Powerex CM450DY-24S Data Sheet

CM450DY-24S
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
A
D
K
K
E2
M
(3 PLACES)
FF
Q
P P P
E2
Q
LABEL
Di1
Tr1
K
G
G2
E2
C1
E1 G1
Z
U
G2
E2
C1
E1 G1
H
N
G
V
W
R
S
Tolerance Otherwise Specified
Division of Dimension Tolerance
0.5 to 3 ±0.2 over 3 to 6 ±0.3 over 6 to 30 ±0.5 over 30 to 120 ±0.8 over 120 to 400 ±1. 2
V
J
X
Y
(4 PLACES)
B
C2E1
L
E
C
Tr2
C2E1
Di2
Outline Drawing and Circuit Diagram
A 4.33 110.0
B 3.15 80.0
C 1.14+0.04/-0.02 29.0+1.0/-0.5
D 3.66±0.01 93.0±0.25
E 2.44±0.01 62.0±0.25
F 0.98 25.0
G 0.24 6.0
H 0.59 15.0
J 0.81 20.5
K 0.55 14.0
L 0.26 Dia. Dia. 6.5
M M6 Metric M6
N 1.18 30.0
P 0.71 18.0
Q 0.28 7.0
R 0.83 21.2
S 0.33 8.5
T 0.0157 0.4
U 0.110 2.8
V 0.16 4.0
W 0.30 7.5
X 0.21 5.3
Y 0.47 12.0
Z 0.85 21.5
Dual IGBTMOD™ S-Series Module
450 Amperes/1200 Volts
Description:
Powerex Dual IGBTMOD™ Modules are designed for use in switching applications. Each module consists of two IGBT Transistors in a half-bridge configuration with each transistor having a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and
thermal management.
Features:
£ Low Drive Power £ Low V £
£ Isolated Baseplate for Easy
Applications:
£ AC Motor Control £ Motion/Servo Control £ UPS £ Welding Power Supplies £ Laser Power Supplies
Ordering Information:
Example: Select the complete module number you desire from the table - i.e. CM450DY-24S is a 1200V (V IGBTMOD™ Power Module.
Current Rating V Type Amperes Volts (x 50)
CM 450 24
CE(sat)
Discrete Super-Fast Recovery Free-Wheel Diode
Heat Sinking
), 450 Ampere Dual
CES
CES
108/13 Rev. 2
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
CM450DY-24S Dual IGBTMOD™ S-Series Module
450 Amperes/1200 Volts
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Inverter Part IGBT/FWDi
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)
*2,*8
IC 410 Amperes
Collector Current (Pulse, Repetitive)*3 I
Total Power Dissipation (TC = 25°C)
Emitter Current (TC = 25°C)
*2,*4
P
*2,*4,*8
I
Emitter Current (Pulse, Repetitive)*3 I
1200 Volts
CES
±20 Volts
GES
900 Amperes
CRM
3330 Watts
tot
*1
410 Amperes
E
*1
900 Amperes
ERM
Module
Characteristics Symbol Rating Units
Maximum Junction Temperature T
Operating Junction Temperature T
Storage Temperature T
Case Temperature
Isolation Voltage (Terminals to Baseplate, RMS, f = 60Hz, AC 1 minute) V
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi). *2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate and the heatsink side just under the chips. Refer to the figure to the right for chip location. The heatsink thermal resistance should be measured just under the chips. *3 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T *4 Junction temperature (Tj) should not increase beyond maximum junction temperature (T *8 This model has 450A size IGBT and FWDi chips. This package limitation is based on package issue.
,*2
TC -40 to +125 °C
rating.
j(max)
) rating.
j(max)
+175 °C
j(max)
-40 to +150 °C
j(op)
-40 to +125 °C
stg
2500 Volts
ISO
20.4
46.8
77.4
Tr1
Di1
Tr1
Di1
Di1
Tr1
33.3
45.6
0
0
33.6
Tr2 Tr2 Tr2
Di2 Di2 Di2
0
21.5
21.6
35.0
48.2
48.4
0
20.6
33.6
46.6
66.2
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi Each mark points to the center position of each chip.
LABEL SIDE
2 08/13 Rev. 2
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