0.5 to 3 ±0.2
over 3 to 6 ±0.3
over 6 to 30 ±0.5
over 30 to 120 ±0.8
over 120 to 400 ±1. 2
The tolerance of size between
terminals is assumed to ±0.4
T
Z
Y
V
P
AK
AG
E B
AH
AJ
AQ
AM
H
AL
AZ
C
11
M N
RQ
AF
C1(1)
C1(2)
E2(3)
E2(4)
AU
F
AD
L
1
P
2
S
3
P
4
GH
AC
AG
Es1
TH2
(18)G1(17)
(16)
Tr1Tr2
Di1Di2
NC
(5)NC(6)
GJJKJ
18
17 16 15 1413 12 11
AB (6 PLACES)
AA (4 PLACES)
5 6
TH1
Cs1
Th
(15)
(14)
NTC
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
A 5.98 152.0
B 4.79 121.7
C 0.81 20.5
D 5.39 137.0
E 4.33±0.02 110.0±0.5
F 0.53 13.5
G 0.81±0.012 20.5±0.3
H 0.15 3.81
J 0.6 15.24
K 0.74±0.012 19.05±0.3
L 0.75 19.24
M 0.3 7.75
N 0.42 10.74
P 0.86 22.0
Q 3.72±0.012 94.5±0.3
R 3.48 88.53
S 1.08 27.53
T 1.62 41.22
U 1.95 49.72
V 1.53 39.0
W 0.47 12.0
X 0.31 8.0
Y 0.26 6.5
Z 0.61 15.64
AA Dia. 5.5 Dia.
Dimensions Inches Millimeters
AB M6 Metric M6
AC 0.6 15.14
AD 0.14 3.6
AE 4.16±0.012 105.9±0.3
AF 0.55 14.0
AG 0.27 7.0
AH 0.14 3.5
AJ 0.67+0.04/-0.02 17.0+1.0/-0.5
AK 0.12 3.0
AL 0.04 1.15
AM 0.02 0.65
AN 0.05 1.2
AP 0.18 4.5
AQ 0.5 12.5
AR 0.18 Dia. 4.5 Dia.
AS 0.10 Dia. 2.6 Dia.
AT 0.09 Dia. 2.25 Dia.
AU 0.45±0.012 11.36±0.3
AV 0.36±0.012 9.15±0.3
AW 0.46±0.012 11.8±0.3
AX 4.18±0.012 106.3±0.3
AY 0.017±0.012 0.45±0.3
AZ 0.51 13.0
BA 0.54 13.7
BB 0.53±0.012 11.35±0.3
AK
DETAIL “A”
DETAIL “B”
BA
M
DETAIL “C”
AW
AU
AV
DETAIL “D”
Dual IGBT
NX-Series Module
450 Amperes/1700 Volts
AR
AS
AT
AP
AN
Description:
Powerex IGBT Modules are
designed for use in switching
45°
M
BA
AY
BB
G
10
H
9
applications. Each module
consists of two IGBT Transistors
in a half-bridge configuration with
each transistor having a reverseconnected super-fast recovery
free-wheel diode. All components
and interconnects are isolated from
the heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
£ Low Drive Power
£ Low V
CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM450DXL-34SA is a 1700V
(V
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)
*2,*4
IC 450 Amperes
Collector Current (Pulse, Repetitive)*3 I
Total Power Dissipation (TC = 25°C)
*2,*4
P
Emitter Current*2 I
Emitter Current (Pulse, Repetitive)*3 I
Isolation Voltage (Terminals to Baseplate, RMS, f = 60Hz, AC 1 minute) V
Maximum Junction Temperature, Instantaneous Event (Overload) T
Maximum Case Temperature*4 T
Operating Junction Temperature, Continuous Operation (Under Switching) T
Storage Temperature T
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Junction temperature (Tj) should not increase beyond maximum junction
temperature (T
*3 Pulse width and repetition rate should be such that device junction temperature (Tj)
does not exceed T
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
j(max)
) rating.
j(max)
rating.
18.5
29.5
30.5
43.6
44.6
70.8
84.9
0
24.2
0
Tr1
Di1
Tr2
Di2
1700 Volts
CES
±20 Volts
GES
900 Amperes
CRM
4410 Watts
tot
*1
450 Amperes
E
*1
900 Amperes
ERM
4000 Volts
ISO
175 °C
j(max)
125 °C
C(max)
-40 to +150 °C
j(op)
-40 to +125 °C
stg
45.1
47.2
Th
Tr1
Di1
92.1
0
Tr1
Di1
Tr2
Tr2
Di2
Di2
27.0
41.1
70.2
84.3
0
27.6
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
Turn-on Switching Energy per Pulse Eon VCC = 1000V, IC = IE = 450A, VGE = ±15V — 147 — mJ
Turn-off Switching Energy per Pulse E
Reverse Recovery Energy per Pulse E
Internal Lead Resistance R
Per Switch,TC = 25°C
Internal Gate Resistance rg Per Switch — 3.2 — Ω
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
VCE = V
CES
VGE = V
GES
IC = 45mA, VCE = 10V 5.4 6.0 6.6 Volts
GE(th)
IC = 450A, VGE = 15V, Tj = 25°C*5 — 2.0 2.5 Volts
CE(sat)
IC = 450A, VGE = 15V, Tj = 25°C*5 — 1.9 2.4 Volts
CE(sat)
— — 119 nF
ies
VCE = 10V, VGE = 0V — — 9.8 nF
oes
— — 2.2 nF
res
— — 900 ns
d(on)
RG = 0Ω, Inductive Load — — 900 ns
d(off)
*1
IE = 450A, VGE = 0V, Tj = 25°C*5 — 4.1 5.3 Volts
EC
*1
IE = 450A, VGE = 0V, Tj = 25°C*5 — 4.0 5.2 Volts
EC
*1
VCC = 1000V, IE = 450A, VGE = ±15V — — 300 ns
rr
*1
RG = 0Ω, Inductive Load — 17 — µC
rr
RG = 0Ω, Tj = 150°C — 129 — mJ
off
*1
Inductive Load — 73 — mJ
rr
CC' + EE'
Main Terminals-Chip, — — 0.6 mΩ
, VGE = 0V — — 1.0 mA
CES
, VCE = 0V — — 0.5 µA
GES
*4
0
24.2
45.1
18.5
29.5
30.5
43.6
44.6
70.8
84.9
47.2
0
Th
Tr1
Tr1
Di1
Di1
Tr2
Di2
92.1
Tr1
Di1
Tr2
Tr2
Di2
Di2
0
27.0
41.1
70.2
84.3
06/13 Rev. 1
0
27.6
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
Creepage Distance ds Terminal to Terminal 22.5 — — mm
Terminal to Baseplate 16.8 — — mm
Clearance da Terminal to Terminal 15.5 — — mm
Terminal to Baseplate 11.3 — — mm
Weight m — 690 — Grams
Flatness of Baseplate ec On Centerline X, Y*8 ±0 — +100 µm
Recommended Operating Conditons, Ta = 25°C
DC Supply Voltage VCC Applied Across C1-E2 Terminals — 1000 1200 Volts
Gate-Emitter Drive Voltage V
G1-Es1/G2-Es2 Terminals
External Gate Resistance RG Per Switch 0 — 18 Ω
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 B
(25/50)
R
R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]
R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
4
= In(
R
25
)/( 1 –
50 T25 T50
MOUNTING SIDE
LABEL SIDE
1
)
+ : CONVEX
– : CONCAVE
X
Y
MOUNTING SIDE
– : CONCAVE
+ : CONVEX
Applied Across 13.5 15.0 16.5 Volts
GE(on)
0
24.2
45.1
18.5
29.5
30.5
43.6
44.6
70.8
84.9
47.2
0
Th
Tr1
Tr1
Di1
Di1
Tr2
Di2
0
27.6
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.