = 2 M

= 100 VDC

= 450 VDC

@100 VDC = 78%

MAX

@375 VDC = 38%

MAX

For R I

= 69%

LIMIT

See Figure 54b for other resistor values

) to select different

values

LIMIT

Input

Voltage

CONTROL

12 k

Figure 4. Y/R/F Pkg Line Sense and Externally Set Current Limit.

Ω

Input

Voltage

CONTROL

Figure 5. P/G Package Line Sense.

Input

Voltage

CONTROL

For R

= 12 k

LIMIT

For R

= 25 k

LIMIT

See Figures 54b, 55b and 56b for other resistor values (R different I

Figure 6. P/G Package Externally Set Current Limit.

= 12 k

= 69%

= 43%

) to select

LIMIT

PI-2517-022604

Ω

values.

Rev. Q 08/16

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TOP242-250

TOPSwitch-GX Family Functional Description

Like TOPSwitch, TOPSwitch-GX is an integrated switched mode power supply chip that converts a current at the control input to a duty cycle at the open drain output of a high voltage power MOSFET. During normal operation the duty cycle of the power MOSFET decreases linearly with increasing CONTROL pin current as shown in Figure 7.

In addition to the three terminal TOPSwitch features, such as the high voltage start-up, the cycle-by-cycle current limiting, loop compensation circuitry, auto-restart, thermal shutdown, the TOPSwitch-GX incorporates many additional functions that reduce system cost, increase power supply performance and design ﬂexibility. A patented high voltage CMOS technology allows both the high voltage power MOSFET and all the low voltage control circuitry to be cost effectively integrated onto a single monolithic chip.

Three terminals, FREQUENCY, LINE-SENSE, and EXTERNAL CURRENT LIMIT (available in Y, R or F package) or one terminal MULTI-FUNCTION (available in P or G package) have been added to implement some of the new functions. These terminals can be connected to the SOURCE pin to operate the TOPSwitch-GX in a TOPSwitch-like three terminal mode. However, even in this three terminal mode, the TOPSwitch-GX offers many new transparent features that do not require any external components:

1. A fully integrated 10 ms soft-start limits peak currents and voltages during start-up and dramatically reduces or eliminates output overshoot in most applications.

2. DC

3. Frequency reduction at light loads lowers the switching

4. Higher switching frequency of 132 kHz reduces the

5. Frequency jittering reduces EMI.

6. Hysteretic over-temperature shutdown ensures

7. Packages with omitted pins and lead forming provide

8. Tighter absolute tolerances and smaller temperature

The LINE-SENSE (L) pin is usually used for line sensing by connecting a resistor from this pin to the rectiﬁed DC high voltage bus to implement line overvoltage (OV), undervoltage (UV) and line feed-forward with DC this mode, the value of the resistor determines the OV/UV thresholds and the DC

of 78% allows smaller input storage capacitor,

MAX

lower input voltage requirement and/or higher power capability.

losses and maintains good cross regulation in multiple output supplies.

transformer size with no noticeable impact on EMI.

automatic recovery from thermal fault. Large hysteresis prevents circuit board overheating.

large drain creepage distance.

variations on switching frequency, current limit and PWM gain.

reduction. In

MAX

is reduced linearly starting from a

MAX

Auto-restart

132

Frequency (kHz)

Auto-restart

Duty Cycle (%)

CD1

TOP242-5 1.6 2.0 TOP246-9 2.2 2.6 TOP250 2.4 2.7

Note: For P and G packages IL is replaced with IM.

IL = 190 µA

IC (mA)

Slope = PWM Gain

IC (mA)

IL = 125 µA

= 125 µA

IL < I

L(DC)

5.2 6.0

5.8 6.6

6.5 7.3

PI-2633-011502

L(DC)

Figure 7. Relationship of Duty Cycle and Frequency to CONTROL Pin Current.

line voltage above the undervoltage threshold. See Table 2 and Figure 11.

The pin can also be used as a remote ON/OFF and a synchronization input.

The EXTERNAL CURRENT LIMIT (X) pin is usually used to reduce the current limit externally to a value close to the operating peak current, by connecting the pin to SOURCE through a resistor. This pin can also be used as a remote ON/OFF and a synchronization input in both modes. See Table 2 and Figure 11.

For the P or G packages the LINE-SENSE and EXTERNAL CURRENT LIMIT pin functions are combined on one MULTI-FUNCTION (M) pin. However, some of the functions become mutually exclusive as shown in Table 3.

The FREQUENCY (F) pin in the Y, R or F package sets the switching frequency to the default value of 132 kHz when connected to SOURCE pin. A half frequency option of

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Rev. Q 08/16

Page 6

TOP242-250

66 kHz can be chosen by connecting this pin to CONTROL pin instead. Leaving this pin open is not recommended.

CONTROL (C) Pin Operation

The CONTROL pin is a low impedance node that is capable of receiving a combined supply and feedback current. During normal operation, a shunt regulator is used to separate the feedback signal from the supply current. CONTROL pin voltage VC is the supply voltage for the control circuitry including the MOSFET gate driver. An external bypass capacitor closely connected between the CONTROL and SOURCE pins is required to supply the instantaneous gate drive current. The total amount of capacitance connected to this pin also sets the auto-restart timing as well as control loop compensation.

When rectiﬁed DC high voltage is applied to the DRAIN pin during start-up, the MOSFET is initially off, and the CONTROL pin capacitor is charged through a switched high voltage current source connected internally between the DRAIN and CONTROL pins. When the CONTROL pin voltage VC reaches approximately 5.8 V, the control circuitry is activated and the soft-start begins. The soft-start circuit gradually increases the duty cycle of the MOSFET from zero to the maximum value over approximately 10 ms. If no external feedback/supply current is fed into the CONTROL pin by the end of the soft-start, the high voltage current source is turned off and the CONTROL pin will start discharging in response to the supply current drawn by the control circuitry. If the power supply is designed properly, and no fault condition such as open loop or shorted output exists, the feedback loop will close, providing external CONTROL pin current, before the CONTROL

pin voltage has had a chance to discharge to the lower threshold voltage of approximately 4.8 V (internal supply undervoltage lockout threshold). When the externally fed current charges the CONTROL pin to the shunt regulator voltage of 5.8 V, current in excess of the consumption of the chip is shunted to SOURCE through resistor R

shown in Figure 2. This current ﬂowing through RE controls the duty cycle of the power MOSFET to provide closed loop regulation. The shunt regulator has a ﬁnite low output impedance ZC that sets the gain of the error ampliﬁer when used in a primary feedback conﬁguration. The dynamic impedance ZC of the CONTROL pin together with the external CONTROL pin capacitance sets the dominant pole for the control loop.

When a fault condition such as an open loop or shorted output prevents the ﬂow of an external current into the CONTROL pin, the capacitor on the CONTROL pin discharges towards 4.8 V. At 4.8 V, auto-restart is activated which turns the output MOSFET off and puts the control circuitry in a low current standby mode. The high-voltage current source turns on and charges the external capacitance again. A hysteretic internal supply undervoltage comparator keeps VC within a window of typically 4.8 V to 5.8 V by turning the high-voltage current source on and off as shown in Figure 8. The auto-restart circuit has a divide-by-eight counter which prevents the output MOSFET from turning on again until eight discharge/charge cycles have elapsed. This is accomplished by enabling the output MOSFET only when the divide-by-eight counter reaches full count (S7). The counter effectively limits TOPSwitch-GX power dissipation by reducing the auto-restart duty cycle to typically 4%.

LINE

0 V

DRAIN

0 V

OUT

0 V

Note: S0 through S7 are the output states of the auto-restart counter

Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-Restart (4) Power Down.

Rev. Q 08/16

S1 S2 S6 S7 S1 S2 S6 S7S0

S1 S7

S6 S7

5.8 V

4.8 V

PI-2545-082299

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Page 7

Auto-restart mode continues until output voltage regulation is again achieved through closure of the feedback loop.

Oscillator and Switching Frequency

The internal oscillator linearly charges and discharges an internal capacitance between two voltage levels to create a sawtooth waveform for the pulse width modulator. This oscillator sets the pulse width modulator/current limit latch at the beginning of each cycle.

Switching

Frequency

DRAIN

TOP242-250

136 kHz

PI-2550-092499

128 kHz

4 ms

The nominal switching frequency of 132 kHz was chosen to minimize transformer size while keeping the fundamental EMI frequency below 150 kHz. The FREQUENCY pin (available only in Y, R or F package), when shorted to the CONTROL pin, lowers the switching frequency to 66 kHz (half frequency) which may be preferable in some cases such as noise sensitive video applications or a high efﬁciency standby mode. Otherwise, the FREQUENCY pin should be connected to the SOURCE pin for the default 132 kHz.

To further reduce the EMI level, the switching frequency is jittered (frequency modulated) by approximately ±4 kHz at 250 Hz (typical) rate as shown in Figure 9. Figure 46 shows the typical improvement of EMI measurements with frequency jitter.

Pulse Width Modulator and Maximum Duty Cycle

The pulse width modulator implements voltage mode control by driving the output MOSFET with a duty cycle inversely proportional to the current into the CONTROL pin that is in excess of the internal supply current of the chip (see Figure 7). The excess current is the feedback error signal that appears across RE (see Figure 2). This signal is ﬁltered by an RC network with a typical corner frequency of 7 kHz to reduce the effect of switching noise in the chip supply current generated by the MOSFET gate driver. The ﬁltered error signal is compared with the internal oscillator sawtooth waveform to generate the duty cycle waveform. As the control current increases, the duty cycle decreases. A clock signal from the oscillator sets a latch which turns on the output MOSFET. The pulse width modulator resets the latch, turning off the output MOSFET. Note that a minimum current must be driven into the CONTROL pin before the duty cycle begins to change.

The maximum duty cycle, DC

is set at a default

MAX,

maximum value of 78% (typical). However, by connecting the LINE-SENSE or MULTI-FUNCTION pin (depending on the package) to the rectiﬁed DC high voltage bus through a resistor with appropriate value, the maximum duty cycle can be made to decrease from 78% to 38% (typical) as shown in Figure 11 when input line voltage increases (see line feed forward with DC

reduction).

MAX

Light Load Frequency Reduction

The pulse width modulator duty cycle reduces as the load at the power supply output decreases. This reduction in

Time

Figure 9. Switching Frequency Jitter (Idealized V

Waveforms).

DRAIN

duty cycle is proportional to the current ﬂowing into the CONTROL pin. As the CONTROL pin current increases, the duty cycle decreases linearly towards a duty cycle of 10%. Below 10% duty cycle, to maintain high efﬁciency at light loads, the frequency is also reduced linearly until a minimum frequency is reached at a duty cycle of 0% (refer to Figure 7). The minimum frequency is typically 30 kHz and 15 kHz for 132 kHz and 66 kHz operation, respectively.

This feature allows a power supply to operate at lower frequency at light loads thus lowering the switching losses while maintaining good cross regulation performance and low output ripple.

Error Ampliﬁer

The shunt regulator can also perform the function of an error ampliﬁer in primary side feedback applications. The shunt regulator voltage is accurately derived from a temperature-compensated bandgap reference. The gain of the error ampliﬁer is set by the CONTROL pin dynamic impedance. The CONTROL pin clamps external circuit signals to the VC voltage level. The CONTROL pin current in excess of the supply current is separated by the shunt regulator and ﬂows through RE as a voltage error signal.

On-Chip Current Limit with External Programmability

The cycle-by-cycle peak drain current limit circuit uses the output MOSFET ON-resistance as a sense resistor. A current limit comparator compares the output MOSFET on-state drain to source voltage, V voltage. High drain current causes V

with a threshold

DS(ON)

to exceed the

DS(ON)

threshold voltage and turns the output MOSFET off until the start of the next clock cycle. The current limit comparator threshold voltage is temperature compensated to minimize the variation of the current limit due to temperature related changes in R

of the output MOSFET. The default

DS(ON)

current limit of TOPSwitch-GX is preset internally. However, with a resistor connected between EXTERNAL CURRENT LIMIT (X) pin (Y, R or F package) or MULTI-FUNCTION (M) pin (P or G package) and SOURCE pin, current limit can be programmed externally to a lower level between 30%

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Rev. Q 08/16

Page 8

TOP242-250

and 100% of the default current limit. Please refer to the graphs in the typical performance characteristics section for the selection of the resistor value. By setting current limit low, a larger TOPSwitch-GX than necessary for the power required can be used to take advantage of the lower R

DS(ON)

for higher efﬁciency/smaller heat sinking requirements. With a second resistor connected between the EXTERNAL CURRENT LIMIT (X) pin (Y, R or F package) or MULTIFUNCTION (M) pin (P or G package) and the rectiﬁed DC high voltage bus, the current limit is reduced with increasing line voltage, allowing a true power limiting operation against line variation to be implemented. When using an RCD clamp, this power limiting technique reduces maximum clamp voltage at high line. This allows for higher reﬂected voltage designs as well as reducing clamp dissipation.

The leading edge blanking circuit inhibits the current limit comparator for a short time after the output MOSFET is turned on. The leading edge blanking time has been set so that, if a power supply is designed properly, current spikes caused by primary-side capacitances and secondary-side rectiﬁer reverse recovery time should not cause premature termination of the switching pulse.

The current limit is lower for a short period after the leading edge blanking time as shown in Figure 52. This is due to dynamic characteristics of the MOSFET. To avoid triggering the current limit in normal operation, the drain current waveform should stay within the envelope shown.

Line Undervoltage Detection (UV)

At power up, UV keeps TOPSwitch-GX off until the input line voltage reaches the undervoltage threshold. At power down, UV prevents auto-restart attempts after the output goes out of regulation. This eliminates power down glitches caused by slow discharge of the large input

storage capacitor present in applications such as standby supplies. A single resistor connected from the LINESENSE pin (Y, R or F package) or MULTI-FUNCTION pin (P or G package) to the rectiﬁed DC high voltage bus sets UV threshold during power up. Once the power supply is successfully turned on, the UV threshold is lowered to 40% of the initial UV threshold to allow extended input voltage operating range (UV low threshold). If the UV low threshold is reached during operation without the power supply losing regulation, the device will turn off and stay off until UV (high threshold) has been reached again. If the power supply loses regulation before reaching the UV low threshold, the device will enter auto-restart. At the end of each auto-restart cycle (S7), the UV comparator is enabled. If the UV high threshold is not exceeded the MOSFET will be disabled during the next cycle (see Figure 8). The UV feature can be disabled independent of the OV feature as shown in Figures 19 and 23.

Line Overvoltage Shutdown (OV)

The same resistor used for UV also sets an overvoltage threshold which, once exceeded, will force TOPSwitch-GX output into off-state. The ratio of OV and UV thresholds is preset at 4.5 as can be seen in Figure 11. When the MOSFET is off, the rectiﬁed DC high voltage surge capability is increased to the voltage rating of the MOSFET (700 V), due to the absence of the reﬂected voltage and leakage spikes on the drain. A small amount of hysteresis is provided on the OV threshold to prevent noise triggering. The OV feature can be disabled independent of the UV feature as shown in Figures 18 and 32.

Line Feed-Forward with DC

Reduction

MAX

The same resistor used for UV and OV also implements line voltage feed-forward, which minimizes output line ripple and reduces power supply output sensitivity to line

Oscillator

X, L or M Pin (STOP)

Figure 10. Synchronization Timing Diagram.

Rev. Q 08/16

(SAW)

MAX

Enable from

Time

PI-2637-060600

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Page 9

TOP242-250

transients. This feed-forward operation is illustrated in Figure 7 by the different values of IL (Y, R or F package) or IM (P or G package). Note that for the same CONTROL pin current, higher line voltage results in smaller operating duty cycle. As an added feature, the maximum duty cycle DC

is also reduced from 78% (typical) at a voltage

MAX

slightly higher than the UV threshold to 30% (typical) at the OV threshold (see Figure 11). Limiting DC

at higher

MAX

line voltages helps prevent transformer saturation due to large load transients in TOP248, TOP249 and TOP250 forward converter applications. DC

of 38% at high

MAX

line was chosen to ensure that the power capability of the TOPSwitch-GX is not restricted by this feature under normal operation.

Remote ON/OFF and Synchronization

TOPSwitch-GX can be turned on or off by controlling the current into the LINE-SENSE pin or out from the EXTERNAL CURRENT LIMIT pin (Y, R or F package) and into or out from the MULTI-FUNCTION pin (P or G package) (see Figure 11). In addition, the LINE-SENSE pin has a 1 V threshold comparator connected at its input. This voltage threshold can also be used to perform remote ON/OFF control. This allows easy implementation of remote ON/OFF control of TOPSwitch-GX in several different ways. A transistor or an optocoupler output connected between the EXTERNAL CURRENT LIMIT or LINE-SENSE pins (Y, R or F package) or the MULTI-FUNCTION pin (P or G package) and the SOURCE pin implements this function with “active-on” (Figures 22, 29 and 36) while a transistor or an optocoupler output connected between the LINESENSE pin (Y, R or F package) or the MULTI-FUNCTION (P or G package) pin and the CONTROL pin implements the function with “active-off” (Figures 23 and 37).

When a signal is received at the LINE-SENSE pin or the EXTERNAL CURRENT LIMIT pin (Y, R or F package) or the MULTI-FUNCTION pin (P or G package) to disable the output through any of the pin functions such as OV, UV and remote ON/OFF, TOPSwitch-GX always completes its current switching cycle, as illustrated in Figure 10, before the output is forced off. The internal oscillator is stopped slightly before the end of the current cycle and stays there as long as the disable signal exists. When the signal at the above pins changes state from disable to enable, the internal oscillator starts the next switching cycle. This approach allows the use of these pins to synchronize TOPSwitch-GX to any external signal with a frequency between its internal switching frequency and 20 kHz.

As seen above, the remote ON/OFF feature allows the TOPSwitch-GX to be turned on and off instantly, on a cycleby-cycle basis, with very little delay. However, remote ON/OFF can also be used as a standby or power switch to turn off the TOPSwitch-GX and keep it in a very low power consumption state for indeﬁnitely long periods. If the TOPSwitch-GX is held in remote off state for long enough

time to allow the CONTROL pin to discharge to the internal supply undervoltage threshold of 4.8 V (approximately 32 ms for a 47 µF CONTROL pin capacitance), the CONTROL pin goes into the hysteretic mode of regulation. In this mode, the CONTROL pin goes through alternate charge and discharge cycles between 4.8 V and 5.8 V (see CONTROL pin operation section above) and runs entirely off the high voltage DC input, but with very low power consumption (160 mW typical at 230 VAC with M or X pins open). When the TOPSwitch-GX is remotely turned on after entering this mode, it will initiate a normal start-up sequence with soft-start the next time the CONTROL pin reaches 5.8 V. In the worst case, the delay from remote on to start-up can be equal to the full discharge/charge cycle time of the CONTROL pin, which is approximately 125 ms for a 47 µF CONTROL pin capacitor. This reduced consumption remote off mode can eliminate expensive and unreliable in-line mechanical switches. It also allows for microprocessor controlled turn-on and turn-off sequences that may be required in certain applications such as inkjet and laser printers.

Soft-Start

Two on-chip soft-start functions are activated at start-up with a duration of 10 ms (typical). Maximum duty cycle starts from 0% and linearly increases to the default maximum of 78% at the end of the 10 ms duration and the current limit starts from about 85% and linearly increases to 100% at the end of the 10 ms duration. In addition to start-up, soft-start is also activated at each restart attempt during auto-restart and when restarting after being in hysteretic regulation of CONTROL pin voltage (VC), due to remote OFF or thermal shutdown conditions. This effectively minimizes current and voltage stresses on the output MOSFET, the clamp circuit and the output rectiﬁer during start-up. This feature also helps minimize output overshoot and prevents saturation of the transformer during start-up.

Shutdown/Auto-Restart

To minimize TOPSwitch-GX power dissipation under fault conditions, the shutdown/auto-restart circuit turns the power supply on and off at an auto-restart duty cycle of typically 4% if an out of regulation condition persists. Loss of regulation interrupts the external current into the CONTROL pin. VC regulation changes from shunt mode to the hysteretic auto-restart mode as described in CONTROL pin operation section. When the fault condition is removed, the power supply output becomes regulated, VC regulation returns to shunt mode, and normal operation of the power supply resumes.

Hysteretic Over-Temperature Protection

Temperature protection is provided by a precision analog circuit that turns the output MOSFET off when the junction temperature exceeds the thermal shutdown temperature (140 °C typical). When the junction temperature cools to below the hysteretic temperature, normal operation

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Rev. Q 08/16

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TOP242-250

resumes providing automatic recovery. A large hysteresis of 70 °C (typical) is provided to prevent overheating of the PC board due to a continuous fault condition. VC is regulated in hysteretic mode and a 4.8 V to 5.8 V (typical) sawtooth waveform is present on the CONTROL pin while in thermal shutdown.

Bandgap Reference

All critical TOPSwitch-GX internal voltages are derived from a temperature-compensated bandgap reference. This reference is also used to generate a temperaturecompensated current reference, which is trimmed to accurately set the switching frequency, MOSFET gate drive current, current limit, and the line OV/UV thresholds. TOPSwitch-GX has improved circuitry to maintain all of the above critical parameters within very tight absolute and temperature tolerances.

High-Voltage Bias Current Source

This current source biases TOPSwitch-GX from the DRAIN pin and charges the CONTROL pin external capacitance during start-up or hysteretic operation. Hysteretic operation occurs during auto-restart, remote OFF and over-temperature shutdown. In this mode of operation, the current source is switched on and off with an effective duty cycle of approximately 35%. This duty cycle is determined by the ratio of CONTROL pin charge (IC) and discharge currents (I

CD1

and I

). This current source is turned off during normal

CD2

operation when the output MOSFET is switching. The effect of the current source switching will be seen on the DRAIN voltage waveform as small disturbances and is normal.

Using Feature Pins

FREQUENCY (F) Pin Operation

The FREQUENCY pin is a digital input pin available in the Y, R or F package only. Shorting the FREQUENCY pin to SOURCE pin selects the nominal switching frequency of

132 kHz (Figure 13), which is suited for most applications. For other cases that may beneﬁt from lower switching frequency such as noise sensitive video applications, a 66 kHz switching frequency (half frequency) can be selected by shorting the FREQUENCY pin to the CONTROL pin (Figure 14). In addition, an example circuit shown in Figure 15 may be used to lower the switching frequency from 132 kHz in normal operation to 66 kHz in standby mode for very low standby power consumption.

LINE-SENSE (L) Pin Operation (Y, R and F Packages)

When current is fed into the LINE-SENSE pin, it works as a voltage source of approximately 2.6 V up to a maximum current of +400 µA (typical). At +400 µA, this pin turns into a constant current sink. Refer to Figure 12a. In addition, a comparator with a threshold of 1 V is connected at the pin and is used to detect when the pin is shorted to the SOURCE pin.

There are a total of four functions available through the use of the LINE-SENSE pin: OV, UV, line feed-forward with DC

reduction, and remote ON/OFF. Connecting

MAX

the LINE-SENSE pin to the SOURCE pin disables all four functions. The LINE-SENSE pin is typically used for line sensing by connecting a resistor from this pin to the rectiﬁed DC high voltage bus to implement OV, UV and DC

reduction with line voltage. In this mode, the value

MAX

of the resistor determines the line OV/UV thresholds, and the DC

is reduced linearly with rectiﬁed DC high voltage

MAX

starting from just above the UV threshold. The pin can also be used as a remote ON/OFF and a synchronization input. Refer to Table 2 for possible combinations of the functions with example circuits shown in Figure 16 through Figure 40. A description of speciﬁc functions in terms of the LINE-SENSE pin I/V characteristic is shown in Figure 11 (right hand side). The horizontal axis represents LINESENSE pin current with positive polarity indicating currents

LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

Figure Number 16 17 18 19 20 21 22 23 24 25 26 27 28 29

Three Terminal Operation

Undervoltage

Overvoltage

Line Feed-Forward (DC

Overload Power Limiting

External Current Limit

Remote ON/OFF

*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin conﬁgurations that are possible.

Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Conﬁgurations.

Rev. Q 08/16

MAX

3 3 3 3 3

)

3 3 3 3

3 3 3 3 3 3

3 3 3 3 3 3 3

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Page 11

TOP242-250

ﬂowing into the pin. The meaning of the vertical axes varies with functions. For those that control the ON/OFF states of the output such as UV, OV and remote ON/OFF, the vertical axis represents the enable/disable states of the output. UV triggers at IUV (+50 µA typical with 30 µA hysteresis) and OV triggers at IOV (+225 µA typical with 8 µA hysteresis). Between the UV and OV thresholds, the output is enabled. For line feed-forward with DC represents the magnitude of the DC with DC at I

L(DC)

reduction lowers maximum duty cycle from 78%

MAX

(+60 µA typical) to 38% at IOV (+225 µA).

reduction, the vertical axis

MAX

. Line feed-forward

MAX

EXTERNAL CURRENT LIMIT (X) Pin Operation (Y, R and F Packages)

When current is drawn out of the EXTERNAL CURRENT LIMIT pin, it works as a voltage source of approximately

1.3 V up to a maximum current of -240 µA (typical). At

-240 µA, it turns into a constant current source (refer to

Figure 12a).

There are two functions available through the use of the EXTERNAL CURRENT LIMIT pin: external current limit and remote ON/OFF. Connecting the EXTERNAL CURRENT LIMIT pin to the SOURCE pin disables the two functions. In high efﬁciency applications, this pin can be used to reduce the current limit externally to a value close to the operating peak current by connecting the pin to the SOURCE pin through a resistor. The pin can also be used for remote ON/OFF. Table 2 shows several possible combinations using this pin. See Figure 11 for a description of the functions where the horizontal axis (left hand side) represents the EXTERNAL CURRENT LIMIT pin current. The meaning of the vertical axes varies with function. For those that control the ON/OFF states of the output such as remote ON/OFF, the vertical axis represents the enable/ disable states of the output. For external current limit, the vertical axis represents the magnitude of the I

. Please

LIMIT

see graphs in the Typical Performance Characteristics

section for the current limit programming range and the selection of appropriate resistor value.

MULTI-FUNCTION (M) Pin Operation (P and G Packages)

The LINE-SENSE and EXTERNAL CURRENT LIMIT pin functions are combined to a single MULTI-FUNCTION pin for P and G packages. The comparator with a 1 V threshold at the LINE-SENSE pin is removed in this case as shown in Figure 2b. All of the other functions are kept intact. However, since some of the functions require opposite polarity of input current (MULTI-FUNCTION pin), they are mutually exclusive. For example, line sensing features cannot be used simultaneously with external current limit setting. When current is fed into the MULTIFUNCTION pin, it works as a voltage source of approximately 2.6 V up to a maximum current of +400 µA (typical). At +400 µA, this pin turns into a constant current sink. When current is drawn out of the MULTI-FUNCTION pin, it works as a voltage source of approximately 1.3 V up to a maximum current of -240 µA (typical). At -240 µA, it turns into a constant current source. Refer to Figure 12b.

There are a total of ﬁve functions available through the use of the MULTI-FUNCTION pin: OV, UV, line feed-forward with DC

reduction, external current limit and remote

MAX

ON/OFF. A short circuit between the MULTI-FUNCTION pin and SOURCE pin disables all ﬁve functions and forces TOPSwitch-GX to operate in a simple three terminal mode like TOPSwitch-II. The MULTI-FUNCTION pin is typically used for line sensing by connecting a resistor from this pin to the rectiﬁed DC high voltage bus to implement OV, UV and DC

reduction with line voltage. In this mode, the

MAX

value of the resistor determines the line OV/UV thresholds, and the DC

is reduced linearly with increasing rectiﬁed

MAX

DC high voltage starting from just above the UV threshold. External current limit programming is implemented by connecting the MULTI-FUNCTION pin to the SOURCE pin

MULTI-FUNCTION PIN TABLE*

Figure Number 30 31 32 33 34 35 36 37 38 39 40

Three Terminal Operation

Undervoltage

Overvoltage

Line Feed-Forward (DC

Overload Power Limiting

External Current Limit

Remote ON/OFF

*This table is only a partial list of many MULTI-FUNCTION pin conﬁgurations that are possible.

Table 3. Typcial MULTI-FUNCTION Pin Conﬁgurations.

www.power.com

MAX

3 3 3

)

3 3

3 3 3 3

3 3 3 3 3

Rev. Q 08/16

Page 12

TOP242-250

M Pin

L PinX Pin

Output MOSFET Switching

Current

Limit

Maximum

Duty Cycle

(Enabled)

(Disabled)

(Default)

LIMIT

(78.5%)

MAX

-22 A

-27

REM(N)

Disabled when supply output goes out of regulation

+ V

Pin Voltage

-250 -200 -150 -100 -50 050 100 150 200 250 300 350 400

X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current ( A)

Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric table and typical performance characteristics sections of the data sheet for measured data.

PI-2636-010802

Figure 11. MULTI-FUNCTION (P or G package), LINSE-SENSE, and EXTERNAL CURRENT LIMIT (Y, R or F package) Pin Characteristics.

through a resistor. However, this function is not necessary in most applications since the internal current limit of the P and G package devices has been reduced, compared to the Y, R and F package devices, to match the thermal dissipation capability of the P and G packages. It is therefore recommended that the MULTI-FUNCTION pin is used for line sensing as described above and not for external current limit reduction. The same pin can also be used as a remote ON/OFF and a synchronization input in both modes. Please refer to Table 3 for possible combinations of the functions with example circuits shown in Figure 30 through Figure 40. A description of speciﬁc functions in terms of the MULTI-FUNCTION pin I/V characteristic is

shown in Figure 11. The horizontal axis represents MULTIFUNCTION pin current with positive polarity indicating currents ﬂowing into the pin. The meaning of the vertical axes varies with functions. For those that control the ON/ OFF states of the output such as UV, OV and remote ON/ OFF, the vertical axis represents the enable/disable states of the output. UV triggers at IUV (+50 µA typical) and OV triggers at IOV (+225 µA typical with 30 µA hysteresis). Between the UV and OV thresholds, the output is enabled. For external current limit and line feed- forward with DC reduction, the vertical axis represents the magnitude of the I reduction lowers maximum duty cycle from 78% at I

LIMIT

and DC

. Line feed-forward with DC

MAX

M(DC)

MAX

Rev. Q 08/16

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TOP242-250

CONTROL (C)

240 µA

VBG + V

EXTERNAL CURRENT LIMIT (X)

LINE-SENSE (L)

TOPSwitch-GX

(Negative Current Sense - ON/OFF,

Current Limit Adjustment)

(Voltage Sense)

1 V

(Positive Current Sense - Undervoltage,

Overvoltage, ON/OFF Maximum Duty

400 µA

Cycle Reduction)

Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simpliﬁed Schematic.

Y, R and F Package

PI-2634-022604

P and G Package

CONTROL (C)

240 µA

VBG + V

MULTI-FUNCTION (M)

400 µA

Figure 12b. MULTI-FUNCTION (M) Pin Input Simpliﬁed Schematic.

(+60 µA typical) to 38% at IOV (+225 µA). External current limit is available only with negative MULTI-FUNCTION pin current. Please see graphs in the Typical Performance Characteristics section for the current limit programming range and the selection of appropriate resistor value.

TOPSwitch-GX

(Negative Current Sense - ON/OFF,

Current Limit Adjustment)

(Positive Current Sense - Undervoltage,

Overvoltage, Maximum Duty

Cycle Reduction)

PI-2548-022604

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TOP242-250

Typical Uses of FREQUENCY (F) PIN

Input

Voltage

CONTROL

PI-2654-071700

Input

Voltage

CONTROL

Figure 13. Full Frequency Operation (132 kHz). Figure 14. Half Frequency Operation (66 kHz).

Input

Voltage

CONTROL

PI-2655-071700

Ω

STANDBY

Figure 15. Half Frequency Standby Mode (For High Standby Efﬁciency).

Rev. Q 08/16

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Page 15

Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins

TOP242-250

C L X S F D

Input

Voltage

Figure 16. Three Terminal Operation (LINE-SENSE and EXTERNAL CURRENT LIMIT Features Disabled. FREQUENCY Pin Tied to SOURCE or CONTROL Pin).

Input

Voltage

CONTROL

X F

CONTROL

C S D

PI-2617-050100

Ω

VUV = IUV x R V

OV = IOV x RLS

For RLS = 2 M

2 MR

VUV = 100 VDC V

DC DC

450 VDC

OV =

@100 VDC = 78%

MAX

@375 VDC = 38%

MAX

PI-2618-081403

Input

Voltage

CONTROL

Figure 17. Line-Sensing for Undervoltage, Overvoltage and Line Feed-Forward.

Ω

Input

Voltage

CONTROL

Ω

Figure 18. Line-Sensing for Undervoltage Only (Overvoltage Disabled).

Input

Voltage

CONTROL

For R

= 12 k

LIMIT

= 25 k

LIMIT

= 69%

= 43%

For R I

See Figure 54b for other resistor values

)

PI-2623-092303

Figure 20. Externally Set Current Limit.

Figure 19. Linse-Sensing for Overvoltage Only (Undervoltage Disabled). Maximum Duty Cycle Reduced at Low Line and Further Reduction with Increasing Line Voltage.

Ω

Input

Voltage

CONTROL

Ω

Figure 21. Current Limit Reduction with Line Voltage.

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Rev. Q 08/16

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TOP242-250

Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)

QR can be an optocoupler output or can be replaced by a manual switch.

Input

Voltage

CONTROL

47 K

ON/OFF

Input

Voltage

ON/OFF

PI-2625-040501

Ω

CONTROL

Ω

Figure 22. Active-on (Fail Safe) Remove ON/OFF. Figure 23. Active-off Remote ON/OFF. Maximum Duty Cycle

Reduced.

Input

Voltage

CONTROL

can be an optocoupler

output or can be replaced by a manual switch.

For R

12 k

LIMIT

= 69%

25 k

= 43%

For R

Input

Voltage

ON/OFF

Ω

CONTROL

Ω

47 k

ON/OFF

PI-2626-040501

Figure 24. Active-on Remote ON/OFF with Externally Set Current Limit.

Ω

ON/OFF

Input

Voltage

Ω

CONTROL

Figure 25. Active-off Remote ON/OFF with Externally Set Current Limit.

Ω

Input

Voltage

CONTROL

VUV = IUV x R V

OV = IOV x RLS

@100 VDC = 78%

2 M

MAX

@375 VDC = 38%

MAX

can be an optocoupler

output or can be replaced by a manual switch.

For R I

47 k

12 k

= 69%

LIMIT

ON/OFF

PI-2628-040501

Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and

EXTERNAL CURRENT LIMIT.

Rev. Q 08/16

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Page 17

TOP242-250

PI-2629-092203

Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)

Input

Voltage

CONTROL

12 k

VUV = IUV x R V

OV = IOV x RLS

For RLS = 2 M

2 M

MAX

For R I

LIMIT

See Figure 54b for

other resistor values (R

LIMIT

= 100 VDC = 450 VDC

@100 VDC = 78% @375 VDC = 38%

= 69%

) to select different

values

= 12 k

Input

Voltage

CONTROL

Figure 28. Line-Sensing and Externally Set Current Limit. Figure 29. Active-on Remote ON/OFF.

Typical Uses of MULTI-FUNCTION (M) Pin

S S

Input

Voltage

CONTROL

D S

C D S

Input

Voltage

CONTROL

Ω

ON/OFF

Ω

PI-2508-081199

Figure 30. Three Terminal Operation (MULIT-FUNCTION Features Disabled).

Ω

Input

Ω

Voltage

CONTROL

Figure 32. Line-Sensing for Undervoltage Only (Overvoltage Disabled).

www.power.com

Figure 31. Line-Sensing for Undervoltage, Overvoltage and Line Feed-Forward.

Ω

Input

Ω

Voltage

CONTROL

Figure 33. Line-Sensing for Overvoltage Only (Undervoltage Disabled). Maximum Duty Cycle Reduced at Low Line and Further Reduction with Increasing Line Voltage.

Rev. Q 08/16

Page 18

TOP242-250

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

Input

Voltage

CONTROL

For R

= 12 k

LIMIT

= 25 k

LIMIT

= 69%

= 43%

For R I

See Figures 54b, 55b and 56b for other resistor values (R different I

) to select

values.

LIMIT

PI-2517-022604

Figure 34. Externally Set Current Limit (Not Normally Required See M Pin Operation Description).

QR can be an optocoupler output or can be replaced by a manual switch.

Input

Voltage

ON/OFF

47 kΩ

CONTROL

PI-2519-040501

Ω

Input

Voltage

CONTROL

Ω

Figure 35. Current Limit Reduction with Line Voltage (Not Normally Required-See M Pin Operation Description).

Input

Voltage

ON/OFF

Ω

CONTROL

Ω

Figure 36. Active-on (Fail Safe) Remote ON/OFF.

Rev. Q 08/16

Figure 37. Active-off Remote ON/OFF. Maximum Duty Cycle Reduced.

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Page 19

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

TOP242-250

can be an optocoupler

output or can be replaced by a manual switch.

For R

12 k

LIMIT

ON/OFF

= 69%

25 k

= 43%

PI-2520-040501

Ω

For R

Voltage

ON/OFF

Input

47 k

CONTROL

Figure 38. Active-on Remote ON/OFF with Externally Set Current Limit (See M Pin Operation Description).

Input

Voltage

CONTROL

ON/OFF

Input

Voltage

Ω

CONTROL

Ω

Figure 39. Active-off Remote ON/OFF with Externally Set Current Limit (See M Pin Operation Description).

Ω

Figure 40. Active-off Remote ON/OFF with LINE-SENSE.

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Rev. Q 08/16

Page 20

TOP242-250

Application Examples

A High Efﬁciency, 30 W, Universal Input Power Supply

The circuit shown in Figure 41 takes advantage of several of the TOPSwitch-GX features to reduce system cost and power supply size and to improve efﬁciency. This design delivers 30 W at 12 V, from an 85 VAC to 265 VAC input, at an ambient of 50 °C, in an open frame conﬁguration. A nominal efﬁciency of 80% at full load is achieved using TOP244Y.

The current limit is externally set by resistors R1 and R2 to a value just above the low line operating peak DRAIN current of approximately 70% of the default current limit. This allows use of a smaller transformer core size and/or higher transformer primary inductance for a given output power, reducing TOPSwitch-GX power dissipation, while at the same time avoiding transformer core saturation during start-up and output transient conditions. The resistors R1 & R2 provide a signal that reduces the current limit with increasing line voltage, which in turn limits the maximum overload power at high input line voltage. This function in combination with the built-in soft-start feature of TOPSwitch-GX, allows the use of a low cost RCD clamp (R3, C3 and D1) with a higher reﬂected voltage, by safely limiting the TOPSwitch-GX drain voltage, with adequate margin under worst case conditions. Resistor R4

provides line sensing, setting UV at 100 VDC and OV at 450 VDC. The extended maximum duty cycle feature of TOPSwitch-GX (guaranteed minimum value of 75% vs. 64% for TOPSwitch-II) allows the use of a smaller input capacitor (C1). The extended maximum duty cycle and the higher reﬂected voltage possible with the RCD clamp also permit the use of a higher primary to secondary turns ratio for T1, which reduces the peak reverse voltage experienced by the secondary rectiﬁer D8. As a result a 60 V Schottky rectiﬁer can be used for up to 15 V outputs, which greatly improves power supply efﬁciency. The frequency reduction feature of the TOPSwitch-GX eliminates the need for any dummy loading for regulation at no load and reduces the no-load/standby consumption of the power supply. Frequency jitter provides improved margin for conducted EMI, meeting the CISPR 22 (FCC B) speciﬁcation.

Output regulation is achieved by using a simple Zener sense circuit for low cost. The output voltage is determined by the Zener diode (VR2) voltage and the voltage drops across the optocoupler (U2) LED and resistor R6. Resistor R8 provides bias current to Zener VR2 for typical regulation of ±5% at the 12 V output level, over line and load and component variations.

PERFORMANCE SUMMARY

Output Power: 30 W Regulation: ± 4% Efficiency: ≥ 79% Ripple: ≤ 50 mV pk-pk

BR1

600 V

20 mH

CX1

100 nF

250 VAC

3.15 A

68 µF 400 V

4.7 nF 1 kV

UF4005

2 MΩ 1/2 W

4.7 MΩ

1/2 W

9.09 kΩ

68 kΩ

2 W

CONTROL

SXF

CY1

2.2 nF

TOPSwitch-GX

TOP244Y

6.8 Ω

47 µF

10 V

C14

1 nF

150 Ω

MBR1060

1N4148

R15

C10

560 µF

35 V

0.1 µF

C11

560 µF

35 V

150 Ω

3.3 µH

LTV817A

VR2 1N5240C 10 V, 2%

12 V @

2.5 A

C12

220 µF

35 V

RTN

150 Ω

PI-2657-081204

Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.

Rev. Q 08/16

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Page 21

TOP242-250

85-265 VAC

A High Efﬁciency, Enclosed, 70 W, Universal Adapter Supply

The circuit shown in Figure 42 takes advantage of several of the TOPSwitch-GX features to reduce cost, power supply size and increase efﬁciency. This design delivers 70 W at 19 V, from an 85 VAC to 265 VAC input, at an ambient of 40 °C, in a small sealed adapter case (4”x2.15”x1”). Full load efﬁciency is 85% at 85 VAC rising to 90% at 230 VAC input.

Due to the thermal environment of a sealed adapter, a TOP249Y is used to minimize device dissipation. Resistors R9 and R10 externally program the current limit level to just above the operating peak DRAIN current at full load and low line. This allows the use of a smaller transformer core size without saturation during start-up or output load transients. Resistors R9 and R10 also reduce the current limit with increasing line voltage, limiting the maximum overload power at high input line voltage, removing the need for any protection circuitry on the secondary. Resistor R11 implements an undervoltage and overvoltage sense as well as providing line feed-forward for reduced output line frequency ripple. With resistor R11 set at 2 MΩ, the power supply does not start operating until the DC rail voltage reaches 100 VDC. On removal of the AC input, the UV sense prevents the output glitching as C1 discharges, turning off the TOPSwitch-GX when the output regulation is

lost or when the input voltage falls to below 40 V, whichever occurs ﬁrst. This same value of R11 sets the OV threshold to 450 V. If exceeded, for example during a line surge, TOPSwitch-GX stops switching for the duration of the surge, extending the high voltage withstand to 700 V without device damage. Capacitor C11 has been added in parallel with VR1 to reduce Zener clamp dissipation. With a switching frequency of 132 kHz, a PQ26/20 core can be used to provide 70 W. To maximize efﬁciency, by reducing winding losses, two output windings are used each with their own dual 100 V Schottky rectiﬁer (D2 and D3). The frequency reduction feature of the TOPSwitch-GX eliminates any dummy loading to maintain regulation at no load and reduces the no-load consumption of the power supply to only 520 mW at 230 VAC input. Frequency jittering provides conducted EMI meeting the CISPR 22 (FCC B) / EN55022B speciﬁcation, using simple ﬁlter components (C7, L2, L3 and C6), even with the output earth grounded.

To regulate the output, an optocoupler (U2) is used with a secondary reference sensing the output voltage via a resistor divider (U3, R4, R5, R6). Diode D4 and C15 ﬁlter and smooth the output of the bias winding. Capacitor C15 (1 µF) prevents the bias voltage from falling during zero to full load transients. Resistor R8 provides ﬁltering of leakage inductance spikes, keeping the bias voltage constant even at high output loads.

0.1

820

RS805

8A 600 V

RT1

1.7 A

3.15 A

BR1

C13

0.33 400 V

L3 75 2A

0.022 F

150 F

400 V

C12

400 V

C11

0.01 F 400 V

13 M

20.5 k

VR1 P6KE200

D1 UF4006

R11 2 M 1/2 W

CONTROL

R10

CONTROL

SXF

C7 2.2 nF

Y1 Safety

TOPSwitch-GX

TOP249Y

0.1 50 V

D2 MBR20100

D3 MBR20100

D4 1N4148

4.7

6.8

16 V

PERFORMANCE SUMMARY

Output Power: 70 W Regulation: Efficiency: 84% Ripple: 120 mV pk-pk No Load Consumption: 0.52 W @ 230 VAC

820

25 V

820

25 V

PC817A

C15

1 50 V

TL431

All resistors 1/8 W 5% unless otherwise stated.

200

270

1 k

4.7 nF 50 V

56 k

C14

0.1

820

25 V

50 V

31.6 k 1%

562

C10

0.1 50 V

4.75 k 1%

19 V

@ 3.6 A

PI-2691-042203

RTN

Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.

www.power.com

Rev. Q 08/16

Page 22

TOP242-250

Resistor R7, C9 and C10 together with C5 and R3 provide loop compensation.

Due to the large primary currents, all the small signal control components are connected to a separate source node that is Kelvin connected to the SOURCE pin of the TOPSwitch-GX. For improved common-mode surge immunity, the bias winding common returns directly to the DC bulk capacitor (C1).

A High Efﬁciency, 250 W, 250-380 VDC Input Power Supply

The circuit shown in Figure 43 delivers 250 W (48 V @

5.2 A) at 84% efﬁciency using a TOP249 from a 250 VDC to 380 VDC input. DC input is shown, as typically at this power level a p.f.c. boost stage would preceed this supply, providing the DC input (C1 is included to provide local decoupling). Flyback topology is still usable at this power level due to the high output voltage, keeping the secondary peak currents low enough so that the output diode and capacitors are reasonably sized.

In this example, the TOP249 is at the upper limit of its power capability and the current limit is set to the internal maximum by connecting the X pin to SOURCE. However, line sensing is implemented by connecting a 2 MΩ resistor from the L pin to the DC rail. If the DC input rail rises above

450 VDC, then TOPSwitch-GX will stop switching until the voltage returns to normal, preventing device damage.

Due to the high primary current, a low leakage inductance transformer is essential. Therefore, a sandwich winding with a copper foil secondary was used. Even with this technique, the leakage inductance energy is beyond the power capability of a simple Zener clamp. Therefore, R2, R3 and C6 are added in parallel to VR1. These have been sized such that during normal operation, very little power is dissipated by VR1, the leakage energy instead being dissipated by R2 and R3. However, VR1 is essential to limit the peak drain voltage during start-up and/or overload conditions to below the 700 V rating of the TOPSwitch-GX MOSFET.

The secondary is rectifed and smoothed by D2 and C9, C10 and C11. Three capacitors are used to meet the secondary ripple current requirement. Inductor L2 and C12 provide switching noise ﬁltering.

A simple Zener sensing chain regulates the output voltage. The sum of the voltage drop of VR2, VR3 and VR4 plus the LED drop of U2 gives the desired output voltage. Resistor R6 limits LED current and sets overall control loop DC gain. Diode D4 and C14 provide secondary soft-ﬁnish, feeding current into the CONTROL pin prior to output regulation

+250-380

VDC

0 V

VR1

P6KE200

2 MΩ 1/2 W

22 µF 400 V

PERFORMANCE SUMMARY

Output Power: 250 W Line Regulation: ± 1% Load Regulation: ± 5% Efficiency: ≥ 85% Ripple: < 100 mV pk-pk No Load Consumption: ≤ 1.4 W (300 VDC)

68 kΩ

2 W

68 kΩ

BYV26C

2 W

SXF

4.7 nF 1 kV

CONTROL

2.2 nF Y1

TOPSwitch-GX

TOP249Y

0.1 µF

50 V

D2 MUR1640CT

560 µF

D2 1N4148

6.8 Ω

47 µF

10 V

63 V

C10

1 µF 50 V

560 µF

63 V

LTV817A

100 Ω

C13

150 nF

63 V

VR2 22 V

BZX79B22

VR3 12 V

BZX79B12

VR4 12 V

BZX79B12

All resistor 1/8 W 5% unless otherwise stated.

C11

3 µH 8A

56 Ω

C12

68 µF

63 V

D4 1N4148

22 µF

10 kΩ

C14

63 V

48 V@

5.2 A

RTN

PI-2692-081204

Figure 43. 250 W, 48 V Power Supply using TOP249.

Rev. Q 08/16

www.power.com

Page 23

TOP242-250

185-265 VAC

and thus ensuring that the output voltage reaches regulation at start-up under low line, full load conditions. Resistor R9 provides a discharge path for C14. Capacitor C13 and R8 provide control loop compensation and are required due to the gain associated with such a high output voltage.

Sufﬁcient heat sinking is required to keep the TOPSwitch-GX device below 110 °C when operating under full load, low line and maximum ambient temperature. Airﬂow may also be required if a large heat sink area is not acceptable.

Multiple Output, 60 W, 185-265 VAC Input Power Supply

Figure 44 shows a multiple output supply typical for high end set-top boxes or cable decoders containing high capacity hard disks for recording. The supply delivers an output power of 45 W continuous/60 W peak (thermally limited) from an input voltage of 185 VAC to 265 VAC. Efﬁciency at 45 W, 185 VAC is ≥ 75%.

The 3.3 V and 5 V outputs are regulated to ±5% without the need for secondary linear regulators. DC stacking (the secondary winding reference for the other output voltages is connected to the cathode of D10 rather than the anode) is used to minimize the voltage error for the higher voltage outputs.

Due to the high ambient operating temperature requirement typical of a set-top box (60 °C), the TOP246Y is used to reduce conduction losses and minimize heat sink size. Resistor R2 sets the device current limit to 80% of typical to limit overload power. The line sense resistor (R1) protects the TOPSwitch-GX from line surges and transients by sensing when the DC rail voltage rises to above 450 V. In this condition the TOPSwitch-GX stops switching, extending the input voltage withstand to 496 VAC, which is ideal for countries with poor power quality. A thermistor (RT1) is used to prevent premature failure of the fuse by limiting the inrush current (due to the relatively large size of C2). An optional MOV (RV1) extends the differential surge protection to 6 kV from 4 kV.

Leakage inductance clamping is provided by VR1, R5 and C5, keeping the DRAIN voltage below 700 V under all conditions. Resistor R5 and capacitor C5 are selected such that VR1 dissipates very little power except during overload conditions. The frequency jittering feature of TOPSwitch-GX allows the circuit shown to meet CISPR22B with simple EMI ﬁltering (C1, L1 and C6) and the output grounded.

The secondaries are rectiﬁed and smoothed by D7 to D11, C7, C9, C11, C13, C14, C16 and C17. Diode D11 for the

3.3 V output is a Schottky diode to maximize efﬁciency.

PERFORMANCE SUMMARY Output Power: 45 W Cont./60 W Peak

Regulation:

3.3 V: ± 5% 5 V: ± 5% 12 V: ± 7% 18 V: ± 7% 30 V: ± 8% Efficiency: ≥75% No Load Consumption: 0.6 W

D1-D4

1N4007 V

20 mH

0.8A

0.1 µF

RV1

275 V

14 mm

3.15 A

RT1

t°

10 Ω

1.7 A

68 µF 400 V

VR1

P6KE170

68 kΩ

2 W

D6 1N4937

CONTROL

2 MΩ 1/2 W

TOPSwitch-GX

2.2 nF Y1

1 nF

400 V

TOP246Y

0.1 µF

50 V

9.08 kΩ

10 Ω

UF4003

C7 D8 UF5402

D9 UF5402

D10 BYV32-200

D11 MBR1045

1N4148

6.8 Ω

47 µF

10 V

47 µF

50 V

330 µF

25 V

C11

C13

1000 µF

25 V

22 µF

C20

10 V

1000 µF

C14

1000 µF

25 V

C17

1000 µF

25 V

390 µF

35 V

1 µF 50 V

C16

25 V

150 Ω

LTV817

3.3 µH

U3 TL431

C18

220 µF

16 V

1 kΩ

3.3 kΩ

C15

220 µF

16 V

0.1 µF

C19

R11

9.53

kΩ

R12 10 k

C12

100 µF

25 V

C10

100 µF

25 V

R10

15.0

kΩ

10 µF

50 V

PI-2693-081704

30 V @

0.03

18 V @

0.5 A

12 V @

0.6 A

5 V @

3.2 A

3.3 V @ 3 A

RTN

Figure 44. 60 W Multiple Output Power Supply using TOP246.

www.power.com

Rev. Q 08/16

Page 24

TOP242-250

Diode D10 for the 5 V output is a PN type to center the 5 V output at 5 V. The 3.3 V and 5 V output require two capacitors in parallel to meet the ripple current requirement. Switching noise ﬁltering is provided by L2 to L5 and C8, C10, C12, C15 and C18. Resistor R6 prevents peak charging of the lightly loaded 30 V output. The outputs are regulated using a secondary reference (U3). Both the 3.3 V and 5 V outputs are sensed via R11 and R10. Resistor R8 provides bias for U3 and R7 sets the overall DC gain. Resistor R9, C19, R3 and C5 provide loop compensation. A soft-ﬁnish capacitor (C20) eliminates output overshoot.

Processor Controlled Supply Turn On/Off

A low cost momentary contact switch can be used to turn the TOPSwitch-GX power on and off under microprocessor control, which may be required in some applications such as printers. The low power remote OFF feature allows an elegant implementation of this function with very few external components, as shown in Figure 45. Whenever the push button momentary contact switch P1 is closed by the user, the optocoupler U3 is activated to inform the microprocessor of this action. Initially, when the power supply is off (M pin is ﬂoating), closing of P1 turns the power

supply on by shorting the M pin of the TOPSwitch-GX to SOURCE through a diode (remote ON). When the secondary output voltage VCC is established, the microprocessor comes alive and recognizes that the switch P1 is closed through the switch status input that is driven by the optocoupler U3 output. The microprocessor then sends a power supply control signal to hold the power supply in the on-state through the optocoupler U4. If the user presses the switch P1 again to command a turn off, the microprocessor detects this through the optocoupler U3 and initiates a shutdown procedure that is product speciﬁc. For example, in the case of the inkjet printer, the shutdown procedure may include safely parking the print heads in the storage position. In the case of products with a disk drive, the shutdown procedure may include saving data or settings to the disk. After the shutdown procedure is complete, when it is safe to turn off the power supply, the microprocessor releases the M pin by turning the optocoupler U4 off. If the manual switch and the optocouplers U3 and U4 are not located close to the M pin, a capacitor CM may be needed to prevent noise coupling to the pin when it is open.

High-Voltage

DC Input

27 kΩ

1N4148

1 nF

D M

CONTROL

S F

TOPSwitch-GX

Figure 45. Remote ON/OFF using Microcontroller.

(+5 V)

External

Wake-up

Signal

6.8 kΩ

LTV817A

Power

Supply

ON/OFF

Control

1N4148

6.8 kΩ

RETURN

PI-2561-030805

MICRO-

100 kΩ

47 µF

LTV817A

PROCESSOR/

CONTROLLER

LOGIC INPUT

P1 Switch

Status

LOGIC

OUTPUT

Rev. Q 08/16

www.power.com

Page 25

TOP242-250

The power supply could also be turned on remotely through a local area network or a parallel or serial port by driving the optocoupler U4 input LED with a logic signal. Sometimes it is easier to send a train of logic pulses through a cable (due to AC coupling of cable, for example) instead of a DC logic level as a wake up signal. In this case, a simple RC ﬁlter can be used to generate a DC level to drive U4 (not shown in Figure 45). This remote on feature can be used to wake up peripherals such as printers, scanners, external modems, disk drives, etc., as needed from a computer. Peripherals are usually designed to turn off automatically if they are not being used for a period of time, to save power.

In addition to using a minimum number of components, TOPSwitch-GX provides many technical advantages in this type of application:

1. Extremely low power consumption in the off mode: 80 mW typical at 110 VAC and 160 mW typical at 230 VAC. This is because, in the remote OFF mode, the TOPSwitch-GX consumes very little power and the external circuitry does not consume any current (either M, L or X pin is open) from the high voltage DC input.

2. A very low cost, low voltage/current, momentary contact switch can be used.

3. No debouncing circuitry for the momentary switch is required. During turn-on, the start-up time of the power supply (typically 10 ms to 20 ms) plus the microprocessor initiation time act as a debouncing ﬁlter, allowing a turn-on only if the switch is depressed ﬁrmly for at least the above delay time. During turn-off, the microprocessor initiates the shutdown sequence when it detects the ﬁrst closure of the switch and subsequent bouncing of the switch has no effect. If necessary, the microprocessor could implement the switch debouncing in software during turn-off, or a ﬁlter capacitor can be used at the switch status input.

4. No external current limiting circuitry is needed for the operation of the U4 optocoupler output due to internal limiting of M pin current.

5. No high voltage resistors to the input DC voltage rail are required to power the external circuitry in the primary. Even the LED current for U3 can be derived from the CONTROL pin. This not only saves components and simpliﬁes layout, but also eliminates the power loss associated with the high voltage resistors in both ON and OFF states.

6. Robust design: There is no ON/OFF latch that can be accidentally triggered by transients. Instead, the power supply is held in the ON-state through the secondaryside microprocessor.

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Rev. Q 08/16

Page 26

TOP242-250

Key Application Considerations

TOPSwitch-II vs. TOPSwitch-GX

Table 4 compares the features and performance differences between TOPSwitch-GX and TOPSwitch-II. Many of the new features eliminate the need for additional discrete

Function TOPSwitch-II TOPSwitch-GX Figures

components. Other features increase the robustness of design, allowing cost savings in the transformer and other power components.

TOPSwitch-GX

Advantages

Soft-Start N/A* 10 ms • Limits peak current and voltage

component stresses during start up

• Eliminates external components used for soft-start in most applications

• Reduces or eliminates output overshoot

External Current Limit

N/A* Programmable 100%

to 30% of default current limit

11,20,21, 24,25,27, 28,34,35, 38,39

• Smaller transformer

• Higher efﬁciency

• Allows power limiting (constant overload power independent of line voltage)

• Allows use of larger device for lower losses, higher efﬁciency and smaller heat sink

MAX

67% 78% 7 • Smaller input cap (wider dynamic

range)

• Higher power capability (when used with RCD clamp for large VOR)

• Allows use of Schottky secondary rectiﬁer diode for up to 15 V output for high efﬁciency

Line Feed-Forward with DC

Reduction

MAX

N/A* 78% to 38% 7,11,17,

26,27,28,

• Rejects line ripple

31,40

Line OV Shutdown N/A* Single resistor

programmable

11,17,19, 26,27,28

• Increases voltage withstand capability against line surge

31,33,40

Line UV Detection N/A* Single resistor

programmable

11,17,18, 26,27,28,

• Prevents auto-restart glitches during power down

31,32,40

Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 • Smaller transformer

• Below start of conducted EMI limits

Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX (continued on next page). *Not available

Rev. Q 08/16

www.power.com

Page 27

TOP242-250

Function TOPSwitch-II TOPSwitch-GX Figures

Switching Frequency Option (Y, R and F Packages)

N/A* 66 kHz ±7% 14,15 • Lower losses when using RC and

RCD snubber for noise reduction in video applications

TOPSwitch-GX

Advantages

• Allows for higher efﬁciency in standby mode

• Lower EMI (second harmonic below 150 kHz)

Frequency Jitter N/A* ±4 kHz @ 132 kHz

9,46 • Reduces conducted EMI

±2 kHz @ 66 kHz

Frequency Reduction N/A* At a duty cycle below

10%

• Zero load regulation without dummy load

• Low power consumption at no-load

Remote ON/OFF N/A* Single transistor or

optocoupler interface or manual switch

11,22,23, 24,25,26, 27,29,36, 37,38,39, 40

• Fast ON/OFF (cycle-by-cycle)

• Active-on or active-off control

• Low consumption in remote off state

• Active-on control for fail-safe

• Eliminates expensive in-line on/off switch

• Allows processor controlled turn on/off

• Permits shutdown/wake-up of peripherals via LAN or parallel port

Synchronization N/A* Single transistor or

optocoupler interface

• Synchronization to external lower frequency signal

• Starts new switching cycle on demand

Thermal Shutdown 125 °C min.

Latched

Hysteretic 130 °C min. shutdown (with 75 °C hysteresis)

• Automatic recovery from thermal fault

• Large hysteresis prevents circuit board overheating

Current Limit Tolerance

DRAIN Creepage at Package

DIP 0.037” / 0.94 mm 0.137” / 3.48 mm

SMD

TO-220

DRAIN Creepage at PCB for Y, R and F Packages

±10% (@ 25 °C)

-8% (0 °C to 100 °C)

±7% (@ 25 °C)

-4% Typical (0 °C to 100 °C)**

0.037” / 0.94 mm 0.137” / 3.48 mm

0.046” / 1.17 mm 0.068” / 1.73 mm

0.045” / 1.14 mm (R and F Package

0.113” / 2.87 mm (performed leads)

N/A*)

• 10% Higher power capability due to tighter tolerance

• Greater immunity to arcing as a result of build-up of dust, debris and other contaminants

• Performed leads accommodate large creepage for PCB layout

• Easier to meet Safety (UL/VDE)

Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available **Current limit set to internal maximum

www.power.com

Rev. Q 08/16

Page 28

TOP242-250

Function TOPSwitch-FX TOPSwitch-GX

Light Load Operation Cycle skipping Frequency and duty

cycle reduction

Line Sensing/Externally Set Current Limit (Y, R and F Packages)

Current Limit Programming Range

P/G Package Current Limits

Y/R/F Package Current Limits

Thermal Shutdown 125 °C min.

Maximum Duty Cycle Reduction Threshold

Line Undervoltage Negative (turn-off) Threshold

Soft-Start 10 ms (duty cycle) 10 ms (duty cycle +

Line sensing and externally set current limit mutually exclusive (M pin)

Line sensing and externally set current limit possible simultaneously (functions split onto L and X pins

100% to 40% 100% to 30% • Minimizes transformer core size in highly

Identical to Y package

TOP243-246 P and G packages internal current limits reduced

100% (R and F package N/A*)

90% (for equivalent R

)

DS(ON)

130 °C min.

70 °C hysteresis

75 °C hysteresis

90 mA 60 mA • Reduces output line frequency ripple at

N/A* 40% of positive

(turn-on) threshold

current limit)

TOPSwitch-GX

Advantages

• Improves light load efﬁciency

• Reduces no-load consumption

• Additional design ﬂexibility allows all features to be used simultaneously

continuous designs

• Matches device current limit to package dissipation capability

• Allows more continuous design to lower device dissipation (lower RMS currents)

• Minimizes transformer core size

• Optimizes efﬁciency for most applications

• Allows higher output powers in high ambient temperature applications

low line

• DC designs using TOP248, TOP249 and TOP250

• Provides a well deﬁned turn-off threshold as the line voltage falls

• Gradually increasing current limit in addition to duty cycle during soft-start further reduces peak current and voltage

• Further reduces component stresses during start up

reduction optimized for forward

MAX

Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available

TOPSwitch-FX vs. TOPSwitch-GX

AN-29. TOP247 to TOP250: Higher output voltages, with a maximum output current of 6 A.

Table 5 compares the features and performance differences between TOPSwitch-GX and TOPSwitch-FX. Many of the new features eliminate the need for additional discrete components. Other features increase the robustness of design, allowing cost savings in the transformer and other power components.

TOPSwitch-GX Design Considerations

Power Table

Data sheet power table (Table 1) represents the maximum practical continuous output power based on the following conditions: TOP242 to TOP246: 12 V output, Schottky output diode, 150 V reﬂected voltage (VOR) and efﬁciency estimates from curves contained in application note

Rev. Q 08/16

For all devices, a 100 VDC minimum for 85-265 VAC and 250 VDC minimum for 230 VAC are assumed and sufﬁcient heat sinking to keep device temperature ≤100 °C. Power levels shown in the power table for the R package device assume 6.45 cm2 of 610 g/m2 copper heat sink area in an enclosed adapter, or 19.4 cm2 in an open frame.

TOPSwitch-GX Selection

Selecting the optimum TOPSwitch-GX depends upon required maximum output power, efﬁciency, heat sinking constraints and cost goals. With the option to externally reduce current limit, a larger TOPSwitch-GX may be used for lower power applications where higher efﬁciency is needed or minimal heat sinking is available.

www.power.com

Page 29

TOP242-250

Amplitude (dBµV)

Input Capacitor

The input capacitor must be chosen to provide the minimum DC voltage required for the TOPSwitch-GX converter to maintain regulation at the lowest speciﬁed input voltage and maximum output power. Since TOPSwitch-GX has a higher DC

than TOPSwitch-II, it is possible to use a

MAX

smaller input capacitor. For TOPSwitch-GX, a capacitance of 2 µF per watt is possible for universal input with an appropriately designed transformer.

Primary Clamp and Output Reﬂected Voltage V

A primary clamp is necessary to limit the peak TOPSwitch-GX drain to source voltage. A Zener clamp requires few parts and takes up little board space. For good efﬁciency, the clamp Zener should be selected to be at least 1.5 times the output reﬂected voltage VOR, as this keeps the leakage spike conduction time short. When using a Zener clamp in a universal input application, a VOR of less than 135 V is recommended to allow for the absolute tolerances and temperature variations of the Zener. This will ensure efﬁcient operation of the clamp circuit and will also keep the maximum drain voltage below the rated breakdown voltage of the TOPSwitch-GX MOSFET.

A high VOR is required to take full advantage of the wider DC

of TOPSwitch-GX. An RCD clamp provides tighter

MAX

clamp voltage tolerance than a Zener clamp and allows a V

as high as 150 V. RCD clamp dissipation can be

minimized by reducing the external current limit as a function of input line voltage (see Figures 21 and 35). The RCD clamp is more cost effective than the Zener clamp but requires more careful design (see Quick Design Checklist).

Output Diode

The output diode is selected for peak inverse voltage, output current, and thermal conditions in the application (including heat sinking, air circulation, etc.). The higher DC

MAX

of TOPSwitch-GX, along with an appropriate transformer turns ratio, can allow the use of a 60 V Schottky diode for higher efﬁciency on output voltages as high as 15 V (see Figure 41: A 12 V, 30 W design using a 60 V Schottky for the output diode).

Bias Winding Capacitor

Due to the low frequency operation at no-load a 1 µF bias winding capacitor is recommended.

Soft-Start

Generally, a power supply experiences maximum stress at start-up before the feedback loop achieves regulation. For a period of 10 ms, the on-chip soft-start linearly increases the duty cycle from zero to the default DC

at turn on.

MAX

In addition, the primary current limit increases from 85% to 100% over the same period. This causes the output voltage to rise in an orderly manner, allowing time for the

feedback loop to take control of the duty cycle. This reduces the stress on the TOPSwitch-GX MOSFET, clamp circuit and output diode(s), and helps prevent transformer saturation during start-up. Also, soft-start limits the amount of output voltage overshoot and, in many applications, eliminates the need for a soft-ﬁnish capacitor.

EMI

The frequency jitter feature modulates the switching frequency over a narrow band as a means to reduce conducted EMI peaks associated with the harmonics of the fundamental switching frequency. This is particularly beneﬁcial for average detection mode. As can be seen in Figure 46, the beneﬁts of jitter increase with the order of the switching harmonic due to an increase in frequency deviation.

-10

-20

0.15 1 10 30

Frequency (MHz)

Figure 46a. TOPSwitch-II Full Range EMI Scan (100 kHz, No Jitter).

-10

Amplitude (dBµV)

-10

-20

0.15 1 10 30

Figure 46b. TOPSwitch-GX Full Range EMI Scan (132 kHz, with Jitter) with Identical Circuitry and Conditions.

TOPSwitch-HX (with jitter)

Frequency (MHz)

EN55022B (QP) EN55022B (AV)

PI-2576-010600

PI-2577-010600

www.power.com

Rev. Q 08/16

Page 30

TOP242-250

The FREQUENCY pin of TOPSwitch-GX offers a switching frequency option of 132 kHz or 66 kHz. In applications that require heavy snubbers on the drain node for reducing high frequency radiated noise (for example, video noise sensitive applications such as VCR, DVD, monitor, TV, etc.), operating at 66 kHz will reduce snubber loss resulting in better efﬁciency. Also, in applications where transformer size is not a concern, use of the 66 kHz option will provide lower EMI and higher efﬁciency. Note that the second harmonic of 66 kHz is still below 150 kHz, above which the conducted EMI speciﬁcations get much tighter.

For 10 W or below, it is possible to use a simple inductor in place of a more costly AC input common mode choke to meet worldwide conducted EMI limits.

Transformer Design

It is recommended that the transformer be designed for maximum operating ﬂux density of 3000 Gauss and a peak ﬂux density of 4200 Gauss at maximum current limit. The turns ratio should be chosen for a reﬂected voltage (VOR) no greater than 135 V when using a Zener clamp, or 150 V (max) when using an RCD clamp with current limit reduction with line voltage (overload protection).

surge capabilities by returning surge currents from the bias winding directly to the input ﬁlter capacitor.

The CONTROL pin bypass capacitor should be located as close as possible to the SOURCE and CONTROL pins and its SOURCE connection trace should not be shared by the main MOSFET switching currents. All SOURCE pin referenced components connected to the MULTIFUNCTION, LINE-SENSE or EXTERNAL CURRENT LIMIT pins should also be located closely between their respective pin and SOURCE. Once again, the SOURCE connection trace of these components should not be shared by the main MOSFET switching currents. It is very critical that SOURCE pin switching currents are returned to the input capacitor negative terminal through a seperate trace that is not shared by the components connected to CONTROL, MULTI-FUNCTION, LINESENSE or EXTERNAL CURRENT LIMIT pins. This is because the SOURCE pin is also the controller ground reference pin.

Any traces to the M, L or X pins should be kept as short as possible and away from the DRAIN trace to prevent noise coupling. LINE-SENSE resistor (R1 in Figures 47-

49) should be located close to the M or L pin to minimize the trace length on the M or L pin side.

For designs where operating current is signiﬁcantly lower than the default current limit, it is recommended to use an externally set current limit close to the operating peak current to reduce peak ﬂux density and peak power (see Figures 20 and 34). In most applications, the tighter current limit tolerance, higher switching frequency and soft-start features of TOPSwitch-GX contribute to a smaller transformer when compared to TOPSwitch-II.

Standby Consumption

Frequency reduction can signiﬁcantly reduce power loss at light or no load, especially when a Zener clamp is used. For very low secondary power consumption, use a TL431 regulator for feedback control. Alternately, switching losses can be signiﬁcantly reduced by changing from 132 kHz in normal operation to 66 kHz under light load conditions.

TOPSwitch-GX Layout Considerations

As TOPSwitch-GX has additional pins and operates at much higher power levels compared to previous TOPSwitch families, the following guidelines should be carefully followed.

Primary Side Connections

Use a single point (Kelvin) connection at the negative terminal of the input ﬁlter capacitor for the TOPSwitch-GX SOURCE pin and bias winding return. This improves

In addition to the 47 µF CONTROL pin capacitor, a high frequency bypass capacitor in parallel may be used for better noise immunity. The feedback optocoupler output should also be located close to the CONTROL and SOURCE pins of TOPSwitch-GX.

Y-Capacitor

The Y-capacitor should be connected close to the secondary output return pin(s) and the positive primary DC input pin of the transformer.

Heat Sinking

The tab of the Y package (TO-220) or F package (TO-262) is internally electrically tied to the SOURCE pin. To avoid circulating currents, a heat sink attached to the tab should not be electrically tied to any primary ground/ source nodes on the PC board.

When using a P (DIP-8), G (SMD-8) or R (TO-263) package, a copper area underneath the package connected to the SOURCE pins will act as an effective heat sink. On double sided boards (Figure 49), top side and bottom side areas connected with vias can be used to increase the effective heat sinking area.

In addition, sufﬁcient copper area should be provided at the anode and cathode leads of the output diode(s) for heat sinking.

Rev. Q 08/16

www.power.com

Page 31

TOP242-250

Safety Spacing

Input Filter Capacitor

PRI

BIAS

PRI

TOP VIEW

TOPSwitch-GX

BIAS

Figure 47. Layout Consideratiions for TOPSwitch-GX using P or G Package.

Y1-

Capacitor

r a n s

f o

Opto-

coupler

SEC

Maximize hatched copper areas ( ) for optimum heat sinking

Output Rectifier Output Filter Capacitor

+ -

Out

PI-2670-042301

TOPSwitch-GX

TOP VIEW

Input Filter Capacitor

Heat Sink

Safety Spacing

Y1-

Capacitor

r a n

Opto-

coupler

Maximize hatched copper areas ( ) for optimum heat sinking

Output Rectifier Output Filter Capacitor

SEC

Out

+ -

PI-2669-042301

Figure 48. Layout Consideratiions for TOPSwitch-GX using Y or F Package.

www.power.com

Rev. Q 08/16

Page 32

TOP242-250

Solder Side

Component Side

TOP VIEW

Safety Spacing

PRI

Input Filter

Capacitor

R1a - 1c

PRI

BIAS

Y1-

Capacitor

r a n s

f o

SEC

Output Filter Capacitors

TOPSwitch-GX

Opto-

coupler

Maximize hatched copper areas ( ) for optimum heat sinking

Out

PI-2734-043001

Figure 49. Layout Considerations for TOPSwitch-GX using R Package.

In Figures 47, 48 and 49, a narrow trace is shown between the output rectiﬁer and output ﬁlter capacitor. This trace acts as a thermal relief between the rectiﬁer and ﬁlter capacitor to prevent excessive heating of the capacitor.

Quick Design Checklist

As with any power supply design, all TOPSwitch-GX designs should be veriﬁed on the bench to make sure that components speciﬁcations are not exceeded under worst case conditions. The following minimum set of tests is strongly recommended:

1. Maximum drain voltage – Verify that peak VDS does not exceed 675 V at highest input voltage and maximum overload output power. Maximum overload output power occurs when the output is overloaded to a level just before the power supply goes into auto-restart (loss of regulation).

2. Maximum drain current – At maximum ambient temperature, maximum input voltage and maximum output load, verify drain current waveforms at start-up for any signs of transformer saturation and excessive leading edge current spikes. TOPSwitch-GX has a leading edge blanking time of 220 ns to prevent premature termination of the ON-cycle.Verify that the

leading edge current spike is below the allowed current limit envelope (see Figure 52) for the drain current waveform at the end of the 220 ns blanking period.

3. Thermal check – At maximum output power, minimum input voltage and maximum ambient temperature, verify that temperature speciﬁcations are not exceeded for TOPSwitch-GX, transformer, output diodes and output capacitors. Enough thermal margin should be allowed

for the part-to-part variation of the R

of TOPSwitch-

DS(ON)

GX, as speciﬁed in the data sheet. The margin required can either be calculated from the tolerances or it can be accounted for by connecting an external resistance in series with the DRAIN pin and attached to the same heat sink, having a resistance value that is equal to the

difference between the measured R

of the device

DS(ON)

under test and the worst-case maximum speciﬁcation.

Design Tools

For a discussion on utilizing TOP248, TOP249 and TOP250 in forward converter conﬁgurations, please refer to the TOPSwitch-GX Forward Design Methodology Application Note.

Up-to-date information on design tools can be found at the Power Integrations website: www.power.com

Rev. Q 08/16

www.power.com

Page 33

TOP242-250

ABSOLUTE MAXIMUM RATINGS

DRAIN Voltage .................................. ................ -0.3 V to 700 V

DRAIN Peak Current: TOP242......................................0.72 A

TOP243......................................1.44 A

TOP244......................................2.16 A

TOP245......................................2.88 A

TOP246 ..................................... 4.32 A

TOP247 ..................................... 5.76 A

TOP248 ..................................... 7.20 A

TOP249 ..................................... 8.64 A

TOP250 ................................... 10.08 A

CONTROL Voltage ................................................. -0.3 V to 9 V

CONTROL Current........ ................................................ 100 mA

LINE SENSE Pin Voltage ........................................-0.3 V to 9 V

THERMAL RESISTANCE

Thermal Resistance: Y or F Package: (qJA)

P or G Package:

(qJA) ................................. 70 °C/W

(qJC) R Package:

(qJA) ................80 °C/W

(qJC)

(1)

.......................... ........................80 °C/W

(2)

(qJC)

................................................... 2 °C/W

(3)

(5)

..................................................11 °C/W

(7);

(5)

....................................................2 °C/W

40 °C/W

(4)

; 60 °C/W

; 30 °C/W

(1,4)

CURRENT LIMIT Pin Voltage ..............................-0.3 V to 4.5 V

MULTI-FUNCTION Pin Voltage ...............................-0.3 V to 9 V

FREQUENCY Pin Voltage ......................................-0.3 V to 9 V

Storage Temperature ...................................... -65 °C to 150 °C

Operating Junction Temperature Lead Temperature Notes:

1. All voltages referenced to SOURCE, TA = 25 °C.

2. Normally limited by internal circuitry.

3. 1/16 in. from case for 5 seconds.

4. Maximum ratings speciﬁed may be applied one at a time, .....

without causing permanent damage to the product. ..............

Exposure to Absolute Maximum Rating conditions for ...........

extended periods of time may affect product reliability.

Notes:

1. Free standing with no heat sink.

2. Measured at the back surface of tab.

3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.

(4)

4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

5. Measured on the SOURCE pin close to plastic interface.

6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad.

(6)

7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.

(3)

...................................................... ..260 °C

(2)

.................. -40 °C to 150 °C

Parameter Symbol

CONTROL FUNCTIONS

Switching Frequency

OSC

(average)

Duty Cycle at ONSET of Frequency

(ONSET)

Reduction

Switching Frequency near

OSC(DMIN)

0% Duty Cycle

Frequency Jitter Deviation

Frequency Jitter Modulation Rate

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 53

(Unless Otherwise Speciﬁed)

FREQUENCY Pin

IC = 3 mA;

TJ = 25 °C

Connected to SOURCE

FREQUENCY Pin

Connected to CONTROL

132 kHz Operation 30

66 kHz Operation 15

132 kHz Operation ±4

66 kHz Operation ±2

Min Typ Max Units

124 132 140

kHz

61.5 66 70.5

10 %

kHz

250 Hz

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Rev. Q 08/16

Page 34

TOP242-250

Parameter Symbol

SOURCE = 0 V; TJ = -40 to 125 °C

CONTROL FUNCTIONS (cont.)

Maximum Duty Cycle

Soft-Start Time PWM Gain

SOFT

MAX

reg

IC = I

PWM Gain Temperature Drift

External Bias Current

See Figure 7

CONTROL Current at 0%

C(OFF)

Duty Cycle Dynamic

Impedance

Dynamic Impedance Temperature Drift

CONTROL Pin Internal Filter Pole

SHUTDOWN/AUTO-RESTART

CONTROL Pin Charging Current

C(CH)

Conditions

See Figure 53

(Unless Otherwise Speciﬁed)

IL ≤ I

or IM ≤ I

L(DC)

or IM = 190 µA

M(DC)

TOP242-247

or IM = 100 µA

CD1

TOP242-247

= 190 µA

TOP248-250

= 100 µA

TOP248-250

TJ = 25 °C; DC

to DC

MIN

MAX

IC = 4 mA; TJ = 25 °C -28 -23 -18 %/mA

See Note A -0.01 %/mA/°C

TOP242-245 1.2 2.0 3.0

TOP250 1.7 2.7 4.2

TOP242-245 6.0 7.0

TJ = 25 °C

TOP246-249 6.6 8.0

TOP250 7.3 8.5

IC = 4 mA; TJ = 25 °C

See Figure 51

VC = 0 V -5.0 -3.5 -2.0

TJ = 25 °C

VC = 5 V -3.0 -1.8 -0.6

Min Typ Max Units

75 78 83

28 38 50

66.5

33 41.3 49.5

60 66.8 73.5

10 15 ms

10 15 22

0.18 %/°C

7 kHz

mATOP246-249 1.6 2.6 4.0

Ω

Charging Current Temperature Drift

Auto-Restart Upper Threshold Voltage

Auto-Restart Lower Threshold Voltage

Rev. Q 08/16

C(AR)U

C(AR)L

See Note A 0.5 %/°C

5.8 V

4.5 4.8 5.1 V

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Page 35

Parameter Symbol

SOURCE = 0 V; TJ = -40 to 125 °C

(Unless Otherwise Speciﬁed)

SHUTDOWN/AUTO-RESTART (cont.)

Conditions

See Figure 53

TOP242-250

Min Typ Max Units

Auto-Restart Hysteresis Voltage

Auto-Restart Duty Cycle

Auto-Restart Frequency

C(AR)hyst

(AR)

0.8 1.0 V

4 8 %

1.0 Hz

MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS

Line Undervoltage Threshold Current and Hysteresis (M or L Pin)

TJ = 25 °C

Threshold 44 50 54

Hysteresis 30 µA

Line Overvoltage or Remote ON/OFF Threshold Current and Hysteresis

TJ = 25 °C

Threshold 210 225 240

Hysteresis 8 µA

(M or L Pin)

L Pin Voltage Threshold

L(TH)

0.5 1.0 1.6 V

µA

Remote ON/OFF Negative Threshold Current and Hysteresis (M or X Pin)

L or M Pin Short Circuit Current

X or M Pin Short Circuit Current

L or M Pin Voltage (Positive Current)

X Pin Voltage (Negative Current)

M Pin Voltage (Negative Current)

REM (N)

L(SC) or

M(SC)

X(SC) or

M(SC)

VL, V

Threshold -35 -27 -20

TJ = 25 °C

Hysteresis 5

VL, VM = V

VX, VM = 0 V

Normal Mode -300 -240 -180

Auto-Restart Mode -110 -90 -70

IL or IM = 50 µA 1.90 2.50 3.00

IL or IM = 225 µA 2.30 2.90 3.30

IX = -50 µA 1.26 1.33 1.40

IX = -150 µA 1.18 1.24 1.30

IM = -50 µA 1.24 1.31 1.39

IM = -150 µA 1.13 1.19 1.25

300 400 520 µA

µA

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Rev. Q 08/16

Page 36

TOP242-250

Conditions

Parameter Symbol

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 53

(Unless Otherwise Speciﬁed)

Min Typ Max Units

MULTI-FUNCTION, LINSE-SENSE AND EXTERNAL CURRENT LIMIT INPUTS (cont.)

Maximum Duty Cycle Reduction Onset Threshold

L(DC) or

M(DC)

TJ = 25 °C 40 60 75 µA

Current

Remote-OFF DRAIN Supply

D(RMT)

Current

Remote-ON Delay

Remote-OFF Setup Time

R(ON)

R(OFF)

FREQUENCY INPUT

FREQUENCY Pin Threshold

Voltage FREQUENCY Pin

Input Current

CIRCUIT PROTECTION

Self Protection Current Limit

LIMIT

(See Note C)

X, L or M Pin

See Figure 71

= 150 V

DRAIN

Floating

L or M Pin Shorted

to CONTROL

From Remote ON to Drain Turn-On

See Note B

Minimum Time Before Drain Turn-On

to Disable Cycle, See Note B

TOP242 P/G

TOP242 Y/R/F

TJ = 25 °C

TOP243 P/G

= 25 °C

TOP243 Y/R/F

= 25 °C

TOP244 P/G

= 25 °C

TOP244 Y/R/F

TJ = 25 °C

TOP245 P/G

= 25 °C

TOP245 Y/R/F

= 25 °C

TOP246 P/G

= 25 °C

TOP246 Y/R/F

= 25 °C

TOP247 Y/R/F

= 25 °C

See Note B 2.9 V

VF = V

Internal

di/dt = 90 mA/

Internal

di/dt = 150 mA/

Internal

di/dt = 180 mA/

Internal

di/dt = 200 mA/

Internal

di/dt = 270 mA/µs

Internal

di/dt = 220 mA/

Internal

di/dt = 360 mA/

Internal

di/dt = 270 mA/µs

Internal

di/dt = 540 mA/µs

Internal

di/dt = 720 mA/

µs

10 40 100 µA

0.418 0.45 0.481

0.697 0.75 0.802

0.837 0.90 0.963

0.930 1.00 1.070

1.256 1.35 1.445

1.02 1.10 1.18

1.674 1.80 1.926

1.256 1.35 1.445

2.511 2.70 2.889

3.348 3.60 3.852

0.6 1.0 mA

1.0 1.6

2.5 µs

Rev. Q 08/16

www.power.com

Page 37

Parameter Symbol

SOURCE = 0 V; TJ = -40 to 125 °C

CIRCUIT PROTECTION (cont.)

Conditions

See Figure 53

(Unless Otherwise Speciﬁed)

TOP242-250

Min Typ Max Units

Self Protection Current Limit (See Note C)

Initial Current Limit

Leading Edge Blanking Time

Current Limit Delay

Thermal Shutdown Temperature

Thermal Shutdown Hysteresis

Power-Up Reset Threshold Voltage

OUTPUT

ON-State Resistance

LIMIT

C(RESET)

DS(ON)

INIT

LEB

IL(D)

TOP248 Y/R/F

TJ = 25 °C

TOP249 Y/R/F

TJ = 25 °C

TOP250 Y/R/F

TJ = 25 °C

See Note B

See Figure 52

TJ = 25 °C, IC = 4 mA

Figure 53, S1 Open 1.75 3.0 4.25 V

TOP242

ID = 50 mA

TOP243

= 100 mA

TOP244

= 150 mA

TOP245

= 200 mA

TOP246

= 300 mA

TOP247

= 400 mA

TOP248

= 500 mA

Internal

di/dt = 900 mA/µs

Internal

di/dt = 1080 mA/µs

Internal

di/dt = 1260 mA/µs

≤85 VAC

(Rectiﬁed Line Input)

265 VAC

(Rectiﬁed Line Input)

4.185 4.50 4.815

5.022 5.40 5.778

5.859 6.30 6.741

0.75 x

LIMIT(MIN)

0.6 x

LIMIT(MIN)

220 ns

IC = 4 mA 100 ns

130 140 150 °C

Ω 75 °C

= 25 °C 15.6 18.0

TJ = 100 °C 25.7 30.0

= 25 °C 7.80 9.00

= 100 °C 12.9 15.0

TJ = 25 °C 5.20 6.00

= 100 °C 8.60 10.0

TJ = 25 °C 3.90 4.50

= 100 °C 6.45 7.50

Ω

TJ = 25 °C 2.60 3.00

= 100 °C 4.30 5.00

= 25 °C 1.95 2.25

= 100 °C 3.22 3.75

= 25 °C 1.56 1.80

= 100 °C 2.58 3.00

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Rev. Q 08/16

Page 38

TOP242-250

Parameter Symbol

OUTPUT (cont.)

ON-State Resistance

DS(ON)

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 53

(Unless Otherwise Speciﬁed)

TOP249

ID = 600 mA

TOP250

ID = 700 mA

TJ = 25 °C 1.30 1.50

TJ = 100 °C 2.15 2.50

TJ = 25 °C 1.10 1.28

TJ = 100 °C 1.85 2.15

Min Typ Max Units

Ω

OFF-State Drain Leakage Current

Breakdown Voltage

Rise Time Fall Time

DSS

VL, VM = Floating; IC = 4 mA

VDS = 560 V; TJ = 125 °C

VL, VM = Floating; IC = 4 mA

See Note D, TJ = 25 °C

Measured in a Typical Flyback

Converter Application

SUPPLY VOLTAGE CHARACTERISTICS

DRAIN Supply Voltage

Shunt Regulator Voltage

C(SHUNT)

See Note E 36 V

Shunt Regulator Temperature Drift

Output MOSFET

Control Supply/

CD1

Enabled

VX, VL, VM = 0 V

Discharge Current

CD2

Output MOSFET

VX, VL, VM = 0 V

470 µA

700 V

100 ns

50 ns

IC = 4 mA 5.60 5.85 6.10 V

±50 ppm/°C

TOP242-245 1.0 1.6 2.5

TOP246-249 1.2 2.2 3.2

Disabled

TOP250 1.3 2.4 3.65

0.3 0.6 1.3

NOTES:

A. For speciﬁcations with negative values, a negative temperature coefﬁcient corresponds to an increase in magnitude with increasing temperature, and a positive temperature coefﬁcient corresponds to a decrease in magnitude with increasing temperature.

B. Guaranteed by characterization. Not tested in production.

C. For externally adjusted current limit values, please refer to Figures 54b, 55b and 56b (Current Limit vs. External Current Limit Resistance) in the Typical Performance Characteristics section. The tolerance speciﬁed is only valid at full current limit.

D. Breakdown voltage may be checked against minimum BV not exceeding minimum BV

E. It is possible to start up and operate

DSS

TOPSwitch-GX

at DRAIN voltages well below 36 V. However, the CONTROL pin

speciﬁcation by ramping the DRAIN pin voltage up to but

DSS

charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart duty cycle. Refer to Figure 68, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage for low voltage operation characteristics.

Rev. Q 08/16

www.power.com

Page 39

CONTROL Pin Current (mA)

DRAIN Current (normalized)

90%

TOP242-250

90%

DRAIN

VOLTAGE

Figure 50. Duty Cycle Measurement.

120

100

Dynamic

Impedance

0 2 4 6 8 10

CONTROL Pin Voltage (V)

Slope

0 V

PI-1939-033015

10%

D =

PI-2039-033001

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1 0

0 1 2 6 83

(Blanking Time)

LEB

INIT(MIN)

LIMIT(MAX)

LIMIT(MIN)

PI-2022-033015

@ 85 VAC

@ 265 VAC

@ 25 ˚C @ 25 ˚C

4 5 7

Time (µs)

Figure 51. CONTROL Pin I-V Characteristic. Figure 52. Drain Current Operating Envelope.

40 V

0-15 V

NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.

2. For P and G packages, short all SOURCE pins together.

Figure 53. TOPSwitch-GX General Test Circuit.

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470 Ω

Y or R Package (X and L Pins) P or G Package (M Pin)

470 Ω

5 W

5-50 V

0-100 kΩ

0.1 µF47 µF

CONTROL

0-60 kΩ

TOPSwitch-GX

SFX

0-100 kΩ

5-50 V

0-60 kΩ

PI-2631-081204

Rev. Q 08/16

Page 40

TOP242-250

Current Limit (A)

di/dt (mA/µs)

Current Limit (A)

PI-2652-042303

BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS

The following precautions should be followed when testing TOPSwitch-GX by itself outside of a power supply. The schematic shown in Figure 53 is suggested for laboratory testing of TOPSwitch-GX.

When the DRAIN pin supply is turned on, the part will be in the auto-restart mode. The CONTROL pin voltage will be oscillating at a low frequency between 4.8 V and

5.8 V and the drain is turned on every eigth cycle of the CONTROL pin oscillation. If the CONTROL pin power supply is turned on while in this auto-restart mode, there

Typical Performance Characteristics

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

-250 -200 -150 -100 -50

Figure 54a. Current Limit vs. X or M Pin Current (see Figures 55a and 56a for TOP245P/G and TOP246P/G).

is only a 12.5% chance that the CONTROL pin oscillation will be in the correct state (drain active state) so that the continuous drain voltage waveform may be observed. It is recommended that the VC power supply be turned on ﬁrst and the DRAIN pin power supply second if continuous drain voltage waveforms are to be observed. The 12.5% chance of being in the correct state is due to the divide-by-8 counter. Temporarily shorting the CONTROL pin to the SOURCE pin will reset TOPSwitch-GX, which then will come up in the correct state.

IX or IM (µA)

PI-2653-033015

Scaling Factors:

TOP242 P/G/Y/R/F: .45 TOP243 P/G: .75 TOP243 Y/R/F: .90 TOP244 P/G: 1 TOP244 Y/R/F: 1.35 TOP245 Y/R/F: 1.80 TOP246 Y/R/F: 2.70 TOP247 Y/R/F: 3.60 TOP248 Y/R/F 4.50 TOP249 Y/R/F: 5.40 TOP250 Y/R/F: 6.32

200

180

160

140

120

100

Rev. Q 08/16

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Minimum

Typical

Maximum and minimum levels are based on characterization.

05K 10K 15K 20K 25K 30K 35K 40K

Maximum

External Current Limit Resistor RIL (Ω)

Scaling Factors:

200

180

160

140

120

100

45K

Figure 54b. Current Limit vs. External Current Limit Resistance (see Figures 55b and 56b for TOP245P/G and TOP246P/G).

di/dt (mA/

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Page 41

Current Limit (A)

PI-3651-110405

1.25

Current Limit (Normalized to 25 °

PI-3653-073003

Typical Performance Characteristics (cont.)

TOP242-250

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

-250 -200 -150 -100 -50

IM (µA)

Figure 55a. Current Limit vs. MULTI-FUNCTION Pin Current (TOP245P/G only).

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

Measured at 25 °C.

0.3

Typical

Refer to MULTIFUNCTION (M) Pin Operation section

PI-3652-033015

Scaling Factor:

TOP245P/G: 1.1

Scaling Factor:

TOP245P/G: 1.1

200

180

160

140

120

100

200

180

160

140

120

100

di/dt (mA/µs)

di/dt (mA/

0.2 05K 10K 15K 20K 25K 30K 35K 40K

45K

External Current Limit Resistor RIL (Ω)

Figure 55b. Current Limit vs. External Current Limit Resistance (TOP245P/G only).

1.20

1.15

1.10

1.05

1.00

.95

.90

.85

.80

.75

.70

05K 10K 15K 20K 25K 30K 35K 40K

100 °C

0 °C

25 °C

45K

External Current Limit Resistor RIL (Ω)

Figure 55c. External Current Limit vs. External Current Limit Resistance at 0 °C, 25 °C and 100 °C Junction Temperature (TOP245P/G only).

www.power.com

Rev. Q 08/16

Page 42

TOP242-250

Current Limit (A)

PI-3725-110405

1.25

Current Limit (Normalized to 25 °

PI-3726-100703

Typical Performance Characteristics (cont.)

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

-250 -200 -150 -100 -50

IM (µA)

Figure 56a. Current Limit vs. MULTI-FUNCTION Pin Current (TOP246P/G only).

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

Measured at 25 °C.

0.3

0.2 05K 10K 15K 20K 25K 30K 35K 40K

Typical

Refer to MULTIFUNCTION (M) Pin Operation section

External Current Limit Resistor RIL (Ω)

Figure 56b. Current Limit vs. External Current Limit Resistance (TOP246P/G only).

PI-3724-033015

Scaling Factor:

TOP246P/G: 1.35

Scaling Factor:

TOP246P/G: 1.35

45K

200

180

160

140

120

100

200

180

160

140

120

100

di/dt (mA/µs)

Rev. Q 08/16

1.20

1.15

1.10

1.05

1.00

.95

.90

.85

.80

.75

.70

05K 10K 15K 20K 25K 30K 35K 40K

100 °C

0 °C

25 °C

External Current Limit Resistor RIL (Ω)

Figure 56c. External Current Limit vs. External Current Limit Resistance at 0 °C, 25 °C and 100 ° Junction Temperature (TOP246P/G only).

45K

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Page 43

Typical Performance Characteristics (cont.)

Breakdown Voltage

(Normalized to 25

Output Frequency

(Normalized to 25

150

PI-2555-040315

(Normalized to 25

Junction Temperature (°C)

Overvoltage Threshold

(Normalized to 25

150

Junction Temperature (°C)

PI-2552-040315

Undervoltage Threshold

(Normalized to 25

TOP242-250

°C)

1.1

PI-176B-033001

1.2

1.0

°C)

0.8

1.0

0.6

0.4

0.2

0.9

-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

Figure 57. Breakdown Voltage vs. Temperature. Figure 58. Frequency vs. Temperature.

1.2

1.0

°C)

0.8

0.6

0.4

Current Limit

0.2

1.2

1.0

°C)

0.8

0.6

0.4

Current Limit

0.2

Use for TOP242-250 Y/R/F packages and TOP242-244 P/G packages only. See Figures 55c and 56c for TOP245P/G and TOP246P/G.

PI-1123A-060794

PI-2554-033015

www.power.com

-50 -25 0 25 50 75 100 125

Junction Temperature (°C)

-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

Figure 59. Internal Current Limit vs. Temperature. Figure 60. External Current Limit vs. Temperature with

RIL = 12 kΩ.

1.2

1.0

0.8

0.6

0.4

0.2

-50 -25 0 25 50 75 100 125 150

Figure 61. Overvoltage Threshold vs. Temperature.

PI-2553-040315

1.2

1.0

0.8

0.6

0.4

0.2

-50 -25 0 25 50 75 100 125

Figure 62. Undervoltage Threshold vs. Temperature.

Rev. Q 08/16

Page 44

TOP242-250

LINE SENSE Pin Voltage (V)

EXTERNAL CURRENT LIMIT

MULTI-FUNCTION Pin Voltage (V)

1.6

MULTI-FUNCTION Pin Voltage (V)

PI-2541-102700

1.2

1.0

0.8

0.6

0.4

0.2

-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

PI-2562-040315

CONTROL Current

(Normalized to 25

Junction Temperature (°C)

Onset Threshold Current

(Normalized to 25

Typical Performance Characteristics (cont.)

PI-2688-102700

µ ≤ ≤ µ

Pin Voltage (V)

  Ω

PI-2689-102300

LINE-SENSE Pin Current (µA)

Figure 63a. LINE-SENSE Pin Voltage vs. Current.

PI-2542-040315

See

-300 -200 -100 0 100 200 300 400 500

Expanded Version

MULTI-FUNCTION Pin Current (µA)

Figure 64a. MULTI-FUNCTION Pin Voltage vs. Current.

EXTERNAL CURRENT LIMIT Pin Current (µA)

Figure 63b. EXTERNAL CURRENT LIMIT Pin Voltage vs. Current.

1.4

1.2

1.0

0.8

0.6

0.4

0.2

VM = 1.37 - IMx 1 kΩ

-25 µA

≤

-200 µA

-300 -200 -150 -50-250 -100 0

≤

MULTI-FUNCTION Pin Current (µA)

Figure 64b. MULTI-FUNCTION Pin Voltage vs. Current (Expanded).

1.2

1.0

0.8

PI-2563-040315

Rev. Q 08/16

Figure 65. Control Current Out at 0% Duty Cycle vs. Temperaure.

0.6

0.4

0.2

-50 -25 0 25 50 75 100 125 150

Figure 66. Max. Duty Cycle Reduction Onset Threshold Current vs. Temperature.

www.power.com

Page 45

Typical Performance Characteristics (cont.)

DRAIN Voltage (V)

DRAIN Current (A)

Charging Current (mA)

DRAIN Capacitance (pF)

600

PI-2650-052815

Remote OFF DRAIN Supply Current

(Normalized to 25

TOP242-250

PI-2645-033015

1.6

VC = 5 V

1.2

CASE

= 25 °C = 100 °C

2 4 6 8 10 12 14 16 18 20

Scaling Factors:

TOP250 1.17 TOP249 1.00 TOP248 0.83 TOP247 0.67 TOP246 0.50 TOP245 0.33 TOP244 0.25 TOP243 0.17 TOP242 0.08

0.8

CONTROL Pin

0.4

0 20 40 60 80 100

DRAIN Voltage (V)

Figure 67. Output Characteristics. Figure 68. IC vs. DRAIN Voltage.

10000

1000

100

Scaling Factors:

TOP250 1.17 TOP249 1.00 TOP248 0.83 TOP247 0.67 TOP246 0.50 TOP245 0.33 TOP244 0.25 TOP243 0.17 TOP242 0.08

PI-2646-040215

600

Scaling Factors:

500

400

300

200

Power (mW)

TOP250 1.17 TOP249 1.00 TOP248 0.83 TOP247 0.67 TOP246 0.50 TOP245 0.33 TOP244 0.25 TOP243 0.17 TOP242 0.08

PI-2564-040315

0 100 200 300 400 500 600

Drain Voltage (V)

Figure 69. C

vs. DRAIN Voltage. Figure 70. DRAIN Capacitance Power.

OSS

www.power.com

100

°C)

Junction Temperature (°C)

Figure 71. Remote OFF DRAIN Supply Current vs. Temperature.

0 200100 400 500300

PI-2690-102700

Rev. Q 08/16

Page 46

TOP242-250

PART ORDERING INFORMATION

TOP 242 G N - TL

TOPSwitch Product Family

GX Series Number

Package Identiﬁer

G Plastic SMD-8B (TOP242-246 only)

P Plastic DIP-8B (TOP242-246 only)

Y Plastic TO-220-7C

R Plastic TO-263-7C (available only with TL option)

F Plastic TO-262-7C

Lead Finish

Blank Standard (Sn Pb)

N Pure Matte Tin (Pb-Free) (P, G, Y & F Packages)

Tape & Reel and Other Options

Blank Standard Conﬁgurations

TL Tape & Reel, (G Package: 1000 min., R Package: 750 min.)

Rev. Q 08/16

www.power.com

Page 47

.146 (3.71) .156 (3.96)

.390 (9.91)

.420 (10.67)

TO-220-7C (Y Package)

.108 (2.74) REF

.165 (4.19) .185 (4.70)

.234 (5.94) .261 (6.63)

TOP242-250

.045 (1.14) .055 (1.40)

.860 (21.84) .880 (22.35)

PIN 1

.050 (1.27)

.200 (5.08)

.150 (3.81)

.050 (1.27)

PIN 1

.100 (2.54)

.461 (11.71) .495 (12.57)

.068 (1.73) MIN

.024 (.61) .034 (.86)

.050 (1.27) BSC

.150 (3.81) BSC

.180 (4.58)

.010 (.25) M

.050 (1.27)

.150 (3.81)

PIN 7

.570 (14.48) REF.

7° TYP.

.080 (2.03) .120 (3.05)

PIN 1 & 7

.012 (.30) .024 (.61)

.190 (4.83) .210 (5.33)

Notes:

1. Controlling dimensions are inches. Millimeter dimensions are shown in parentheses.

2. Pin numbers start with Pin 1, and continue from left to right when viewed from the front.

3. Dimensions do not include mold ﬂash or other protrusions. Mold ﬂash or protrusions shall not exceed .006 (.15 mm) on any side.

4. Minimum metal to metal spacing at the package body for omitted pin locations is .068 in. (1.73 mm).

5. Position of terminals to be measured at a location .25 (6.35) below the package body.

6. All terminals are solder plated.

PIN 2 & 4

.040 (1.02) .060 (1.52)

.670 (17.02) REF.

Y07C

www.power.com

MOUNTING HOLE PATTERN

PI-2644-040110

Rev. Q 08/16

Page 48

TOP242-250

-E-

.240 (6.10) .260 (6.60)

Pin 1

-D-

.125 (3.18) .145 (3.68)

-TSEATING PLANE

.100 (2.54) BSC

D S

⊕

.356 (9.05) .387 (9.83)

.014 (.36) .022 (.56)

.004 (.10)

T E D S

⊕

PDIP-8B (P Package)

.137 (3.48) MINIMUM

.048 (1.22) .053 (1.35)

.010 (.25) M

.057 (1.45) .068 (1.73)

(NOTE 6)

.015 (.38)

MINIMUM

.118 (3.00) .140 (3.56)

Notes:

1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.

3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be perpendicular to plane T.

.008 (.20) .015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62) .390 (9.91)

P08B

PI-2551-081716

-E-

.240 (6.10) .260 (6.60)

Pin 1

-D-

.125 (3.18) .145 (3.68)

.032 (.81) .037 (.94)

D S

.004 (.10)

⊕

.100 (2.54) (BSC)

.356 (9.05) .387 (9.83)

.048 (1.22) .053 (1.35)

SMD-8B (G Package)

.137 (3.48) MINIMUM

.372 (9.45) .388 (9.86) E S

⊕

.057 (1.45) .068 (1.73)

(NOTE 5)

.009 (.23)

.010 (.25)

.046

.060

Pin 1

.086

.186

Solder Pad Dimensions

.004 (.10)

.004 (.10) .012 (.30)

.060

.286

.036 (0.91) .044 (1.12)

.046

.080

Notes:

1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.

2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.

.420

3. Pin locations start with Pin 1, and continue counter-clock wise to Pin 8 when viewed from the top. Pin 6 is omitted.

4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).

5. Lead width measured at package body.

6. D and E are referenced datums on the package body.

0 -

G08B

PI-2546-081716

Rev. Q 08/16

www.power.com

Page 49

TO-263-7C (R Package)

TOP242-250

.055 (1.40) .066 (1.68)

.326 (8.28) .336 (8.53)

.208 (5.28)

Ref.

LD #1

.024 (0.61) .034 (0.86)

.638 (16.21)

.380 (9.65)

.390 (9.91)

.420 (10.67)

.315 (8.00)

.038 (0.97)

.580 (14.73) .620 (15.75)

.100 (2.54)

Solder Pad Dimensions

.128 (3.25)

.050 (1.27)

REF

.245 (6.22)

MIN

0.68 (1.73) MIN

.045 (1.14) .055 (1.40)

.225 (5.72)

MIN

.000 (0.00) .010 (0.25)

.090 (2.29)

-A-

.050 (1.27)

.165 (4.19) .185 (4.70)

Notes:

1. Package outline exclusive of mold flash & metal burr.

2. Package outline inclusive of plating thickness.

3. Foot length measured at intercept point between datum A lead surface.

4. Controlling dimensions are in inches. Millimeter dimensions are shown in parentheses.

5. Minimum metal to metal spacing at the package body for the omitted pin locations is .068 in. (1.73 mm).

.110 (2.79)

.010 (0.25)

.012 (0.30) .024 (0.61)

8 -°0

.004 (0.10)

R07C

PI-2664-040110

www.power.com

Rev. Q 08/16

Page 50

TOP242-250

TO-262-7C (F Package)

.795 (20.18)

REF.

PIN 1

.050 (1.27)

.200 (5.08)

PIN 1

.150 (3.81)

.390 (9.91)

.420 (10.67)

.050 (1.27)

.100 (2.54)

.326 (8.28) .336 (8.53)

.068 (1.73) MIN

.024 (.61) .034 (.86)

.050 (1.27) BSC

.150 (3.81) BSC

.180 (4.58)

.055 (1.40) .066 (1.68)

.010 (.25) M

.050 (1.27)

.150 (3.81)

PIN 7

.045 (1.14)

.165 (4.17) .185 (4.70)

7° TYP.

.080 (2.03) .120 (3.05)

PIN 1 & 7

.012 (.30) .024 (.61)

.190 (4.83) .210 (5.33)

Notes:

1. Controlling dimensions are inches. Millimeter dimensions are shown in parentheses.

2. Pin numbers start with Pin 1, and continue from left to right when viewed from the front.

3. Dimensions do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15 mm) on any side.

4. Minimum metal to metal spacing at the package body for omitted pin locations is .068 inch (1.73 mm).

5. Position of terminals to be measured at a location .25 (6.35) below the package body.

6. All terminals are solder plated.

.055 (1.40)

.495 (12.56) REF.

.595 (15.10) REF.

PIN 2 & 4

.040 (1.02) .060 (1.52)

.040 (1.06) .060 (1.52)

Rev. Q 08/16

F07C

MOUNTING HOLE PATTERN

PI-2757-040110

www.power.com

Page 51

TOP242-250

Revision Notes Date

D - 11/00

Added R package (D2PAK). Corrected abbreviations (s = seconds). Corrected x-axis units in Figure 11 ( Added missing external current limit resistor in Figure 25 (RIL).

Corrected spelling. Added caption for Table 4. Corrected Breakdown Voltage parameter condition (TJ = 25 °C). Corrected font sizes in ﬁgures. Figure 40 replaced. Corrected schematic component values in Figure 44.

F Corrected Power Table value. 9/01

Added TOP250 device and F package (TO-262).

Added R package Thermal Impedance parameters and adjusted Output Power values in Table 1. Adjusted Off-State Current value.

Added note to parameter table for Breakdown Voltage measurement. Miscellaneous text corrections.

Updated P, Y, R and F package information.

Revised thermal impedances (q Expanded Maximum Duty Cycle and deleted Maximum Duty Cycle Reduction Slope parameters. Corrected DIP-8B and SMD-8B Package Drawings.

Added TOP245P. Miscellaneous text corrections.

K Corrected typographic errors in Figures 4, 6, 20, 28 and 34; and in MULTI-FUNCTION (M) Pin Operation section. 9/03

L Added TOP246P. 3/04

M Added lead-free ordering information. 12/04

Updated Maximum Duty Cycle conditions.

Minor error corrections. Added Note 4 to Absolute Maximum Ratings speciﬁcation.

O Added TOP245G and TOP246G 11/05

P Updated with new Logo, headers and footers only. 05/15

Updated PDIP-8B (P Package) and SMD-8B (G Package) per PCN-16232.

µA).

) for all package types.

7/01

1/02

9/02

4/03

8/03

4/05

08/16

www.power.com

Rev. Q 08/16

Page 52

TOP242-250

For the latest updates, visit our website: www.power.com

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANT Y HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.

Patent Information

The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm.

Life Support Policy

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in signiﬁcant injury or death to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE-iDriver, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch, InnoSwitch, HiperTFS, HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2016, Power Integrations, Inc.

Power Integrations Worldwide Sales Support Locations

World Headquarters

5245 Hellyer Avenue San Jose, CA 95138, USA. Main: +1-408-414-9200 Customer Service: Phone: +1-408-414-9665 Fax: +1-408-414-9765 e-mail: usasales@power.com

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Cambridge Semiconductor, a Power Integrations company Westbrook Centre, Block 5, 2nd Floor Milton Road Cambridge CB4 1YG Phone: +44 (0) 1223-446483 e-mail: eurosales@power.com

Rev. Q 08/16

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