POWEREX CM800DU-12H Datasheet

CM800DU-12H
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
A
"R" (4 PLACES)
BEE
"S" (3 PLACES)
C2E1
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
J 0.53 14.5
C2E1
E2
E2
ML
Q
Dimensions Inches Millimeters
F
G
C1
H
J
K
J
"T" (4 PLACES)
D
G2 E2
E1 G1
C
G2E2E1G1
C1
N
P
K 1.57 40.0
L 1.42 36.0 M 1.72 43.8 N 0.54 13.8
P 0.45 11.5 Q 5.51 140.0 R 0.26 Dia. 6.5 Dia.
SM8 M8
TM4 M4
Dual IGBTMOD™ U-Series Module
800 Amperes/ 600 Volts
Description:
Powerex IGBTMOD™ Modules are designed for use in switching applications. Each module consists of two IGBT Transistors in a half­bridge configuration with each tran­sistor having a reverse-connected super-fast recovery free-wheel diode. All components and inter­connects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.
Features:
Low Drive PowerLow VDiscrete Super-Fast Recovery
Isolated Baseplate for Easy
Applications:
AC Motor ControlMotion/Servo ControlUPSWelding Power SuppliesLaser Power Supplies
Ordering Information:
Example: Select the complete module number you desire from the table - i.e. CM800DU-12H is a 600V (V IGBTMOD™ Power Module.
Type Amperes Volts (x 50)
CM 800 12
CE(sat)
Free-Wheel Diode Heat Sinking
), 800 Ampere Dual
CES
Current Rating V
CES
1
1
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
CM800DU-12H Dual IGBTMOD U-Series Module
800 Amperes/600 Volts
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM800DU-12H Units
Junction T emper ature T Storage Temperature T Collector-Emitter Voltage (G-E SHORT) V Gate-Emitter Voltage (C-E SHORT) V Collector Current (Tc = 25°C) I Peak Collector Current I Emitter Current** (Tc = 25°C) I Peak Emitter Current** I Maximum Collector Dissipation (Tc = 25°C, Tj ≤ 150°C) P
j
stg CES GES
C
CM
E
EM
c
Mounting Torque, M8 Main Terminal – 95 in-lb Mounting Torque, M6 Mounting – 40 in-lb G(E) Terminal, M4 – 15 in-lb Weight – 1200 Grams Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) V
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed T **Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
iso
-40 to 150 °C
-40 to 125 °C 600 Volts ±20 Volts 800 Amperes
1600* Amperes
800 Amperes
1600* Amperes
1500 Watts
2500 Volts
rating.
j(max)
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current I Gate Leakage Voltage I Gate-Emitter Threshold Voltage V Collector-Emitter Saturation Voltage V
CES GES VGE
GE(th)
CE(sat) IC
VCE = V
, VGE = 0V ––2mA
CES
= V
, VCE = 0V ––0.5 µA
GES
IC = 80mA, VCE = 10V 4.5 6 7.5 Volts
= 800A, VGE = 15V, Tj = 25°C – 2.55 3.15 Volts
IC = 800A, VGE = 15V, Tj = 125°C – 2.75 – Volts Total Gate Charge Q Emitter-Collector Voltage** V
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
G VCC
EC
= 300V, IC = 800A, VGE = 15V – 1600 – nC
IE = 800A, VGE = 0V ––2.6 Volts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Resistive Turn-on Delay Time t Load Rise Time t Switch Turn-off Delay Time t Times Fall Time t Diode Reverse Recovery Time** t Diode Reverse Recovery Charge** Q
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
ies oes res
d(on) VCC
r VGE1
d(off) RG
f
rr IE
rr IE
VCE = 10V, VGE = 0V ––38.4 nf
= 300V, IC = 800A, – – 400 ns
= V
GE2
= 3.1, Resistive ––500 ns Load Switching Operation ––300 ns = 800A, diE/dt = -1600A/µs –– 160 ns = 800A, diE/dt = -1600A/µs – 1.92 – µC
= 15V, ––2000 ns
––70.4 nf
––10.4 nf
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R Thermal Resistance, Junction to Case R Contact Thermal Resistance R
2
2
Q Per IGBT 1/2 Module ––0.083 °C/W
th(j-c)
R Per FWDi 1/2 Module ––0.13 °C/W
th(j-c)
th(c-f)
Per Module, Thermal Grease Applied – 0.010 – °C/W
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