POWEREX CM400DY-66H Datasheet

MITSUBISHI HVIGBT MODULES
CM400DY-66H
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
INSULATED TYPE
CM400DY-66H
IC...................................................................400A
HIGH POWER SWITCHING USE
V
CES ....................................................... 3300V
2-elements in a pack
APPLICATION
Inverters, Converters, DC choppers, Induction heating, DC to DC converters.
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
130
5 - M4 NUTS
CM
57
E1
114
±0.25
E2(C1)
G1
7.2
36.3
48.8 53.6
24.5
61.5
18
57
±0.25
C2E1
E2C1
G2
C2
4 - M8 NUTS
20
±0.25
40
140
124
6 - φ 7 MOUNTING HOLES
C2
C2
G2
E2
CIRCUIT DIAGRAM
39.55.7
15
E2
C1
G1
E1
15
E1
38
5
HVIGBT MODULES (High Voltage Insulated Gate Bipolar Transistor Modules)
28
LABEL
30
Feb. 2000
MITSUBISHI HVIGBT MODULES
.
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
MAXIMUM RATINGS (Tj = 25°C)
Symbol Item Conditions UnitRatings
CES
V VGES IC ICM IE IEM PC Tj Tstg Viso
Collector-emitter voltage Gate-emitter voltage
Collector current
(Note 2)
Emitter current
(Note 2)
Maximum collector dissipation
(Note 3)
Junction temperature Storage temperature Isolation voltage
Mounting torque
Mass
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
Symbol Item Conditions
CES
I VGE(th)
IGES VCE(sat)
Cies Coes Cres QG td (on) tr td (off) tf VEC trr Qrr Rth(j-c)Q Rth(j-c)R Rth(c-f)
Note 1. Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
Collector cutoff current Gate-emitter threshold voltage Gate-leakage current Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time
(Note 2)
Emitter-collector voltage
(Note 2)
Reverse recovery time
(Note 2)
Reverse recovery charge Thermal resistance
Contact thermal resistance
2. I
E, VEC, trr, Qrr & die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode.
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
j) should not increase beyond 150°C.
GE = 0V
V
CE = 0V
V
C = 25°C
T Pulse (Note 1)
C = 25°C
T Pulse (Note 1)
C = 25°C, IGBT part
T
— Charged part to base plate, rms, sinusoidal, AC 60Hz 1min. Main terminals screw M8 Mounting screw M6 Auxiliary terminals screw M4 Typical value
V
CE = VCES, VGE = 0V
IC = 40mA, VCE = 10V V
GE = VGES, VCE = 0V j = 25°C
T
j = 125°C
T
CE = 10V
V
GE = 0V
V
CC = 1650V, IC = 400A, VGE = 15V
V
CC = 1650V, IC = 400A
V
GE1 = VGE2 = 15V
V
G = 7.5
R
I
C = 400A, VGE = 15V (Note 4)
Resistive load switching operation
E = 400A, VGE = 0V
I
E = 400A
I die / dt = –800A / µs Junction to case, IGBT part (Per 1/2 module) Junction to case, FWDi part (Per 1/2 module) Case to fin, conductive grease applied (Per 1/2 module)
HIGH POWER SWITCHING USE
–40 ~ +150 –40 ~ +125
6.67 ~ 13.00
2.84 ~ 6.00
0.88 ~ 2.00
Limits
Min Typ Max
— — — — — — — — — — — — — — — —
0.016
CM400DY-66H
INSULA TED TYPE
3300
±20 400 800 400 800
3400
6000
1.5
6.04.5 7.5
4.40
4.80 40
4.0
1.2
1.9 — — — —
3.30 — 100 — —
5
0.5
5.72 — — — — —
1.00
2.00
2.00
1.00
4.29
1.20 —
0.036
0.072 —
V V A A A A
W
°C °C
V N·m N·m N·m
kg
Unit
mA
V
µA
V
nF nF nF
µC
µs µs µs µs
V
µs
µC
K/W K/W K/W
HVIGBT MODULES (High Voltage Insulated Gate Bipolar Transistor Modules)
Feb. 2000
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