PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
FX50KMJ-2
4V DRIVE
•
VDSS .............................................................–100V
•
rDS (ON) (MAX) ................................................ 50mΩ
•
ID ....................................................................–50A
•
Integrated Fast Recovery Diode (TYP.) .........100ns
•
Viso ................................................................................ 2000V
•
OUTLINE DRAWING Dimensions in mm
10 ± 0.3 2.8 ± 0.2
3 ± 0.33.6 ± 0.3
15 ± 0.314 ± 0.5
1
2
3
1
3
2
6.5 ± 0.3
φ 3.2 ± 0.2
1.1 ± 0.2
1.1 ± 0.2
0.75 ± 0.15
2.54 ± 0.252.54 ± 0.25
2.6 ± 0.2
1
2
3
E
0.75 ± 0.15
4.5 ± 0.2
GATE
DRAIN
SOURCE
TO-220FN
APPLICATION
Motor control, Lamp control, Solenoid control
DC-DC converter, etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol
VDSS
VGSS
ID
IDM
IDA
IS
ISM
PD
Tch
Tstg
Viso
—
Drain-source voltage
Gate-source voltage
Drain current
Drain current (Pulsed)
Avalanche drain current (Pulsed)
Source current
Source current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Isolation voltage
Weight
Parameter Conditions Ratings Unit
VGS = 0V
VDS = 0V
L = 30µH
AC for 1minute, Terminal to case
Typical value
–100
±20
–50
–200
–50
–50
–200
35
–55 ~ +150
–55 ~ +150
2000
2.0
V
V
A
A
A
A
A
W
°C
°C
V
g
Jan.1999
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
IGSS
IDSS
VGS (th)
rDS (ON)
rDS (ON)
VDS (ON)
yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
VSD
Rth (ch-c)
trr
Drain-source breakdown voltage
Gate-source leakage current
Drain-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state resistance
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Source-drain voltage
Thermal resistance
Reverse recovery time
ID = –1mA, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = –100V, VGS = 0V
ID = –1mA, VDS = –10V
ID = –25A, VGS = –10V
ID = –25A, VGS = –4V
ID = –25A, VGS = –10V
ID = –25A, VDS = –10V
VDS = –10V, VGS = 0V, f = 1MHz
VDD = –50V, ID = –25A, VGS = –10V , RGEN = RGS = 50Ω
IS = –25A, VGS = 0V
Channel to case
IS = –50A, dis/dt = 100A/µs
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
–100
—
—
–1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
–1.5
39
47
–0.98
49.2
11130
896
480
57
118
828
380
–1.0
—
100
—
±0.1
–0.1
–2.0
50
61
–1.25
—
—
—
—
—
—
—
—
–1.5
3.57
—
V
µA
mA
V
mΩ
mΩ
V
S
pF
pF
pF
ns
ns
ns
ns
V
°C/W
ns
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
50
40
30
20
10
POWER DISSIPATION PD (W)
0
0 20050 100 150
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
–100
–80
–60
–40
–20
DRAIN CURRENT ID (A)
0
0 –2–4–6–8–10
VGS =
–10V
(TYPICAL)
–8V
–6V
Tc = 25°C
Pulse Test
–5V
PD = 35W
C (°C)
–4V
–3V
MAXIMUM SAFE OPERATING AREA
–3
–2
2
–10
–7
–5
–3
–2
1
–10
–7
TC = 25°C
–5
Single Pulse
DRAIN CURRENT ID (A)
–3
–2
0
–10
–7
–5
–3
–3 –5–7 –2 –2–10
100µs
1ms
10ms
100ms
0
–2 –10
–3 –5–7–2 –10
1
DRAIN-SOURCE VOLTAGE V
OUTPUT CHARACTERISTICS
(TYPICAL)
–50
–40
–30
VGS =
–10V
–4V
–8V
–6V
–5V
–20
–10
DRAIN CURRENT ID (A)
0
0 –1.0 –2.0 –3.0 –4.0 –5.0
tw =
10µs
DC
–3 –5–7
DS (V)
Tc = 25°C
Pulse Test
PD = 35W
2
–3V
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V)
Jan.1999