Power integrations SCALE-1, SCALE-2 Handling Instructions Manual

AN-1501 Application Note

Handling Instructions for SCALE™-1 and SCALE™-2 Gate Drivers

Scope

This Application Note defines the requirements for handling the high-power SCALE™-1 and SCALE™-2 products (gate driver cores, plug-and-play gate drivers) from Power Integrations in terms of:

• Storage conditions

• Soldering instructions for gate driver core products

• Mechanical handling

• ESD handling

• Guideline for Return Material Analysis - RMA

The information given here applies to all customers, distributors a nd suppliers receiving high-power product s from Power Integrations.

Content

Scope .............................................................................................................................................. 1

Content ........................................................................................................................................... 1

Storage Conditions ......................................................................................................................... 2

Soldering Instructions for Driver Core Products............................................................................ 3

Reflow Soldering.................................................................................................................. 3

Wave Soldering ................................................................................................................... 3

Selective Soldering ............................................................................................................... 3

Manual Soldering ................................................................................................................. 4

Mechanical Handling ...................................................................................................................... 4

Insertion of Gate Driver Cores into the Carrier PCB ................................................................. 4

ESD Handling .................................................................................................................................. 6

EPA (Electrostatic Protected Area) ......................................................................................... 6

Guideline for Return Material Analysis - RMA ................................................................................ 6

Legal Disclaimer ............................................................................................................................. 7

Manufacturer .................................................................................................................................. 7

Power Integrations Worldwide High Power Customer Support Locations .................................... 8

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AN-1501

Material

Measures

Ambient

Ambient Conditions

Max. Storage

[Months]

Non-dry pack*1

Original packaging

Air

25°C ± 10°C /

Dry pack*2

Packed, evacuated,

ESD protection

Air

25°C ± 10°C / < 85%

Dry pack*3

Packed, evacuated,

ESD protection

Nitrogen

25°C ± 10°C / < 85%

>48

Application Note

Storage Conditions

Power Integrations products mentio ned in this Application Note must be stored and shipped according to the environmental conditions specified in Table 1.

Atmosphere

desiccant*4, Humidity Indicator Card (HIC), sealed moisture barrier bag,

desiccant, Humidity Indicator Card (HIC), sealed moisture barrier bag,

[Temp. / RH]

10% - 45%

Table 1 Environmental conditions and lifetime during storage and transportation

Legend:

Products must be processed before the end of the maximum storage time.

- Low-pollution atmosphere and packaging

- Valid for single packed drivers

- Valid for single packed trays and stored in a nitrogen atmosphere

- Number of desiccant units to be calculated according to JEDEC Standard 033

Time

Processing after the expiring date can increase the risk of non-processability or malfunction. If the original packaging is damaged, opened and not stored in the ambient conditions specified in Table 1,

the products must be processed within 168 hours.

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AN-1501

Name

Leaded

Lead-Free

Flux

25 weight % rosin, 75 weight % isopropanol

Solder alloy

Sn63Pb37

Sn96.5Ag3.0Cu0.5

Flux amount

The fluxing is determined as per the requirement of the board area and the solder joint size.

Pot temperature

280…300°C

PCB top-side temperature

100…125°C

Nozzle dragging rate

2…8mm/s3

Point soldering time

3…5s4

Parameter

Leaded

Lead-Free

Flux

25 weight % rosin, 75 weight % isopropanol

Solder alloy

Sn63Pb37

Sn96.5Ag3.0Cu0.5

Flux amount

Depending on the PCB size and assembly comp lexity, the flux is determined to the bottom.

Pot temperature

250°C

255°C

Preheating rate

3…4K/s1

PCB top-side temperature

90…110°C2

Dipping/dwelling time

3…5s

Solder pot contact width

20mm

Cooling-down rate

5K/s

Application Note

Soldering Instructions for Driver Core Products

Power Integrations gate driver cores can be soldered with the following techniques, which are defined for different process conditions.

Reflow Soldering

Reflow soldering of drivers is not permitted.

Wave Soldering

Selective Soldering

obtain maximum solder on the top side of the PCB with minimal flux residues on

…depending on the length of the wave soldering machine

…depending on the thermal mass and components on the board when it reaches the solder pot

…depending on the solder joint size

The solder nozzle should be selected depending on the surface area of the solder joint.

…depending on the size of the solder joint

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