Powerex IGBTMOD™ Modules
are designed for use high
frequency applications; 30 kHz for
hard switching applications and
60 to 70 kHz for soft switching
applications. Each module
consists of two IGBT Transistors
in a half-bridge configuration with
each transistor having a reverseconnected super-fast recovery
free-wheel diode. All components
and interconnects are isolated from
the heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
£ Low E
£ Discrete Super-Fast Recovery
£ Isolated Baseplate for Easy
Applications:
£ Power Supplies
£ Induction Heating
£ Welders
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM400E3Y6-24NFH is a 1200V
(V
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Inverter IGBT/FWDi Part
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
1200 Volts
CES
±20 Volts
GES
Collector Current (Operation, TC = 25°C)*3 IC 400 Amperes
Collector Current (Pulse, Repetitive)*2 I
Total Power Dissipation (TC = 25°C)
*2,*3
P
Emitter Current (Operation, TC = 25°C)*3 I
Emitter Current (Pulse, Repetitive)*2 I
800 Amperes
CRM
2190 Watts
tot
*1
50 Amperes
E
*1
100 Amperes
ERM
Clamp Diode Part
Characteristics Symbol Rating Units
Repetitive Peak Reverse Voltage V
Forward Current (Operation, TC = 25°C)*3 IF 400 Amperes
Forward Current (Pulse, Repetitive)*2 I
1200 Volts
RRM
800 Amperes
FRM
Module
Characteristics Symbol Rating Units
Isolation Voltage (Charged Part to Baseplate, f= 60 Hz, AC 1 Minute) V
Maximum Junction Temperature T
Operating Junction Temperature T
Storage Temperature T
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*2 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*3 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location. The heatsink ther mal resistance should be measured just under the chips.
060.1
0
18.4
30.4
34.4
077.042.231.8
Each mark points to the center position of each chip.
Emitter-Collector Voltage VFM IF = 400A*4 — 5.5 7.0 Volts
Internal Lead Resistance R
Chip - Terminals
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*4 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*3 Case temperature (TC) is measured on the surface (mounting side) of the baseplate just under the chips.
Refer to the figure to the right for chip location.
*5 B
(25/50)
R
R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]
R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]
*6 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure.
= In(
R
25
)/( 1 –
50 T25 T50
1
)
+ CONVEX
– CONCAVE
Y
X
Q Per Inver ter IGBT*3 — — 0.057 K/W
th(j-c)
D Per Inverter FWDi*3 — — 0.430 K/W
th(j-c)
D Per ClampDi*3 — — 0.098 K/W
th(j-c)
Thermal Grease Applied, — 0.02 — K/W
th(c-s)
*3,*7
060.1
0
BOTTOM
18.4
30.4
34.4
3 mm
Th
Di1
Tr2Tr2
Di2
Di1
0
24.4
34.5
HEATSINK SIDE
HEATSINK SIDE
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
– CONCAVE
+ CONVEX
077.042.231.8
Each mark points to the center position of each chip.
Tr2: IGBT Di2: FWDi
Di1: ClampDi Th: NTC Thermistor
52.4
LABEL SIDE
412/11 Rev. 0
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