BULD85KC
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
2
MAY 1994 - REVISED SEPTEMBER 1997
PRODUCT INFORMATION
NOTES: 2. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
3. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts, and located
within 3.2 mm from the device body.
NOTE 4: Tested in a typical High Frequency Electronic Ballast.
electrical characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CEO(sus)
Collector-emitter
sustaining voltage
I
C
= 0.1 A L = 25 mH 400 V
I
CES
Collector-emitter
cut-off current
V
CE
= 600 V VBE= 0 10 µA
I
EBO
Emitter cut-off
current
V
EB
= 9 V IC= 0 1 mA
V
BE(sat)
Base-emitter
saturation voltage
I
B
= 0.2 A IC= 1 A (see Notes 2 and 3) 0.85 1.1 V
V
CE(sat)
Collector-emitter
saturation voltage
IB = 0.2 A
I
B
= 0.4 A
I
C
= 1 A
I
C
= 2 A
(see Notes 2 and 3)
0.2
0.4
0.5
1
V
h
FE
Forward current
transfer ratio
V
CE
= 10 V
V
CE
= 1 V
V
CE
= 5 V
I
C
= 0.01 A
I
C
= 1 A
I
C
= 2 A
(see Notes 2 and 3)1010
10
17.5
15
15.52020
V
EC
Anti-parallel diode
forward voltage
I
E
= 1 A (see Notes 2 and 3) 1.2 1.5 V
thermal characteristics
PARAMETER MIN TYP MAX UNIT
R
θJA
Junction to free air thermal resistance 62.5 °C/W
R
θJC
Junction to case thermal resistance 1.78 °C/W
switching characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
rr
Anti-parallel diode
reverse recovery time
Measured by holding transistor
in an off condition, V
EB
= -3 V.
(see Note 4) 1 µs
inductive-load switching characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
sv
Storage time
I
C
= 1 A
L = 1 mH
I
B(on)
= 0.2 A
I
B(off)
= 0.2 A
V
CC
= 40 V
V
CLAMP
= 300 V
4 5 µs
resistive-load switching characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
fi
Current fall time
I
C
= 1 A
V
CC
= 300 V
I
B(on)
= 0.2 A
I
B(off)
= 0.2 A
150 200 ns