0.5 to 3 ±0.2
over 3 to 6 ±0.3
over 6 to 30 ±0.5
over 30 to 120 ±0.8
over 120 to 400 ±1.2
The tolerance of size between
terminals is assumed to ±0.4
AQ
AQ
AM
CM450DX-34SA
Dual IGBT
NX-Series Module
450 Amperes/1700 Volts
Description:
Powerex IGBT Modules are
designed for use in switching
applications. Each module
consists of two IGBT Transistors
in a half-bridge configuration with
each transistor having a reverseconnected super-fast recovery
free-wheel diode. All components
and interconnects are isolated from
the heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
£ Low Drive Power
£ Low V
£ Discrete Super-Fast Recovery
£ Isolated Baseplate for Easy
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM450DX-34SA is a 1700V
(V
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)*2 IC 300 Amperes
Collector Current (Pulse)*3 IC 450 Amperes
Collector Current (VGE = 15V , Pulse, Repetitive)*3 I
Total Power Dissipation (TC = 25°C)
Emitter Current (TC = 25°C)
*2,*4
P
*2,*4
I
Emitter Current (Pulse)*3 I
Emitter Current (Pulse, TC = 25°C)
*2,*4
I
Maximum Junction Temperature T
Maximum Case Temperature*2 T
Operating Junction Temperature T
Storage Temperature T
Isolation Voltage (Terminals to Baseplate, RMS, f = 60Hz, AC 1 minute) V
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*3 Pulse width and repetition rate should be such that device junction temperature (Tj)
does not exceed T
*4 Junction temperature (Tj) should not increase beyond maximum junction
temperature (T
j(max)
j(max)
) rating.
rating.
0
1700 Volts
CES
±20 Volts
GES
900 Amperes
CRM
3000 Watts
tot
*1
300 Amperes
E
*1
450 Amperes
E
*1
900 Amperes
ERM
175 °C
j(max)
125 °C
C(max)
-40 to +150 °C
j(op)
-40 to +125 °C
stg
4000 Volts
ISO
Tr2
Di2
Tr2
Di2
Th
27.8
37.7
41.9
Tr1, Tr2: IGBT, Di1, Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
Turn-on Switching Energy per Pulse Eon VCC = 1000V, IC = IE = 450A, — 80 — mJ
Turn-off Switching Energy per Pulse E
Reverse Recovery Energy per Pulse E
Internal Lead Resistance R
Per Switch,TC = 25°C
Internal Gate Resistance rg Per Switch — 1.7 — Ω
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
Creepage Distance ds Terminal to Terminal 17.0 — — mm
Terminal to Baseplate 10.0 — — mm
Clearance da Terminal to Terminal 17.5 — — mm
Terminal to Baseplate 10.0 — — mm
Weight m — 330 — Grams
Flatness of Baseplate ec On Centerline X, Y*8 ±0 — +100 µm
Recommended Operating Conditions, Ta = 25°C
(DC) Supply Voltage VCC Applied Across C1-E2 — 1000 1200 Volts
Gate (-Emitter Drive) Voltage V
External Gate Resistance RG Per Switch 1.2 — 27 Ω
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 B
(25/50)
R
R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]
R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
MOUNTING SIDE
R
25
= In(
)/( 1 –
50 T25 T50
+ : CONVEX
MOUNTING SIDE
1
– : CONCAVE
)
MOUNTING
X
Y
SIDE
– : CONCAVE
+ : CONVEX
4
Applied Across G1-Es1 / G2-Es2 14.0 15.0 16.5 Volts
GE(on)
Tr2
Di2
Tr2
Di2
Th
0
27.8
37.7
41.9
Tr1, Tr2: IGBT, Di1, Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.