POWEREX FX50KMJ-2 Datasheet

PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
FX50KMJ-2
4V DRIVE
VDSS .............................................................–100V
rDS (ON) (MAX) ................................................ 50m
Integrated Fast Recovery Diode (TYP.) .........100ns
Viso ................................................................................ 2000V
OUTLINE DRAWING Dimensions in mm
10 ± 0.3 2.8 ± 0.2
3 ± 0.33.6 ± 0.3
15 ± 0.314 ± 0.5
1
2
3
1
3
2
6.5 ± 0.3
φ 3.2 ± 0.2
1.1 ± 0.2
1.1 ± 0.2
0.75 ± 0.15
2.54 ± 0.252.54 ± 0.25
2.6 ± 0.2
1 2 3
E
0.75 ± 0.15
4.5 ± 0.2
GATE DRAIN SOURCE
TO-220FN
APPLICATION
Motor control, Lamp control, Solenoid control DC-DC converter, etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol VDSS VGSS ID IDM IDA IS ISM PD Tch Tstg Viso
Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Avalanche drain current (Pulsed) Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Isolation voltage Weight
Parameter Conditions Ratings Unit
VGS = 0V VDS = 0V
L = 30µH
AC for 1minute, Terminal to case Typical value
–100
±20 –50
–200
–50 –50
–200
35 –55 ~ +150 –55 ~ +150
2000
2.0
V V A A A A A
W °C °C
V g
Jan.1999
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
IGSS IDSS VGS (th) rDS (ON) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c) trr
Drain-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time
ID = –1mA, VGS = 0V VGS = ±20V, VDS = 0V VDS = –100V, VGS = 0V ID = –1mA, VDS = –10V ID = –25A, VGS = –10V ID = –25A, VGS = –4V ID = –25A, VGS = –10V ID = –25A, VDS = –10V
VDS = –10V, VGS = 0V, f = 1MHz
VDD = –50V, ID = –25A, VGS = –10V , RGEN = RGS = 50
IS = –25A, VGS = 0V Channel to case IS = –50A, dis/dt = 100A/µs
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
–100
— —
–1.0
— — — — — — — — — — — — — —
— — —
–1.5
39 47
–0.98
49.2
11130
896 480
57 118 828 380
–1.0
— 100
— ±0.1 –0.1 –2.0
50
61
–1.25
— –1.5
3.57
V
µA
mA
V m m
V
S
pF pF pF
ns ns ns ns
V
°C/W
ns
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
50
40
30
20
10
POWER DISSIPATION PD (W)
0
0 20050 100 150
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
–100
–80
–60
–40
–20
DRAIN CURRENT ID (A)
0
0 –2–4–6–8–10
VGS = –10V
(TYPICAL)
–8V –6V
Tc = 25°C Pulse Test
–5V
PD = 35W
C (°C)
–4V
–3V
MAXIMUM SAFE OPERATING AREA
–3 –2
2
–10
–7 –5
–3 –2
1
–10
–7
TC = 25°C
–5
Single Pulse
DRAIN CURRENT ID (A)
–3 –2
0
–10
–7 –5
–3
–3 –5–7 –2 –2–10
100µs
1ms
10ms
100ms
0
–2 –10
–3 –5–7–2 –10
1
DRAIN-SOURCE VOLTAGE V
OUTPUT CHARACTERISTICS
(TYPICAL)
–50
–40
–30
VGS = –10V
–4V
–8V –6V –5V
–20
–10
DRAIN CURRENT ID (A)
0
0 –1.0 –2.0 –3.0 –4.0 –5.0
tw = 10µs
DC
–3 –5–7
DS (V)
Tc = 25°C Pulse Test
PD = 35W
2
–3V
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V)
Jan.1999
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