Terminals T and R correspond to the
alternative line designators of A and B
T(A)R(B)
MDXXBG
SD4XAA
●
description
Low Differential Capacitance . . . 39 pF max.
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by
a.c. power system or lightning flash disturbances whic h ar e ind uc ed or co ndu cte d on to the telephone li ne. A
single device provides 2-point protection and is typically u sed for the protec tion of 2 -wire tel ecommunicatio n
equipment (e.g. between the Ri ng and Tip wires for telephones a nd modems ). Combinati ons of devices ca n
be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially
clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to
crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the
overvoltage to be safely diverted through the device. The high crowbar holding cu rrent prevents d.c. latchup
as the diverted current subsides.
This TISP4xxxH4BJ range consists of six voltage variants to meet various maxi mum system voltage levels
(135 V to 270 V). They are guaranteed to voltage li mit and withs tand the li sted inter nat ional li ghtning sur ges
in both polar ities. These high (H) current p rotection d evices are in a plastic package SMBJ (JEDEC DO214AA with J-bend l eads) and supplied i n embossed carrier reel pack. For alternative voltage and holdin g
current values, consult the factory. For lower rated impulse curren ts in the SMB package, the 50 A 10/1000
TISP4xxxM3BJ series is available.
PRODUCT INFORMATION
Information is current as of publication date. Produc ts conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape)500
8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator)300
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)250
5/200 µs (VDE 0433, 10/700 µs voltage wave shape)220
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape)200
5/310 µs (ITU-T K20/21, 10/700 µs voltage wave shape)200
5/310 µs (FTZ R12, 10/700 µs voltage wave shape)200
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)160
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape)100
Non-repetitive peak on-state current (see Notes 2, 3 and 5)
20 ms (50 Hz) full sine wave
16.7 ms (60 Hz) full sine wave
1000 s 50 Hz/60 Hz a.c.
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 Adi
Junction temperatureT
Storage temperature rangeT
= 25°C (unless otherwise noted)
A
RATINGSYMBOLVALUEUNIT
‘4165
‘4180
‘4200
‘4265
‘4300
‘4360
V
DRM
I
TSP
I
TSM
/dt400A/µs
T
J
stg
±135
±145
±155
±200
±230
±270
55
60
2.1
-40 to +150°C
-65 to +150°C
V
A
A
NOTES: 1. See Applications Information and Figure 10 for voltage values at lower temperatures.
2. Initially the TISP4xxxH4BJ must be in thermal equilibrium with T
3. The surge may be repeated after the TISP4xxxH4BJ returns to its initial conditions.
4. See Applications Information and Figure 11 for current ratings at other temperatures.
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring
track widths. See Figure 8 for the current ratings at other durations. Derate current v alues at -0.61%/°C for ambient temperatures
above 25 °C