Power integrations SCALE-1, SCALE-2 Handling Instructions Manual

AN-1501 Application Note
Handling Instructions for SCALE™-1 and SCALE™-2 Gate Drivers

Scope

Storage conditions
Soldering instructions for gate driver core products
Mechanical handling
ESD handling
Guideline for Return Material Analysis - RMA

Content

Scope .............................................................................................................................................. 1
Content ........................................................................................................................................... 1
Storage Conditions ......................................................................................................................... 2
Soldering Instructions for Driver Core Products............................................................................ 3
Reflow Soldering.................................................................................................................. 3
Wave Soldering ................................................................................................................... 3
Selective Soldering ............................................................................................................... 3
Manual Soldering ................................................................................................................. 4
Mechanical Handling ...................................................................................................................... 4
Insertion of Gate Driver Cores into the Carrier PCB ................................................................. 4
ESD Handling .................................................................................................................................. 6
EPA (Electrostatic Protected Area) ......................................................................................... 6
Guideline for Return Material Analysis - RMA ................................................................................ 6
Legal Disclaimer ............................................................................................................................. 7
Manufacturer .................................................................................................................................. 7
Power Integrations Worldwide High Power Customer Support Locations .................................... 8
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AN-1501
Material
Measures
Ambient
Ambient Conditions
Max. Storage
[Months]
Non-dry pack*1
Original packaging
Air
25°C ± 10°C /
24
Dry pack*2
Packed, evacuated,
ESD protection
Air
25°C ± 10°C / < 85%
36
Dry pack*3
Packed, evacuated,
ESD protection
Nitrogen
25°C ± 10°C / < 85%
>48
Application Note

Storage Conditions

Power Integrations products mentio ned in this Application Note must be stored and shipped according to the environmental conditions specified in Table 1.
Atmosphere
desiccant*4, Humidity Indicator Card (HIC), sealed moisture barrier bag,
desiccant, Humidity Indicator Card (HIC), sealed moisture barrier bag,
[Temp. / RH]
10% - 45%
Table 1 Environmental conditions and lifetime during storage and transportation
*1
Legend:
Products must be processed before the end of the maximum storage time.
- Low-pollution atmosphere and packaging
*2
- Valid for single packed drivers
*3
- Valid for single packed trays and stored in a nitrogen atmosphere
*4
- Number of desiccant units to be calculated according to JEDEC Standard 033
Time
Processing after the expiring date can increase the risk of non-processability or malfunction. If the original packaging is damaged, opened and not stored in the ambient conditions specified in Table 1,
the products must be processed within 168 hours.
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AN-1501
Name
Leaded
Lead-Free
Flux
25 weight % rosin, 75 weight % isopropanol
25 weight % rosin, 75 weight % isopropanol
Solder alloy
Sn63Pb37
Sn96.5Ag3.0Cu0.5
Flux amount
The fluxing is determined as per the requirement of the board area and the solder joint size.
Pot temperature
280…300°C
PCB top-side temperature
100…125°C
Nozzle dragging rate
2…8mm/s3
Point soldering time
3…5s4
Parameter
Leaded
Lead-Free
Flux
25 weight % rosin, 75 weight % isopropanol
25 weight % rosin, 75 weight % isopropanol
Solder alloy
Sn63Pb37
Sn96.5Ag3.0Cu0.5
Flux amount
Depending on the PCB size and assembly comp lexity, the flux is determined to the bottom.
Pot temperature
250°C
255°C
Preheating rate
3…4K/s1
PCB top-side temperature
90…110°C2
Dipping/dwelling time
3…5s
Solder pot contact width
20mm
Cooling-down rate
5K/s
Application Note

Soldering Instructions for Driver Core Products

Power Integrations gate driver cores can be soldered with the following techniques, which are defined for different process conditions.

Reflow Soldering

Reflow soldering of drivers is not permitted.

Wave Soldering

Selective Soldering

obtain maximum solder on the top side of the PCB with minimal flux residues on
1
…depending on the length of the wave soldering machine
2
…depending on the thermal mass and components on the board when it reaches the solder pot
3
…depending on the solder joint size
The solder nozzle should be selected depending on the surface area of the solder joint.
4
…depending on the size of the solder joint
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AN-1501
Name
Leaded
Lead-Free
Solder iron temperature
320°C
340°C (SAC305)
Maximum solder time
3-4s
Transformer
Transformer
Application Note

Manual Soldering

It is recommended to use lead-free solder EF2210, SAC30 5 alloy. However, other solder types may also be used.

Mechanical Handling

The correct handling of mechanical gate drivers is based on two fundamental principles:
1) No excessive mechanical force must be applied to transformers.
2) No excessive mechanical force causing bending (reflected to IPC-T-650) must be applied to PCBs.
The root causes of possible driver failure mentioned above may appear during mounting and later during operation. If the carrier PCB on which the driver core is pla ced is large, there is a risk of driver PCB bending referred to the carrier PCB. These phenomena can be seen during vibrations tests where momentary displacement between driver core and carrier PCB can be observed. Therefore if significant vibrations are foreseeable, it is necessary to mechanically stabilize the driver.

Insertion of Gate Driver Cores into the Carrier PCB

It is recommended that no large steady-state or temporary mechanical force be applied to the transformers or terminals of the gate core drivers. Applying excessive mechanical force to the transformer bends the PCB and considerably stresses the transformer solder joints, leading to potential pre-damage. This increases the probability of cracks at the transformer solder points and other assembled SMD components, especially ceramic capacitors and resistors.
The transformer may be held by hand during removal or insertion from/into the packaging or assembly to carrier PCB, but the PCB should be free from bending.
Fig. 1 illustrates the correct removal and assembly of the driver core. If mechanical force applied to transformer cause s PCB b ending or excessive mechanical stress to the solder join ts, the force must be shifted directly to the corresponding terminals of the driver PCB.
Fig. 1 Not recommended (left) and recommended (right) ways of handling Power Integrations gate driver
cores during assembly (body plan of a driver)
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AN-1501
PCB
IGBT Module
Distance bolt
A
B
C
Application Note
The IPC-T-650 standard gives general guidance for PCB handling and recommends that PCBs with surface mount components are not exposed to bending or twisting o f more than 0.5% in relation to their length a nd width. Fig. 2 s hows the gate driver core 2SC0435T as an example. It has dimension s (length and width) of
Fig. 2 Dimensions of a standard Power Integrations gate driver core
In case of Plug-and-Play drivers which are screw-fitted to a powe r module, it is important to adjust the height of the distance bolts properly. This will increase the driver’s vibration withstand capability and avoid PCB bending. Fig. 3 illustrates the corr ect usage of the bolts.
Fig. 3 Correct (A) and wrong (B and C) fixing of Power Integrations gate drivers
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AN-1501 Application Note

ESD Handling

EPA (Electrostatic Protected Area)

In order to ensure a safe ESD environment in w hich the work on electronics c omponents or subassemblies such as printed circuit boards is carried out, an ESD protected area or EPA must be set up and correctly used every time Power Integrations’ high-power SCALE™-1 and SCALE™-2 product s are handled or processed. An EPA or ESD PA (ESD Protected Area) is designed to minimize the generation and retention of ESD. It allows the level of failures during production and later in life to be kept to a minimum.

Guideline for Return Material Analysis - RMA

The following requirements are necessary to ensure proper RMA process handling:
Acquire RMA number from the Powe r Integrations Customer Service Department before return.
For each RMA case, a “Driver Failure Description Form DFDF” must be compl eted.
In the customs documents, a goods value of 1 USD must be specified.
Returned product must be packed properly and according to ESD rules.
Note that the RMA process is not applicable to:
Prototypes (PRT) and Engineering (ENG) samples Products that were used or operated beyond specification Products arrived at customers with transportation damages Products which arrive at Power Integrations without “Driver Failure Description Form DFDF” Products without ESD-compliant packaging
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AN-1501 Application Note

Legal Disclaimer

The statements, technical information and recommendations contained herein are believed to be accurate as of the date hereof. All parameters, numbers, values and other technical data included in the technical information were calculated and determined to our best knowledge in accordance with the relevant technical norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in general. We exclude any representation or warranty, express or implied, in relation to the accuracy or completeness of the statements, technical information and recommendations contained herein. No responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information, recommendations or opini ons communicated and any liab ility for any direct, indirect or consequentia l loss or damage suffered by any person arising therefrom is expressly disclaimed.

Manufacturer

Power Integrations Switzerland GmbH Johann-Renfer-Strasse 15 2504 Biel-Bienne, Switz er la nd
Phone +41 32 344 47 47 Fax +41 32 344 47 40 Email igbt-driver.sales@power.com Website www.power.com/igbt-driver
2015 Power Integrat ions Switzerland GmbH. All rights reserved.
We reserve the right to make any technical modifications without prior notice. Version 1.0 from 2016-04-14
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AN-1501
World Headquarters
China (Shenzhen)
Japan (Kanagawa)
Application Note

Power Integrations Worldwide High Power Customer Support Locations

5245 Hellyer Avenue San Jose, CA 95138 | USA Main +1 408 414 9200 Customer Service: Phone +1 408 414 9665 Fax +1 408 414 9765 Email usasales@power.com
Switzerland (Biel)
Johann-Renfer-Strasse 15 2504 Biel-Bienne | Switzerland Phone +41 32 344 47 47 Fax +41 32 344 47 40 Email igbt-driver.sales@power.com
Germany (Ense)
HellwegForum 1 59469 Ense | Germany Phone +49 2938 643 9990 Email
igbt-driver.sales@power.com
China (Shanghai)
Rm 2410, Charity Plaza, No. 88 North Caoxi Road Shanghai, PRC 200030 Phone +86 21 6354 6323 Fax +86 21 6354 6325 Email chinasales@power.com
17/F, Hivac Building, No 2 , Keji South 8th Road, Nanshan District Shenzhen | China, 518057 Phone +86 755 8672 8725 Fax +86 755 8672 8690 Hotline +86 400 0755 669 Email chinasales@power.com
UK (Cambridge)
Westbrook Centre, Block 5, 2nd Floor Milton Road Cambridge CB4 1YG Phone: +44 (0) 1223-446483 Email: eurosales@power.com
India (Bangalore)
#1, 14th Main Road Vasanthanagar Bangalore 560052 | India Phone +91 80 4113 8020 Fax +91 80 4113 8023 Email indiasales@power.com
Kosei Dai-3 Bldg., 2-12-11, Shin­Yokohama, Kohoku-ku, Yokohama-shi, Kanagawa 222-0033 | Japan Phone +81 45 471 1021 Fax +81 45 471 3717 Email japansales@power.com
Korea (Seoul)
RM 602, 6FL Korea City Air Terminal B/D, 159-6 Samsung-Dong, Kangnam-Gu Seoul 135-728 | Korea Phone +82 2 2016 6610 Fax +82 2 2016 6630 Email koreasales@power.com
Taiwan (Taipei)
5F, No. 318, Nei Hu Rd., Sec. 1 Nei Hu Dist. Taipei 11493 | Taiwan R.O.C. Phone +886 2 2659 4570 Fax +886 2 2659 4550 Email taiwansales@power.com
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