0.5 to 3 ±0.2
over 3 to 6 ±0.3
over 6 to 30 ±0.5
over 30 to 120 ±0.8
over 120 to 400 ±1. 2
V
J
X
Y
(4 PLACES)
B
C2E1
L
E
C
Tr2
C2E1
Di2
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
A 4.33 110.0
B 3.15 80.0
C 1.14+0.04/-0.02 29.0+1.0/-0.5
D 3.66±0.01 93.0±0.25
E 2.44±0.01 62.0±0.25
F 0.98 25.0
G 0.24 6.0
H 0.59 15.0
J 0.81 20.5
K 0.55 14.0
L 0.26 Dia. Dia. 6.5
M M6 Metric M6
Dimensions Inches Millimeters
N 1.18 30.0
P 0.71 18.0
Q 0.28 7.0
R 0.83 21.2
S 0.33 8.5
T 0.0157 0.4
U 0.110 2.8
V 0.16 4.0
W 0.30 7.5
X 0.21 5.3
Y 0.47 12.0
Z 0.85 21.5
Dual IGBTMOD™
S-Series Module
450 Amperes/1200 Volts
Description:
Powerex Dual IGBTMOD™
Modules are designed for use in
switching applications. Each
module consists of two IGBT
Transistors in a half-bridge
configuration with each transistor
having a reverse-connected
super-fast recovery free-wheel
diode. All components and
interconnects are isolated from the
heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
£ Low Drive Power
£ Low V
£
£ Isolated Baseplate for Easy
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ UPS
£ Welding Power Supplies
£ Laser Power Supplies
Ordering Information:
Example: Select the complete
module number you desire from
the table - i.e. CM450DY-24S is a
1200V (V
IGBTMOD™ Power Module.
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Inverter Part IGBT/FWDi
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)
*2,*8
IC 410 Amperes
Collector Current (Pulse, Repetitive)*3 I
Total Power Dissipation (TC = 25°C)
Emitter Current (TC = 25°C)
*2,*4
P
*2,*4,*8
I
Emitter Current (Pulse, Repetitive)*3 I
1200 Volts
CES
±20 Volts
GES
900 Amperes
CRM
3330 Watts
tot
*1
410 Amperes
E
*1
900 Amperes
ERM
Module
Characteristics Symbol Rating Units
Maximum Junction Temperature T
Operating Junction Temperature T
Storage Temperature T
Case Temperature
Isolation Voltage (Terminals to Baseplate, RMS, f = 60Hz, AC 1 minute) V
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*3 Pulse width and repetition rate should be such that device junction temperature (Tj)
does not exceed T
*4 Junction temperature (Tj) should not increase beyond maximum junction
temperature (T
*8 This model has 450A size IGBT and FWDi chips. This package limitation is based
on package issue.
,*2
TC -40 to +125 °C
rating.
j(max)
) rating.
j(max)
+175 °C
j(max)
-40 to +150 °C
j(op)
-40 to +125 °C
stg
2500 Volts
ISO
20.4
46.8
77.4
Tr1
Di1
Tr1
Di1
Di1
Tr1
33.3
45.6
0
0
33.6
Tr2 Tr2 Tr2
Di2 Di2 Di2
0
21.5
21.6
35.0
48.2
48.4
0
20.6
33.6
46.6
66.2
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi
Each mark points to the center position of each chip.
Turn-on Switching Energy per Pulse Eon VCC = 600V, IC = IE = 450A, — 54.9 — mJ
Turn-off Switching Energy per Pulse E
Reverse Recovery Energy per Pulse E
Internal Lead Resistance R
Per Switch,TC = 25°C
Internal Gate Resistance rg Per Switch — 4.3 — Ω
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
Creepage Distance ds Terminal to Terminal — — — mm
Terminal to Baseplate — — — mm
Clearance da Terminal to Terminal — — — mm
Terminal to Baseplate — — — mm
Weight m — 580 — Grams
Flatness of Baseplate ec On Centerline X, Y*7 -100 — ±100 µm
Recommended Operating Conditons, Ta = 25°C
(DC) Supply Voltage VCC Applied Across C1-E2 — 600 850 Volts
Gate (-Emitter Drive) Voltage V
External Gate Resistance RG Per Switch 0 — 8 Ω
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*7 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
Y
X
– CONCAVE
+ CONVEX
BOTTOM
LABEL SIDE
BOTTOM
– CONCAVE
+ CONVEX
Applied Across G1-Es1 / G2-Es2 13.5 15.0 16.5 Volts
GE(on)
20.4
46.8
46.6
77.4
Tr1
Di1
Tr1
Di1
Di1
Tr1
66.2
LABEL SIDE
BOTTOM
3 mm
0
0
33.3
45.6
0
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi
Each mark points to the center position of each chip.